MCIMX257CJM4A - i.MX25 ARM926EJ-S MPU 400MHz 400-LFBGA | NXP
MPN: MCIMX257CJM4A ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $20.8 | $208.00 |
| 100 | $18.95 | $1,895.00 |
| 500 | $17.4 | $8,700.00 |
| 1,000 | $15.95 | $15,950.00 |
MCIMX257CJM4A Overview
What is an ARM926EJ-S microprocessor? An ARM926EJ-S is a 32-bit RISC processor core based on the ARMv5TEJ architecture, featuring the Jazelle Java bytecode accelerator for hardware-accelerated Java execution. It sits within the broader hierarchy: ARM926EJ-S -> ARM9 family -> ARM architecture -> 32-bit embedded microprocessor -> microprocessor IC. The i.MX25 family extends NXP's ARM9-based portfolio and adds DDR2 memory support, two embedded USB PHYs, 3.3 V I/O compatibility, three general-purpose 12-bit ADCs, and a touchscreen controller.
Key features of the MCIMX257CJM4A include 400 MHz CPU clock, 128 GPIO lines, integrated DDR/DDR2 memory controller, dual USB 2.0 OTG PHYs, three 12-bit SAR ADCs, a 4-wire resistive touchscreen controller, and an on-chip NAND/NOR flash controller. The package offers 400 balls on a 17x17 mm MAP-BGA substrate suitable for high-density industrial designs. The industrial temperature grade (-40C to +85C) makes it suitable for factory automation and HMI panels.
Architecturally, the i.MX25 employs a layered bus matrix with separate AHB layers for system RAM, peripherals, and external memory, helping sustain throughput under simultaneous loads. The integrated video processing blocks (i.MX25 has basic image processing and LCD controller) interface directly to TFT panels. Hardware cryptography is not present in this SoC; security-sensitive workloads are offloaded to companion ICs.
Typical applications include industrial human-machine interfaces (HMIs), point-of-sale terminals, portable data collectors, barcode scanners, factory automation controllers, and consumer electronics requiring low-power 32-bit processing with rich peripheral integration. The 400-LFBGA package supports fine-pitch PCB designs typical of industrial control boards.
When designing with this processor, pay close attention to PCB stack-up and BGA fanout routing. A minimum 4-layer PCB with continuous power planes is recommended. Thermal management is typically passive due to the low power consumption of the ARM926EJ-S at 400 MHz, but a copper-spreader thermal pad under the BGA is still advisable for industrial temperature compliance.
This page synthesizes verified distributor pricing, drop-in alternatives, and practical design considerations beyond the manufacturer datasheet summary, helping engineers evaluate the MCIMX257CJM4A for new designs and legacy industrial platforms.
Drop-in alternatives for MCIMX257CJM4A — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCIMX257CJM4A (same form factor and footprint) — differing in Package, Core Architecture, LCD Controller, USB, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCIMX253CJM4A
✅ Drop-In✓ In Stock
$22.8 / Unit
View Datasheet →MCIMX255CJM4A
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX258CJM5A
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX256CJM3A
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX257CJM4A Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM926EJ-S (ARMv5TEJ) |
| Core Count | 1 |
| Data Bus Width | 32-bit |
| Maximum CPU Clock | 400 MHz |
| External Memory Support | DDR/DDR2, NAND, NOR flash |
| Number of I/O | 128 |
| Package | 400-LFBGA (17x17 mm) |
| Oscillator Type | External |
| USB | 2x USB 2.0 OTG with integrated PHY |
| ADC | 3x 12-bit SAR ADC |
| Touchscreen Controller | 4-wire resistive, integrated |
| Graphics | LCD controller (basic, no GPU) |
| Operating Temperature | -40C to +85C (industrial) |
| Mounting Type | Surface Mount (BGA) |
| Packaging | Tray |
| RoHS Status | Compliant |
MCIMX257CJM4A 400-lfbga (17x17 mm) Pin Configuration Guide
Pin configuration for MCIMX257CJM4A (400-lfbga (17x17 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCIMX257CJM4A.
Refer to the datasheet for full pin configuration.
Typical Applications
MCIMX257CJM4A is suitable for 6 applications: Industrial Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) Terminals, Portable Data Collectors and Barcode Scanners, Factory Automation Controllers, Consumer Electronics with Touch UI, Medical Monitoring Device Interfaces.
Industrial Human-Machine Interface (HMI) Panels
The MCIMX257CJM4A is well suited to industrial HMI panels thanks to its 400 MHz ARM926EJ-S core, integrated 4-wire resistive touchscreen controller, and LCD interface driving TFT panels up to SVGA resolution. The three 12-bit SAR ADCs support analog front-ends for sensor monitoring on the same board. With 128 GPIO, designers can drive keys, LEDs, rotary encoders, and backlight control without external logic. The industrial -40C to +85C rating ensures continuous operation on factory floors where ambient temperatures fluctuate.
Recommended
Point-of-Sale (POS) Terminals
POS terminals benefit from the MCIMX257CJM4A's combination of ARM926EJ-S processing, dual USB 2.0 OTG PHYs (for barcode scanners and receipt printers), and DDR2 memory support for transaction databases. The integrated touchscreen controller accepts signature-capture input directly, reducing external component count. Running embedded Linux or WinCE on the 400 MHz core delivers responsive checkout flows. The 400-LFBGA package enables compact terminal form factors suitable for retail counter placement.
Recommended
Portable Data Collectors and Barcode Scanners
Portable data collectors leverage the MCIMX257CJM4A's low-power ARM926EJ-S core at 400 MHz, which is fast enough for barcode decoding and inventory database queries while sipping battery power. The dual USB OTG PHYs allow connection to scanner sleds and charging cradles. The integrated SAR ADCs read battery voltage and temperature sensors for accurate fuel gauging. Designers can pair the SoC with a companion PMIC and use deep sleep modes between scans to extend battery life across full shifts.
Recommended
Factory Automation Controllers
Factory automation controllers rely on deterministic real-time response, which the MCIMX257CJM4A delivers through its ARM926EJ-S core paired with the i.MX25 peripheral mix. The 128 GPIO lines interface to PLC-style digital I/O, the SAR ADCs read 4-20 mA loop signals through external front-ends, and the dual USB ports connect to HMI panels and programming tools. The industrial temperature rating and 400-LFBGA package suit long-life equipment designs where 5-10 year production cycles are common.
Recommended
Consumer Electronics with Touch UI
Consumer appliances and home automation gateways benefit from the MCIMX257CJM4A's integrated resistive touchscreen controller plus LCD interface. The 400 MHz ARM926EJ-S core runs embedded Linux with Qt or similar UI frameworks smoothly. The DDR2 controller enables rich graphical menus. USB OTG simplifies firmware updates via USB stick in the field. Cost-conscious consumer designs favor the i.MX25 over higher-tier Cortex-A platforms when the workload fits within ARM9 performance.
Recommended
Medical Monitoring Device Interfaces
The MCIMX257CJM4A powers non-critical medical device interfaces such as bedside infotainment terminals and patient entertainment displays. Its ARM926EJ-S core handles video playback and UI rendering, while the resistive touchscreen supports gloved-finger operation in clinical environments. The industrial temperature rating suits medical equipment thermal envelopes. Designers must add appropriate isolation and IEC 60601-1 compliant power design externally; the SoC itself is not a patient-contact device.
Recommended
Recommended Products Summary
Engineering reference data for MCIMX257CJM4A — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCIMX253CJM4A | MCIMX255CJM4A | MCIMX258CJM5A | MCIMX256CJM3A |
|---|---|---|---|---|---|
| Package | 400-LFBGA (17x17 mm) | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Touchscreen Controller | Yes (4-wire resistive) | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Industrial-grade i.MX25 with balanced peripheral set (vs MCIMX253CJM4A)
- Cost-effective upgrade path to MCIMX258 family (vs MCIMX258CJM5A)
- Lower-power variant available in same package (vs MCIMX256CJM3A)
Design Notes
Estimated: the 400-LFBGA package at 0.8 mm pitch requires a 4-layer PCB minimum with continuous ground and power planes. Use microvia-in-pad or staggered microvia stack-ups if HDI is needed for fanout escape. Match DDR2 trace lengths within 25 mil tolerance per byte lane; route differential USB pairs with 90 ohm differential impedance and length matching under 150 mil.
Estimated: at 400 MHz the ARM926EJ-S core typically dissipates under 1 W, so the 400-LFBGA does not require an explicit heatsink. However, place a copper spreader array of thermal vias under the BGA central balls and connect to the inner ground plane to maintain case temperature under 85C in sealed enclosures. Always validate with a thermal probe in worst-case ambient.
Do not assume pin-to-pin compatibility between MCIMX25 family members without checking the peripheral enable matrix in the i.MX25 reference manual. Several balls carry different functions across MCIMX253/MCIMX255/MCIMX257/MCIMX258 variants. Also confirm DDR2 timing configuration matches the chosen memory vendor's datasheet; wrong write leveling calibration is a common cause of boot instability.
Compliance Information
RoHS compliant per distributor listings. Not AEC-Q100 qualified (industrial grade only). MSL level not confirmed in verified data - see _validation_note.
