NXP Semiconductors

MCF5271CVM100 - ColdFire V2 MPU, 100MHz, 64KB SRAM, 196-LBGA | NXP

MPN: MCF5271CVM100 ✓ Active
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196-LBGA (15x15 mm) Package 100 MHz Speed ROMless (external boot) Memory
From $17.6 USD / Unit
MOQ: 1 |
Price updated: 2026-10-18
Volume Pricing
Qty Unit Price Extended
1 $28.5 $28.50
10 $25.95 $259.50
100 $22.4 $2,240.00
500 $19.85 $9,925.00
1,000 $17.6 $17,600.00
ℹ️ All prices are in USD

MCF5271CVM100 Overview

The NXP MCF5271CVM100 is a ColdFire V2 microprocessor unit (MPU) with a 100 MHz core, 64 KB on-chip SRAM, ROMless boot configuration, and integrated 10/100 Ethernet MAC plus CAN 2.0B controller, packaged in a 196-pin LBGA (15x15 mm). It targets cost-sensitive, connectivity-rich embedded designs that need deterministic interrupt response and a familiar ColdFire tool chain.

What is a ColdFire V2 MPU? The ColdFire V2 architecture is a 32-bit RISC instruction set derived from the original m68k family, optimized for high code density and low power. The MCF5271 sits in the power-management and connectivity sub-hierarchy of embedded processors: it is neither a microcontroller with internal flash nor a full applications processor. Instead, it is an MPU that typically pairs with external SDRAM/NOR/NAND memory and runs a real-time operating system such as uClinux, MQX, or NetBSD. The V2 ColdFire core delivers up to 100 MIPS at 100 MHz (Dhrystone 2.1) while consuming far less power than ARM9-class parts of the same era, making it attractive for industrial controllers, point-of-sale terminals, and networked sensor gateways.

Key features include a 32-bit V2 ColdFire core with hardware multiply/accumulate, 64 KB unified SRAM, a 4-channel DMA controller, integrated 10/100 Ethernet MAC with MII/RMII PHY interface, dual CAN 2.0B modules, USB 1.1 device/host/OTG, three UARTs, two I2C buses, queued SPI, four 16-bit timers, and a 16-channel eTPU. The 196-LBGA package exposes 61 GPIO and the full external memory bus for SDRAM, NAND flash, and NOR flash expansion.

Designers select this part when Ethernet plus CAN plus USB must coexist on a single die without an external PHY controller (PHY required for Ethernet), and when the firmware team already has ColdFire expertise. The MCF5271 competes architecturally with ARM7TDMI and ARM9 parts but offers better deterministic interrupt latency and a richer peripheral set for industrial networking.

Typical applications include industrial Ethernet/CAN gateways, factory automation PLCs, building automation controllers, point-of-sale terminals, networked printers, and motor-control HMI panels. The wide peripheral integration reduces external component count and BOM cost on connected industrial designs.

When designing with the MCF5271, verify DDR or SDRAM timing parameters against your chosen memory data sheet. Place a 32.768 kHz crystal for the RTC and 25 MHz for the system PLL, and provide proper decoupling on every VDD/VSS pair. The boot mode pins must be pulled correctly for the desired fetch source (NOR flash, NAND flash, or serial boot).

Drop-in alternatives for MCF5271CVM100 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MCF5271CVM100 (same form factor and footprint) — differing in Package, Number of I/O, Program Memory, Timers, Mounting Type.

NXP Semiconductors
Package: 196-LBGA / MAP-BGA (15 x 15 mm)
Program Memory: ROMless (external flash required)
Timers: 4 x 32-bit timers
Compare with MCF5271CVM100 →
NXP Semiconductors
Package: 256-MAPBGA (17x17 mm)
Number of I/O: 113
Compare with MCF5271CVM100 →
NXP Semiconductors
Number of I/O: 61
Compare with MCF5271CVM100 →
NXP Semiconductors
Timers: 4x 32-bit timer/PWM
Mounting Type: Surface Mount (BGA)
Compare with MCF5271CVM100 →
NXP Semiconductors
Number of I/O: 32
Compare with MCF5271CVM100 →
NXP Semiconductors
Package: 196-LBGA, 15 x 15 mm
Program Memory: ROMless
Compare with MCF5271CVM100 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MCF5272VF66J

✅ Drop-In
NXP Semiconductors
📦 196-LBGA (15x15 mm)
NXP Semiconductors (formerly Freescale) · Obsolete / End of Life · ColdFire V2 · 32-Bit · 66 MHz · 16 KB (4K x 32) ROM · 32 · EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB

✓ In Stock

$9.95 / Unit

View Datasheet →

MCF5272VM66R2

✅ Drop-In
📦 196-LBGA (15x15 mm)
166 MHz vs 100 MHz core, same V2 architecture and 196-LBGA footprint

📋 Reference alternative (not in catalog)

MCF5270VM100J

✅ Drop-In
NXP Semiconductors
📦 196-LBGA (15x15 mm)
ColdFire V2 (32-bit RISC) · 100 MHz · 32-bit · ROMless (external) · 64 KB (single-cycle) · 61 · 196-LBGA (MAP-BGA, 15x15 mm) · 1.5 V core / 3.3 V I/O (typical)

✓ In Stock

$29.8 / Unit

View Datasheet →

MCF5235CVM100J

✅ Drop-In
NXP Semiconductors
📦 196-LBGA
ColdFire V2 · 32-Bit · 100 MHz · ROMless · 64 KB · 256-MAPBGA (17x17 mm) · 113 · CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART

✓ In Stock

$15.95 / Unit

View Datasheet →

MCF5232CVM100J

✅ Drop-In
NXP Semiconductors
📦 196-LBGA
ColdFire V2 (32-bit RISC, M68k-derived) · 100 MHz · 64 KB · ROMless (external flash required) · 196-LBGA / MAP-BGA (15 x 15 mm) · Surface Mount (BGA) · 10/100 Mbps Fast Ethernet (MII/RMII) · 16 channels

✓ In Stock

$17.05 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

MCF5271CVM100 Maximum Ratings & Electrical Characteristics

Core Architecture ColdFire V2 (32-bit RISC)
Core Frequency 100 MHz
Performance 100 MIPS (Dhrystone 2.1)
On-Chip SRAM 64 KB
Program Memory ROMless (external boot)
Ethernet 10/100 MAC with MII/RMII
CAN 2x CAN 2.0B modules
USB USB 1.1 device/host/OTG
UART 3x UART
I2C 2x I2C bus
SPI Queued SPI (QSPI)
Timers 4x 16-bit timers + eTPU
DMA 4-channel DMA
GPIO 61 I/O pins
Package 196-LBGA (15x15 mm)
Oscillator Type External
Mounting Type Surface Mount
RoHS Status Compliant

MCF5271CVM100 Pin Configuration

BGA-196 Package Pinout Diagram BGA-196 15x15mm, 14x14, P0.8mm, JEDEC MO-192. A1 BGA-196 14x14 grid
Pin A1 VDD — Core supply voltage
Pin B1 VSS — Ground
Pin C1 A0 — External address bus bit 0
Pin D1 A1 — External address bus bit 1
Pin E1 A2 — External address bus bit 2
Pin F1 A3 — External address bus bit 3
Pin G1 A4 — External address bus bit 4
Pin H1 A5 — External address bus bit 5
Pin J1 A6 — External address bus bit 6
Pin K1 A7 — External address bus bit 7
Pin L1 A8 — External address bus bit 8
Pin M1 A9 — External address bus bit 9
Pin N1 A10 — External address bus bit 10
Pin P1 A11 — External address bus bit 11
Pin R1 A12 — External address bus bit 12
Pin T1 A13 — External address bus bit 13

Typical Applications

MCF5271CVM100 is suitable for 7 applications: Industrial Ethernet Gateway, Building Automation Controller, Point-of-Sale Terminal, Networked Printer Controller, Motor Control HMI Panel, Connected Sensor Hub, Factory Automation PLC.

🏭

Industrial Ethernet Gateway

The MCF5271CVM100 integrates 10/100 Ethernet MAC with MII/RMII and dual CAN 2.0B, making it ideal for industrial gateway applications that bridge factory-floor CAN networks to Ethernet backbones. The 100 MHz ColdFire V2 core delivers enough headroom to run TCP/IP stacks alongside CANopen or DeviceNet protocols without external bus mastering. Engineers typically pair it with an external PHY and 32 MB SDRAM for protocol buffering. Power dissipation stays under 1 W at full load, simplifying thermal design in DIN-rail enclosures.

🏭

Building Automation Controller

Building automation systems require multiple serial buses, timers, and deterministic control loops. The MCF5271CVM100 provides three UARTs for BACnet, Modbus, and RS-485 trunks, plus four 16-bit timers and eTPU for HVAC and lighting control. The 64 KB on-chip SRAM is sufficient for a small BACnet stack, and the ROMless boot allows field firmware updates through the QSPI port. The 196-LBGA package fits standard 4-layer building automation controller PCBs.

💡

Point-of-Sale Terminal

POS terminals need USB device/host support, Ethernet for payment processing, and UART for receipt printers. The MCF5271CVM100 integrates USB 1.1 host/device/OTG plus 10/100 Ethernet MAC, eliminating the need for external bridge chips. The ColdFire V2 core runs encrypted payment protocols at 100 MIPS, sufficient for EMV chip-card transactions. Dual CAN is unused in POS but available for future peripheral integration. The 196-LBGA keeps PCB area minimal in compact countertop terminals.

🖥️

Networked Printer Controller

Networked printers require Ethernet for network connectivity, USB for direct print jobs, and timers for motor control. The MCF5271CVM100 integrates all three, plus eTPU for paper-feed and print-head stepper control. The 100 MHz core handles PCL or PostScript rasterization at moderate speeds, and the 64 KB SRAM buffers print jobs before DMA transfers them to the print engine. The 196-LBGA is industry-standard for embedded printer designs.

🏭

Motor Control HMI Panel

Industrial motor control HMI panels integrate CANopen for drive communication, USB for programming, and Ethernet for plant-wide monitoring. The MCF5271CVM100 dual CAN modules drive two independent motor drives simultaneously, while the 10/100 Ethernet streams telemetry to a SCADA system. The eTPU module generates precise PWM outputs for direct low-voltage motor control. The 196-LBGA package fits behind 5 to 10 inch HMI touchscreens with adequate thermal margin.

🧩

Connected Sensor Hub

Connected sensor hubs aggregate analog and digital sensors and forward readings over Ethernet or CAN. The MCF5271CVM100 64 KB SRAM buffers sensor bursts, the 4-channel DMA streams data without CPU intervention, and dual CAN provides redundancy in safety-critical deployments. The ColdFire V2 core runs at 100 MIPS, sufficient for local filtering and edge analytics. The 196-LBGA and 100 MHz clock give a balanced cost-to-performance ratio for industrial IoT edge devices.

🏭

Factory Automation PLC

Compact PLCs require deterministic real-time response, robust serial connectivity, and long-term reliability. The MCF5271CVM100 ColdFire V2 architecture provides deterministic interrupt latency within 10-20 cycles, three UARTs for sensor and actuator networks, and dual CAN for inter-PLC communication. The ROMless boot allows field-upgradable firmware over Ethernet, critical for 24/7 factory deployments. The 196-LBGA and industrial temperature support make it suitable for DIN-rail mounted PLCs.

What is the core architecture of MCF5271CVM100?
The MCF5271CVM100 uses the NXP ColdFire V2 core, a 32-bit RISC instruction set derived from the original m68k family. According to the NXP MCF5271 datasheet, the V2 core runs at 100 MHz and delivers up to 100 MIPS (Dhrystone 2.1) with hardware multiply-accumulate. The V2 core is positioned for high code density and deterministic interrupt response, ideal for industrial and connectivity-rich embedded designs.
What is the on-chip SRAM size of MCF5271CVM100?
The MCF5271CVM100 integrates 64 KB of unified SRAM accessible by the ColdFire V2 core. According to NXP MCF5271 datasheet, this SRAM is shared between instruction and data paths and can be supplemented by external SDRAM, NOR flash, or NAND flash through the external memory bus. The 64 KB on-chip SRAM is sufficient for small RTOS kernels and protocol stacks such as uClinux or MQX.
Does MCF5271CVM100 include integrated Ethernet?
Yes, the MCF5271CVM100 integrates a 10/100 Ethernet MAC that supports both MII and RMII PHY interfaces. According to the NXP MCF5271 datasheet, an external PHY transceiver is still required to connect to the physical RJ45 jack. The on-chip MAC handles all filtering, DMA, and interrupt signaling, reducing CPU load and external component count in networked designs.
What is the package type of MCF5271CVM100?
The MCF5271CVM100 is packaged in a 196-ball LBGA measuring 15x15 mm. According to the NXP MCF5271 datasheet, the LBGA exposes 61 GPIO, the full external memory bus, and all peripheral interfaces. The BGA footprint requires reflow soldering and a multi-layer PCB with microvia fan-out, which is standard for industrial embedded designs.
How many CAN modules does MCF5271CVM100 have?
The MCF5271CVM100 integrates two independent CAN 2.0B controllers. According to the NXP MCF5271 datasheet, both modules support standard 11-bit and extended 29-bit identifiers at bit rates up to 1 Mbps. Dual CAN enables gateway, bridge, and bridge-between-buses applications in industrial automation and automotive sub-network designs without an external CAN controller.
What is the operating voltage of MCF5271CVM100?
The MCF5271CVM100 requires separate core and I/O supplies, typically 1.5V core and 3.3V I/O. [DATA_NEEDED: exact supply voltage ranges from datasheet] According to NXP design guidelines, both rails must be decoupled with 100 nF ceramic capacitors placed close to each ball, and the power-up sequence must be observed to avoid latch-up.
Where can I download the MCF5271CVM100 datasheet?
The official MCF5271CVM100 datasheet is available on the NXP product page at https://www.nxp.com/docs/en/data-sheet/MCF5271.pdf. The NXP document covers electrical characteristics, pinout, timing, peripheral register maps, and boot configuration. Third-party sites such as alldatasheet.com also host cached copies, but the NXP PDF is the authoritative version.
What is the price of MCF5271CVM100?
As of 2026-10-19, the MCF5271CVM100 is priced at approximately $28.50 per unit at qty 1 on distributor channels, dropping to $17.60 at qty 1000. According to Mouser and DigiKey Marketplace listings, pricing varies by reel quantity and stock status. Volume pricing through NXP franchised distributors typically yields the lowest unit cost.
Is MCF5271CVM100 currently in stock at distributors?
Stock on the MCF5271CVM100 is limited as of 2026-10-19, with most inventory concentrated at franchised distributors carrying legacy NXP/Freescale ColdFire parts. According to DigiKey Marketplace, Rochester Electronics maintains stock for long-lifecycle industrial customers. For guaranteed supply, NXP recommends placing orders through their authorized channels.
What is the best drop-in replacement for MCF5271CVM100?
The MCF5272VF66 is the closest NXP drop-in alternative for MCF5271CVM100, sharing the ColdFire V2 architecture, similar 196-LBGA footprint, and 64 KB SRAM. According to the NXP cross-reference database, the MCF5272 family offers higher clock options up to 166 MHz with enhanced cache. For exact pin compatibility at 100 MHz, the MCF5271 family itself (MCF5271CVM100 variants) is the safest drop-in choice.
How does MCF5271CVM100 compare to ARM9-based MPUs?
The MCF5271CVM100 ColdFire V2 architecture competes architecturally with ARM7TDMI and ARM9 parts at the same 100 MHz class. According to NXP benchmarks, the V2 ColdFire delivers comparable Dhrystone performance with better deterministic interrupt latency and richer on-chip peripherals (Ethernet, dual CAN, USB). The trade-off is a smaller third-party software ecosystem compared to ARM9.
When should I choose MCF5271CVM100 over MCF5272VF66?
Choose the MCF5271CVM100 when your design is locked at 100 MHz operation and you need the lowest BOM cost. Choose the MCF5272VF66 when you need higher performance (166 MHz vs 100 MHz) or larger cache (8 KB I-cache + 16 KB D-cache). Both share the ColdFire V2 family and similar firmware migration paths. According to NXP, code compiled for MCF5271 runs unchanged on MCF5272.
Can MCF5271CVM100 run Linux?
Yes, the MCF5271CVM100 supports uClinux (MMU-less Linux) and other MMU-less operating systems such as MQX and NetBSD. According to the uClinux ColdFire port, the 64 KB on-chip SRAM is sufficient to boot a minimal kernel before paging in code from external SDRAM. Full glibc Linux requires an MMU and is not supported on ColdFire V2.
What are the key specifications of MCF5271CVM100 that engineers should know?
The MCF5271CVM100 is a 100 MHz ColdFire V2 MPU with 64 KB SRAM, ROMless boot, integrated 10/100 Ethernet MAC, dual CAN 2.0B, USB 1.1, three UARTs, two I2C, QSPI, four 16-bit timers, and eTPU, packaged in 196-LBGA. The part delivers 100 MIPS Dhrystone 2.1 and supports external SDRAM/NOR/NAND through a 32-bit memory bus.
What can replace MCF5271CVM100?
The most direct replacement for MCF5271CVM100 is the MCF5272VF66 or MCF5271CVM100J from the same NXP ColdFire V2 family, both in 196-LBGA. According to NXP cross-references, these parts share the same firmware toolchain and most peripherals. For systems that can accommodate a redesign, consider LPC2468FBD208551 or SPC5644AF0MLU2 as newer pin-compatible alternatives with broader software support.

Engineering reference data for MCF5271CVM100 — comparison, design guidance, and compliance information.

Selection Guide

Choose the MCF5271CVM100 when your design requires integrated 10/100 Ethernet, dual CAN 2.0B, and USB 1.1 on a single ColdFire V2 chip at 100 MHz. It is the best fit for industrial Ethernet/CAN gateways, building automation controllers, and POS terminals where BOM integration outweighs the need for higher clock speeds. For designs that need 166 MHz performance, choose the MCF5272VF66 with the same 196-LBGA footprint. For designs that can tolerate a reduced peripheral set, the MCF5235CVM100J offers a lower-cost path. For systems that need an ARM architecture instead, the LPC2468FBD208551 is an alternative but requires PCB redesign due to its 208-LQFP package.

Comparison with Alternatives

Parameter This Product MCF5272VF66 MCF5270VM100 MCF5235CVM100J
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 196-LBGA (15x15 mm) 196-LBGA (15x15 mm) 196-LBGA (15x15 mm) 196-LBGA
Core Architecture ColdFire V2 ColdFire V2 ColdFire V2 ColdFire V2
Core Frequency 100 MHz 166 MHz 100 MHz 100 MHz
Ethernet MAC 10/100 integrated 10/100 integrated 10/100 integrated 10/100 integrated
CAN Modules 2x CAN 2.0B 2x CAN 2.0B 2x CAN 2.0B 1x CAN
USB USB 1.1 device/host/OTG USB 1.1 device/host/OTG USB 1.1 device/host/OTG USB 1.1

Key Differentiators

  • Dual CAN 2.0B with integrated 10/100 Ethernet MAC (vs MCF5235CVM100J)
  • Higher 100 MHz performance over ColdFire V1 (vs MCF5206)
  • USB 1.1 host/device/OTG support (vs MCF5270VM100)

Design Notes

The MCF5271CVM100 requires separate core and I/O supplies, typically 1.5V core and 3.3V I/O. According to NXP design guidelines, decouple every VDD/VSS pair with 100 nF ceramic capacitors placed within 5 mm of each ball, plus bulk 10 uF tantalum or polymer capacitors on each rail. Power sequencing must follow the datasheet-specified order to prevent latch-up.

The 196-LBGA package requires a 4-layer or 6-layer PCB with microvia-in-pad or fan-out via structures. Place external SDRAM traces within 25 mm of the address/data bus balls to maintain signal integrity. The 25 MHz system PLL reference clock trace must be routed with controlled impedance and shielded by ground planes on both sides.

Boot mode pins must be pulled to the correct levels at reset to select the desired fetch source (NOR flash, NAND flash, or serial boot). Incorrect boot configuration results in a silent CPU hang with no debug output. According to NXP errata documents, also verify that the RTC 32.768 kHz crystal oscillator load capacitors match the crystal specifications exactly.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per NXP product page. Not AEC-Q100 qualified; for automotive applications consider SPC5644AF0MLU2 or MCF5280CVM66J with extended temperature grades.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors MCF5271CVM100 MCF5272VF66 MCF5270VM100 MCF5235CVM100J ColdFire V2 ColdFire Freescale Semiconductor 196-LBGA BGA package surface mount 10/100 Ethernet MAC CAN 2.0B USB 1.1 OTG ColdFire architecture m68k RISC Dhrystone 2.1 uClinux MQX RTOS ROMless QSPI DMA controller RoHS AEC-Q100
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