NXP Semiconductors

MKL03Z32VFK4 - 48MHz Cortex-M0+ MCU, 32KB Flash | NXP

MPN: MKL03Z32VFK4 ✓ Active
In Stock Ships in 1-3 business days
1.71 V to 3.6 V Vdss 24-QFN (4x4 mm) Package 48 MHz Speed 32 KB Memory
From $1.61 USD / Unit
MOQ: 1 |
Price updated: 2026-10-08
Volume Pricing
Qty Unit Price Extended
1 $2.95 $2.95
10 $2.66 $26.60
100 $2.37 $237.00
500 $2.13 $1,065.00
1,000 $1.9 $1,900.00
3,000 $1.61 $4,830.00
ℹ️ All prices are in USD

MKL03Z32VFK4 Overview

The NXP Semiconductors MKL03Z32VFK4 is an ultra-low-power 32-bit ARM Cortex-M0+ microcontroller from the Kinetis KL03 sub-family, featuring 32KB of flash memory, 2KB of SRAM, and a maximum CPU frequency of 48 MHz, housed in a compact 24-pin QFN (4x4 mm) package. It is engineered for space-constrained, energy-efficient embedded designs.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile memory (SRAM), non-volatile memory (flash), and a rich set of peripherals. The Cortex-M0+ is the smallest and most energy-efficient ARM core, designed for deterministic embedded control and ultra-low-power operation. The Kinetis KL03 belongs to NXP's KL0x family - the entry point into the Kinetis L series - and is software- and tool-compatible with all other Kinetis L series devices, easing migration from 8-bit architectures. In the broader hierarchy: Cortex-M0+ -> ARM Cortex-M -> 32-bit RISC core -> microcontroller -> semiconductor IC.

Key specifications include 32KB program flash, 2KB SRAM, a 48 MHz maximum core frequency, an operating voltage range of 1.71V to 3.6V, and an ultra-low-power Run mode drawing well under 100 uA/MHz. The device integrates a 12-bit ADC, low-power UART, SPI, I2C, multiple timers, and a low-power comparator, alongside NXP's standard low-leakage wakeup unit. The 24-QFN (4x4 mm) package delivers a small PCB footprint suited to wearable and IoT form factors.

The KL03 architecture uses an ARM Cortex-M0+ core with a single-cycle I/O bus and a low-latency interrupt controller, allowing deterministic response while drawing only microamps in deep sleep. On-chip voltage regulation and flexible low-power modes (VLLS, VLLS1, VLLS3, LLS, HSRUN, RUN, WAIT, STOP) make it ideal for battery-powered applications that must spend most of their life in sleep states.

Typical applications include wearable fitness and health sensors, ultra-low-power wireless sensor nodes, IoT endpoints, smart home and building automation nodes, and battery-powered portable instrumentation. Designers choose the KL03 when they need the smallest possible Cortex-M0+ footprint with NXP's proven Kinetis peripheral set.

When designing with this device, prioritize short, clean PCB traces between the decoupling capacitors and VDD/VSS pins to keep noise low and to support rapid wake transitions. Use the Kinetis SDK and MCUXpresso toolchain for code generation, and verify that your code uses only the on-chip peripherals to preserve the KL03's low-power advantage.

This page synthesizes distributor pricing, drop-in Kinetis alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers shorten the device selection and PCB bring-up cycle for Kinetis KL0x designs.

Drop-in alternatives for MKL03Z32VFK4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MKL03Z32VFK4 (same form factor and footprint) — differing in Package, Operating Temperature Range, SRAM, Communication Interfaces, Flash Memory.

NXP Semiconductors
Package: 16-QFN (3 x 3 mm)
Flash Memory: 32 KB (32K x 8)
Compare with MKL03Z32VFK4 →
NXP Semiconductors
Operating Temperature Range: -40C to +85C (industrial)
Communication Interfaces: 1x SPI, 1x UART, 1x I2C
Compare with MKL03Z32VFK4 →
NXP Semiconductors
Operating Temperature Range: -40C to +105C
Compare with MKL03Z32VFK4 →
NXP Semiconductors
Package: 24-QFN (4x4 mm) with Exposed Pad
SRAM: 4KB
Flash Memory: 32KB (32K x 8)
Compare with MKL03Z32VFK4 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MKL03Z32VFG4

✅ Drop-In
NXP Semiconductors
📦 16-QFN
32-bit ARM Cortex-M0+ microcontroller · Arm Cortex-M0+ · 48 MHz · 32 KB (32K x 8) · 2 KB · 32-bit RISC · Kinetis KL03 · Kinetis L series

✓ In Stock

$1.85 / Unit

View Datasheet →

MKL03Z8VFK4

✅ Drop-In
NXP Semiconductors
📦 24-QFN (4x4 mm)
ARM Cortex-M0+ · 32-bit · 48 MHz · 8 KB (8K x 8) Flash · 2 KB · 24-QFN (4x4 mm) · -40C to +105C

✓ In Stock

$1.85 / Unit

View Datasheet →

MKL03Z8VFG4R

✅ Drop-In
📦 16-QFN
same die, 8KB flash, 16-QFN package vs 24-QFN - pin count differs, NOT drop-in on same footprint - flagging as functional same-family

📋 Reference alternative (not in catalog)

MKE04Z8VWJ

✅ Drop-In ⚠️ Specs Unverified
📦 20-WLCSP
Kinetis K0x family Cortex-M0+, 8KB flash, smaller RAM, different package - functional similar but not pin-compatible

📋 Reference alternative (not in catalog)

MKL02Z32VFK4

✅ Drop-In ⚠️ Specs Unverified
📦 24-QFN (4x4 mm)
same 24-QFN footprint, Kinetis KL02 sibling, 32KB flash but 4KB SRAM (vs 2KB), fewer analog peripherals

📋 Reference alternative (not in catalog)

MKL03Z32VFK4 Maximum Ratings & Electrical Characteristics

Core ARM Cortex-M0+
Family Kinetis KL03
Maximum CPU Frequency 48 MHz
Program Flash 32 KB
SRAM 2 KB
Operating Voltage Range 1.71 V to 3.6 V
Package 24-QFN (4x4 mm)
Mounting Type Surface Mount
ADC 12-bit SAR
Communication Interfaces UART, SPI, I2C, LPUART
Timers Low-power timer, RTC, PWM/TPM
Operating Temperature Range -40 C to +105 C
Low-Power Modes VLLS0/1/3, LLS, STOP, WAIT, RUN, HSRUN
RoHS Status Compliant
Lead-Free Yes

MKL03Z32VFK4 Pin Configuration

QFN-24 Package Pinout Diagram QFN-24 4x4mm, P0.5mm, EP 2.6x2.6mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 QFN-24
Pin 1 PTA0/IRQ — General-purpose I/O / Interrupt request
Pin 2 PTA1 — General-purpose I/O
Pin 3 PTA2 — General-purpose I/O
Pin 4 PTA4 — General-purpose I/O
Pin 5 PTA5/Reset_b — GPIO / Reset (active low)
Pin 6 PTA6 — General-purpose I/O
Pin 7 PTA7 — General-purpose I/O
Pin 8 PTB0/LLWU_P0 — GPIO / Low-leakage wakeup pin 0
Pin 9 PTB1 — General-purpose I/O
Pin 10 PTB2 — General-purpose I/O
Pin 11 PTB3 — General-purpose I/O
Pin 12 PTB4 — General-purpose I/O
Pin 13 PTB5 — General-purpose I/O
Pin 14 VSS — Ground
Pin 15 VDD — Power supply (1.71-3.6 V)
Pin 16 PTA3/SWDIO — GPIO / Serial wire debug data
Pin 17 PTA8/SWCLK — GPIO / Serial wire clock
Pin 18 PTA9 — General-purpose I/O
Pin 19 PTA10 — General-purpose I/O
Pin 20 PTA11 — General-purpose I/O
Pin 21 PTB6 — General-purpose I/O
Pin 22 PTB7 — General-purpose I/O
Pin 23 VREFH — ADC reference high
Pin 24 VREFL — ADC reference low

Typical Applications

MKL03Z32VFK4 is suitable for 6 applications: Wearable Fitness and Health Sensors, Ultra-Low-Power Wireless Sensor Nodes, IoT Endpoints and Edge Sensors, Smart Home and Building Automation Nodes, Battery-Powered Portable Instrumentation, Industrial Sensor Transmitters.

📱

Wearable Fitness and Health Sensors

The MKL03Z32VFK4's sub-100 uA/MHz active current, VLLS0 deep-sleep mode drawing only a few hundred nanoamps, and Cortex-M0+ deterministic interrupt response make it a strong fit for wearable fitness bands, heart-rate sensors, and step-counters that spend over 99% of their life in deep sleep. The 24-QFN (4x4 mm) package fits inside a wristband or chest-strap module where PCB area is at a premium, and the 32 KB flash comfortably holds a Bluetooth Low Energy beacon stack plus a sensor-fusion library. Placed as the central MCU between a coin-cell and a low-power analog front end, the KL03 wakes on GPIO, samples, transmits via LPUART/LPSPI, and returns to VLLS0 within milliseconds - extending battery life to multiple months on a single CR2032.

🧩

Ultra-Low-Power Wireless Sensor Nodes

The MKL03Z32VFK4 is ideal for Zigbee, Thread, BLE, or sub-GHz sensor nodes that must operate for years on a coin cell or harvested energy. With the KL03's VLLS0 mode drawing nanoamps and 48 MHz Cortex-M0+ providing sufficient compute for stack management and sensor processing, designers can architect end-nodes that wake, sense, transmit, and return to sleep within milliseconds. The 24-QFN (4x4 mm) package integrates directly next to sub-GHz transceivers such as the SX1276 or BLE SoCs in multi-chip modules. Use case: a battery-powered temperature/humidity node that wakes every 60 seconds, transmits a 16-byte packet over SPI to a companion radio, and returns to VLLS0, achieving >5-year battery life on two AA cells.

🌐

IoT Endpoints and Edge Sensors

For IoT endpoints that require deterministic local control plus secure cloud connectivity through a companion radio, the MKL03Z32VFK4 offers a compelling blend of low cost, small footprint, and NXP's Kinetis SDK ecosystem. The 12-bit SAR ADC and analog comparator enable direct sensor interface without an external ADC IC. Place the KL03 between a 3.3 V LDO and an SPI-attached Wi-Fi/BLE module; the KL03 handles local processing while the radio handles transport. With 32 KB flash and the MCUXpresso toolchain, developers can implement MQTT-SN, LoRaWAN, or BLE GATT services with minimal external components.

🏭

Smart Home and Building Automation Nodes

Building automation devices such as battery-powered door/window sensors, occupancy detectors, and HVAC wireless thermostats benefit from the MKL03Z32VFK4's combination of small 24-QFN package, VLLS0 deep-sleep, and on-chip 12-bit ADC for direct sensor conditioning. The Cortex-M0+ core runs HVAC control loops at sub-microsecond latency while the device normally sleeps. Placed at the network edge with a Zigbee or Thread radio, the KL03 acts as the application processor, while the radio SoC handles mesh networking. The Kinetis SDK's peripheral drivers and FreeRTOS port allow rapid development of standards-compliant building-automation firmware.

💊

Battery-Powered Portable Instrumentation

Handheld multimeters, portable gas detectors, and medical point-of-care devices leverage the MKL03Z32VFK4's low active current and deterministic Cortex-M0+ performance for measurement and display driving. The 12-bit ADC delivers sufficient resolution for basic measurements, and the LPUART allows low-speed debug without disturbing low-power operation. Place the KL03 between a lithium-coin-cell and a segmented LCD or OLED display; use the on-chip low-power timer for periodic measurement while the MCU sleeps. Kinetis SDK support enables rapid development of IEC 60730-compliant firmware for safety-critical portable devices.

🏭

Industrial Sensor Transmitters

Loop-powered 4-20 mA sensor transmitters, wirelessHART adapters, and field-mount vibration sensors benefit from the MKL03Z32VFK4's industrial operating temperature range (-40 C to +105 C) and ultra-low sleep current for loop-powered operation. The 32 KB flash is sufficient for HART or WirelessHART protocol stacks, and the 24-QFN (4x4 mm) package fits inside standard industrial sensor housings. Place the KL03 between a 24 V loop interface and a vibration/temperature sensor chain; the 12-bit ADC digitizes the sensor signal while the MCU runs protocol stacks over SPI-attached modems. Industrial-grade ESD and EMI robustness of the Kinetis L series simplifies IEC 61000-4 compliance.

Recommended Products Summary

FXAS21002C 3-axis gyroscope companion Used in: Wearable Fitness and Health Sensors MAX30102 PPG heart-rate sensor Used in: Wearable Fitness and Health Sensors SX1276 sub-GHz transceiver companion Used in: Ultra-Low-Power Wireless Sensor Nodes BC832 BLE module Used in: Ultra-Low-Power Wireless Sensor Nodes RN4870 BLE module companion Used in: IoT Endpoints and Edge Sensors ESP32-S3 Wi-Fi/BLE companion SoC Used in: IoT Endpoints and Edge Sensors EFR32MG21 Zigbee/Thread radio SoC companion Used in: Smart Home and Building Automation Nodes MCP9700 analog temperature sensor Used in: Battery-Powered Portable Instrumentation XTR105 4-20 mA loop transmitter companion Used in: Industrial Sensor Transmitters
What is the operating voltage of MKL03Z32VFK4?
The MKL03Z32VFK4 operates from 1.71 V to 3.6 V. According to the NXP KL03 datasheet, this wide range supports single-cell lithium (1.8 V to 3.0 V), coin-cell (3.0 V), and 3.3 V regulated rails. At full 48 MHz HSRUN mode the device requires at least 2.1 V; below that it downshifts to lower-frequency RUN/WAIT modes to maintain correct logic operation.
How much flash and SRAM does MKL03Z32VFK4 have?
The MKL03Z32VFK4 integrates 32 KB of program flash and 2 KB of SRAM. The 32 KB flash is sized for small RTOS or bare-metal Cortex-M0+ firmware (typical BLE beacon stacks, sensor fusion, simple control loops). The 2 KB SRAM is the smallest in the Kinetis L series; engineers targeting more buffering should step up to the KL05 or KL27 sub-family.
What is the maximum clock speed of MKL03Z32VFK4?
The MKL03Z32VFK4 runs at a maximum core frequency of 48 MHz. The Cortex-M0+ core achieves 0.93 DMIPS/MHz, giving roughly 45 DMIPS of integer compute. The 48 MHz HSRUN mode is unlocked above 2.1 VDD, and the device automatically drops into 20 MHz RUN when VDD falls below that threshold to protect timing margins.
What package does MKL03Z32VFK4 use?
The MKL03Z32VFK4 ships in a 24-pin QFN (Quad Flat No-lead) package measuring 4 x 4 mm. This is the smallest footprint option in the KL03 line. The exposed pad must be soldered to the ground plane for thermal and electrical performance, and pin 1 is identified by a marker dot on the top surface.
Where can I buy MKL03Z32VFK4 online?
The MKL03Z32VFK4 is currently stocked at authorized distributors including DigiKey, Mouser, and Avnet, with pricing starting around $2.95 at qty 1 (as of 2026-10-09). Volume pricing drops below $1.61 at 3,000 pieces. Octopart aggregates live stock from 11 distributors for instant comparison across North America, EU, and APAC inventory.
What is the lead time for MKL03Z32VFK4?
The MKL03Z32VFK4 ships immediately from in-stock inventory at DigiKey and Mouser (as of 2026-10-09); factory lead time is typically 8-12 weeks for production volumes above distributor stock. Because the Kinetis KL03 is an active NXP part, NXP's product longevity program targets 10-15 years of supply - longer than typical consumer MCUs.
MKL03Z32VFK4 vs MKL03Z32VFG4 - which is better for low-power designs?
Both share the same Kinetis KL03 die, 32 KB flash, 2 KB SRAM, and 48 MHz Cortex-M0+ core. The MKL03Z32VFK4 ships in a 24-QFN (4x4 mm) footprint while the MKL03Z32VFG4 uses the larger 16-QFN package. For wearable or sensor-node designs where PCB area matters, MKL03Z32VFK4 is the better choice; for breadboard-friendly prototypes, MKL03Z32VFG4 may be easier to hand-solder.
MKL03Z32VFK4 vs MKL03Z8VFK4 - what is the difference?
The MKL03Z32VFK4 has 32 KB of flash and 2 KB of SRAM, while the MKL03Z8VFK4 has only 8 KB of flash and 2 KB of SRAM. Both share the same 24-QFN (4x4 mm) package and 48 MHz Cortex-M0+ core, making them pin-compatible. The 8 KB variant is intended for very small firmware footprints (bootloader + minimal app), while the 32 KB variant supports richer application code.
When should I choose MKL03Z32VFK4 over MKL02Z32VFK4?
Choose MKL03Z32VFK4 when you need additional analog peripherals and the LPUART/LPSPI low-power serial interfaces that the KL02 lacks. The KL02 has a similar 32 KB flash / 4 KB SRAM profile but a less rich analog chain and fewer low-power wake-up sources. Pick MKL03Z32VFK4 for new designs; the KL02 is appropriate only when cost is the dominant constraint and the analog set is sufficient.
What is the best drop-in replacement for MKL03Z32VFK4?
The best drop-in replacement for MKL03Z32VFK4 is the MKL03Z32VFG4 - both share the same KL03 die, 32 KB flash, 2 KB SRAM, 48 MHz core, and Kinetis peripheral set, differing only in QFN-24 vs QFN-16 mechanical package. For exact 24-QFN footprint replacement, the MKL03Z8VFK4 (8 KB flash) is fully pin-compatible and operates identically except for flash density.
Where to download MKL03Z32VFK4 datasheet PDF?
The official MKL03Z32VFK4 datasheet (NXP document KL03P24M48SF0) is available on NXP's product page at nxp.com and is mirrored on distributor sites including DigiKey and Mouser. The datasheet covers electrical characteristics, pinout, package drawings, and the full peripheral register map for the Kinetis KL03 sub-family.
Where to find MKL03Z32VFK4 pinout diagram?
The MKL03Z32VFK4 pinout is documented in Section 5 (Pinout) of the NXP KL03 datasheet. The 24-QFN pin assignment includes power (VDD, VSS, VREFH, VREFL), reset (RESET_b), debug (SWDIO, SWCLK), and a mix of GPIO/analog pins multiplexed to UART, SPI, I2C, ADC, and timer peripherals. The XAIPART product page renders an interactive SVG pinout derived from the same datasheet.
What are the key specifications of MKL03Z32VFK4 that engineers should know?
Key specifications: ARM Cortex-M0+ core at 48 MHz, 32 KB flash, 2 KB SRAM, 1.71 V to 3.6 V supply, 24-QFN (4x4 mm) package, 12-bit SAR ADC, low-power UART/SPI/I2C, and multiple low-power modes (VLLS, LLS, STOP). The KL03 is software- and tool-compatible with all other Kinetis L series devices, easing migration from 8-bit MCUs and supporting battery lifetimes of years on coin cells.
What is the best cross-brand equivalent for MKL03Z32VFK4?
There is no exact cross-brand drop-in replacement for the MKL03Z32VFK4 in the same 24-QFN footprint. Comparable cross-brand Cortex-M0+ MCUs from STMicroelectronics (STM32L0 G0 series) and Microchip (SAM D10) offer similar 48 MHz performance and ultra-low power, but require PCB rework because of different pin counts and package outlines. Designers should treat cross-brand options as functional alternatives, not drop-in replacements.

Engineering reference data for MKL03Z32VFK4 — comparison, design guidance, and compliance information.

Selection Guide

Choose MKL03Z32VFK4 when you need the smallest 24-QFN (4x4 mm) NXP Kinetis Cortex-M0+ MCU with 32 KB flash for ultra-low-power IoT, wearable, or sensor-node applications. Choose MKL03Z8VFK4 if you can fit within 8 KB flash - same 24-QFN footprint, lower cost. Choose MKL03Z32VFG4 only if you can lay out a 16-QFN footprint and do not need the extra GPIO. Choose MKL02Z32VFK4 if you need 4 KB of SRAM (vs 2 KB) and the slightly different analog chain is acceptable. All KL03 variants share the same 48 MHz Cortex-M0+ core, Kinetis SDK, and MCUXpresso toolchain, so firmware is portable across the sub-family.

Comparison with Alternatives

Parameter This Product MKL03Z32VFG4 MKL03Z8VFK4 MKL03Z8VFG4R MKE04Z8VWJ MKL02Z32VFK4
Package 24-QFN (4x4 mm) 16-QFN 24-QFN (4x4 mm) - same 16-QFN 20-WLCSP 24-QFN (4x4 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+
Max CPU Frequency 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz
Program Flash 32 KB 32 KB 8 KB (-75%) 8 KB (-75%) 8 KB (-75%) 32 KB (same)
SRAM 2 KB 2 KB 2 KB 2 KB 1 KB (-50%) 4 KB (+100%)
Operating Voltage 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V 2.7 V to 5.5 V 1.71 V to 3.6 V
Package Pin Count 24 16 24 16 20 24

Key Differentiators

  • Smallest footprint in the Kinetis L series (vs MKL03Z32VFG4)
  • Largest flash in the 24-QFN KL03 line (vs MKL03Z8VFK4)
  • Best-in-class VLLS0 deep-sleep current (vs MKL02Z32VFK4)

Design Notes

Estimated: average current consumption in a typical 1% duty-cycle IoT node (wake every 60 s, sample, transmit, return to VLLS0) is dominated by sleep current. With the KL03 VLLS0 sleep of approximately 0.5 uA and active current of approximately 4 mA at 48 MHz for 5 ms, the average is about 1.7 uA - giving >5 years of life on a 220 mAh CR2032 coin cell. Always include a 100 nF decoupling capacitor within 3 mm of each VDD/VSS pin pair.

The 24-QFN (4x4 mm) package has an exposed thermal pad on the underside that MUST be soldered to a copper ground pour for electrical performance and thermal dissipation. Use 0.1 mm via array (8-12 vias) under the pad stitched to the bottom ground plane to maximize heat sinking. Keep high-speed SWD traces (SWDIO, SWCLK) under 50 mm and avoid routing them near analog ADC inputs to prevent digital-noise coupling into the 12-bit ADC.

Do not operate the device above 48 MHz core clock - exceeding this causes flash wait-state violations and undefined behavior. Do not exceed 3.6 V on VDD even momentarily; the on-chip voltage regulator has no over-voltage clamp. When migrating code from the KL02 to the KL03, reconfigure any GPIO that previously used the KL02's specific analog channels - the KL03 has different peripheral muxing on shared pins and incorrect muxing will silently break UART, SPI, and ADC functionality.

Estimated: at 48 MHz core and 3.6 V supply, the KL03 dissipates approximately 14 mW (typical active current 4 mA x 3.6 V). With the 24-QFN 4x4 mm footprint soldered to a 1 square inch 2-oz copper pour, theta_JA is approximately 80 C/W, yielding a 1.1 C temperature rise above ambient - well within the 105 C maximum operating junction temperature. No external heatsink is required for any normal MCU operating mode.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

Standard NXP Kinetis KL03 is not AEC-Q100 qualified - use the KEAZ automotive sub-family for AEC-Q100. RoHS and REACH compliance per NXP product page; halogen-free status not explicitly published.

Data verified on: 2026-10-09 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors MKL03Z32VFK4 MKL03Z32VFG4 MKL03Z8VFK4 MKL03Z8VFG4R MKL02Z32VFK4 MKE04Z8VWJ ARM Cortex-M0+ Kinetis KL03 Kinetis L series microcontroller 32-bit MCU ultra-low-power 24-QFN QFN package family VLLS0 low-leakage wakeup unit LPUART LPSPI 12-bit SAR ADC RoHS REACH MCUXpresso Kinetis SDK Bluetooth Low Energy
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