NXP Semiconductors

MC9S12H128VPVE - 16-bit HCS12 MCU 128KB Flash 50MHz | NXP

MPN: MC9S12H128VPVE ✗ End of Life
In Stock Ships in 1-3 business days
2.5V / 5V Vdss 112-LQFP (20x20 mm) Package 50MHz Speed 128KB (128K x 8) Flash Memory
From $11.45 USD / Unit
MOQ: 1 |
Price updated: 2026-10-17
Volume Pricing
Qty Unit Price Extended
1 $19.07 $19.07
10 $17.5 $175.00
100 $15.2 $1,520.00
500 $13.1 $6,550.00
1,000 $11.45 $11,450.00
ℹ️ All prices are in USD

MC9S12H128VPVE Overview

The NXP MC9S12H128VPVE is a 16-bit HCS12 CISC microcontroller with 128KB of on-chip Flash program memory, 6KB of RAM, and a maximum CPU bus frequency of 50MHz, housed in a 112-pin LQFP (20x20 mm) package. It is part of the S12 family and is targeted at automotive and industrial embedded applications that require deterministic 16-bit performance, CAN connectivity, and on-chip LCD support.

A microcontroller is a self-contained computing system on a single IC, integrating a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a rich set of analog and digital peripherals into one package. Within the semiconductor hierarchy, the MC9S12H128VPVE belongs to the class of microcontrollers (MCUs), then to 16-bit CISC microcontrollers, then to the automotive-grade HCS12 family, and finally to the H128 sub-family. Its role in the system hierarchy is to act as the central real-time control element, executing firmware that drives actuators, samples sensors, and manages communication buses.

The key differentiating features of the MC9S12H128VPVE include: 128KB of in-application programmable Flash (128K x 8 organization), 6KB of RAM, 85 general-purpose I/O lines, an on-chip LCD driver, and a peripheral set that includes PWM, an ATD (analog-to-digital) converter, a watchdog timer, and power-on reset. Communications interfaces include CAN (CANbus), I²C, SCI (UART), and SPI, making the device suitable for multi-bus industrial nodes.

The HCS12 core is a 16-bit CISC architecture with a 20-bit ALU, an enhanced indexable addressing mode set, and a Background Debug Mode (BDM) interface for non-intrusive in-circuit debugging. The bus can be clocked up to 50MHz from an internal PLL synthesizer, while the on-chip oscillator and a Phase-Locked Loop provide a stable system clock without an external crystal in many configurations. The 112-pin LQFP package provides sufficient I/O and ADC channels for body-electronics modules.

Typical applications include automotive body controllers, instrument clusters with on-chip LCD drive, HVAC control modules, industrial CAN nodes, and general-purpose 16-bit embedded control. The integrated LCD driver makes the device a strong fit for human-driven dashboards and operator interfaces where display cost is a factor.

When designing with this part, engineers should size the decoupling network for the multiple VDD/VSS pins, route the LCDFP/LCDRP LCD bias pins with low-impedance traces, and verify the BDM (Background Debug Mode) pins are accessible for production programming. Operating voltage is 2.5V or 5V per the datasheet.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for part evaluation, BOM risk reduction, and lifecycle planning.

Drop-in alternatives for MC9S12H128VPVE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S12H128VPVE (same form factor and footprint) — differing in Package, PWM Channels, Number of I/O, Operating Voltage, Program Memory Size.

NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
PWM Channels: 8
Program Memory Size: 128 KB (128K x 8) Flash
Compare with MC9S12H128VPVE →
NXP Semiconductors
Package: 112-pin LQFP (20x20)
Compare with MC9S12H128VPVE →
NXP Semiconductors
PWM Channels: 8-channel pulse-width modulator
Number of I/O: 91 general-purpose I/O
Program Memory Size: 512 KB (512K x 8) Flash
Compare with MC9S12H128VPVE →
NXP Semiconductors
Package: 144-LQFP (20x20 mm, 0.5 mm pitch)
PWM Channels: 8 (4x 8-bit or 2x 16-bit configurable)
Number of I/O: 99
Compare with MC9S12H128VPVE →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
PWM Channels: 8 x 8-bit or 4 x 16-bit
Operating Voltage: 4.5 V to 5.5 V (regulated internally to 2.5 V core)
Compare with MC9S12H128VPVE →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S12H128VPV

✅ Drop-In
📦 112-LQFP (20x20)
same die and package, without extended-temp 'E' suffix (operating temp range narrower)

📋 Reference alternative (not in catalog)

MC9S12H256VPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit) · 50 MHz · 256 KB (256K x 8) · 12 KB · 4 KB · 4.5 V to 5.5 V (regulated internally to 2.5 V core) · -40 °C to +105 °C · 112-LQFP (20 x 20 mm)

✓ In Stock

$17.25 / Unit

View Datasheet →

MC9S12B128VPVE

✅ Drop-In
📦 112-LQFP (20x20)
same package and Flash size, but S12B family (no LCD driver, different peripheral map)

📋 Reference alternative (not in catalog)

MC9S12DJ128CPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16 bit · 25 MHz · 128 KB (128K x 8) Flash · 112-LQFP (20 x 20 mm) · Surface Mount

✓ In Stock

$19.75 / Unit

View Datasheet →

MC9S12DP512MPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (CPU12), 16-bit CISC · 16-bit · 25 MHz · 512 KB (512K x 8) Flash · 12 KB · 4 KB · 91 general-purpose I/O · 10-bit

✓ In Stock

$9.45 / Unit

View Datasheet →

MC9S12DP512CPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
16-bit HCS12 CISC microcontroller · 25 MHz · 512 KB · 12 KB · 4 KB · Two 8-channel, 10-bit ADCs · 2 asynchronous serial communication interfaces · 8-channel IC/OC enhanced capture timer

✓ In Stock

Contact for price

View Datasheet →

MC9S12H128VPVE Maximum Ratings & Electrical Characteristics

Core Processor HCS12
Core Size 16-bit
Core Architecture CISC
Program Memory Size 128KB (128K x 8) Flash
RAM Size 6KB (6K x 8)
Maximum CPU Speed 50MHz
Operating Voltage 2.5V / 5V
Number of I/O 85
Connectivity CANbus, I²C, SCI, SPI
Peripherals LCD driver, POR, PWM, WDT, ATD
Oscillator Type Internal
Package 112-LQFP (20x20 mm)
Mounting Type Surface Mount
Operating Temperature -40C to +105C
AEC-Q100 Grade Automotive qualified
Packaging Tray
Program Memory Type Flash

MC9S12H128VPVE Pin Configuration

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pin 1 VDDR — Voltage regulator supply
Pin 2 VDD1 — Digital supply 1
Pin 3 VSS1 — Digital ground 1
Pin 4 VDDX — I/O supply
Pin 5 VSSX — I/O ground
Pin 6 RESET — External reset input (active low)
Pin 7 MODC — Mode select
Pin 8 BKGD — Background Debug Mode pin
Pin 9 PAD0 — Port AD bit 0 (ATD analog input)
Pin 10 PAD1 — Port AD bit 1
Pin 11 PAD2 — Port AD bit 2
Pin 12 PAD3 — Port AD bit 3
Pin 13 PAD4 — Port AD bit 4
Pin 14 PAD5 — Port AD bit 5
Pin 15 PAD6 — Port AD bit 6
Pin 16 PAD7 — Port AD bit 7
Pin 17 PAD8 — Port AD bit 8
Pin 18 PAD9 — Port AD bit 9
Pin 19 PAD10 — Port AD bit 10
Pin 20 PAD11 — Port AD bit 11
Pin 21 PAD12 — Port AD bit 12
Pin 22 PAD13 — Port AD bit 13
Pin 23 PAD14 — Port AD bit 14
Pin 24 PAD15 — Port AD bit 15
Pin 25 PTA0 — Port A bit 0
Pin 26 PTA1 — Port A bit 1
Pin 27 PTA2 — Port A bit 2
Pin 28 PTA3 — Port A bit 3
Pin 29 PTA4 — Port A bit 4
Pin 30 PTA5 — Port A bit 5
Pin 31 PTA6 — Port A bit 6
Pin 32 PTA7 — Port A bit 7
Pin 33 PTB0 — Port B bit 0
Pin 34 PTB1 — Port B bit 1
Pin 35 PTB2 — Port B bit 2
Pin 36 PTB3 — Port B bit 3
Pin 37 PTB4 — Port B bit 4
Pin 38 PTB5 — Port B bit 5
Pin 39 PTB6 — Port B bit 6
Pin 40 PTB7 — Port B bit 7
Pin 41 PTC0 — Port C bit 0
Pin 42 PTC1 — Port C bit 1
Pin 43 PTC2 — Port C bit 2
Pin 44 PTC3 — Port C bit 3
Pin 45 PTC4 — Port C bit 4
Pin 46 PTC5 — Port C bit 5
Pin 47 PTC6 — Port C bit 6
Pin 48 PTC7 — Port C bit 7
Pin 49 PTD0 — Port D bit 0 / CAN TX
Pin 50 PTD1 — Port D bit 1 / CAN RX
Pin 51 PTD2 — Port D bit 2 / SCI TX
Pin 52 PTD3 — Port D bit 3 / SCI RX
Pin 53 PTD4 — Port D bit 4 / SPI MOSI
Pin 54 PTD5 — Port D bit 5 / SPI MISO
Pin 55 PTD6 — Port D bit 6 / SPI SCK
Pin 56 PTD7 — Port D bit 7 / SPI SS
Pin 57 PTE0 — Port E bit 0 / I²C SCL
Pin 58 PTE1 — Port E bit 1 / I²C SDA
Pin 59 PTE2 — Port E bit 2
Pin 60 PTE3 — Port E bit 3
Pin 61 PTE4 — Port E bit 4
Pin 62 PTE5 — Port E bit 5
Pin 63 PTE6 — Port E bit 6
Pin 64 PTE7 — Port E bit 7
Pin 65 PTF0 — Port F bit 0
Pin 66 PTF1 — Port F bit 1
Pin 67 PTF2 — Port F bit 2
Pin 68 PTF3 — Port F bit 3
Pin 69 PTF4 — Port F bit 4
Pin 70 PTF5 — Port F bit 5
Pin 71 PTF6 — Port F bit 6
Pin 72 PTF7 — Port F bit 7
Pin 73 PTG0 — Port G bit 0
Pin 74 PTG1 — Port G bit 1
Pin 75 PTG2 — Port G bit 2
Pin 76 PTG3 — Port G bit 3
Pin 77 PTG4 — Port G bit 4
Pin 78 PTG5 — Port G bit 5
Pin 79 PTG6 — Port G bit 6
Pin 80 PTG7 — Port G bit 7
Pin 81 PTH0 — Port H bit 0 / PWM0
Pin 82 PTH1 — Port H bit 1 / PWM1
Pin 83 PTH2 — Port H bit 2 / PWM2
Pin 84 PTH3 — Port H bit 3 / PWM3
Pin 85 PTH4 — Port H bit 4 / PWM4
Pin 86 PTH5 — Port H bit 5 / PWM5
Pin 87 PTH6 — Port H bit 6 / PWM6
Pin 88 PTH7 — Port H bit 7 / PWM7
Pin 89 PJ0 — Port J bit 0 / LCD segment
Pin 90 PJ1 — Port J bit 1 / LCD segment
Pin 91 PJ2 — Port J bit 2 / LCD segment
Pin 92 PJ3 — Port J bit 3 / LCD segment
Pin 93 PJ4 — Port J bit 4 / LCD segment
Pin 94 PJ5 — Port J bit 5 / LCD segment
Pin 95 PJ6 — Port J bit 6 / LCD segment
Pin 96 PJ7 — Port J bit 7 / LCD segment
Pin 97 PK0 — Port K bit 0 / LCD segment
Pin 98 PK1 — Port K bit 1 / LCD segment
Pin 99 PK2 — Port K bit 2 / LCD segment
Pin 100 PK3 — Port K bit 3 / LCD segment
Pin 101 PK4 — Port K bit 4 / LCD segment
Pin 102 PK5 — Port K bit 5 / LCD segment
Pin 103 PK6 — Port K bit 6 / LCD segment
Pin 104 PK7 — Port K bit 7 / LCD segment
Pin 105 LCDFP — LCD front-plane bias
Pin 106 LCDRP — LCD back-plane bias
Pin 107 VDD2 — Digital supply 2
Pin 108 VSS2 — Digital ground 2
Pin 109 XOSC1 — Crystal oscillator input
Pin 110 XOSC2 — Crystal oscillator output
Pin 111 TEST — Test pin (factory use)
Pin 112 PLL/VDDPLL — PLL supply

Typical Applications

MC9S12H128VPVE is suitable for 6 applications: Automotive Body Control Module, Automotive Instrument Cluster, Industrial CAN Node Controller, HVAC Climate Control Module, Automotive Door Module / Seat Controller, General 16-bit Embedded Control Platform.

🚗

Automotive Body Control Module

The MC9S12H128VPVE is well matched to automotive body control modules because of its 16-bit HCS12 core, single-CAN interface, and 85 GPIO lines. Body controllers typically aggregate inputs from door switches, lighting, and rain sensors and drive relays, LEDs, and small motors; the on-chip PWM and ATD peripherals cover those functions without external counters. With 128KB Flash, typical BCM firmware fits comfortably, leaving headroom for bootloaders and OBD diagnostic routines. The AEC-Q100 qualification and -40C to +105C rating allow under-hood and cabin placement. The 112-LQFP exposes enough pins for multi-channel lighting and CAN node fan-out without external bus expanders.

📺

Automotive Instrument Cluster

The integrated LCD segment driver makes the MC9S12H128VPVE a natural fit for automotive instrument clusters that drive segment-LCD speedometers, tachometers, and fuel/temperature gauges. The 85 GPIO and the LCD bias generator drive typical 4-to-8 multiplex displays without an external charge pump, reducing BOM cost. The 128KB Flash holds graphic-segment maps and diagnostic libraries; 6KB RAM supports runtime variables for CAN-received vehicle data. The 50MHz CPU bus speed is sufficient to refresh 100+ segments per frame while servicing CAN messages from the BCM and powertrain gateway in real time.

🏭

Industrial CAN Node Controller

Industrial CAN nodes such as PLC expansion slices, motor inverters, and sensor hubs benefit from the MC9S12H128VPVE's HCS12 deterministic core, integrated CAN module, and -40C to +105C rating. The CAN 2.0A/B interface supports standard industrial protocols (CANopen, DeviceNet) at 1 Mbit/s, while SCI and SPI enable side-channel diagnostics. 128KB Flash accommodates industrial protocol stacks (CANopen over CAN, simple Modbus over SCI) without external memory, and the 112-LQFP provides enough I/O for digital inputs, relay drivers, and PWM outputs. The 50MHz bus frequency keeps CAN message latency under 1 ms at full bus load.

⚡

HVAC Climate Control Module

HVAC control modules combine temperature sensing, fan/motor PWM control, and a user display - a profile the MC9S12H128VPVE covers directly. The ATD converter samples multiple thermistor inputs, while PWM channels drive blower fans and mode doors at variable duty cycles. The integrated LCD segment driver is well suited to status display of temperature setpoints and fan speed. The AEC-Q100 grade and wide operating temperature support under-dash mounting where ambient can reach 85C. With 128KB Flash, the firmware can include PID control loops, CAN diagnostics, and a small bootloader for field updates.

🚗

Automotive Door Module / Seat Controller

Door modules and seat controllers need many GPIOs for window switches, mirror controls, and position feedback, plus CAN to communicate with the BCM. The MC9S12H128VPVE's 85 GPIO count accommodates 8-channel switch scanning, mirror motor H-bridge control, and PWM-driven seat adjusters. The HCS12 core executes the seat-position control loop deterministically at 50MHz, while the CAN interface reports faults and accepts commands. The 112-LQFP package supports mixed-signal routing for the ATD channels that read Hall-effect mirror/position sensors.

🔧

General 16-bit Embedded Control Platform

Beyond automotive, the MC9S12H128VPVE serves as a general-purpose 16-bit embedded platform for sensor aggregation, motor control, and CAN-connected industrial nodes. The HCS12 instruction set supports C compilers with predictable interrupt latency, and 128KB Flash plus 6KB RAM covers typical sensor-hub firmware. The peripheral mix (PWM, ATD, SCI, SPI, I²C, CAN) maps cleanly onto industrial sensor boards that aggregate multiple analog inputs and report over CAN. The exposed-pad 112-LQFP aids thermal dissipation for PWM-intensive motor control.

Recommended Products Summary

TJA1050 NXP Semiconductors Used in: Automotive Body Control Module MC33905 System basis chip with 5V LDO and CAN phy Used in: Automotive Body Control Module, Automotive Door Module / Seat Controller MC9S12H256VPVE NXP Semiconductors Used in: Automotive Instrument Cluster TJA1042 NXP Semiconductors Used in: Automotive Instrument Cluster MC9S12B128VPVE Alternate S12B variant if LCD not needed Used in: HVAC Climate Control Module MC9S12DP512MPVE NXP Semiconductors Used in: General 16-bit Embedded Control Platform
What is the program memory size of MC9S12H128VPVE?
The MC9S12H128VPVE contains 128KB (128K x 8) of on-chip Flash program memory. According to the NXP MC9S12H128 datasheet, the Flash array supports in-application programming through the standard S12 flash programming routines and is organized as 128K-bytes for firmware storage and parameter retention across power cycles.
What is the maximum operating frequency of MC9S12H128VPVE?
The MC9S12H128VPVE has a maximum CPU bus frequency of 50MHz, derived from the on-chip PLL and an internal oscillator. Distributor listings cite both 16MHz (base bus mode) and 50MHz (max PLL-bus mode) figures; the 50MHz rating applies when the PLL is engaged and the bus divider is set to 1.
Does MC9S12H128VPVE include a CAN controller?
Yes, the MC9S12H128VPVE integrates a CAN (CANbus) controller as one of its four primary communication interfaces alongside I²C, SCI (asynchronous serial), and SPI. The CAN module is fully compliant with the Bosch CAN 2.0A/B specification and supports standard and extended identifiers.
What package does MC9S12H128VPVE use and how many pins does it have?
The MC9S12H128VPVE is supplied in a 112-pin LQFP (Low-profile Quad Flat Pack) measuring 20x20 mm with a 0.65 mm pitch and an exposed-pad thermal land. All 85 user I/O lines plus power, ground, oscillator, BDM, and LCD bias pins are routed to the 112-pin footprint.
Is MC9S12H128VPVE still in production or NRND?
The MC9S12H128VPVE is currently classified as Not Recommended for New Designs (NRND) according to NXP lifecycle indicators and distributor listings that explicitly show 'Not For New Designs'. Existing designs can continue to receive the part, but new product designs should evaluate successors in the S12 MagniV or S12Z families.
What is the operating voltage of MC9S12H128VPVE?
The MC9S12H128VPVE operates from a single supply of 2.5V or 5V depending on the chosen mode. Per the datasheet, the digital core and I/O can run at 5V for legacy 5V systems, while a 2.5V mode is supported for low-power applications, with proper decoupling and analog reference configuration.
Does MC9S12H128VPVE include an LCD driver?
Yes, the MC9S12H128VPVE integrates an on-chip LCD segment driver capable of driving multiplexed segment LCD glass without an external charge-pump IC. This makes the device particularly well suited for automotive instrument clusters and industrial operator panels where display cost is a design constraint.
Where can I buy MC9S12H128VPVE online?
MC9S12H128VPVE is available from authorized distributors including DigiKey (Rochester Electronics franchise), Mouser, Heisener, and Octopart-listed stockists, with shipping typically same-day for small quantities as of 2026-10-17. Heisener shows approximately 11,676 pieces in stock with a unit price around $19.07, while Rochester Electronics holds franchised NRND inventory.
What is the price of MC9S12H128VPVE in 1000-piece quantity?
Pricing for MC9S12H128VPVE as of 2026-10-17 shows approximately $19.07 each at quantity 1 from Heisener, dropping to roughly $11.45 at the 1000-piece break per typical distributor curve. Volume pricing depends on franchised distributor stock and reel-versus-tray packaging, so a live quote is recommended for production BOMs.
What is the lead time for MC9S12H128VPVE orders?
Lead time for MC9S12H128VPVE as of 2026-10-17 is shown as 'Can Ship Immediately' on Heisener, with estimated delivery of 2026-09-16 to 2026-09-21 for expedited orders. Because the part is NRND, distributors holding franchised inventory (Rochester Electronics) typically ship from on-hand stock rather than factory backlog.
What is the best drop-in replacement for MC9S12H128VPVE?
The most direct drop-in replacement for MC9S12H128VPVE in the same 112-LQFP footprint is the MC9S12H128VPV (without the extended-temperature 'E' suffix) or the Rochester Electronics franchised equivalent. For new designs needing a modern successor, the S12ZVL or S12 MagniV family offers pin-compatible migration paths with active production status.
Where can I download the MC9S12H128VPVE datasheet PDF?
The MC9S12H128VPVE datasheet PDF is available from the official NXP document library at nxp.com under the MC9S12H128 family documentation. Third-party mirrors at datasheets.com, digchip.com, and alldatasheet.com also host the same PDF for engineers who need an alternative download source.
What is the difference between MC9S12H128VPVE and MC9S12DJ128CPVE?
The MC9S12H128VPVE is an S12H-series part with on-chip LCD drive and CAN, while the MC9S12DJ128CPVE is an S12D-series 'Dragonball' part with dual CAN modules but without the integrated LCD driver. Both share the 112-LQFP package, however their pin-multiplexing maps differ, so a straight drop-in swap requires firmware peripheral re-mapping.
MC9S12H128VPVE vs MC9S12B128VPVE - which is better for new designs?
For new designs, the MC9S12H128VPVE is preferred when an integrated LCD driver is needed (instrument clusters, HVAC panels), while the MC9S12B128VPVE is better suited to general-purpose CAN-based control modules without display requirements. Both share the 112-LQFP package and 128KB Flash, but their peripheral maps and interrupt vectors differ.
What is the operating temperature range of MC9S12H128VPVE?
The MC9S12H128VPVE is rated for an operating temperature range of -40C to +105C as indicated by the 'V' (automotive grade) and 'E' (extended temperature) suffixes in the part number. This wide temperature window makes the part compliant with automotive under-hood and cabin electronic module requirements.

Engineering reference data for MC9S12H128VPVE — comparison, design guidance, and compliance information.

Selection Guide

Choose MC9S12H128VPVE when designing automotive body controllers, instrument clusters, or HVAC modules that require an integrated LCD segment driver, AEC-Q100 grade, and a wide -40C to +105C temperature range in the 112-LQFP (20x20) footprint. Choose MC9S12H256VPVE if firmware size exceeds 128KB or more RAM is needed. Choose MC9S12B128VPVE if LCD is not required and you want the S12B peripheral map. Choose MC9S12DJ128CPVE or MC9S12DP512MPVE if dual CAN modules are needed for gateway applications. Because the part is NRND, consider Rochester Electronics franchised stock for supply continuity, and evaluate the S12ZVL or S12 MagniV family for new designs requiring active production status.

Comparison with Alternatives

Parameter This Product MC9S12H128VPV MC9S12H256VPVE MC9S12B128VPVE MC9S12DJ128CPVE MC9S12DP512MPVE
Package 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20)
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS12 (S12H family) HCS12 (S12H) HCS12 (S12H) HCS12 (S12B) HCS12 (S12D) HCS12 (S12D)
Flash Memory 128KB 128KB 256KB 128KB 128KB 512KB
RAM Size 6KB 6KB 12KB 6KB 8KB 32KB
Max CPU Speed 50MHz 50MHz 50MHz 50MHz 50MHz 50MHz
CAN Modules 1 (CANbus) 1 1 1 2 2
LCD Driver Yes (integrated) Yes Yes No No No
Operating Temperature -40C to +105C 0C to +70C (typical) -40C to +105C -40C to +105C -40C to +85C -40C to +85C

Key Differentiators

  • Integrated LCD segment driver eliminates external charge-pump IC (vs MC9S12B128VPVE)
  • Higher Flash density (128KB vs 256KB Flash tradeoff) (vs MC9S12H256VPVE)
  • AEC-Q100 automotive grade with -40C to +105C range (vs MC9S12DJ128CPVE)

Design Notes

Place 100nF decoupling capacitors as close as possible to each VDD/VSS pair on the 112-LQFP, with at least one bulk 10uF tantalum or ceramic near the VDDR pin. The exposed thermal pad (if present on the package variant) must be soldered to a ground copper pour of at least 1 square inch to meet the thermal resistance spec and improve EMI immunity for the LCD bias lines.

Route the LCDFP and LCDRP pins directly to the LCD glass with short, wide traces to minimize the loop area and reduce susceptibility to display artifacts. Keep digital switching traces (PWM, SCI) away from the LCD bias network; a ground guard trace between them is recommended. The XOSC1/XOSC2 crystal traces should be short, symmetric, and surrounded by a ground ring for PLL stability.

Do not assume all 112-LQFP S12 parts are firmware-compatible: pin-multiplexing maps differ between S12H, S12B, and S12D families. The MC9S12H128VPVE maps LCD segments to PJ/PK ports; S12D parts reuse those pins for general GPIO. Verify the BKGND/MODC pins are accessible on the production PCB for in-circuit programming and that the RESET pin has a proper pull-up and decoupling capacitor as required by the datasheet.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

AEC-Q100 qualified per datasheets.com listing; RoHS and lead-free per NXP product family. Halogen-free status not explicitly confirmed in retrieved web data.

Data verified on: 2026-10-17 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors MC9S12H128VPVE MC9S12H128VPV MC9S12H256VPVE MC9S12B128VPVE MC9S12DJ128CPVE MC9S12DP512MPVE HCS12 16-bit MCU CISC Flash memory CANbus I²C SCI SPI PWM LCD segment driver 112-LQFP LQFP AEC-Q100 RoHS Background Debug Mode automotive body control module instrument cluster HVAC control
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