MPC8313VRAGDB - PowerPC e300c3 MPU 400MHz 516-TEPBGA | NXP
MPN: MPC8313VRAGDB ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.4 | $724.00 |
| 100 | $65.1 | $6,510.00 |
| 500 | $58.2 | $29,100.00 |
| 1,000 | $51.75 | $51,750.00 |
MPC8313VRAGDB Overview
A microprocessor (MPU) is a single-chip processor that integrates the central processing unit, memory management unit, and a wide range of peripheral controllers on a single die, forming the compute heart of an embedded system. Within the broader taxonomy, the MPC8313 belongs to MPU -> 32-bit embedded processor -> application-specific SoC -> semiconductor device category, and it sits at the network-edge/branch-office tier of NXP's PowerQUICC II Pro lineup, optimized for low-power, low-cost gateway designs.
Key features of the MPC8313VRAGDB include the e300c3 core with 16KB instruction and 16KB data L1 caches, a 32-bit DDR1/DDR2 memory controller supporting up to 256MB of addressable memory, dual 10/100/1000 Ethernet MACs, dual PCI interfaces, USB 2.0 host/device, and a security engine (SEC 2.3) for hardware-accelerated cryptography on select part numbers. The integrated peripherals reduce external chip count in gateway and WiFi access point designs.
The architecture combines a high-performance e300 core with a flexible peripheral set, enabling simultaneous line-rate packet processing and host-side application workloads. DDR1/DDR2 support allows designers to use cost-effective legacy memories, while the dual GbE MACs simplify multi-port networking gear without an external switch. The silicon is fabricated in a 130nm CMOS technology and is designed for fanless operation in industrial environments.
Typical applications include SOHO routers, WiFi access points, VoIP gateways, industrial control boards, and print/imaging controllers. It is also found in network-attached storage (NAS) entry-level platforms, set-top box auxiliary processors, and secure terminal equipment requiring the optional security engine.
When designing with the MPC8313, allocate the bottom layer of the PCB as a continuous ground pour for thermal dissipation and signal integrity. The TEPBGA package uses lead-free SnAgCu solder balls with 1.27mm pitch; surface-mount assembly requires precise reflow profile control per J-STD-020 moisture sensitivity level handling guidelines.
This page synthesizes distributor pricing, parametric context, and cross-reference alternatives that are not consolidated in the manufacturer datasheet, helping engineers verify compatibility and shorten the sourcing cycle.
Drop-in alternatives for MPC8313VRAGDB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8313VRAGDB (same form factor and footprint) — differing in Encryption, Manufacturer, Memory Controller, USB, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8313E-RAGDB
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8313VRAGDGA
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8313VRAGDGB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8313CVRAGDB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8313VRAGDB Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors |
| Series | MPC83xx |
| Core Processor | PowerPC e300c3 |
| Number of Cores | 1 |
| Core Architecture | 32-Bit |
| Core Speed | 400 MHz |
| Package / Case | 516-TEPBGA (27x27 mm) |
| Mounting Type | Surface Mount |
| L1 Cache | 16 KB instruction + 16 KB data |
| Memory Controller | 32-bit DDR1/DDR2, up to 256 MB |
| Ethernet | Dual 10/100/1000 MAC |
| PCI | Dual PCI interface |
| USB | USB 2.0 Host/Device |
| Security Engine | SEC 2.3 (variant dependent) |
| Operating Temperature | 0C to +105C |
| Encryption | Without encryption (per suffix) |
| RoHS Status | Compliant (Pb-free suffix) |
MPC8313VRAGDB 516-tepbga (27x27 mm) Pin Configuration Guide
Pin configuration for MPC8313VRAGDB (516-tepbga (27x27 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8313VRAGDB.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8313VRAGDB is suitable for 7 applications: SOHO Router / Residential Gateway, WiFi Access Point Controller, VoIP Media Gateway, Industrial Control / Automation Board, Print and Imaging Controller, Entry-Level NAS / File Server, Secure Terminal / POS Equipment.
SOHO Router / Residential Gateway
The MPC8313VRAGDB's 400MHz e300c3 core, dual GbE MACs, and 32-bit DDR1/DDR2 controller make it a strong fit for SOHO router and residential gateway designs. Its integrated packet handling offloads NAT and routing from a host CPU, while the USB 2.0 host supports external storage or 3G/4G dongles. Power consumption below 5W typical enables fanless wall-wart form factors common in consumer broadband CPE.
Recommended
WiFi Access Point Controller
In enterprise and SMB wireless access points, the MPC8313VRAGDB serves as the host processor handling 802.11 management frames, RADIUS authentication forwarding, and CAPWAP tunneling. Its dual GbE MACs separate wired uplink and wired downstream ports, and its PCI interface connects to common 802.11n/ac radios. The industrial temperature range supports ceiling-mounted installations.
Recommended
VoIP Media Gateway
VoIP gateway designs leverage the MPC8313VRAGDB's TDM interfaces, dual Ethernet ports, and PCI expansion to support 4-16 channel FXS/FXO cards. The e300c3 core handles SIP/RTP processing for small-business PBX replacements. Hardware flow-control and zero-copy DMA on Ethernet minimize jitter on voice traffic, critical for maintaining MOS scores above 4.0.
Recommended
Industrial Control / Automation Board
Factory automation controllers benefit from the MPC8313VRAGDB's industrial temperature rating (0C to +105C), deterministic DDR memory controller, and dual PCI for motion-control daughter cards. Its MMU enables full Linux or VxWorks deployment for SCADA and PLC integration. The robust 130nm CMOS process is field-proven in long-lifecycle industrial installations.
Recommended
Print and Imaging Controller
Multifunction printer (MFP) controllers use the MPC8313VRAGDB as the main CPU to drive the scanner pipeline, RIP processing, and network connectivity. The dual PCI connects to scanner and engine controllers, while the USB 2.0 host supports external media printing. The DDR2 memory bandwidth is sufficient for 600-dpi color scan-to-email workflows at production rates.
Recommended
Entry-Level NAS / File Server
Entry-level Network Attached Storage appliances use the MPC8313VRAGDB to manage SMB/NFS file services, RAID coordination, and the dual Ethernet ports for link aggregation or LAN segregation. Its hardware-assisted CRC and DMA channels sustain 80-100 MB/s throughput on SATA-attached disks. The industrial temperature range supports unattended operation in server closets.
Recommended
Secure Terminal / POS Equipment
Point-of-sale terminals and secure payment appliances use the MPC8313VRAGDB to drive displays, encrypt card data, and connect via Ethernet or dial-up. While the non-E suffix lacks hardware crypto, software TLS and PCI PTS guidance can be supported on the e300c3 core. The USB host supports peripherals such as receipt printers and barcode scanners in retail deployments.
Recommended
Recommended Products Summary
Engineering reference data for MPC8313VRAGDB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8313E-RAGDB | MPC8313VRAGDGA | MPC8313VRAGDGB | MPC8313CVRAGDB | MPC8378VRALGA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 516-TEPBGA (27x27) - same | 668-TEPBGA - different |
| Core | e300c3 400MHz | e300c3 400MHz | e300c3 400MHz | e300c3 400MHz | e300c3 400MHz | e300c4 667MHz |
| Encryption Engine | No (non-E suffix) | SEC 2.3 included | No (non-E suffix) | No (non-E suffix) | No (non-E suffix) | SEC 3.3 included |
| Ethernet MACs | Dual 10/100/1000 | Dual 10/100/1000 | Dual 10/100/1000 | Dual 10/100/1000 | Dual 10/100/1000 | Dual 10/100/1000 |
| Memory Controller | 32-bit DDR1/DDR2, 256 MB | 32-bit DDR1/DDR2, 256 MB | 32-bit DDR1/DDR2, 256 MB | 32-bit DDR1/DDR2, 256 MB | 32-bit DDR1/DDR2, 256 MB | 64-bit DDR2, 1 GB |
Key Differentiators
- No hardware encryption accelerator, lower cost for non-VPN designs (vs MPC8313E-RAGDB)
- Lower core frequency vs MPC8378 family (vs MPC8378VRALGA)
- DDR1/DDR2 controller vs DDR2-only in newer MPUs (vs MPC8378VRALGA (DDR2 only))
Design Notes
Estimated: at typical SOHO router conditions (Vcore 1.0V, ambient 55C, full CPU load), the MPC8313VRAGDB dissipates roughly 2.5-3.5 W. The 516-TEPBGA's exposed die and 27x27 mm body provide moderate heat removal through PCB copper pours; place at least eight thermal vias in the central array under the die to a continuous bottom-layer ground pour. For sealed enclosures above 3W dissipation, attach a small clip-on heatsink.
Route DDR traces first using matched-length pairs (within 25 mils) on the same layer, with reference ground plane directly underneath. The MPC8313's DDR controller is sensitive to impedance discontinuities; maintain 50 ohm single-ended / 100 ohm differential routing for SERDES lines. Use the NXP MPC8313 design checklist for via count, decoupling cap placement, and length matching.
Do not assume all MPC8313 suffixes have the same features; the E-suffix adds SEC 2.3, while C-suffix is extended temperature. The pin-1 indicator on the TEPBGA must be confirmed during assembly per JEDEC BGA orientation, and moisture-sealed package handling per J-STD-033 is required because BGA packages are moisture-sensitive.
The dual GbE MACs drive either GMII/RGMII directly to a PHY or SGMII over SerDes. Estimated: keep SGMII trace length below 25 mm with continuous ground reference and matched 100 ohm differential impedance. Route USB 2.0 differential pair with 90 ohm differential, max length 50 mm, and avoid crossing any clock or switching power node.
Compliance Information
Lead-free TEPBGA package per NXP product page. Halogen-free status not explicitly stated in retrieved data; AEC-Q100 not applicable for MPU outside automotive grade.