MK52DN512CLQ10 - 100MHz Cortex-M4 MCU 512KB Flash | NXP K52
MPN: MK52DN512CLQ10 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $21.71 | $21.71 |
| 10 | $19.54 | $195.40 |
| 100 | $17.36 | $1,736.00 |
| 500 | $15.19 | $7,595.00 |
| 1,000 | $13.02 | $13,020.00 |
MK52DN512CLQ10 Overview
A K52-sub-family MCU is a low-power, mixed-signal ARM Cortex-M4 microcontroller that combines Cortex-M4 DSP/FPU compute with on-chip analog front-end peripherals, positioning it between a general-purpose MCU and a precision analog front-end IC. In the broader taxonomy it belongs to microcontrollers -> 32-bit microcontrollers -> ARM Cortex-M microcontrollers -> mixed-signal MCUs. The Kinetis K50/K52 series specifically targets precision signal-chain applications where the analog front end is as critical as the digital core.
Key features include 100 MHz Cortex-M4 core with single-precision FPU and DSP instructions, 512 KB program Flash, 128 KB SRAM, integrated 16-bit ADC with up to 4 differential or 8 single-ended inputs, two 12-bit DACs, multiple UART/SPI/I2C ports, USB 2.0 full-speed On-The-Go, 10/100 Ethernet MAC with MII/RMII, low-power run, wait, stop, and VLLS modes, and a wide operating voltage range from 1.71 V to 3.6 V. The device is qualified over the -40 C to +105 C industrial temperature range.
The architecture pairs an ARM Cortex-M4 core with a Cortex-M4 Memory Protection Unit, a four-channel DMA controller, an embedded voltage regulator with on-chip decoupling, and the analog measurement engine. The combination of DSP-class compute, hardware FPU, and integrated high-resolution ADC/DAC enables single-chip precision measurement designs that previously required a separate DSP and a dedicated analog front-end.
Typical applications include industrial process control and PLC analog modules, medical patient-monitoring instruments, smart energy and power-metering endpoints, building automation sensor nodes, and USB- or Ethernet-connected test and measurement equipment. The integrated Ethernet and high-resolution ADC make the part particularly attractive for distributed measurement nodes that must aggregate analog sensor data and publish it on an industrial network.
When designing with this part, ensure the analog supply decoupling is placed close to the VDDA pin and that the ADC reference pins are driven from a low-noise source. The 144-LQFP footprint offers generous ground paddle access; tying the exposed pad to a clean analog ground improves ADC performance in precision measurement designs.
This page synthesizes verified distributor stock and pricing, drop-in Kinetis-family alternatives, and practical PCB/decoupling notes drawn from the K50/K52 datasheet, providing information not available on the bare manufacturer product page.
Drop-in alternatives for MK52DN512CLQ10 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MK52DN512CLQ10 (same form factor and footprint) — differing in Package, Program Flash Memory, Terminal Form, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MK52DN512ZCLQ10
✅ Drop-In📋 Reference alternative (not in catalog)
MK52DN512CMD10
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →MK50DN512CLQ10
✅ Drop-In✓ In Stock
$10.21 / Unit
View Datasheet →MK50DN512ZCLQ10
✅ Drop-In📋 Reference alternative (not in catalog)
MK40DN512ZVMD10
✅ Drop-In✓ In Stock
$8.38 / Unit
View Datasheet →MK52DN512CLQ10 Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-M4 with FPU and DSP |
| Maximum Core Frequency | 100 MHz |
| Program Flash Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Operating Voltage Range | 1.71 V to 3.6 V |
| Package | 144-LQFP (20x20 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +105 C |
| ADC | 16-bit SAR, multiple channels |
| DAC | 12-bit, dual |
| USB | USB 2.0 Full-Speed OTG |
| Ethernet | 10/100 MAC with MII/RMII |
| Supply Voltage (datasheet) | 1.8 V / 2.5 V / 3.3 V (multi-range) |
| RoHS Status | Compliant |
MK52DN512CLQ10 144-lqfp (20x20 mm) Pin Configuration Guide
Pin configuration for MK52DN512CLQ10 (144-lqfp (20x20 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MK52DN512CLQ10.
Refer to the datasheet for full pin configuration.
Typical Applications
MK52DN512CLQ10 is suitable for 6 applications: Industrial Process Control and PLC Analog Modules, Medical Patient Monitoring Instrumentation, Smart Energy and Power Metering, Building Automation Sensor Nodes, Industrial Ethernet Test and Measurement, USB-OTG Connected Sensor Hubs.
Industrial Process Control and PLC Analog Modules
The MK52DN512CLQ10 fits industrial process control and PLC analog modules because it integrates a 16-bit SAR ADC and 12-bit DAC alongside a 100 MHz Cortex-M4 with FPU. With 512 KB Flash and 128 KB SRAM the part runs ladder-logic or PID control loops plus a real-time Ethernet stack without external memory. Compared with discrete MCU + ADC solutions, the integrated measurement engine reduces PCB area and BOM while improving noise immunity for 4-20 mA loop digitisation.
Recommended
Medical Patient Monitoring Instrumentation
The MK52DN512CLQ10 is suited to medical patient monitoring because its on-chip op-amps and trans-impedance amplifiers directly support photodiode front-ends for pulse oximetry, ECG leads, and respiration sensors. The 100 MHz Cortex-M4 DSP engine executes FIR/IIR filter chains for bio-signal conditioning in real time, and the 128 KB SRAM buffers multi-channel waveforms. USB-OTG connectivity simplifies the tethered bedside-monitor link, while the 1.71-3.6 V range supports battery-powered portable designs.
Recommended
Smart Energy and Power Metering
The MK52DN512CLQ10 is a strong fit for single-phase and poly-phase smart energy meters because its 16-bit ADC simultaneously digitises voltage and current channels for accurate power calculation. The 100 MHz core computes RMS, harmonics and reactive power on-chip; 128 KB SRAM captures waveform logs. Integrated Ethernet MAC supports AMI backhaul, while the industrial -40 C to +105 C range ensures the design operates in outdoor meter enclosures.
Recommended
Building Automation Sensor Nodes
The MK52DN512CLQ10 fits building-automation sensor nodes that aggregate analog measurements (temperature, humidity, CO2, light) and publish them over Ethernet or USB. Low-power run, wait, stop and VLLS modes help meet battery-life targets for wireless gateway nodes. The integrated analog front-end eliminates separate signal-conditioning ICs, reducing the node BOM for HVAC controllers, smart thermostats, and security panels.
Recommended
Industrial Ethernet Test and Measurement
The MK52DN512CLQ10 suits Ethernet-connected test and measurement instruments because the 100 MHz Cortex-M4 with FPU runs DSP filter routines on acquired waveforms, while the integrated 10/100 Ethernet MAC streams results to a host PC. The 16-bit ADC and 12-bit DAC support arbitrary waveform generation and acquisition up to the ADC's sample rate. USB-OTG and Ethernet coexistence simplify dual-port connectivity for bench equipment.
Recommended
USB-OTG Connected Sensor Hubs
The MK52DN512CLQ10 supports USB-OTG connected sensor hubs that expose multiple analog channels to a tablet or PC for diagnostics. The on-chip USB 2.0 full-speed OTG controller with integrated PHY eliminates external PHY cost and board area. Combined with the analog measurement engine, a single chip handles capacitive-touch, temperature, strain-gauge and biometric sensor readouts, then streams them over USB to the host application.
Recommended
Recommended Products Summary
Engineering reference data for MK52DN512CLQ10 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MK52DN512ZCLQ10 | MK52DN512CMD10 | MK50DN512CLQ10 | MK50DN512ZCLQ10 | MK40DN512ZVMD10 |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M4 @ 100 MHz | ARM Cortex-M4 @ 100 MHz | ARM Cortex-M4 @ 100 MHz | ARM Cortex-M4 @ 100 MHz | ARM Cortex-M4 @ 100 MHz | ARM Cortex-M4 @ 100 MHz |
| Program Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| ADC | 16-bit SAR + analog engine | 16-bit SAR + analog engine | 16-bit SAR + analog engine | 16-bit SAR + analog engine | 16-bit SAR + analog engine | 16-bit SAR (no analog engine) |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Ethernet | 10/100 MAC (MII/RMII) | 10/100 MAC (MII/RMII) | 10/100 MAC (MII/RMII) | 10/100 MAC (MII/RMII) | 10/100 MAC (MII/RMII) | 10/100 MAC (MII/RMII) |
| Operating Voltage | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
Key Differentiators
- Integrated analog measurement engine on-chip (vs MK40DN512ZVMD10)
- K52 sub-family specific peripheral mix optimized for measurement (vs MK50DN512ZCLQ10)
- Same die in 144-LQFP enables drop-in across sub-families (vs MK52DN512CMD10)
Design Notes
The MK52DN512CLQ10 operates from 1.71 V to 3.6 V across the full -40 C to +105 C range. Per the K52 datasheet, decouple each VDD pin with a 100 nF ceramic plus a 4.7 uF bulk capacitor placed within 5 mm of the pin; tie VDDA to VDD with a ferrite bead and a dedicated 100 nF plus 1 uF RC filter to isolate analog noise from the digital core. Estimated: with VDDA driven by a LDO at 50 mA load, the ferrite bead should target 600 ohm at 100 MHz to attenuate MCU switching noise.
The 144-LQFP 20x20 mm package has an exposed thermal pad that MUST be soldered to a continuous ground copper pour for thermal and electrical reasons. Per the K52 datasheet, this improves theta_JA significantly versus a non-paddled footprint. Estimated: a 4-layer PCB with 4 square inches of GND copper reduces theta_JA to roughly 30 C/W, allowing continuous 100 MHz operation at +105 C ambient.
Place the analog measurement engine decoupling on the same layer as the MCU, within 3 mm of the VDDA/VREFH pins. The 16-bit ADC performance degrades by 1-2 LSBs if the analog ground return currents share a path with high-di/dt digital traces. Per the K52 datasheet, route USB DP/DN as a 90 ohm differential pair and place the ESD protection within 3 mm of the connector; route RMII signals with 50 ohm controlled impedance and length-matched to within 50 mil.
Do not power VDDA before VDD or leave VDDA floating - the integrated analog measurement engine requires a stable supply. The USB DP/DN pins require no external 15 kohm pull-downs when using the on-chip FS PHY, but a 1 Mohm pair to ground is recommended for ESD discharge path. Ensure the NRST pin has a 10 kohm pull-up and a 100 nF cap to ground for proper reset timing per the K52 datasheet.
Keep the 50 MHz external crystal traces short and symmetric; place the load capacitors within 2 mm of the XTAL pins and guard them with a ground ring. The Ethernet RMII signals should be length-matched to within 25 mil, and the MII/RMII clock trace routed away from analog ADC inputs. Per the Kinetis K52 hardware design considerations, the 32 kHz RTC crystal traces must be isolated from any switching node to avoid jitter on the RTC timing.
Compliance Information
RoHS compliant per NXP product page. Not AEC-Q100 qualified - for automotive metering/EV designs, choose SPC5746BSK1MKU2 (Power Architecture ASIL-D) instead. Lead-free LQFP package supports JEDEC J-STD-020 reflow.
