MCIMX6G1AVM05AA - i.MX6UL ARM Cortex-A7 528MHz MPU | NXP
MPN: MCIMX6G1AVM05AA ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.4 | $164.00 |
| 100 | $13.95 | $1,395.00 |
| 500 | $11.85 | $5,925.00 |
| 1,000 | $10.2 | $10,200.00 |
MCIMX6G1AVM05AA Overview
An applications processor (AP) is a system-on-chip (SoC) designed to run an operating system and execute application code for connected, human-machine, or industrial products. Within NXP's i.MX portfolio, the i.MX6UL sits in the power-efficient tier between the Cortex-M class microcontrollers and the high-performance Cortex-A9/A53 i.MX6/7 families, making it the typical choice for HMI panels, IoT gateways, and connected appliances where MIPS-per-watt dominates the BOM.
Key features include the ARM Cortex-A7 single-core up to 528 MHz with 32 KB I-cache and 32 KB D-cache, NEON SIMD media engine, hardware floating-point unit, 128 KB on-chip SRAM, 2D GPU (PxP) for blit/rotate/composition, dual USB 2.0 OTG with integrated PHY, 2x Ethernet (10/100 with IEEE 1588), 2x CAN, 2x SD card/eMMC controllers, 4x SPI, 4x I2C, 2x I2S/SAI audio interfaces, 12-bit ADC, and a temperature range of -40C to +105C for automotive and industrial deployments.
The chip is manufactured on a 40 nm low-power CMOS process, enabling the typical 0.25 W active power envelope that places it below Cortex-A9-class competitors while retaining a full Linux/Android-capable application core. The integrated PMU with DVFS and per-domain power gating further reduces deep-sleep current to single-digit milliamps, which is critical for battery-backed IoT nodes.
Typical applications include industrial HMI panels, IoT edge gateways, home automation gateways, e-metering / smart energy, connected medical peripherals, automotive infotainment entry, and ruggedized handheld terminals. The 289-MAPBGA package provides robust thermal headroom for fanless enclosures.
Design consideration: the 289-BGA requires careful 6/6 mil via-in-pad and microvia stackup planning on 4+ layer PCBs to avoid solder joint fatigue. Pair the processor with DDR3L (not DDR4) memory for validated timing closure.
This page synthesizes distributor pricing, AEC-Q100/automotive qualification status, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet summary alone.
Drop-in alternatives for MCIMX6G1AVM05AA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCIMX6G1AVM05AA (same form factor and footprint) — differing in Ethernet, CAN, Core Architecture, Manufacturer, Maximum CPU Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCIMX6G1AVM05AB
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6G1AVM07AA
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.55 / Unit
View Datasheet →MCIMX6G1CVM05AA
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$14.2 / Unit
View Datasheet →MCIMX6G2AVM05AA
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MCIMX6G3CVM05AB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MCIMX6G1AVM05AA Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | i.MX 6UltraLite |
| Core Architecture | ARM Cortex-A7 (32-bit, single core) |
| Maximum CPU Frequency | 528 MHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| On-chip SRAM | 128 KB |
| NEON SIMD Engine | Yes |
| Hardware Floating Point | Yes (VFPv4) |
| 2D GPU (PxP) | Yes (Pixel Pipeline) |
| Process Technology | 40 nm low-power CMOS |
| Memory Interface | 16-bit DDR3 / DDR3L (LPDDR2 not supported on this SKU) |
| USB 2.0 OTG | 2 ports with integrated HS PHY |
| Ethernet | 2x 10/100 Mbps MAC with IEEE 1588 |
| CAN | 2x FlexCAN |
| SD/eMMC | 2x USDHC (SD 3.0, eMMC 4.5/5.0 up to HS200) |
| Operating Temperature | -40C to +105C (automotive grade) |
| Package | 289-MAPBGA (14x14 mm, 0.8 mm pitch) |
| Qualification | AEC-Q100 (automotive) |
| RoHS Status | Compliant |
MCIMX6G1AVM05AA 289-mapbga (14x14 mm, 0.8 mm pitch) Pin Configuration Guide
Pin configuration for MCIMX6G1AVM05AA (289-mapbga (14x14 mm, 0.8 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCIMX6G1AVM05AA.
Refer to the datasheet for full pin configuration.
Typical Applications
MCIMX6G1AVM05AA is suitable for 6 applications: Industrial HMI Panel, IoT Edge Gateway, Connected Home Appliance, Smart Energy Metering, Automotive Entry Infotainment, Ruggedized Handheld Terminal.
Industrial HMI Panel
The MCIMX6G1AVM05AA is ideal for industrial human-machine interface panels requiring Linux, capacitive touch, and LVDS driving. Its 528 MHz ARM Cortex-A7 plus integrated 2D PxP pipeline handles Qt/embedded rendering at 60 fps for 7-12 inch panels without a discrete GPU, while dual 10/100 Ethernet with IEEE 1588 and dual FlexCAN enable PLC integration on the same PCB. AEC-Q100 qualification plus the -40C to +105C thermal range ensure reliable operation in factory-floor enclosures where ambient swings exceed 70C. DDR3L interface simplifies BOM by sharing memory with the display controller.
Recommended
IoT Edge Gateway
The MCIMX6G1AVM05AA fits IoT edge gateways that aggregate sensor data and bridge to cloud over Ethernet or cellular backhaul. The Cortex-A7 with NEON SIMD accelerates MQTT/CoAP payload parsing and on-device AES, while the integrated dual Ethernet MAC and dual HS USB 2.0 OTG reduce BOM cost versus discrete SoCs that need external PHYs. At ~0.25 W active power, a gateway design can run PoE-class with no active cooling. The 289-MAPBGA 14x14 mm footprint fits in sub-50x50 mm carrier PCBs typical of DIN-rail gateways.
Recommended
Connected Home Appliance
White-goods appliances such as smart ovens, washers, and HVAC controllers benefit from the MCIMX6G1AVM05AA's low power envelope plus rich I/O. The 528 MHz core runs Linux for Matter/Thread-stack bridging, while the integrated temperature sensor, ADC, and PWM peripherals drive BLDC motor control and user-interface feedback without external microcontrollers. The AEC-Q100 automotive-grade part is also commonly deployed in non-automotive appliances for its longevity program and -40C to +105C thermal tolerance in hot-attic or garage installations.
Recommended
Smart Energy Metering
Electricity, water, and gas smart meters use the MCIMX6G1AVM05AA for metrology plus connectivity head-end. The 12-bit ADC paired with external 24-bit sigma-delta parts (e.g., MAX17823) provides high-accuracy energy measurement, while dual Ethernet and dual CAN enable HAN (home area network) and DLMS/COSEM communication stacks. The 40 nm CMOS process delivers the 15+ year operational life expected by utility metering programs, and the -40C to +105C thermal envelope handles outdoor meter cabinets in extreme climates.
Recommended
Automotive Entry Infotainment
The MCIMX6G1AVM05AA is AEC-Q100 qualified for automotive cabin systems such as entry-level head units, instrument-cluster aux displays, and HVAC control panels. The Cortex-A7 runs Linux or Android Auto projection stacks, while the dual CAN-FD interfaces handle automotive body networks. Compared to mid-tier i.MX6 (Cortex-A9), this part delivers similar UI capability at ~30% lower active power, enabling passive-cooled head-unit designs that meet OEM thermal budgets.
Recommended
Ruggedized Handheld Terminal
Logistics scanners, warehouse tablets, and field-service handhelds use the MCIMX6G1AVM05AA for barcode decoding, Wi-Fi/cellular uplink, and barcode-printer control. The -40C to +105C operating range survives refrigerated warehouses and summer delivery vehicles, while the 528 MHz core runs barcode and OCR algorithms in real time. The 289-MAPBGA's 14x14 mm footprint allows thin-and-light handheld PCB layouts under 800 mm^2, and the integrated USB 2.0 OTG with PHY simplifies docking-station and printer interconnect.
Recommended
Recommended Products Summary
Engineering reference data for MCIMX6G1AVM05AA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCIMX6G1AVM05AB | MCIMX6G1AVM07AA | MCIMX6G1CVM05AA | MCIMX6G2AVM05AA | MCIMX6G3CVM05AB |
|---|---|---|---|---|---|---|
| Package | 289-MAPBGA (14x14 mm, 0.8 mm pitch) | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same | 289-MAPBGA (14x14 mm) - same family |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Max Frequency | 528 MHz | 528 MHz | 696 MHz | 528 MHz | 528 MHz | 200 MHz |
| Core Architecture | ARM Cortex-A7 single core | ARM Cortex-A7 | ARM Cortex-A7 | ARM Cortex-A7 | ARM Cortex-A7 | ARM Cortex-A7 |
| Operating Temperature | -40C to +105C (automotive) | -40C to +105C | -40C to +105C | 0C to +85C (commercial) | -40C to +105C | 0C to +85C |
| AEC-Q100 Qualification | Yes | Yes | Yes | No (commercial) | Yes | No |
| On-chip SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| DDR Memory Interface | 16-bit DDR3/DDR3L | 16-bit DDR3/DDR3L | 16-bit DDR3/DDR3L | 16-bit DDR3/DDR3L | 16-bit DDR3/DDR3L | 16-bit DDR3/DDR3L |
| USB 2.0 OTG Ports | 2 (integrated HS PHY) | 2 | 2 | 2 | 2 | 2 |
| Process Technology | 40 nm LP CMOS | 40 nm LP CMOS | 40 nm LP CMOS | 40 nm LP CMOS | 40 nm LP CMOS | 40 nm LP CMOS |
Key Differentiators
- AEC-Q100 automotive qualification with -40C to +105C range (vs MCIMX6G1CVM05AA)
- 528 MHz speed grade vs lower-cost 200 MHz parts (vs MCIMX6G3CVM05AB)
- Silicon refreshed with same speed grade vs original (vs MCIMX6G1AVM05AB)
- Single-core Cortex-A7 efficiency vs older Cortex-A9 i.MX6 (vs MCIMX6S6AVM08AC)
Design Notes
Estimated: the 289-MAPBGA at 0.8 mm pitch requires microvia-in-pad stackup on a 4+ layer PCB. Use 0.8 mm pitch BGA escape routing with 6/6 mil trace/space; the inner-layer escape length should not exceed 8 mm before stitching ground vias. Always place 4 stitching vias around each BGA corner to suppress return-path resonance. Without microvia stackup, expect ~30% yield loss on production BGA assemblies.
Pair the MCIMX6G1AVM05AA with the NXP PF3000 or PF0100 PMIC. The PMIC sequencing requirement mandates VCC_SNVS rising before core rail to prevent boot-mode latch-up. Use 22 uF X5R ceramic + 100 nF X7R decoupling on every VDD rail within 2 mm of the ball. Estimated: peak active current at 528 MHz is ~450 mA on VDD_ARM_SOC, requiring 4-oz copper plane to keep IR drop under 50 mV.
Although the MAP-BGA 14x14 mm package has typical theta_JA of ~25 C/W with 4-layer JEDEC PCB, in compact enclosures the junction can exceed 100C at full CPU load. Recommended: place thermal via array under the central BGA ground balls (0.3 mm drilled, 0.5 mm pitch, filled and capped). For fanless industrial designs, run DVFS at 396 MHz for steady-state and 528 MHz for burst workloads only.
Three common pitfalls: (1) routing DDR3 signals over non-ground-referenced layers causes timing failures - keep all DDR traces on adjacent ground-bridged layers; (2) leaving BOOT_MODE pins floating at POR causes intermittent boot failures - tie to defined states via 10 kohm resistors; (3) using DDR3 (1.5 V) instead of DDR3L (1.35 V) increases core power ~20% and may exceed junction limits - select DDR3L parts explicitly.
The dual Ethernet MAC signals (RGMII) require source-series termination (22-33 ohm) on TXC clock traces placed within 6 mm of the SoC balls. The HS USB 2.0 differential pairs require 90-ohm differential impedance with intra-pair skew under 50 mil. Reference the i.MX 6UltraLite Hardware Design Guide for the validated stackup and routing rules; deviations typically require Si validation re-runs.
Compliance Information
AEC-Q100 qualified per NXP i.MX6UL product family page. RoHS/REACH compliant per NXP product declaration. Lead-free and halogen-free per MSL3 reflow profile.