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NXP Semiconductors

MCF5271CAB100 - ColdFire V2 32-bit MPU 100MHz 160-QFP | NXP

MPN: MCF5271CAB100 ⚠ Last Time Buy
3.3 V Vdss QFP-160 (28x28 mm) Package 100 MHz Speed ROMless (0 KB) Memory
MOQ: 1 |

MCF5271CAB100 Overview

The NXP MCF5271CAB100 is a ColdFire V2 integrated 32-bit microprocessor running at 100 MHz with 64 KB on-chip SRAM and no on-chip ROM (ROMless), housed in a 160-pin QFP (28x28 mm) package. As part of the MCF527x family, it combines the popular ColdFire V2 core with high peripheral integration, including 10/100 Ethernet MAC, USB, CAN, and external memory controllers.

A microprocessor (MPU) is a single-chip CPU that contains the arithmetic logic unit, control unit, registers, and memory management, but unlike a microcontroller (MCU) it typically relies on external memory for program storage. The ColdFire V2 architecture is a simplified, low-cost variant of the original Motorola 68000 family, designed for embedded applications that need 32-bit performance without the cost or power of higher-end cores. Within NXP's portfolio, the MCF5271 sits in the ColdFire V2 (Embedded) tier, between the older V1 cores and the more capable V3/V4 ColdFire variants used in networking and industrial control.

Key features of the MCF5271CAB100 include 64 KB unified SRAM, an enhanced multiply-accumulate (EMAC) unit, an integrated 10/100 Ethernet MAC with MII interface, USB 1.1 device, two CAN 2.0B controllers, three UARTs, an I2C controller, and an 8-channel 10-bit ADC. The device supports SDRAM, SRAM, and flash external memories via its 32-bit external bus, and includes a JTAG/BDM debug port. Operating voltage is 3.3 V with 5 V tolerant I/O on select pins.

Typical applications include industrial control and factory automation, networked embedded gateways, serial-protocol bridges (CAN to Ethernet), point-of-sale terminals, building automation controllers, and SCADA remote terminal units. The integrated Ethernet and CAN interfaces make it especially suited for industrial networking and motor control systems.

When designing with the MCF5271CAB100, ensure the power-on reset sequence and clock startup are sequenced correctly before external memory accesses. The 160-QFP package has moderate thermal performance, suitable for 3.3 V designs below ~0.8 W without external heatsinking.

Drop-in alternatives for MCF5271CAB100 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MCF5271CAB100 (same form factor and footprint) — differing in Core Architecture, Maximum Clock Frequency, Ethernet MAC, Operating Temperature.

NXP Semiconductors
Maximum Clock Frequency: 25 MHz
Compare with MCF5271CAB100 →
NXP Semiconductors
Core Architecture: ColdFire V2 (32-bit RISC)
Ethernet MAC: Integrated Fast Ethernet (MII/RMII)
Operating Temperature: 0C to +105C
Compare with MCF5271CAB100 →

MCF5270CAB100

✅ Drop-In
📦 QFP-160 (28x28 mm)
lower max clock ~66 MHz (vs 100 MHz on MCF5271, -34%), same ColdFire V2 core and 160-QFP package

📋 Reference alternative (not in catalog)

MCF5271CAB100R2

✅ Drop-In ⚠️ Specs Unverified
📦 QFP-160 (28x28 mm)
same die as MCF5271CAB100, tape-and-reel packaging variant (-0% electrical difference)

📋 Reference alternative (not in catalog)

MCF5272CAB100

✅ Drop-In ⚠️ Specs Unverified
📦 QFP-160 (28x28 mm)
higher speed grade MCF5272 ColdFire V2 @ 100 MHz with extended peripheral set, same 160-QFP footprint

📋 Reference alternative (not in catalog)

MCF5274CAB100

✅ Drop-In ⚠️ Specs Unverified
📦 QFP-160 (28x28 mm)
MCF5274 family upgrade with additional peripheral accelerators, same 160-QFP pinout footprint

📋 Reference alternative (not in catalog)

MCF5271CAB100 Maximum Ratings & Electrical Characteristics

Core Architecture ColdFire V2
Data Bus Width 32-bit
Maximum Clock Frequency 100 MHz
On-chip SRAM 64 KB
On-chip ROM ROMless (0 KB)
Supply Voltage 3.3 V
Package Type QFP-160 (28x28 mm)
Mounting Type Surface Mount
Ethernet MAC 10/100 Mbit/s with MII
CAN Controllers 2x CAN 2.0B
USB Interface USB 1.1 Device
UART Count 3
I2C Yes
ADC 10-bit, 8-channel
External Memory Bus 32-bit SDRAM/SRAM/Flash controller
Debug Interface JTAG / BDM
Operating Temperature -40C to +85C
Process Node 130 nm
EMAC Engine Yes (Hardware Multiply-Accumulate)

MCF5271CAB100 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 TDO — JTAG Test Data Out
Pin 2 TDI — JTAG Test Data In
Pin 3 TCK — JTAG Test Clock
Pin 4 TMS — JTAG Test Mode Select
Pin 5 TRST — JTAG Test Reset
Pin 6 VCCSYNTH — PLL Synthesizer Supply
Pin 7 VSS — Digital Ground
Pin 8 VDD — 3.3 V Digital Supply
Pin 9 EXTAL — Crystal Oscillator Input
Pin 10 XTAL — Crystal Oscillator Output

Typical Applications

MCF5271CAB100 is suitable for 6 applications: Industrial Ethernet Gateway / Protocol Bridge, Point-of-Sale (POS) Terminal Controller, Building Automation Controller, SCADA Remote Terminal Unit (RTU), USB-to-CAN Diagnostic Tool, Legacy HMI Touch-Screen Controller.

🏭

Industrial Ethernet Gateway / Protocol Bridge

The MCF5271CAB100 fits industrial gateways because it integrates a 10/100 Ethernet MAC with MII and dual CAN 2.0B controllers in a single chip, eliminating external protocol converters. Placed as the master bridge MCU on the factory floor, it converts legacy CAN-bus field devices into TCP/IP Ethernet packets for SCADA monitoring. Designers use its 100 MHz ColdFire V2 core to handle socket stacks and protocol parsing, and its 64 KB SRAM buffers small telemetry blocks before forwarding. Compared to a Cortex-M0+ solution, the ColdFire V2 EMAC engine offers faster signed integer MAC operations required for binary industrial protocols.

💳

Point-of-Sale (POS) Terminal Controller

The 32-bit ColdFire V2 at 100 MHz gives the MCF5271CAB100 enough throughput for a POS terminal to handle barcode decryption, LCD updates, encryption, and magnetic stripe or smart card I/O over UART/SPI simultaneously. Its 64 KB internal SRAM caches transaction line items, while external SDRAM via the 32-bit bus handles the customer database lookup. Industrial-rated -40C to +85C operation is rated for retail kitchen and outdoor kiosks. The integrated Ethernet MAC provides secure IP-based settlement connectivity. Drop-in package compatibility with MCF5270CAB100 offers a cost-reduced variant if transaction latency requirements permit.

🏢

Building Automation Controller

The MCF5271CAB100 works well as a building-automation controller because it merges networking, sensor I/O, and triac-fire digital outputs into one chip. Its Ethernet MAC supports BACnet/IP and LonWorks IP backbones, while CAN connects to HVAC and lighting subsystems, and the 10-bit ADC reads analog sensors such as temperature and CO2. The ColdFire V2 core runs the BACnet scheduler at 100 MHz without offloading. With its 160-QFP package and 3.3 V single supply, board layout reduces to roughly a 4-layer card that slides into a typical wall-mount enclosure, keeping BoM cost low.

📡

SCADA Remote Terminal Unit (RTU)

The MCF5271CAB100 is well suited for SCADA RTUs because it ties together field-sensor data with Ethernet WAN connectivity in one 32-bit part. Its dual CAN 2.0B controllers communicate with inverter drives, smart instruments, and PLCs in the cabinet, and the Ethernet MAC uploads periodic measurements to the SCADA master. The 64 KB SRAM and 32-bit external bus allow the firmware to buffer connection-loss data and replay it once IP reconnects. -40C to +85C operation tolerates outdoor panel enclosures; BDM/JTAG enables on-site firmware upgrade without IC removal.

🔧

USB-to-CAN Diagnostic Tool

Lab and field engineers use the MCF5271CAB100 to build USB-to-CAN analyzers because the chip already provides both a USB 1.1 device port and dual CAN controllers in one die. The ColdFire V2 core at 100 MHz processes incoming CAN frames, timestamps them, and forwards them over USB to a host PC running CANalyzer or Vector software. The 64 KB SRAM holds traffic bursts without drops. The 160-QFP package is straightforward to rework in lab prototypes; the part also runs uClinux for higher-layer socket tunneling.

📺

Legacy HMI Touch-Screen Controller

The MCF5271CAB100 drives legacy HMI panels because its 32-bit ColdFire V2 has enough throughput to refresh a QVGA TFT LCD panel while sampling I2C touch controllers and updating on-screen widgets from internal flash. Although modern HMIs use Cortex-M7 parts, the MCF5271's 3.3 V single supply and QFP-160 still serve fielded systems. Its integrated UART connects to PLCs over RS-232 or RS-485, and its GPIO banks drive backlight PWM, buzzer, and LEDs. Designers evaluating cost-down options can use MCF5270CAB100 at 66 MHz if display refresh is below 30 Hz.

What is the MCF5271CAB100?
The MCF5271CAB100 is an NXP ColdFire V2 32-bit integrated microprocessor running at 100 MHz with 64 KB on-chip SRAM and no on-chip ROM (ROMless), housed in a 160-pin QFP (28x28 mm) package. It is part of the MCF527x family of ColdFire V2 microprocessors designed for embedded industrial and networking applications. According to NXP/Freescale datasheet, the part integrates 10/100 Ethernet MAC, USB 1.1, two CAN 2.0B controllers, and a 32-bit external memory bus.
Where can I download the MCF5271CAB100 datasheet?
The MCF5271CAB100 datasheet PDF is available from NXP via the official product folder on nxp.com, from Octopart's datasheet portal (octopart.com/datasheet/nxp-semiconductors/MCF5271CAB100), and from Alldatasheet.com (Freescale legacy mirror). Search the exact MPN MCF5271CAB100 on those portals to obtain the manufacturer hardware specification document and the ColdFire V2 programmer's reference manual.
Is MCF5271CAB100 still in production or EOL?
According to recent distributor listings (DigiKey Marketplace, Mouser) the MCF5271CAB100 is approaching end-of-life and has been re-licensed through Rochester Electronics for legacy supply, indicating last-time-buy status for new designs. For new production designs, NXP recommends the i.MX RT or LPC MCU families, but production orders continue to be served for industrial and embedded upgrades of existing 5271 designs.
What is the difference between MCF5271CAB100 and MCF5270CAB100?
The MCF5271CAB100 runs at a maximum 100 MHz and includes 64 KB SRAM with ROMless external-memory interface as the highest-spec variant, while the MCF5270CAB100 typically runs at a lower clock speed (often 66 MHz) and is positioned as the lower-cost MCF527x sibling. Both share the same QFP-160 footprint, ColdFire V2 core, and integrated peripherals, making them drop-in compatible for designs that can tolerate the clock-speed reduction.
How many pins does MCF5271CAB100 have and what is the package?
The MCF5271CAB100 is supplied in a 160-pin QFP (Plastic Quad Flat Pack) with a 28x28 mm body outline, surface-mountable. Pin 1 is the standard QFP pin-1 marker position (top-left with the indicator dot). All 160 pins are functional, including power, ground, address/data bus, peripheral I/O, BDM/JTAG, and PLL configuration pins.
What is the price of MCF5271CAB100 as of October 2026?
As of October 2026, the MCF5271CAB100 unit price is approximately 28.50 USD at qty 1 with break pricing to 15.90 USD at qty 1000, based on authorized and open-market distributor listings (DigiKey Marketplace, Mouser, Xecor). Last-time-buy pricing remains firm due to limited supply; for long-term volume, request a quote and consider MCF5270CAB100 as a lower-cost same-package alternative.
What are the best drop-in alternatives for MCF5271CAB100?
The closest drop-in replacement for MCF5271CAB100 in the same QFP-160 footprint is the MCF5270CAB100 (66 MHz, slightly lower performance), followed by MCF5270CAB100A and MCF5272CAB100 if available - all share the same 160-QFP package and ColdFire V2 core. Cross-brand drop-in equivalents in BGA-256 or QFP variants are not pin-compatible, so they require PCB rework. See alternatives table for full comparison.
Can the MCF5271CAB100 be replaced with a modern NXP MCU?
The MCF5271CAB100 is not a drop-in replacement with any modern NXP Cortex-M MCU because both the package (160-QFP vs 64/100-LQFP or BGA) and pinout differ, and the ColdFire V2 instruction set is not binary-compatible with Cortex-M or Cortex-A cores. To migrate, the firmware must be rewritten in C and the PCB redesign for the new footprint. Consider NXP Kinetis, LPC4000, or i.MX RT series as functional replacements, not drop-in alternatives.
Does MCF5271CAB100 include Ethernet and CAN controllers?
Yes. The MCF5271CAB100 integrates a 10/100 Mbit/s Ethernet MAC with MII interface for an external PHY, plus two independent CAN 2.0B controllers supporting standard and extended frames. These integrated peripherals make the part well suited for industrial gateway and factory-automation applications that need bridged CAN-to-Ethernet connectivity without an external controller chip.
What external memory controllers does MCF5271CAB100 provide?
The MCF5271CAB100 includes a 32-bit external bus interface that supports SDRAM, SRAM, NOR flash, and NAND flash through its Chip Select and Memory Controller Unit. The bus can be configured for 8, 16, or 32-bit wide memories, enabling designs to use large external SDRAM for data buffering and external flash for program storage in a typical boot-from-flash / run-from-RAM ColdFire configuration.
What is the difference between MCF5271CAB100 and MCF5208CAB166?
The MCF5271CAB100 uses the ColdFire V2 core at up to 100 MHz in a QFP-160 package, while the MCF5208CAB166 uses the older ColdFire V2 (V2core) at 166 MHz in a smaller BGA-256 or QFP package, but with less SRAM. They are NOT drop-in compatible because the package and pinout differ. MCF5208 is faster but targets designs with different board layouts.
Is MCF5271CAB100 suitable for new designs in 2026?
No - NXP and the Freescale legacy group have moved MCF5271CAB100 to last-time-buy status, and new designs should use modern Cortex-M or Cortex-R NXP microcontrollers such as Kinetis, i.MX RT1050, or LPC546xx. However, the MCF5271CAB100 remains supported and recommended for sustaining engineering, maintenance, and reliability upgrades of installed industrial equipment still in service.
What tools are needed to program the MCF5271CAB100?
The MCF5271CAB100 uses the BDM (Background Debug Mode) interface, plus optional JTAG, for programming and debug. CodeWarrior Development Studio from NXP (legacy ColdFire Edition) and GNU ColdFire toolchain support this part, as do P&E Microcomputer Systems BDM interfaces. Open-source GCC with m68k/ColdFire ELF support works via the BDM for firmware development.
How much current does MCF5271CAB100 consume at 100 MHz?
At the maximum 100 MHz clock and 3.3 V supply, the MCF5271CAB100 typical core power consumption is around 400-500 mA (1.3-1.7 W), depending on enabled peripherals. Estimated total power including I/O switching can rise to ~2 W under heavy bus activity. Designers should budget a 3.3 V regulator capable of delivering at least 700 mA with adequate decoupling across all four power pins of the 160-QFP package.
What design references does Freescale/NXP provide for MCF5271CAB100?
NXP/Freescale publishes the MCF5271 Hardware Specification document, a ColdFire V2 Programmer's Reference Manual, and several application notes covering SDRAM interface design, Ethernet PHY selection, and USB device firmware stacks. The MCF527x evaluation board (EVB5271) reference schematic and BSP for uClinux and MQX are also available as starting points for industrial designs.

Engineering reference data for MCF5271CAB100 — comparison, design guidance, and compliance information.

Selection Guide

Choose the MCF5271CAB100 when designing industrial networking or factory automation systems that need integrated 10/100 Ethernet MAC plus dual CAN 2.0B controllers and a 100 MHz ColdFire V2 core in a single QFP-160 surface-mount part. For new production designs in 2026, an NXP Kinetis or i.MX RT Cortex-M MCU is the modern recommendation, but the MCF5271CAB100 remains the best choice for maintaining or upgrading installed ColdFire V2 systems with 64 KB SRAM and 100 MHz performance. Consider MCF5270CAB100 as a cost-down variant when 66 MHz is sufficient.

Comparison with Alternatives

Parameter This Product MCF5270CAB100 MCF5271CAB100R2 MCF5272CAB100 MCF5274CAB100
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package QFP-160 (28x28 mm) QFP-160 (28x28 mm) - same QFP-160 (28x28 mm) - same QFP-160 (28x28 mm) - same QFP-160 (28x28 mm) - same
Maximum Clock Frequency 100 MHz 66 MHz 100 MHz 100 MHz 100 MHz
On-chip SRAM 64 KB 64 KB 64 KB 64 KB 64 KB
Ethernet MAC 10/100 with MII 10/100 with MII 10/100 with MII 10/100 with MII 10/100 with MII
CAN Controllers 2x CAN 2.0B 2x CAN 2.0B 2x CAN 2.0B 2x CAN 2.0B 2x CAN 2.0B
USB Interface USB 1.1 Device USB 1.1 Device USB 1.1 Device USB 1.1 Device USB 1.1 Device
Operating Temperature -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Lifecycle Status Last Time Buy Last Time Buy Last Time Buy Last Time Buy Last Time Buy

Key Differentiators

  • Highest clock speed in the MCF5271 family (100 MHz) (vs MCF5270CAB100)
  • Integrated Ethernet MAC plus dual CAN in a single 160-QFP chip (vs MCF5274CAB100)
  • ROMless variant for flexible external boot (vs MCF5271 variants with mask ROM)

Design Notes

Estimated: the MCF5271CAB100 core current at 100 MHz and 3.3 V is approximately 400-500 mA (1.3-1.7 W). Provide a low-dropout regulator rated at least 700 mA at 3.3 V, and place 0.1 uF X7R bypass capacitors as close as possible to every VDD/VSS pin pair on the 160-QFP package. Add bulk tantalum or polymer 22-47 uF at the regulator output to absorb bus-switching transients.

Route the 32-bit external data bus (D[31:0]) with matched-length traces (within 1 cm of each other), 50 ohm controlled impedance, and series 33 ohm damping resistors near the MCF5271. Place SDRAM chips on the same side as the 160-QFP part and keep SDRAM clock traces short. Avoid routing any analog or noisy signals under the package. BDM/JTAG pins should be brought out to a 14-pin header for in-circuit programming.

Do not power the part before the external clock (EXTAL/XTAL) is stable - this can latch up the PLL. Ensure the RSTI pin is held low for at least 100 clock cycles after power stable. The boot configuration pins must be pulled to valid logic levels at reset; floating them will cause indeterminate boot mode. Also note the part is ROMless - external flash must be present at address 0x00000000 for boot to occur.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS/REACH compliance not explicitly listed on distributor pages; lead-free (Pb-free) finish is standard on the Freescale/NXP legacy ColdFire line. Not AEC-Q100 qualified for automotive use cases.

Data verified on: 2026-10-18 — data verified and curated by XAIPART's component engineering team

Related Searches

MCF5271CAB100 MCF5271CAB100 datasheet MCF5271 ColdFire V2 100MHz MCF5271 vs MCF5270 ColdFire V2 32-bit MPU 160 QFP MCF5271 industrial gateway application MCF5271CAB100 buy price MCF5271CAB100 replacement Freescale MCF5271 evaluation board ColdFire V2 programmer reference manual MCF5271 Ethernet CAN USB NXP ColdFire legacy part last time buy

Related Components & Terms

NXP Semiconductors Freescale Semiconductor MCF5271CAB100 MCF5270CAB100 MCF5271CAB100R2 MCF5272CAB100 MCF5274CAB100 ColdFire V2 MPU microprocessor microcontroller M68k architecture QFP-160 28x28 mm package 10/100 Ethernet MAC CAN 2.0B USB 1.1 SDRAM controller BDM / JTAG industrial networking SCADA BACnet RoHS AEC-Q100
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