MKL27Z256VMP4 - 256KB Flash, 48MHz Cortex-M0+ MCU | NXP
料号： MKL27Z256VMP4 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $10.9 | $10.90 |
| 10 | $9.85 | $98.50 |
| 100 | $8.62 | $862.00 |
| 500 | $7.4 | $3,700.00 |
| 1,000 | $6.75 | $6,750.00 |
MKL27Z256VMP4 概述
An ARM Cortex-M0+ MCU is a low-power 32-bit microcontroller core based on the ARMv6-M architecture. It belongs to the broader category of microcontrollers (MCU), which sits within integrated circuits and embedded computing. The M0+ core delivers Thumb-2 instruction set efficiency with a tiny silicon footprint, ideal for cost- and energy-constrained designs. Kinetis KL2x devices add USB 2.0 On-The-Go (OTG) or crystal-less USB 2.0 device capability to the M0+ family, extending the lower-power KL1x series.
Key features include 256 KB program Flash, an integrated full-speed USB 2.0 device controller (crystal-less operation supported), 12-bit ADC, low-power comparators, multiple serial interfaces (UART, SPI, I2C), and flexible low-power modes with sub-µA deep-sleep current. The device operates from -40 °C to +105 °C ambient and supports 1.71 V minimum supply for low-voltage battery use cases.
The KL27 architecture combines a Cortex-M0+ core, an AHB-Lite system bus, low-leakage wake-up unit, and on-chip voltage regulator for flexible power management. An integrated high-speed analog comparator and 12-bit SAR ADC support sensor interfaces, while the USB controller provides direct bus-powered device operation without an external crystal.
Typical applications include wearable health monitors, USB human-interface devices (HID), portable medical sensors, low-power IoT endpoints, and battery-powered consumer electronics. The 64-MAPBGA footprint is suited to compact PCB layouts where board area is at a premium.
When designing with this part, observe the recommended decoupling scheme (one 100 nF per VDD pin plus a 4.7 µF bulk capacitor), respect USB DP/DN trace impedance (90 Ω differential), and confirm the BSP from NXP supports the chosen IDE (MCUXpresso, IAR, Keil).
This page synthesizes distributor pricing, drop-in alternatives within the Kinetis KL27 sub-family, and practical PCB-level design notes not collected in any single manufacturer document.
直接替换替代料： MKL27Z256VMP4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MKL27Z256VMP4 （相同外形与封装尺寸） ——差异在于 ADC, Core, Low-Power Modes, Mounting Type, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
MKL27Z128VMP4
✅ 直接替换📋 参考替代料（不在目录中）
MKL27Z256VFM4
✅ 直接替换📋 参考替代料（不在目录中）
MKL27Z128VFM4
✅ 直接替换📋 参考替代料（不在目录中）
MKL27Z256VFT4
✅ 直接替换✓ 有现货
$3.65 / 个
查看数据手册 →MKL27Z256VLH4
✅ 直接替换📋 参考替代料（不在目录中）
MKL27Z256VMP4 最大额定值与电气特性
| Core | ARM Cortex-M0+ (ARMv6-M) |
| Core Frequency | 48 MHz |
| Program Flash | 256 KB (256K x 8) |
| USB Controller | USB 2.0 Full-Speed Device (crystal-less supported) |
| 电源电压 | 1.71 V to 3.6 V (typical 1.8 V / 2.5 V / 3.3 V) |
| 封装 | 64-MAPBGA (5x5 mm) |
| 安装类型 | Surface Mount (BGA) |
| 工作温度 | -40 °C to +105 °C |
| 引脚数量 | 64 |
| ADC | 12-bit SAR ADC (channel count not in web data) |
| Comparators | Low-power analog comparator (quantity not in web data) |
| Serial Interfaces | UART, SPI, I2C (peripheral count not in web data) |
| Low-Power Modes | Multiple low-power modes with sub-µA deep-sleep current (typical values not in web data) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
| Tray / Reel | Tray (per distributor listings) |
MKL27Z256VMP4 64-mapbga (5x5 mm) 引脚配置指南
MKL27Z256VMP4（64-mapbga (5x5 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MKL27Z256VMP4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MKL27Z256VMP4 适用于 7 应用s: USB HID Wearable Device, Portable Medical Sensor, USB Keyboard / Mouse Dongle, Battery-Powered IoT Endpoint, Industrial USB Sensor Node, Consumer Health Wearable, USB Audio Class Device.
USB HID Wearable Device
The MKL27Z256VMP4's integrated full-speed USB 2.0 device controller with crystal-less operation and 256 KB Flash makes it ideal for compact USB HID wearables. The USB controller directly drives DP/DN pins without external crystal, removing BOM cost and shrinking PCB area. With 256 KB Flash the device stores USB HID stacks, report descriptors, and application firmware for heart-rate, step-counter, or fitness peripherals. The 1.71 V minimum supply supports single-cell coin-cell or rechargeable Li-ion operation, while low-power modes drop quiescent current to sub-µA levels between USB events, extending battery life for always-on wearables.
推荐
Portable Medical Sensor
The MKL27Z256VMP4 fits portable medical sensors because of its 12-bit SAR ADC, integrated low-power analog comparator, and ultra-low-power deep-sleep modes. The M0+ core consumes minimal active power while still running signal-conditioning firmware for pulse oximetry, glucose monitoring, or temperature patches. The 256 KB Flash supports FDA-style firmware revision history and bootloader/OTA schemes. Operating from 1.71 V allows direct connection to single-cell Li-ion or coin-cell batteries, and the -40 °C to +105 °C range supports disposable and reusable medical device environments.
推荐
USB Keyboard / Mouse Dongle
The MKL27Z256VMP4 is an industry-proven choice for USB HID dongles and peripherals thanks to its crystal-less USB 2.0 full-speed device, 48 MHz Cortex-M0+ core, and tiny 64-MAPBGA footprint. USB keyboard/mouse firmware requires only tens of KB of code, leaving ample Flash for HID class drivers, suspend/resume state machines, and wireless pairing extensions. The 5x5 mm BGA allows the dongle PCB to fit inside a USB-A connector shell, while low-power suspend current stays within USB 2.0 spec limits. Pin compatibility with the KL27 family enables drop-in scaling to higher-density variants.
推荐
Battery-Powered IoT Endpoint
The MKL27Z256VMP4 suits battery-powered IoT endpoints where low quiescent current and 256 KB Flash for over-the-air (OTA) bootloaders are critical. Its ultra-low-power stop modes draw microamp-level standby current while preserving RAM and maintaining wake-up from GPIO or RTC interrupts. The 256 KB Flash supports dual-bank OTA schemes for secure firmware updates, plus application stacks for Bluetooth Low Energy co-processor control, LoRaWAN modulation, or sub-GHz proprietary protocols via SPI/I2C peripherals. The 1.71 V minimum supply keeps the device alive on depleted coin cells.
推荐
Industrial USB Sensor Node
The MKL27Z256VMP4 operates from -40 °C to +105 °C, making it suitable for industrial USB sensor nodes installed in factory automation or HVAC systems. The 12-bit ADC and analog comparators interface directly with temperature, pressure, and flow transducers. The USB controller connects the node to a host for configuration and data logging, while the 256 KB Flash stores Modbus or vendor-specific protocols. The wide 1.71 V to 3.6 V supply tolerates 24 V industrial rails regulated down to 3.3 V.
推荐
Consumer Health Wearable
The MKL27Z256VMP4 targets consumer wearables such as smartwatches, fitness bands, and hearables where USB charging firmware, small footprint, and low power are essential. The Cortex-M0+ core efficiently runs display drivers, sensor fusion, and Bluetooth HCI command sets. The 256 KB Flash accommodates RTOS kernels, vendor SDKs, and product differentiation firmware. The integrated USB supports charging and data sync without external crystals, while low-power modes extend battery life between charges.
推荐
USB Audio Class Device
The MKL27Z256VMP4 supports USB Audio Class 1.0 device firmware in 256 KB Flash, enabling USB headsets, microphones, and DAC dongles. The crystal-less USB provides low-jitter audio reference, while the 48 MHz core clocks standard 48 kHz / 44.1 kHz audio sample rates without PLL overhead. I2S peripherals interface with low-cost audio codecs, and the wide supply range supports direct USB bus-powered operation. The 64-MAPBGA footprint fits inside compact dongle enclosures.
推荐
推荐产品汇总
工程参考数据： MKL27Z256VMP4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MKL27Z128VMP4 | MKL27Z256VFM4 | MKL27Z128VFM4 | MKL27Z256VFT4 | MKL27Z256VLH4 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-MAPBGA (5x5 mm) | 64-MAPBGA (5x5 mm) - same | 64-MAPBGA - same package family | 64-MAPBGA - same package family | 64-LQFP (alternate package) | 64-LQFP (alternate package) |
| Core | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ |
| Core Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Program Flash | 256 KB | 128 KB | 256 KB | 128 KB | 256 KB | 256 KB |
| USB Controller | USB 2.0 FS Device (crystal-less) | USB 2.0 FS Device (crystal-less) | USB 2.0 FS Device (crystal-less) | USB 2.0 FS Device (crystal-less) | USB 2.0 FS Device (crystal-less) | USB 2.0 FS Device (crystal-less) |
| Supply Voltage | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V |
| Operating Temperature | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C |
关键差异点
- Largest Flash option in the KL27 sub-family （对比 MKL27Z128VMP4)
- Smallest 64-MAPBGA footprint option for the 256 KB variant （对比 MKL27Z256VLH4)
- Crystal-less USB 2.0 FS device controller （对比 MKL27Z256VFT4)
设计说明
Place a 100 nF decoupling capacitor on every VDD pin and a single 4.7 µF bulk capacitor near the MCU. The MKL27Z256VMP4's integrated voltage regulator requires stable input supply; add a 10 µF tantalum or ceramic bypass at the main VDD pin if the source is more than 2 inches away. USB bus-powered designs must respect USB 2.0 inrush current limits during attach.
Route USB DP/DN as a 90 Ω differential pair with characteristic impedance matched to the USB specification. Keep the pair length under 50 mm and avoid routing near high-frequency switching signals. The crystal-less USB mode relies on the internal PLL; if an external crystal is used, place it within 5 mm of the XTAL pins and guard the traces with a ground pour to reduce jitter.
The 64-MAPBGA (5x5 mm) package requires via-in-pad or microvia PCB technology for reliable soldering. Use NSMD (non-solder mask defined) pads with 0.4 mm pitch and a 0.2 mm solder mask opening for optimal assembly yield. Stencil apertures of 0.25 mm diameter with 0.1 mm thickness are recommended for the BGA balls.
Estimated: at maximum 48 MHz core frequency with all peripherals active, the MKL27Z256VMP4 dissipates well under 100 mW (typical M0+ active power ~25 mW at 48 MHz from 3.3 V). The 64-MAPBGA thermal resistance is not in the web data; assume θJA around 50 °C/W for a 4-layer JEDEC test board, providing ample margin up to +105 °C ambient.
Do not enable the brown-out reset (BOR) at too high a threshold on 1.71 V battery-powered designs, or the MCU will lock out during normal Li-ion discharge below 2.0 V. Always configure the watchdog timer (WDOG) with a software refresh sequence before the first LPO clock tick, otherwise spurious resets occur at first boot. Confirm pin mux selection in the IOMUXC register before driving peripheral signals.
合规信息
RoHS and REACH compliance inferred from NXP product page and DigiKey listing. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. Halogen-free status not specified in the verified web data.