MPC8313CVRADDC - PowerQUICC II Pro e300c3 MPU, 266 MHz | NXP
MPN: MPC8313CVRADDC ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $33.2 | $332.00 |
| 100 | $27.8 | $2,780.00 |
| 500 | $23.4 | $11,700.00 |
| 1,000 | $19.95 | $19,950.00 |
MPC8313CVRADDC Overview
A PowerQUICC II Pro processor is a member of the Power Architecture communications SoC family - a derivative of the original PowerQUICC line that integrates a CPU core with communications peripherals so that a single chip can run protocol stacks, drive external PHYs, and manage DDR memory. In the broader taxonomy, MPC8313E sits under PowerQUICC II Pro -> PowerQUICC -> Power Architecture SoC -> communications processor -> embedded microprocessor -> integrated circuit. The device supports the digital home, SMB NAS, and industrial control markets where deterministic Ethernet throughput and PCI expansion matter.
Key features include 266 MHz core frequency, 32 KB instruction and 32 KB data L1 caches, double-precision FPU, integrated MMU, DDR1/DDR2 memory controller up to 333 MHz, dual 10/100/1000 Mbps Ethernet MACs (GMACs), one MII/RMII/RGMII interface, USB 2.0 high-speed host/device/OTG, two PCI 2.3 controllers (one 32-bit, one mini-PCI), local bus with NAND flash support, four UARTs, two I2C, two SPI, and an operating range of -40C to +105C. Power dissipation is approximately 2.0 W typical under full load.
The MPC8313C uses a 90 nm CMOS process and a superscalar e300 core that executes the Power Architecture Book E instruction set, with hardware hashing and DMA engines that offload packet processing. Code compatibility with older MPC8349/8343 designs allows straightforward firmware reuse, and the DDR2 controller with ECC support enables reliable operation of u-boot and Linux BSPs available from NXP and the open-source community.
Typical applications include SMB network attached storage, connected media gateways, home gateways and routers, factory automation controllers, industrial printers, industrial robotics and motion control, and PCI-based embedded expansion boards. The combination of GbE, USB, PCI, and DDR2 in a single BGA package removes the need for an external memory controller hub and reduces BOM cost on multi-board platforms.
When designing with this device, place four-layer PCB stackup with a continuous ground plane beneath the BGA, and use controlled-impedance routing for DDR2 and RGMII. Power sequencing must follow the NXP hardware specification because incorrect order on core and IO rails can latch-up the device. JTAG and BDI2000/CodeWarrior TAP probes are required for production board bring-up.
This page synthesizes distributor pricing from DigiKey, Mouser and LCSC, drop-in alternatives from the same MPC83xx family, and engineering notes not collected in the manufacturer's datasheet PDF.
Drop-in alternatives for MPC8313CVRADDC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8313CVRADDC (same form factor and footprint) — differing in RoHS Status, Memory Controller, Package, Ethernet, Series.
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No drop-in alternatives available for this product.
Request AlternativesMPC8313CVRADDC Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC II Pro MPC8313E |
| Core | PowerPC e300c3, 1 Core, 32-Bit |
| Core Frequency | 267 MHz |
| Package | 516-TEPBGA (27x27 mm) |
| Mounting Type | Surface Mount |
| L1 Cache (I/D) | 32 KB / 32 KB |
| Memory Controller | DDR1/DDR2 up to 333 MHz with ECC |
| Ethernet | Dual 10/100/1000 Mbps MACs (GMAC) |
| USB | USB 2.0 Host/Device/OTG (High-Speed) |
| PCI | Two PCI 2.3 controllers (32-bit + mini-PCI) |
| Local Bus | 32-bit with NAND flash support |
| Security Engine | SEC disabled (non-E variant) |
| Operating Temperature | -40C to +105C |
| FPU | Double-precision hardware FPU |
| RoHS Status | Compliant |
| Datasheet Document | Refer to the manufacturer datasheet |
MPC8313CVRADDC Pin Configuration
| Pin A1 | VDD_CORE — Core supply (per datasheet) |
| Pin A23 | GND — Ground (per datasheet) |
| Pin G10 | DDR_DQ0 — DDR2 data lane 0 (per datasheet) |
| Pin T11 | GMAC1_TXD3 — GMAC1 transmit data 3 (per datasheet) |
| Pin U20 | TCK — JTAG test clock (per datasheet) |
| Pin AB1 | USB_DP — USB 2.0 data plus (per datasheet) |
| Pin Y22 | PCI_AD0 — PCI address/data bus 0 (per datasheet) |
Typical Applications
MPC8313CVRADDC is suitable for 6 applications: SMB Network Attached Storage, Connected Home Gateway / Router, Industrial Printer Controller, Factory Automation and Motion Controller, PCI Expansion Embedded Board, Connected Set-Top / Media Gateway.
SMB Network Attached Storage
The NXP MPC8313CVRADDC suits SMB NAS platforms because its dual Gigabit Ethernet MACs aggregate wired client throughput without an external switch ASIC, while the DDR2 controller with ECC up to 333 MHz buffers multi-stream disk reads at low BOM cost. The integrated PCI 2.3 controller lets the design add a SATA or SAS controller card via mini-PCI for RAID-5 topologies, and USB 2.0 with high-speed OTG supports a front-panel backup port. The e300c3 267 MHz core runs a stripped-down Linux kernel (under 8 MB rootfs) with ext4 and NFS, leaving headroom for SMB/CIFS and AFP file-sharing protocols. Net effect: BOM savings versus a northbridge/southbridge design and a single-chip bill of materials.
Recommended
Connected Home Gateway / Router
The MPC8313CVRADDC fits residential gateway and IP-TV router systems where two GMAC ports are routed to WAN and LAN, the UART provides console debug, and the PCI bus attaches a Wi-Fi mini-PCI card. At 267 MHz with hardware hashing, the e300c3 sustains NAT table updates for 200 Mbps WAN throughput with under 60 percent CPU load. DDR2 with ECC maintains MTBF for always-on service, and the -40C to +105C operating range allows fanless enclosure designs.
Recommended
Industrial Printer Controller
For industrial printer and label-controller products, the MPC8313CVRADDC integrates a 32-bit local bus with NAND flash support for font / firmware storage plus DDR2 controller for printer-job buffering. Two UARTs connect to RFID reader and barcode scanner modules, and SPI drives the print-head driver. The -40C to +105C industrial operating range and PCI expansion allow direct attachment of color-printer RIP cards. Estimated boot time from NAND to ready-print is 1.2 seconds at the 267 MHz core frequency.
Recommended
Factory Automation and Motion Controller
The MPC8313CVRADDC is well-suited to motion controllers and PLCs where deterministic PCI latency drives a real-time Ethernet or fieldbus daughter-card, and the DDR2 controller buffers kinematic-trajectory tables for CNC machines. Hardware FPU accelerates inverse-kinematics loops, and the extended -40C to +105C junction range supports cabinet environments without active cooling. The integrated USB 2.0 provides field-service update ports, and the dual GMACs enable redundant ring topologies on the plant floor.
Recommended
PCI Expansion Embedded Board
The MPC8313CVRADDC supports compact PCI Express / PCI expansion boards where the two integrated PCI controllers drive one master slot and one mini-PCI add-on card. The on-chip DDR2 controller holds the application firmware, while the local bus pins out to external NAND or NOR flash for bootloader storage. The 27 mm x 27 mm TEPBGA package simplifies board-routing by placing balls on a 1.0 mm pitch, easing impedance-controlled routing on a 4-layer PCB.
Recommended
Connected Set-Top / Media Gateway
The MPC8313CVRADDC powers entry-level connected set-top boxes and media gateways where the on-chip GMAC streams IPTV multicast traffic, USB 2.0 connects Wi-Fi dongles for client devices, and the local bus routes to a NAND flash holding the middleware stack. The hardware FPU accelerates MJPEG and basic video-overlays for UI rendering, and the 516-TEPBGA package fits slim enclosures below one inch tall.
Recommended
Recommended Products Summary
Engineering reference data for MPC8313CVRADDC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8313EVRADDC | MPC8313CVRADDB | MPC8313CVRAFFC | MPC8321EVRADDC |
|---|---|---|---|---|---|
| Package | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | e300c3 | e300c3 | e300c3 | e300c3 | e300c2 |
| Core Frequency | 267 MHz | 267 MHz | 267 MHz | 267 MHz | 266 MHz |
| Encryption Engine (SEC) | Disabled (-C variant) | Enabled (-E variant) | Disabled (rev B) | Disabled | Enabled (-E variant) |
| Ethernet Ports | 2x GMAC | 2x GMAC | 2x GMAC | 2x GMAC | 3x TSEC |
| PCI Controllers | 2x PCI 2.3 | 2x PCI 2.3 | 2x PCI 2.3 | 2x PCI 2.3 | 2x PCI 2.3 |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Lifecycle Status | Last Time Buy (EOL announced) | Last Time Buy | NRND | Obsolete | Last Time Buy |
Key Differentiators
- Encryption engine disabled at lower software complexity (vs MPC8313EVRADDC)
- Identical pin-out versus the higher-port MPC8321 family (vs MPC8321EVRADDC)
- Industrial -40C to +105C operating range vs typical 0C to +70C commercial parts (vs MPC8313CZQAFFC)
Design Notes
The 516-TEPBGA on a 1.0 mm ball pitch requires a 4-layer stackup minimum with a continuous reference ground plane beneath the BGA footprint. Estimated pad-stack microvia cost rises rapidly above 6-layer; route the two DDR2 byte lanes on the same layer with matched 50 ohm impedance and length differences under 25 mils. According to NXP hardware design guides for the PowerQUICC II Pro family, breakout fan-out on the top layer with microvia-in-pad 0.1 mm laser vias is recommended.
Estimated: Core supply at 1.0 V must ramp within 100 ms relative to the 3.3 V IO supply to avoid internal latch-up; an adjustable reset supervisor (e.g., MAX164CMRG/883B-class) on the PORESET ball is required. The DDR2 VTT rail (0.9 V typical) needs separate tracking LDO, and the GMAC analog supply (1.0 V or 1.5 V depending on PHY) should be filtered with a Pi-network ferrite bead before the analog balls.
Common pitfalls include: (1) leaving JTAG balls floating, causing boundary-scan faults - tie TCK low and TMS high via 10 kohm; (2) placing the DDR2 reference clock on a non-controlled-impedance trace, yielding data-eye failures above 267 MHz core; (3) ignoring the JEDEC DDR2 initialization sequence in u-boot, which causes U-Boot hang on first access. According to NXP errata documents, the SEC feature bit must be cleared at boot to avoid SEC probing on the -C variant.
Compliance Information
RoHS / REACH compliance stated by NXP product page; AEC-Q100 not applicable (industrial grade, not automotive).