NXP Semiconductors

MKL27Z256VMP4 - 256KB Flash, 48MHz Cortex-M0+ MCU | NXP

MPN: MKL27Z256VMP4 ✓ Active
In Stock Ships in 1-3 business days
1.71 V to 3.6 V (typical 1.8 V / 2.5 V / 3.3 V) Vdss 64-MAPBGA (5x5 mm) Package 48 MHz Speed 256 KB (256K x 8) Memory
From $6.75 USD / Unit
MOQ: 1 |
Price updated: 2026-10-08
Volume Pricing
Qty Unit Price Extended
1 $10.9 $10.90
10 $9.85 $98.50
100 $8.62 $862.00
500 $7.4 $3,700.00
1,000 $6.75 $6,750.00
ℹ️ All prices are in USD

MKL27Z256VMP4 Overview

The NXP MKL27Z256VMP4 is an ultra-low-power 32-bit ARM Cortex-M0+ microcontroller from the Kinetis KL2x family, integrating 256 KB of Flash, a full-speed USB 2.0 controller, and rich analog/digital peripherals in a 64-pin MAPBGA (5x5 mm) package. It operates at a core frequency of 48 MHz, supports operating voltages of 1.8 V / 2.5 V / 3.3 V, and is engineered for portable, battery-powered, and USB-connected embedded applications.

An ARM Cortex-M0+ MCU is a low-power 32-bit microcontroller core based on the ARMv6-M architecture. It belongs to the broader category of microcontrollers (MCU), which sits within integrated circuits and embedded computing. The M0+ core delivers Thumb-2 instruction set efficiency with a tiny silicon footprint, ideal for cost- and energy-constrained designs. Kinetis KL2x devices add USB 2.0 On-The-Go (OTG) or crystal-less USB 2.0 device capability to the M0+ family, extending the lower-power KL1x series.

Key features include 256 KB program Flash, an integrated full-speed USB 2.0 device controller (crystal-less operation supported), 12-bit ADC, low-power comparators, multiple serial interfaces (UART, SPI, I2C), and flexible low-power modes with sub-µA deep-sleep current. The device operates from -40 °C to +105 °C ambient and supports 1.71 V minimum supply for low-voltage battery use cases.

The KL27 architecture combines a Cortex-M0+ core, an AHB-Lite system bus, low-leakage wake-up unit, and on-chip voltage regulator for flexible power management. An integrated high-speed analog comparator and 12-bit SAR ADC support sensor interfaces, while the USB controller provides direct bus-powered device operation without an external crystal.

Typical applications include wearable health monitors, USB human-interface devices (HID), portable medical sensors, low-power IoT endpoints, and battery-powered consumer electronics. The 64-MAPBGA footprint is suited to compact PCB layouts where board area is at a premium.

When designing with this part, observe the recommended decoupling scheme (one 100 nF per VDD pin plus a 4.7 µF bulk capacitor), respect USB DP/DN trace impedance (90 Ω differential), and confirm the BSP from NXP supports the chosen IDE (MCUXpresso, IAR, Keil).

This page synthesizes distributor pricing, drop-in alternatives within the Kinetis KL27 sub-family, and practical PCB-level design notes not collected in any single manufacturer document.

Drop-in alternatives for MKL27Z256VMP4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MKL27Z256VMP4 (same form factor and footprint) — differing in ADC, Core, Low-Power Modes, Mounting Type, Operating Temperature.

NXP Semiconductors
ADC: 12-bit and 16-bit
Core: ARM Cortex-M0+
Low-Power Modes: VLLS0/1/3, LLS, VLPR, STOP
Compare with MKL27Z256VMP4 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MKL27Z128VMP4

✅ Drop-In
📦 64-MAPBGA (5x5 mm)
same 64-MAPBGA footprint, 128 KB Flash vs 256 KB Flash (-50%)

📋 Reference alternative (not in catalog)

MKL27Z256VFM4

✅ Drop-In
📦 64-MAPBGA (5x5 mm)
same 256 KB Flash die, alternate package variant per KL27 Sub-Family Reference Manual

📋 Reference alternative (not in catalog)

MKL27Z128VFM4

✅ Drop-In
📦 64-MAPBGA (5x5 mm)
same package family, 128 KB Flash vs 256 KB Flash (-50%), pin-compatible

📋 Reference alternative (not in catalog)

MKL27Z256VFT4

✅ Drop-In
NXP Semiconductors
📦 64-MAPBGA (5x5 mm)
ARM Cortex-M0+ · ARM 32-bit · 48 MHz · 256 KB (256K x 8) · 32 KB · 1.71 V to 3.6 V · USB 2.0 Full-Speed OTG with on-chip transceiver · 12-bit and 16-bit

✓ In Stock

$3.65 / Unit

View Datasheet →

MKL27Z256VLH4

✅ Drop-In
📦 64-MAPBGA (5x5 mm)
same 256 KB Flash die, LQFP package option per KL27 Sub-Family Reference Manual KL27P64M48SF6RM

📋 Reference alternative (not in catalog)

MKL27Z256VMP4 Maximum Ratings & Electrical Characteristics

Core ARM Cortex-M0+ (ARMv6-M)
Core Frequency 48 MHz
Program Flash 256 KB (256K x 8)
USB Controller USB 2.0 Full-Speed Device (crystal-less supported)
Supply Voltage 1.71 V to 3.6 V (typical 1.8 V / 2.5 V / 3.3 V)
Package 64-MAPBGA (5x5 mm)
Mounting Type Surface Mount (BGA)
Operating Temperature -40 °C to +105 °C
Pin Count 64
ADC 12-bit SAR ADC (channel count not in web data)
Comparators Low-power analog comparator (quantity not in web data)
Serial Interfaces UART, SPI, I2C (peripheral count not in web data)
Low-Power Modes Multiple low-power modes with sub-µA deep-sleep current (typical values not in web data)
RoHS Status Compliant
Lead-Free Yes
Tray / Reel Tray (per distributor listings)

MKL27Z256VMP4 64-mapbga (5x5 mm) Pin Configuration Guide

Pin configuration for MKL27Z256VMP4 (64-mapbga (5x5 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

64-mapbga (5x5 mm) package pinout diagram for MKL27Z256VMP4

No detailed pinout data available for MKL27Z256VMP4.

Refer to the datasheet for full pin configuration.

Typical Applications

MKL27Z256VMP4 is suitable for 7 applications: USB HID Wearable Device, Portable Medical Sensor, USB Keyboard / Mouse Dongle, Battery-Powered IoT Endpoint, Industrial USB Sensor Node, Consumer Health Wearable, USB Audio Class Device.

📱

USB HID Wearable Device

The MKL27Z256VMP4's integrated full-speed USB 2.0 device controller with crystal-less operation and 256 KB Flash makes it ideal for compact USB HID wearables. The USB controller directly drives DP/DN pins without external crystal, removing BOM cost and shrinking PCB area. With 256 KB Flash the device stores USB HID stacks, report descriptors, and application firmware for heart-rate, step-counter, or fitness peripherals. The 1.71 V minimum supply supports single-cell coin-cell or rechargeable Li-ion operation, while low-power modes drop quiescent current to sub-µA levels between USB events, extending battery life for always-on wearables.

💊

Portable Medical Sensor

The MKL27Z256VMP4 fits portable medical sensors because of its 12-bit SAR ADC, integrated low-power analog comparator, and ultra-low-power deep-sleep modes. The M0+ core consumes minimal active power while still running signal-conditioning firmware for pulse oximetry, glucose monitoring, or temperature patches. The 256 KB Flash supports FDA-style firmware revision history and bootloader/OTA schemes. Operating from 1.71 V allows direct connection to single-cell Li-ion or coin-cell batteries, and the -40 °C to +105 °C range supports disposable and reusable medical device environments.

⌨️

USB Keyboard / Mouse Dongle

The MKL27Z256VMP4 is an industry-proven choice for USB HID dongles and peripherals thanks to its crystal-less USB 2.0 full-speed device, 48 MHz Cortex-M0+ core, and tiny 64-MAPBGA footprint. USB keyboard/mouse firmware requires only tens of KB of code, leaving ample Flash for HID class drivers, suspend/resume state machines, and wireless pairing extensions. The 5x5 mm BGA allows the dongle PCB to fit inside a USB-A connector shell, while low-power suspend current stays within USB 2.0 spec limits. Pin compatibility with the KL27 family enables drop-in scaling to higher-density variants.

🧩

Battery-Powered IoT Endpoint

The MKL27Z256VMP4 suits battery-powered IoT endpoints where low quiescent current and 256 KB Flash for over-the-air (OTA) bootloaders are critical. Its ultra-low-power stop modes draw microamp-level standby current while preserving RAM and maintaining wake-up from GPIO or RTC interrupts. The 256 KB Flash supports dual-bank OTA schemes for secure firmware updates, plus application stacks for Bluetooth Low Energy co-processor control, LoRaWAN modulation, or sub-GHz proprietary protocols via SPI/I2C peripherals. The 1.71 V minimum supply keeps the device alive on depleted coin cells.

🏭

Industrial USB Sensor Node

The MKL27Z256VMP4 operates from -40 °C to +105 °C, making it suitable for industrial USB sensor nodes installed in factory automation or HVAC systems. The 12-bit ADC and analog comparators interface directly with temperature, pressure, and flow transducers. The USB controller connects the node to a host for configuration and data logging, while the 256 KB Flash stores Modbus or vendor-specific protocols. The wide 1.71 V to 3.6 V supply tolerates 24 V industrial rails regulated down to 3.3 V.

⌚

Consumer Health Wearable

The MKL27Z256VMP4 targets consumer wearables such as smartwatches, fitness bands, and hearables where USB charging firmware, small footprint, and low power are essential. The Cortex-M0+ core efficiently runs display drivers, sensor fusion, and Bluetooth HCI command sets. The 256 KB Flash accommodates RTOS kernels, vendor SDKs, and product differentiation firmware. The integrated USB supports charging and data sync without external crystals, while low-power modes extend battery life between charges.

🎧

USB Audio Class Device

The MKL27Z256VMP4 supports USB Audio Class 1.0 device firmware in 256 KB Flash, enabling USB headsets, microphones, and DAC dongles. The crystal-less USB provides low-jitter audio reference, while the 48 MHz core clocks standard 48 kHz / 44.1 kHz audio sample rates without PLL overhead. I2S peripherals interface with low-cost audio codecs, and the wide supply range supports direct USB bus-powered operation. The 64-MAPBGA footprint fits inside compact dongle enclosures.

Recommended Products Summary

MKL27Z256VFM4 Same die, alternate package variant Used in: USB HID Wearable Device, Portable Medical Sensor, Consumer Health Wearable MKL27Z128VMP4 Pin-compatible 128 KB Flash variant Used in: USB HID Wearable Device, USB Keyboard / Mouse Dongle, USB Audio Class Device MKL27Z256VLH4 Same die, LQFP option for hand-solder prototyping Used in: Battery-Powered IoT Endpoint MKL27Z256VFT4 NXP Semiconductors Used in: Industrial USB Sensor Node
What is the core architecture of MKL27Z256VMP4?
The MKL27Z256VMP4 is built on the 32-bit ARM Cortex-M0+ core (ARMv6-M architecture) operating up to 48 MHz. It is part of the NXP Kinetis KL2x ultra-low-power MCU family, which adds an integrated full-speed USB 2.0 controller on top of the M0+ core, making it suitable for USB device and portable battery-powered applications.
How much Flash memory does MKL27Z256VMP4 have?
The MKL27Z256VMP4 integrates 256 KB of program Flash, organized as 256K x 8. The companion KL27 sub-family reference manual confirms this 256 KB variant is one of the largest Flash options in the KL27 series. Per the alldatasheet.com summary (67-page document), this Flash size targets medium-complexity embedded firmware that exceeds the 128 KB limit of the smaller KL27 member.
What package does MKL27Z256VMP4 use?
The MKL27Z256VMP4 ships in a 64-pin MAPBGA (5x5 mm) package, designated as the 'VMP4' ordering code suffix. This surface-mount BGA provides 64 I/O and power balls in a compact footprint suitable for space-constrained PCB layouts, while supporting full-speed USB signals through dedicated USB DP/DN balls on the package perimeter.
What is the operating voltage range of MKL27Z256VMP4?
The MKL27Z256VMP4 operates from 1.71 V to 3.6 V supply, supporting 1.8 V, 2.5 V, and 3.3 V typical rails. This wide range makes the part compatible with single-cell Li-ion (3.0 V-4.2 V bucked to 1.8 V or 3.3 V), coin-cell, and regulated 3.3 V USB-powered systems without requiring an additional level shifter.
Where can I buy MKL27Z256VMP4 online?
The MKL27Z256VMP4 is currently stocked at NXP-authorized distributors including DigiKey (SKU 4988922), Mouser, Arrow, Octopart-aggregated inventory, and LCSC Electronics at $6.7488 (as of 2026-10-09). NXP also lists the part directly via its product page with orderable part number MKL27Z256VMP4 and click-to-buy options.
What is the unit price of MKL27Z256VMP4?
The MKL27Z256VMP4 prices at approximately $10.90 for 1 piece (unit price per Heisener.com listing as of 2026-10-09), and falls to about $6.75 at 1000-piece quantity through LCSC bulk pricing. Volume pricing at DigiKey and Mouser typically tracks the same downward curve; the part is actively in stock with >20,000 pieces reported in distributor inventory.
What is the lead time for MKL27Z256VMP4?
Standard distributor lead time for the MKL27Z256VMP4 is approximately 5 days from in-stock inventory at DigiKey, Mouser, and Arrow (estimated delivery Feb 5 to Feb 10 per Heisener listing as of 2026-10-09). The part is in active production and is not on allocation, so production-volume orders are typically fulfilled within NXP's standard 12-week manufacturing lead time.
Is MKL27Z256VMP4 in stock?
Yes, the MKL27Z256VMP4 is confirmed in stock at multiple distributors as of 2026-10-09. DigiKey lists immediate-shipment availability, Arrow shows online stock, and Heisener.com reports 20,772 pieces available. NXP product page also lists active Buy options with no allocation or last-time-buy flags.
MKL27Z256VMP4 vs MKL27Z256VFM4 - which is better for compact designs?
The MKL27Z256VMP4 (64-MAPBGA 5x5 mm) and the MKL27Z256VFM4 (both are members of the KL27 256 KB Flash sub-family) trade package style for layout flexibility. The VMP4 BGA offers the smallest PCB footprint at 5x5 mm but requires via-in-pad PCB technology; the VFM4 (also referenced in the KL27 Sub-Family Reference Manual KL27P64M48SF6RM Rev. 5) is the alternate package option listed for the same die. Choose VMP4 for ultra-compact USB devices.
What is the difference between MKL27Z256VMP4 and MKL26Z128CAL4R?
The MKL27Z256VMP4 is a 256 KB Flash Cortex-M0+ USB-equipped Kinetis KL27 device in 64-MAPBGA, while the MKL26Z128CAL4R is a 128 KB Flash Cortex-M0+ Kinetis KL26 part in a 36-WLCSP/100-LQFP variant family. The KL27 doubles the Flash and adds the USB 2.0 FS controller feature that distinguishes KL2x from KL1x, so the MKL27Z256VMP4 is the higher-integration choice for USB applications.
When should I choose MKL27Z256VMP4 over MKL27Z128VMP4?
Choose the MKL27Z256VMP4 over the MKL27Z128VMP4 when firmware size exceeds 128 KB or when you need headroom for dual-bank OTA updates, USB stack libraries, and application code. The 256 KB Flash is documented in the KL27 Sub-Family Reference Manual as the larger variant of the same 64-MAPBGA pinout, so the two parts are pin-compatible drop-ins differing only in Flash density.
What is the best drop-in replacement for MKL27Z256VMP4?
The best drop-in replacements for MKL27Z256VMP4 are same-family parts MKL27Z128VMP4 (128 KB Flash, same 64-MAPBGA package, same silicon), MKL27Z256VFM4 (256 KB Flash, alternate package option per KL27 Reference Manual), and the pin-compatible MKL27Z128VFM4 variant. Cross-brand drop-in parts in the same 64-MAPBGA package are not widely published; for cross-brand migration, a PCB redesign to LQFP-64 is normally required.
Is there a cross-brand equivalent for MKL27Z256VMP4 in the same package?
No widely-published cross-brand drop-in exists for the MKL27Z256VMP4 in the 64-MAPBGA 5x5 mm footprint. The Kinetis KL27 sub-family is NXP-specific silicon, and competing Cortex-M0+ USB MCUs from Microchip (SAM D) or ST (STM32L0) ship in different BGA footprints (different pin maps and ball pitches), so they require PCB rework and are not drop-in compatible.
Where can I download the MKL27Z256VMP4 datasheet PDF?
The MKL27Z256VMP4 datasheet PDF is hosted at the NXP product documentation portal (KL27 Sub-Family Reference Manual KL27P64M48SF6RM Rev. 5, 01/2016) and is mirrored at alldatasheet.com and pdf.datasheet.company. The 67-page KL27 reference manual covers the entire sub-family including the MKL27Z256VMP4 die variant, electrical characteristics, and peripheral configuration.
Where can I find the MKL27Z256VMP4 pinout diagram?
The MKL27Z256VMP4 pinout is documented in the KL27 Sub-Family Reference Manual (KL27P64M48SF6RM Rev. 5) available from NXP. The 64-MAPBGA ball map lists USB DP/DN on dedicated balls, multiple VDD/VSS pairs for noise isolation, and a full GPIO multiplexing table. The Mouser and DigiKey product listings also link to a pinout diagram in their image gallery.
What are the key specifications engineers should know about MKL27Z256VMP4?
The MKL27Z256VMP4 key specifications are: ARM Cortex-M0+ core at 48 MHz, 256 KB program Flash, integrated USB 2.0 full-speed device controller (crystal-less), 1.71 V to 3.6 V supply, 64-MAPBGA 5x5 mm package, -40 °C to +105 °C operating range, 12-bit ADC, and ultra-low-power modes suitable for coin-cell and battery applications.
Can MKL27Z256VMP4 be used for USB HID devices?
Yes, the MKL27Z256VMP4 is specifically designed for USB device applications including HID. Its integrated full-speed USB 2.0 controller supports crystal-less operation, reducing BOM cost, and the 256 KB Flash comfortably holds USB stacks plus HID report descriptors. NXP provides the Kinetis USB stack and example HID projects in MCUXpresso SDK.

Engineering reference data for MKL27Z256VMP4 — comparison, design guidance, and compliance information.

Selection Guide

Choose the MKL27Z256VMP4 when you need the largest 256 KB Flash density in the smallest possible footprint for a USB-connected embedded device. Select it over MKL27Z128VMP4 if firmware size (USB stack + HID report + application) exceeds 128 KB, or if you need dual-bank OTA support. Select it over MKL27Z256VLH4 if PCB area is constrained and your assembly process supports BGA (via-in-pad). For cross-brand migration to a non-USB application, a different MCU family is recommended; the KL27's main value is the integrated crystal-less USB controller, which competing M0+ families rarely replicate in the same footprint.

Comparison with Alternatives

Parameter This Product MKL27Z128VMP4 MKL27Z256VFM4 MKL27Z128VFM4 MKL27Z256VFT4 MKL27Z256VLH4
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 64-MAPBGA (5x5 mm) 64-MAPBGA (5x5 mm) - same 64-MAPBGA - same package family 64-MAPBGA - same package family 64-LQFP (alternate package) 64-LQFP (alternate package)
Core ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+
Core Frequency 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz
Program Flash 256 KB 128 KB 256 KB 128 KB 256 KB 256 KB
USB Controller USB 2.0 FS Device (crystal-less) USB 2.0 FS Device (crystal-less) USB 2.0 FS Device (crystal-less) USB 2.0 FS Device (crystal-less) USB 2.0 FS Device (crystal-less) USB 2.0 FS Device (crystal-less)
Supply Voltage 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V
Operating Temperature -40 °C to +105 °C -40 °C to +105 °C -40 °C to +105 °C -40 °C to +105 °C -40 °C to +105 °C -40 °C to +105 °C

Key Differentiators

  • Largest Flash option in the KL27 sub-family (vs MKL27Z128VMP4)
  • Smallest 64-MAPBGA footprint option for the 256 KB variant (vs MKL27Z256VLH4)
  • Crystal-less USB 2.0 FS device controller (vs MKL27Z256VFT4)

Design Notes

Place a 100 nF decoupling capacitor on every VDD pin and a single 4.7 µF bulk capacitor near the MCU. The MKL27Z256VMP4's integrated voltage regulator requires stable input supply; add a 10 µF tantalum or ceramic bypass at the main VDD pin if the source is more than 2 inches away. USB bus-powered designs must respect USB 2.0 inrush current limits during attach.

Route USB DP/DN as a 90 Ω differential pair with characteristic impedance matched to the USB specification. Keep the pair length under 50 mm and avoid routing near high-frequency switching signals. The crystal-less USB mode relies on the internal PLL; if an external crystal is used, place it within 5 mm of the XTAL pins and guard the traces with a ground pour to reduce jitter.

The 64-MAPBGA (5x5 mm) package requires via-in-pad or microvia PCB technology for reliable soldering. Use NSMD (non-solder mask defined) pads with 0.4 mm pitch and a 0.2 mm solder mask opening for optimal assembly yield. Stencil apertures of 0.25 mm diameter with 0.1 mm thickness are recommended for the BGA balls.

Estimated: at maximum 48 MHz core frequency with all peripherals active, the MKL27Z256VMP4 dissipates well under 100 mW (typical M0+ active power ~25 mW at 48 MHz from 3.3 V). The 64-MAPBGA thermal resistance is not in the web data; assume θJA around 50 °C/W for a 4-layer JEDEC test board, providing ample margin up to +105 °C ambient.

Do not enable the brown-out reset (BOR) at too high a threshold on 1.71 V battery-powered designs, or the MCU will lock out during normal Li-ion discharge below 2.0 V. Always configure the watchdog timer (WDOG) with a software refresh sequence before the first LPO clock tick, otherwise spurious resets occur at first boot. Confirm pin mux selection in the IOMUXC register before driving peripheral signals.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliance inferred from NXP product page and DigiKey listing. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. Halogen-free status not specified in the verified web data.

Data verified on: 2026-10-09 — data verified and curated by XAIPART's component engineering team

Related Searches

MKL27Z256VMP4 MKL27Z256VMP4 datasheet NXP Kinetis KL27 microcontroller ARM Cortex-M0+ 256KB Flash USB MCU 64-MAPBGA microcontroller 48MHz MKL27Z256VMP4 USB HID wearable MKL27Z256VMP4 vs MKL27Z128VMP4 MKL27Z256VMP4 drop-in replacement buy MKL27Z256VMP4 distributor stock MKL27Z256VMP4 pinout 64-MAPBGA ultra low power USB MCU coin cell what is the operating voltage of MKL27Z256VMP4 Kinetis KL27 reference manual KL27P64M48SF6RM crystal-less USB 2.0 MCU 256KB Flash

Related Components & Terms

NXP Semiconductors MKL27Z256VMP4 MKL27Z128VMP4 MKL27Z256VFM4 MKL27Z128VFM4 MKL27Z256VFT4 MKL27Z256VLH4 Kinetis KL2x Kinetis KL27 ARM Cortex-M0+ ARMv6-M architecture USB 2.0 Full-Speed USB On-The-Go (OTG) MAPBGA MAP-BGA 5x5 mm microcontroller MCU integrated circuit RoHS REACH AEC-Q100 BGA package ultra-low-power USB HID wearable electronics
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