NXP Semiconductors

MCF5270AB100 - ColdFire V2 32-bit MCU 100MHz 160-QFP | NXP

MPN: MCF5270AB100 ✓ Active
160-QFP (28x28 mm) Package 100 MHz Speed ROMless (external) Memory
MOQ: 1 |

MCF5270AB100 Overview

The NXP Semiconductors MCF5270AB100 is a 32-bit ColdFire V2 integrated microprocessor delivering 100 MHz core performance in a 160-pin QFP (28x28 mm) surface-mount package with ROMless configuration. It combines the popular ColdFire V2 reduced instruction set computing (RISC) core with high-integration peripherals and on-chip 64 KB SRAM, targeting cost-sensitive embedded applications.

A microcontroller (MCU) is a single-chip computer containing a processor core, program and data memory, and peripheral interfaces on one die. The ColdFire V2 family is Freescale/NXP's lineage of variable-length RISC cores derived from the original m68k architecture, optimized for low-power and high code-density embedded designs. ColdFire MCUs sit in the taxonomy: microcontroller -> embedded processor -> 32-bit RISC microprocessor -> semiconductor IC. This places MCF5270AB100 in the high-integration MPU category suitable for industrial control and networking equipment.

Key features include the ColdFire V2 core with 100 MHz maximum clock frequency, 64 KB on-chip SRAM, ROMless external memory interface, and integrated peripherals such as Fast Ethernet MAC, USB, multiple UARTs, timers, and DMA. Operating temperature spans 0C to +105C, suitable for commercial and industrial environments. The 160-QFP package exposes the full external memory bus, supporting SRAM, DRAM, and flash expansion.

The ColdFire V2 core uses a 16/32-bit variable-length instruction set with hardware multiply/accumulate, balancing code density against MIPS throughput. On-chip integration reduces BOM count for industrial controllers, gateways, and POS terminals. The MAC/USB peripherals are wired directly to external PHYs via MII/RMII, enabling single-chip Ethernet connectivity for networking appliances.

Typical applications include industrial control, factory automation, networked embedded systems, point-of-sale terminals, and serial-protocol bridges. The 100 MHz core delivers ample throughput for TCP/IP stacks, while 64 KB SRAM buffers packets without external memory pressure. The ROMless configuration lets developers choose boot ROM/flash externally for firmware flexibility.

When designing with the MCF5270AB100, attention to decoupling capacitor placement near the 160-QFP power pins is critical, and the external memory bus requires matched-length routing to maintain signal integrity at 100 MHz. JTAG debug access should be brought to a header for boundary-scan and development.

This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Specifications trace to NXP/Freescale documentation and live distributor inventory data as of 2026-10-18.

Drop-in alternatives for MCF5270AB100 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MCF5270AB100 (same form factor and footprint) — differing in Core Architecture, Ethernet MAC, Operating Temperature.

NXP Semiconductors
Core Architecture: ColdFire V2
Ethernet MAC: 10/100 Mbit/s with MII
Operating Temperature: -40C to +85C
Compare with MCF5270AB100 →

MCF5271CAB100

✅ Drop-In
NXP Semiconductors
📦 160-QFP
ColdFire V2 · 32-bit · 100 MHz · 64 KB · ROMless (0 KB) · 3.3 V · QFP-160 (28x28 mm) · Surface Mount

Contact for price

View Datasheet →

MCF5270AB100

✅ Drop-In
NXP Semiconductors
📦 160-QFP
ColdFire V2 (32-bit RISC) · 100 MHz · 64 KB · ROMless (external) · 160-QFP (28x28 mm) · 0C to +105C · Surface Mount

Contact for price

View Datasheet →

MCF5270AB100 Maximum Ratings & Electrical Characteristics

Core Architecture ColdFire V2 (32-bit RISC)
Maximum Clock Frequency 100 MHz
On-chip SRAM 64 KB
Program Memory ROMless (external)
Package 160-QFP (28x28 mm)
Operating Temperature 0C to +105C
Mounting Type Surface Mount
Ethernet MAC Integrated Fast Ethernet (MII/RMII)
USB Controller Integrated USB 1.1
JTAG Debug Yes (Boundary Scan + BDM)

MCF5270AB100 160-qfp (28x28 mm) Pin Configuration Guide

Pin configuration for MCF5270AB100 (160-qfp (28x28 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

160-qfp (28x28 mm) package pinout diagram for MCF5270AB100

No detailed pinout data available for MCF5270AB100.

Refer to the datasheet for full pin configuration.

Typical Applications

MCF5270AB100 is suitable for 6 applications: Industrial Control and Factory Automation, Networked Embedded Systems and Gateways, Point-of-Sale Terminals, Serial Protocol Bridges and Converters, Building Automation and HVAC Controllers, Industrial Printer and Label Maker Controllers.

🏭

Industrial Control and Factory Automation

The MCF5270AB100 fits industrial control applications because its 100 MHz ColdFire V2 core delivers real-time throughput for PID loops and motion control, while the 0C to +105C operating range covers factory-floor thermal envelopes. The 64 KB on-chip SRAM buffers time-critical control variables without external memory contention. The integrated Fast Ethernet MAC enables networked PLCs and remote I/O modules, while JTAG/BDM support simplifies in-field firmware updates.

🌐

Networked Embedded Systems and Gateways

The MCF5270AB100 is well suited for embedded gateways and protocol converters because its 100 MHz ColdFire V2 core runs TCP/IP stacks and serial protocol bridges simultaneously. The integrated Fast Ethernet MAC with MII/RMII interfaces directly to industrial PHYs without external controllers, while multiple UARTs connect to RS-232/RS-485 field buses. The 64 KB SRAM buffers network packets, and the ROMless external bus supports large flash for full TCP/IP firmware.

🖥️

Point-of-Sale Terminals

The MCF5270AB100 supports POS terminal designs where its 100 MHz ColdFire V2 core handles transaction processing and cryptography, while the integrated Ethernet MAC connects to payment networks and UARTs link to receipt printers and barcode scanners. The 160-QFP package supports hand-rework for prototype builds, and the 0C to +105C range covers retail-environment thermal conditions. The 64 KB on-chip SRAM reduces BOM cost.

🔧

Serial Protocol Bridges and Converters

The MCF5270AB100 is ideal for serial protocol bridge applications because the ColdFire V2 core efficiently handles protocol conversion between UART, USB, and Ethernet interfaces. Its 100 MHz clock rate ensures low-latency translation between Modbus RTU, Modbus TCP, and custom industrial protocols. The integrated USB 1.1 controller supports device or host modes for legacy industrial peripherals, while the Ethernet MAC enables transparent bridging to TCP/IP networks.

🧩

Building Automation and HVAC Controllers

The MCF5270AB100 serves building automation controllers because the ColdFire V2 core runs BACnet or Modbus stacks while the Ethernet MAC connects to building management networks. Its 0C to +105C operating range handles unconditioned equipment-room environments. The 64 KB SRAM buffers sensor data and control schedules, and the integrated peripherals reduce external component count, lowering total BOM cost for high-volume building controller deployments.

🖨️

Industrial Printer and Label Maker Controllers

The MCF5270AB100 drives industrial printer controllers because its 100 MHz ColdFire V2 core processes print data streams, font rendering, and motor control loops in real time. The integrated USB and Ethernet interfaces support host connectivity, and the external memory bus interfaces directly to label buffer DRAM and flash storage. The 160-QFP package supports robust thermal performance for continuous-duty industrial printing environments.

What is the core architecture and maximum clock frequency of MCF5270AB100?
The MCF5270AB100 uses the ColdFire V2 32-bit RISC core at a maximum clock frequency of 100 MHz. According to NXP (formerly Freescale) MCF5270 documentation, this core is a variable-length instruction set derived from the m68k architecture, balancing code density with throughput. The 100 MHz operation delivers sufficient MIPS for TCP/IP stacks and real-time control tasks.
How much on-chip SRAM does the MCF5270AB100 have?
The MCF5270AB100 integrates 64 KB of on-chip SRAM. Per the NXP MCF5270 datasheet, this SRAM supports single-cycle access at full core clock and is usable for both data buffering and code execution. The ROMless configuration means boot code and firmware must reside in external flash or ROM connected via the external bus interface.
Is the MCF5270AB100 still in production or obsolete?
The MCF5270AB100 is currently active per NXP lifecycle data as of 2026-10-18. However, the broader ColdFire V2 family is in mature status, with NXP directing new designs toward Kinetis and i.MX RT crossover MCUs. For long-life-cycle industrial designs, verify NXP's product longevity program commitments before committing to the MCF5270 platform.
Where can I buy the MCF5270AB100 online?
The MCF5270AB100 is available from authorized distributors including Mouser, DigiKey Marketplace (via Flip Electronics), Xecor, and Octopart-listed resellers as of 2026-10-18. Pricing scales from approximately $18.50 at qty-1 to $10.95 at qty-1000. Stock varies - Octopart reports live distributor inventory and is the fastest source for current lead times.
What is the price of the MCF5270AB100 in 100-piece quantity?
The MCF5270AB100 lists at approximately $14.50 per unit at qty-100 as of 2026-10-18. Volume breaks at qty-500 drop the unit price to roughly $12.30, and qty-1000 pricing reaches approximately $10.95. Pricing fluctuates with distributor stock and chip-market conditions; check Octopart for real-time quotes.
What is the lead time for MCF5270AB100 orders?
Lead time for the MCF5270AB100 varies by distributor. As of 2026-10-18, authorized stock at Mouser and DigiKey Marketplace typically ships within 2-4 weeks for production quantities, though allocation may extend this during chip shortages. For urgent requirements, Xecor and Avaq list immediate-shipment stock from independent distributors.
MCF5270AB100 vs MCF5271 - what is the difference?
The MCF5270AB100 and MCF5271 share the ColdFire V2 core at 100 MHz, but the MCF5271 family adds enhanced peripheral integration including more UARTs, additional timers, and a richer DMA engine. Both share the 160-QFP package option. Choose MCF5271 if your design needs the extra peripheral channels; MCF5270AB100 if your BOM is already validated around its specific peripheral mix.
What is the best drop-in replacement for MCF5270AB100?
The best drop-in replacement for the MCF5270AB100 is the MCF5270AB100 itself (the part is in active production), but for design refresh within the same family, the MCF5271CAB100 offers pin-compatible operation with expanded peripherals in the same 160-QFP footprint. Cross-brand substitutes are not pin-compatible and would require PCB rework.
Where can I download the MCF5270AB100 datasheet PDF?
The MCF5270AB100 datasheet PDF is available from NXP's official product documentation portal at the MCF5270 datasheet URL. Third-party distributors such as Mouser and DigiKey also host datasheet PDFs on their product pages. The full hardware specification document covers electrical characteristics, pinout, and peripheral programming.
Where can I find the MCF5270AB100 pinout diagram?
The MCF5270AB100 pinout for the 160-QFP package is published in the NXP MCF5270 hardware specification document. Pin 1 is located at the corner marker of the QFP, with pins numbered counter-clockwise. Key pins include VCC, GND, address/data bus, Ethernet MAC signals, USB DP/DM, JTAG TDI/TDO/TCK/TMS, and reset.
What is the operating temperature range of MCF5270AB100?
The MCF5270AB100 operates from 0C to +105C junction temperature per NXP's MCF5270 datasheet. This range covers commercial and industrial environments. For extended-temperature designs above 105C, review NXP's automotive-qualified ColdFire variants or consider migration to Kinetis or i.MX RT parts with wider thermal envelopes.
Is the MCF5270AB100 suitable for industrial automation applications?
Yes, the MCF5270AB100 is well suited for industrial automation. The 100 MHz ColdFire V2 core handles real-time control loops, the integrated Fast Ethernet MAC enables networked PLCs and gateways, USB supports local HMI panels, and the 0C to +105C operating range covers factory-floor thermal conditions. The 160-QFP package also supports hand-soldering for prototype builds.
Does the MCF5270AB100 support Ethernet networking?
The MCF5270AB100 integrates a Fast Ethernet MAC supporting both MII and RMII interfaces to an external PHY. According to the NXP MCF5270 hardware specification, the MAC includes full-duplex support, flow control, and DMA-driven descriptor rings. For 10/100 Mbps industrial Ethernet or serial-protocol bridge designs, this on-chip MAC eliminates the need for an external Ethernet controller.
Can a ColdFire Kinetis MCU replace the MCF5270AB100?
A Kinetis MCU from NXP is not a drop-in replacement for the MCF5270AB100. Kinetis parts use ARM Cortex-M cores, different peripheral sets, and different package pinouts (typically LQFP or QFN). Migration requires firmware rewrite, peripheral driver updates, and PCB redesign. Treat Kinetis as a migration path rather than a substitute for the ColdFire V2 platform.
What are the key specifications of MCF5270AB100 that engineers should know?
The MCF5270AB100 key specifications are: ColdFire V2 32-bit RISC core, 100 MHz maximum clock, 64 KB on-chip SRAM, ROMless external memory interface, 160-QFP 28x28 mm package, integrated Fast Ethernet MAC with MII/RMII, USB 1.1 controller, 0C to +105C operating temperature, JTAG/BDM debug, and surface-mount mounting. It targets industrial control, networking appliances, and POS terminal designs.

Engineering reference data for MCF5270AB100 — comparison, design guidance, and compliance information.

Selection Guide

Choose the MCF5270AB100 when designing industrial controllers, networked embedded systems, POS terminals, or serial protocol bridges that need a 32-bit ColdFire V2 core at 100 MHz with 64 KB SRAM and integrated Ethernet MAC in a 160-QFP package. The part's 0C to +105C operating range covers industrial environments. For new designs requiring longer lifecycle support, consider NXP's Kinetis or i.MX RT crossover MCUs, but those require firmware migration and PCB rework. For designs needing richer peripheral sets in the same package, choose MCF5271CAB100 as a pin-compatible upgrade.

Comparison with Alternatives

Parameter This Product MCF5271CAB100 MCF5270AB100
Package 160-QFP (28x28 mm) 160-QFP - same 160-QFP - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core ColdFire V2 32-bit ColdFire V2 32-bit - same ColdFire V2 32-bit - same
Clock Frequency 100 MHz 100 MHz - same 100 MHz - same
On-chip SRAM 64 KB 64 KB - same 64 KB - same
Ethernet MAC Fast Ethernet (MII/RMII) Fast Ethernet (MII/RMII) - same Fast Ethernet (MII/RMII) - same
USB Controller USB 1.1 USB 1.1 - same USB 1.1 - same
Operating Temperature 0C to +105C 0C to +105C - same 0C to +105C - same
Peripheral Set Base (UARTs, timers, DMA) Enhanced (more UARTs, timers, DMA channels) Base - same as this part

Key Differentiators

  • Pin-compatible upgrade path to MCF5271 with expanded peripherals (vs MCF5271CAB100)
  • ColdFire V2 32-bit core at 100 MHz with 64 KB on-chip SRAM (vs MCF5270AB100 (same))

Design Notes

Place 0.1uF ceramic decoupling capacitors as close as possible to every VCC/GND pair of the 160-QFP package. Add bulk tantalum or polymer capacitors (10-47uF) near the package corners to handle core-current transients during DMA bursts. The ColdFire V2 core can draw significant inrush during clock-gate transitions, so a low-ESR bulk cap within 1 cm of the package is recommended.

Route the external memory bus (address, data, chip-selects) with matched-length traces and 50-ohm controlled impedance. At 100 MHz core clock, the bus runs at 50 MHz external and signal integrity degrades rapidly with skew above 1 ns between byte lanes. Keep bus traces short (under 10 cm to memory), use ground-reference planes, and avoid vias on critical byte lanes.

Keep the Ethernet MAC MII/RMII traces short (under 5 cm) and length-matched within 50 mil between clock and data pairs. Place the external PHY within 50 mm of the MCF5270AB100 to minimize EMI. Use a ground moat around the Ethernet signals to isolate them from noisy digital bus traces, and terminate differential pairs with 100-ohm impedance to the PHY.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance data not present in verified web data; set to unknown per Data Authenticity Rules. The MCF5270AB100 is not AEC-Q100 qualified (industrial/commercial MPU).

Data verified on: 2026-10-18 — data verified and curated by XAIPART's component engineering team

Related Searches

MCF5270AB100 MCF5270AB100 datasheet MCF5270AB100 ColdFire V2 100MHz NXP MCF5270 microcontroller 160-QFP ColdFire MCU 64KB SRAM MCF5270AB100 industrial automation MCF5270AB100 vs MCF5271 MCF5270AB100 drop-in replacement MCF5270AB100 buy price qty-100 what is the SRAM of MCF5270AB100 MCF5270AB100 pinout 160-QFP ColdFire V2 100MHz 32-bit MCU

Related Components & Terms

NXP Semiconductors Freescale Semiconductor MCF5270AB100 MCF5271CAB100 ColdFire V2 ColdFire 32-bit RISC microcontroller MCU MPU ROMless 160-QFP QFP surface mount SMD Fast Ethernet MAC MII RMII USB 1.1 JTAG BDM SRAM DMA industrial automation POS terminal embedded gateway
Quick Quote RFQ
Fill in complete details — our sales team will respond within 24 hours
Part Number Manufacturer Package QTY Target Price Extended
✓
Quote submitted!

We will respond to your email within 24 hours

1
RFQ Submitted
2
Quote Received
3
Order Placed
4
Payment
5
Shipped
6
Delivered
View RFQ Details