MCF53721CVM240 - ColdFire V3 32-Bit MPU 240MHz | NXP
MPN: MCF53721CVM240 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.55 | $13.55 |
| 10 | $12.2 | $122.00 |
| 100 | $10.85 | $1,085.00 |
| 500 | $9.92 | $4,960.00 |
| 1,000 | $9.35 | $9,350.00 |
MCF53721CVM240 Overview
What is a ColdFire microprocessor? ColdFire is a 68k-architecture derivative microprocessor family designed by Freescale/NXP that brings 32-bit processing to cost- and power-sensitive embedded applications. It sits within the MPU (microprocessor) hierarchy, above 8/16-bit microcontrollers, and provides higher clock speeds and richer peripheral integration. The MCF537x family specifically adds on-chip Ethernet, USB, and hardware encryption, targeting industrial control networks and secure communication endpoints.
The MCF53721CVM240 features 32 KB of unified SRAM, 62 programmable I/O lines, an external oscillator interface, and an integrated ColdFire V3 core capable of 211 Dhrystone 2.1 MIPS. Its advanced integration reduces BOM by consolidating communications peripherals, timers, and DMA into one device for connected industrial systems.
The ColdFire V3 core uses a Variable-Length RISC architecture with 16- and 32-bit instruction mixes, a hardware multiply/accumulate unit, and a configurable Memory Management Unit (MMU) on select derivatives. At 240 MHz the device consumes well under 1 W typical, an order of magnitude lower than comparable PowerPC parts, enabling fanless industrial designs.
Typical applications include industrial Ethernet gateways, secured building-automation controllers, and networked sensor hubs. The MCF53721CVM240 is also used in HVAC controllers, substation automation, and point-of-sale terminals where deterministic real-time response and hardware-accelerated cryptography simplify the firmware.
Designers should evaluate the absence of internal Flash when selecting boot configuration: external boot ROM or Flash is required, and the boot mode is sample-strapped via the configuration pins. Plan PCB layout with 4-layer minimum and matched-length Ethernet traces to meet signal integrity at 100 Mbps.
This page compiles distributor pricing, drop-in same-package alternatives from the MCF537x family, and application-specific design guidance not centralized in the manufacturer datasheet.
Drop-in alternatives for MCF53721CVM240 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCF53720CVM240
✅ Drop-In📋 Reference alternative (not in catalog)
MCF53722CVM240
✅ Drop-In📋 Reference alternative (not in catalog)
MCF53723CVM240
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MCF53721CVM240 Maximum Ratings & Electrical Characteristics
| Core Architecture | ColdFire V3 (32-bit) |
| Family | MCF537x (DragonFire) |
| Maximum Clock Frequency | 240 MHz |
| Dhrystone Performance | 211 MIPS (Dhrystone 2.1) |
| Program Memory Type | ROMless |
| RAM Size | 32K x 8 (32 KB unified SRAM) |
| Number of I/O Lines | 62 |
| Supply Voltage | 1.5 V core / 3.3 V I/O (typical) |
| Oscillator Type | External |
| Package | 196-LBGA (15x15 mm) |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| On-chip Peripherals | Ethernet, USB, encryption accelerator, DMA, timers |
| RoHS Status | Compliant |
MCF53721CVM240 196-lbga (15x15 mm) Pin Configuration Guide
Pin configuration for MCF53721CVM240 (196-lbga (15x15 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCF53721CVM240.
Refer to the datasheet for full pin configuration.
Typical Applications
MCF53721CVM240 is suitable for 6 applications: Industrial Ethernet Gateway, Building Automation Controller, Networked Sensor Hub, HVAC Controller Board, Substation Automation / Energy Management, Point-of-Sale Terminal.
Industrial Ethernet Gateway
The MCF53721CVM240's integrated dual 10/100 Ethernet MAC, 240 MHz ColdFire V3 core, and hardware encryption accelerator make it ideally suited as the central processor in industrial Ethernet gateways. Its 211 Dhrystone 2.1 MIPS deliver enough headroom to run Profinet, EtherNet/IP, or Modbus TCP protocol stacks concurrently with a TLS/DTLS security layer without external crypto assistance. The 32 KB on-chip SRAM buffers incoming frames at line rate, while the external 32-bit memory bus connects to 8-32 MB of SDRAM for connection tables and firmware. Designers place the part on a 4-layer PCB with impedance-controlled 100-ohm differential pairs for Ethernet and a ferrite bead on the analog 1.5 V core rail to meet CISPR 11 emissions in industrial environments.
Recommended
Building Automation Controller
BACnet/IP, KNX, and LonWorks gateways require deterministic interrupt latency, real-time Ethernet connectivity, and robust peripheral integration - areas where the MCF53721CVM240 excels. The ColdFire V3 core's interrupt response time and integrated Ethernet MAC produce reliable protocol timing, while the 240 MHz clock supports encrypted BACnet Secure Communication (BACnet/SC) sessions. Its 62 programmable I/O lines interface directly to field wiring (relays, triacs, optocouplers) without external GPIO expanders. The -40C to +85C industrial temperature rating (to verify per datasheet) suits unheated equipment closets. Designers route the 32 KB SRAM for stack/heap use and back the part with 16 MB SDRAM for IP routing tables; the external bus controller handles chip-select decoding for boot Flash and SRAM chip-enables.
Recommended
Networked Sensor Hub
Energy and environmental sensor hubs aggregate dozens of sensor inputs and forward them over Ethernet or cellular links - a workload that matches the MCF53721CVM240's combination of an ADC interface, multiple UART/SPI/I2C controllers, and 240 MHz processing. The ColdFire V3 core runs Micrium uC/OS-II or FreeRTOS with deterministic task scheduling, while DMA channels offload bulk sensor data transfers, freeing CPU cycles for protocol encryption and aggregation. Hardware encryption offloads secure MQTT or TLS to a coprocessor block, lowering CPU load 30-50%. The 196-LBGA (15x15 mm) package permits PCB designs below 50x50 mm for compact DIN-rail enclosures, and the part's sub-1 W power consumption enables PoE-powered operation.
Recommended
HVAC Controller Board
Commercial HVAC controllers need reliable 32-bit processing for PID loops, multi-protocol connectivity, and a wide operating temperature range for plant-room installations. The MCF53721CVM240's ColdFire V3 core drives multi-loop PID at millisecond resolution while its integrated Ethernet and UART ports bridge to BACnet MS/TP, Modbus RTU, and KNX buses. The 240 MHz clock leaves sufficient MIPS headroom for graphical touch-display controllers or zone scheduling algorithms. Designers should size the external memory bus to at least 8 MB Flash for firmware over-the-air updates. For fanless mounting, the part's typical 0.7 W power draw is acceptable inside sealed enclosures with passive heatsink-only cooling.
Recommended
Substation Automation / Energy Management
Substation automation controllers compile IEC 61850 GOOSE messages, run real-time fault detection, and forward telemetry over Ethernet - all tasks well-served by the MCF53721CVM240's 211 Dhrystone MIPS, dual Ethernet MACs, and hardware encryption. The ColdFire V3 core processes GOOSE frames with sub-millisecond latency, while the encryption accelerator handles DNP3-SA authentication. Its 62 GPIO lines interface to digital I/O modules via backplane connectors. The 15x15 mm LBGA package integrates into dense backplane PCBs that fan out to multiple slots. Verify operating-temperature grade against the datasheet for utility-cabinet deployment; an industrial-grade derivative should be sourced for full -40C to +85C coverage.
Recommended
Point-of-Sale Terminal
POS terminals require secure transaction processing, multi-protocol peripheral support, and reliable operation in retail environments - features the MCF53721CVM240 supports well. The ColdFire V3 core handles encrypted PIN-pad communication, USB peripherals (barcode scanners, receipt printers), and Ethernet/IP-based payment authorization. The hardware encryption block accelerates AES and 3DES for PCI-PTS compliance without offloading to a separate secure-element IC. The 196-LBGA package fits the compact mainboards typical of POS hardware, while the 240 MHz clock delivers enough processing headroom for color touch-display UI rendering.
Recommended
Recommended Products Summary
Engineering reference data for MCF53721CVM240 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCF53720CVM240 | MCF53722CVM240 | MCF53723CVM240 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Package | 196-LBGA (15x15 mm) | 196-LBGA (15x15) - same | 196-LBGA (15x15) - same | 196-LBGA (15x15) - same |
| Core | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 |
| Clock Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz |
| Dhrystone MIPS | 211 MIPS | 211 MIPS | 211 MIPS | 211 MIPS |
| On-chip SRAM | 32 KB | 32 KB | 32 KB | 32 KB |
| Encryption Accelerator | Yes | Reduced | Yes | Yes (full) |
| Ethernet MACs | 2 (10/100) | 2 (10/100) | 2 (10/100) | 2 (10/100) |
| USB | Yes (OTG) | Yes (Host/Device) | Yes (OTG) | Yes (OTG) |
Key Differentiators
- In-family drop-in alternative available without PCB rework (vs MCF5329 part numbers (different pinout))
- Modern ColdFire V3 core with on-chip encryption (vs MCF5272VF66 (ColdFire V2, 66 MHz))
- Higher Dhrystone performance than competing legacy Freescale parts (vs MCF5232CVM100 (100 MHz))
Design Notes
Estimated: at 240 MHz with all peripherals enabled, expect approximately 0.7-0.9 W total power consumption. Decouple the 1.5 V core rail with at least 10 uF ceramic plus 1 uF bulk tantalum to handle dynamic load steps when peripherals transition from idle. Add a ferrite bead between the 3.3 V supply and the analog PLL rail to reduce jitter. The MCF53721CVM240 requires separate 1.5 V and 3.3 V rails; ensure sequencing: 3.3 V should ramp within 100 ms before the 1.5 V rail to avoid latch-up.
The 196-LBGA package has a thermal resistance around 25-30 C/W (theta_JB) with proper PCB land pattern. At full load the part dissipates under 1 W, so a fanless design is reasonable, but the LBGA thermal pad must be soldered to a continuous ground plane. Add 8-12 thermal vias under the exposed die-attach paddle to spread heat into internal copper layers. Avoid running the part in a sealed enclosure above +70C ambient without verifying junction temperature against the datasheet's thermal derating curve.
Use a 4-layer PCB minimum with continuous ground and power planes adjacent to signal layers. The 196-LBGA package has 1.0 mm ball pitch - microvia technology (HDI) is optional but recommended for escape routing. Route Ethernet MII signals (TX/RX clocks and data) with matched lengths within 50 mil, and place the 49.9-ohm termination resistors within 5 mm of the MCF53721CVM240 pins. Keep the external 32-bit memory bus traces short to minimize capacitive loading; group SDCLK, SDCAS, SDRAS, and SDWE tightly.
Do not assume any on-chip Flash exists - boot firmware must be loaded from external Flash via the external bus controller. The RSTOUT pin should drive external reset supervisor chips; do not leave it floating. JTAG TCK must be pulled low through a 10k resistor during normal operation to avoid accidental boundary-scan intrusion. The boot-mode configuration pins (BM[0:2]) are sampled at reset; ensure they are tied to valid logic levels with no intermittent state. Do not substitute similar MCF5329 variants - they are not pin-compatible despite similar package.
Place the external 32.768 kHz crystal within 5 mm of the RTC pins and route its traces symmetrically with a guard ring to ground. For USB OTG routing, target 90-ohm differential impedance with no more than two vias in series on D+/D-. Bypass the PLL analog supply (PLLVDD) with a 1 uF ceramic and a 0.01 uF ceramic in parallel; keep this island isolated from digital switching noise. The RMII/MII reference clock output buffer should drive short traces; if the PHY is more than 25 mm away, consider adding a clock buffer to avoid jitter accumulation.
Compliance Information
RoHS/REACH compliant per NXP environmental documentation. Standard commercial-grade part; AEC-Q100 not applicable for an industrial MPU. Halogen-free per NXP CoA for LBGA encapsulation.
