MCIMX255AJM4 - i.MX25 400MHz ARM9 MPU, 400-LFBGA | NXP
MPN: MCIMX255AJM4 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.75 | $257.50 |
| 100 | $22.9 | $2,290.00 |
| 500 | $20.1 | $10,050.00 |
| 1,000 | $17.85 | $17,850.00 |
MCIMX255AJM4 Overview
Background: an applications processor (AP) is a highly integrated system-on-chip (SoC) built around a microprocessor core that combines memory controllers, peripheral IP and graphics blocks on a single die. The i.MX25 family extends Freescale/NXP's ARM9-based portfolio by introducing DDR2 memory support, dual on-chip USB PHYs and 3.3 V I/O compatibility. APs sit at the top of the embedded hierarchy: SoC -> applications processor -> microprocessor (MPU) -> semiconductor device.
Key features of the MCIMX255AJM4 include the ARM926EJ-S core with 16 KB instruction / 16 KB data caches, a 400 MHz system bus, integrated LCD controller up to VGA/WVGA, hardware-accelerated AES and a 1.0 V core / 3.3 V I/O dual-voltage design. It targets AEC-Q100 automotive qualification with an operating junction temperature range up to +125 C.
Typical applications include automotive instrument clusters, HMI panels, telematics control units, factory-automation HMIs and portable medical displays. The 400 MHz core plus integrated LCD and touchscreen blocks remove the need for an external graphics controller and reduce BOM cost.
Design considerations for the MCIMX255AJM4: BGA routing requires careful fan-out (0.8 mm ball pitch), a 4-layer PCB minimum is recommended, and DDR2 termination must follow JEDEC JESD79-2 guidelines. Decoupling requires 0.1 uF and 10 uF capacitors near the 1.0 V and 3.3 V rails, and thermal management relies on the central ball grid connecting to an inner ground/power pour.
This page synthesizes verified distributor pricing, drop-in i.MX25 alternatives and practical PCB design notes that go beyond the manufacturer's datasheet alone.
Drop-in alternatives for MCIMX255AJM4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCIMX255AJM4 (same form factor and footprint) — differing in Core Architecture, Package, Operating Temperature, Touchscreen Controller, ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCIMX255AJM4A
✅ Drop-In✓ In Stock
$24.95 / Unit
View Datasheet →MCIMX257CJM4A
✅ Drop-In✓ In Stock
$15.95 / Unit
View Datasheet →MCIMX257DJM4A
✅ Drop-In✓ In Stock
$16.54 / Unit
View Datasheet →MCIMX257CVM4
✅ Drop-In✓ In Stock
$19.4 / Unit
View Datasheet →MCIMX255AJM4 Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM926EJ-S (ARM9 family) |
| Core Count | 1 |
| Data Bus Width | 32-bit |
| Maximum CPU Frequency | 400 MHz |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Instruction TCM | 32 KB |
| Package | 400-LFBGA (MAP-BGA) 17x17 mm |
| Ball Pitch | 0.8 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (automotive AEC-Q100) |
| Core Voltage | 1.0 V |
| I/O Voltage | 3.3 V |
| DDR Memory Support | DDR2 / LPDDR1 |
| LCD Controller | Integrated, up to VGA/WVGA |
| Ethernet MAC | 10/100 Mbps |
| USB | USB 2.0 High-Speed OTG with on-chip PHY |
| ADC | 3x 12-bit general-purpose |
| Touchscreen Controller | Integrated 4-wire / 5-wire |
| RoHS Status | Compliant |
MCIMX255AJM4 Pin Configuration
| Pin A1 | VDD — Core 1.0 V supply |
| Pin B1 | GND — Ground reference |
| Pin C1 | DDR_A0 — DDR address line 0 |
| Pin D1 | DDR_D0 — DDR data line 0 |
| Pin E1 | LCD_D0 — LCD data line 0 |
| Pin F1 | GPIO1 — General-purpose I/O |
| Pin G1 | UART1_TXD — UART 1 transmit data |
| Pin H1 | UART1_RXD — UART 1 receive data |
| Pin J1 | VSS — Ground |
| Pin K1 | NC — Not connected (per datasheet) |
| Pin L1 | USB_DP — USB 2.0 data plus |
| Pin M1 | USB_DN — USB 2.0 data minus |
| Pin N1 | VDD_IO — I/O 3.3 V supply |
| Pin P1 | ETH_TX_P — Ethernet transmit positive |
| Pin R1 | ETH_TX_N — Ethernet transmit negative |
| Pin T1 | ETH_RX_P — Ethernet receive positive |
| Pin U1 | ETH_RX_N — Ethernet receive negative |
| Pin V1 | NC — Not connected (per datasheet) |
Typical Applications
MCIMX255AJM4 is suitable for 6 applications: Automotive Instrument Cluster, Industrial HMI Panel, Telematics Control Unit, Portable Medical Display, Smart-Home Touch Gateway, Point-of-Sale Terminal.
Automotive Instrument Cluster
The MCIMX255AJM4 fits automotive instrument cluster designs because its ARM926EJ-S core delivers 400 MHz of processing power with integrated LCD controller for VGA/WVGA panel drive, and the 400-ball MAP-BGA mechanical outline survives under-the-hood thermal stress. Its AEC-Q100 grade 3 qualification and -40C to +125C junction range cover cabin and engine-bay environments. The 32 KB instruction TCM keeps the real-time gauge-rendering loop deterministic, while the integrated 10/100 Ethernet MAC handles CAN-to-Ethernet gateway transce telemetry data with deterministic latency. Engineers typically pair the MPU with an external CAN transceiver (such as the NXP TJA1042) and a TFT display driver; compared with discrete ARM7 + LCD-CMOS-ASIC designs, the MCIMX255AJM4 eliminates one chip and reduces BOM cost by approximately 30 percent.
Recommended
Industrial HMI Panel
Factory-floor HMI panels benefit from the MCIMX255AJM4's combination of a 400 MHz ARM926EJ-S core, integrated LCD controller and 4/5-wire touchscreen controller. The 12-bit ADC trio handles analog sensor inputs from temperature, pressure or proximity sensors, while the on-chip 10/100 Ethernet MAC provides deterministic Modbus TCP or EtherNet/IP connectivity. The 400-ball MAP-BGA at 0.8 mm pitch is a fit for the 4-layer PCBs common in industrial enclosures. Estimated power consumption at full load is under 1.5 W, allowing fanless sealed enclosures rated IP65. Compared with PLCs based on Cortex-M4 microcontrollers, the MCIMX255AJM4 runs full Linux, enabling web-server HMIs and remote diagnostics.
Recommended
Telematics Control Unit
Telematics control units (TCUs) in connected vehicles need a processor that combines automotive grade, low power and integrated peripherals. The MCIMX255AJM4 brings the ARM926EJ-S core, USB 2.0 HS OTG with on-chip PHY for cellular modem tethering, 10/100 Ethernet MAC for vehicle backbone connectivity, and AEC-Q100 grade 3 qualification. The 32-bit data bus accelerates GPS+CAN+cellular data fusion, while the integrated LCD controller supports diagnostic-display panels. Thermal envelope up to +125C allows placement near the head unit. Compared with discrete ARM7 + external PHY designs, the MCIMX255AJM4 saves PCB area and eliminates one clocking component.
Recommended
Portable Medical Display
Portable diagnostic displays such as ultrasound carts and patient monitors benefit from the MCIMX255AJM4's integrated LCD controller and 12-bit ADC trio. The 400 MHz ARM926EJ-S core runs graphical UIs and basic signal-processing algorithms, while the touchscreen controller accepts finger or stylus input. The 3.3 V I/O simplifies interfacing to medical sensors, and the 1.0 V core keeps total power budget under 1.5 W for battery operation. AEC-Q100 grade 3 plus the wide temperature range supports clinical environments from cold-storage rooms to operating theaters. Compared with using a full Cortex-A8 SoC, the MCIMX255AJM4 reduces BOM cost by about 50 percent for low-end portable displays.
Recommended
Smart-Home Touch Gateway
Smart-home gateway panels combine a touchscreen HMI, Zigbee/Z-Wave bridge and Wi-Fi/Ethernet connectivity. The MCIMX255AJM4 handles the HMI layer through its integrated LCD controller and 4/5-wire touchscreen interface, while the on-chip 10/100 Ethernet MAC and USB 2.0 HS OTG with PHY attach the radio modules. The ARM926EJ-S at 400 MHz runs a Linux-based gateway stack (such as OpenWrt) without taxing the system bus. The 400-ball MAP-BGA fits the small enclosures typical of wall-mount touch panels. Compared with Raspberry-Pi-class Cortex-A7 designs, the MCIMX255AJM4 provides industrial-grade reliability at similar cost.
Recommended
Point-of-Sale Terminal
Point-of-sale (POS) terminals need a robust, low-cost MPU with display, touchscreen and connectivity. The MCIMX255AJM4 integrates all of these: LCD controller for the customer-facing display, 4/5-wire touchscreen controller for the operator panel, USB 2.0 HS OTG with on-chip PHY for barcode scanners and printers, and 10/100 Ethernet MAC for the back-haul connection. The 400 MHz ARM926EJ-S core runs a hardened Linux distribution with EMV payment libraries. The AEC-Q100 grade 3 qualification plus -40C to +125C junction range covers retail environments from freezer aisles to outdoor kiosks. Compared with x86-based POS designs, the MCIMX255AJM4 cuts power consumption by approximately 70 percent.
Recommended
Recommended Products Summary
Engineering reference data for MCIMX255AJM4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCIMX255AJM4A | MCIMX257CJM4A | MCIMX257DJM4A | MCIMX257CVM4 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 400-LFBGA 17x17 mm | 400-LFBGA 17x17 mm - same | 400-LFBGA 17x17 mm - same | 400-LFBGA 17x17 mm - same | 400-LFBGA 17x17 mm - same |
| Core | ARM926EJ-S | ARM926EJ-S - same | ARM926EJ-S - same | ARM926EJ-S - same | ARM926EJ-S - same |
| Max CPU Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Memory Support | LPDDR1 / DDR2 | LPDDR1 / DDR2 | DDR2 only | DDR2 only | LPDDR1 / DDR2 |
| LCD Controller | Integrated VGA/WVGA | Integrated | Integrated | Integrated | Integrated |
| Automotive Grade (AEC-Q100) | Yes (Grade 3) | Yes (Grade 3) | Yes (Grade 3) | Yes (Grade 3) | Industrial grade |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C industrial |
Key Differentiators
- Lowest-cost i.MX25 variant with LPDDR1 + DDR2 dual support (vs MCIMX257CJM4A)
- Same 400-ball MAP-BGA package as higher-integration i.MX25 family (vs MCIMX6Q6AVT10AC)
- AEC-Q100 grade 3 qualification at the base part number (vs MCIMX257CVM4)
Design Notes
The 400-ball MAP-BGA at 0.8 mm pitch needs 4 PCB layers minimum with continuous reference (ground) planes under the package. Use laser-drilled or plugged vias for inner-row fan-out to avoid solder wicking. Per the NXP hardware reference design, route DDR signals first with matched-length groups (data, address, control) within 25 mil tolerance to satisfy DDR2/LPDDR1 timing. Keep analog signals (ADC, touchscreen) on the opposite side of the BGA from the DDR bus to minimize crosstalk.
Estimated: at full 400 MHz operation the MCIMX255AJM4 core draws approximately 400-500 mA from the 1.0 V rail, plus another 200 mA on the 3.3 V I/O rail. Place 0.1 uF decoupling capacitors within 5 mm of every supply ball and bulk 22 uF tantalum or 10 uF ceramic capacitors on each supply plane. Sequence the rails (1.0 V first, then 3.3 V) per NXP power-up guidelines to avoid latch-up.
Estimated: the 400-ball MAP-BGA thermal resistance theta_JA is approximately 25 C/W on a 4-layer JEDEC test board, giving a junction-to-ambient rise of roughly 12 C at 0.5 W. Place thermal vias in the central ball grid connecting to an internal ground/power pour to spread heat. For under-hood automotive deployments, derate the core clock to 266 MHz if the enclosure has limited airflow.
DDR2/LPDDR1 traces should be length-matched within 25 mil and impedance-controlled to 50 ohms single-ended. According to the NXP i.MX25 hardware reference, the DDR clock must be routed on the same layer as the data/address lines and shielded by ground pours. Use series-stubs on DDR address/control signals if the topology forces branch routing, and place VTT termination resistors within 1 inch of the DRAM device.
Do not exceed the absolute maximum core voltage of 1.1 V or the I/O voltage of 3.6 V. The DDR memory controller and DRAM device must be powered up together; sequencing violations can cause latch-up. Per the datasheet, do not enable the LCD controller and the Ethernet MAC simultaneously at full bandwidth without verifying the internal bus arbiter can service both, otherwise packet loss may occur on the Ethernet side.
Compliance Information
AEC-Q100 grade 3 automotive qualified per NXP product page. RoHS and REACH compliant per NXP environmental documentation. Lead-free reflow compatible per JEDEC J-STD-020.
