Analog Devices

MX7575SQ/883B - 8-Bit 5µs SAR ADC, MIL-883B | Maxim Integrated

MPN: MX7575SQ/883B ✗ End of Life
In Stock Ships in 1-3 business days
+5 V (single supply) Vdss 18-CDIP (ceramic DIP, through-hole) Package
From $10.75 USD / Unit
MOQ: 1 |
Price updated: 2026-10-14
Volume Pricing
Qty Unit Price Extended
1 $18.5 $18.50
10 $16.2 $162.00
100 $13.85 $1,385.00
500 $12.1 $6,050.00
1,000 $10.75 $10,750.00
ℹ️ All prices are in USD

MX7575SQ/883B Overview

The Maxim Integrated MX7575SQ/883B is an 8-bit, microprocessor-compatible, successive-approximation analog-to-digital converter (SAR ADC) with a 5 µs conversion time, housed in an 18-pin CDIP (ceramic DIP) package and qualified to MIL-STD-883B for military and aerospace applications.

What is a SAR ADC? A successive-approximation-register analog-to-digital converter is a type of data converter that uses a binary-search algorithm against an internal precision DAC to determine each bit of the output word in N clock cycles for an N-bit converter. SAR ADCs occupy the middle ground between flash ADCs (fastest, lowest resolution) and sigma-delta ADCs (highest resolution, slowest); they are the workhorse converter for 8-to-16-bit industrial, instrumentation, and process-control sampling because they deliver a single conversion on demand with deterministic latency and modest power consumption.

Key features of the MX7575SQ/883B include a single +5 V supply operation, parallel data output for direct µP bus connection, a built-in track-and-hold, and a ratiometric reference input that lets the user scale full-scale range to any span between 0 V and VREF. The /883B suffix indicates the part is processed to MIL-STD-883B, including burn-in and extended temperature screening, making it suitable for avionics, missile guidance, and ruggedized industrial systems.

Architecturally, the MX7575 family combines a CMOS successive-approximation register, a precision thin-film DAC ladder, and a CMOS comparator on a single die. The 5 µs typical conversion time at 8 bits resolution corresponds to roughly 200 kSPS sampling capability, which is sufficient for control-loop digitizing, vibration monitoring, and multiplexed data acquisition.

Typical applications include military/aerospace data acquisition systems, industrial process-control analog input modules, multiplexed 4-to-16 channel scanning digitizers, vibration and acoustic monitoring front-ends, and legacy µP-based instrumentation where parallel-output ADCs simplify interface glue logic. The ceramic DIP package and MIL-STD-883B screening also make it a preferred choice for new designs that must trace to MIL-PRF-38535 qualified manufacturing lines.

When designing with this converter, route the analog input trace as a guard-ring-protected microstrip, decouple VDD and VREF with 10 µF tantalum in parallel with 100 nF ceramic at the package pins, and drive /CS and the conversion-start logic with a clean digital supply. The reference pin must be bypassed with at least 1 µF to ground.

This page synthesizes distributor availability (5100 units in stock per icDirectory as of 2026-10-15), MIL-STD-883B qualification notes, and same-package Maxim cross-references that you will not find aggregated in the manufacturer datasheet PDF alone.

Drop-in alternatives for MX7575SQ/883B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MX7575SQ/883B (same form factor and footprint) — differing in Mounting Type, Resolution, Architecture, Conversion Method, Number of Terminals.

Maxim Integrated
Mounting Type: Through-Hole (THT)
Conversion Method: Successive Approximation (SAR)
Analog Devices
Resolution: 8 bits
Architecture: Half-flash (pipelined sub-ranging flash) ADC
Conversion Method: Flash (with internal T/H)
NXP Semiconductors
Mounting Type: Surface Mount
Resolution: 10 bit
Architecture: Sigma-Delta

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MX7575SQ

✅ Drop-In
📦 CDIP-18
commercial-grade version, no MIL-STD-883B burn-in/screening, same die and 18-pin CDIP pinout

📋 Reference alternative (not in catalog)

MX7575KN

✅ Drop-In
📦 PDIP-18
commercial-grade plastic PDIP18 package, no MIL screening, same die

📋 Reference alternative (not in catalog)

MX7575JN

✅ Drop-In ⚠️ Specs Unverified
📦 PDIP-18
commercial-grade PDIP18, wider supply tolerance, same die

📋 Reference alternative (not in catalog)

MX7575BQ

✅ Drop-In ⚠️ Specs Unverified
📦 CDIP-18
MIL-STD-883B variant with B-grade screening, same die, slightly tighter linearity

📋 Reference alternative (not in catalog)

MX7575CWI

✅ Drop-In ⚠️ Specs Unverified
📦 SOIC-18
wide-temp SOIC-18 surface-mount variant, same SAR core

📋 Reference alternative (not in catalog)

MX7575SQ/883B Maximum Ratings & Electrical Characteristics

Manufacturer Maxim Integrated (now Analog Devices)
Part Number MX7575SQ/883B
Function ADC, Successive Approximation, 8-Bit, 1-Channel
Resolution 8 bit
Conversion Time (typical) 5 µs
Conversion Time (max) 10 µs
Number of Channels 1
Data Access Parallel, 8-bit
Input Type Single-ended analog, ratiometric reference
Architecture SAR with internal DAC and track-and-hold
Supply Voltage +5 V (single supply)
Process Technology CMOS
Package / Case 18-CDIP (ceramic DIP, through-hole)
Package Code DIP
Terminal Form Through-Hole
Number of Terminals 18
Package Shape Rectangular
Temperature Grade Military
Qualification MIL-STD-883B (suffix /883B)
Mounting Type Through-Hole

MX7575SQ/883B Pin Configuration

DIP-18 Package Pinout Diagram DIP-18 18-pin dual inline, 7.62mm pitch, JEDEC MS-001. 1 18 2 17 3 16 4 15 5 14 6 13 7 12 8 11 9 10 DIP-18
Pin 1 VREF — Reference voltage input (ratiometric)
Pin 2 ANALOG IN — Analog input (single-ended)
Pin 3 AGND — Analog ground
Pin 4 DB7 — Parallel data output bit 7 (MSB)
Pin 5 DB6 — Parallel data output bit 6
Pin 6 DB5 — Parallel data output bit 5
Pin 7 DB4 — Parallel data output bit 4
Pin 8 DB3 — Parallel data output bit 3
Pin 9 DB2 — Parallel data output bit 2
Pin 10 DB1 — Parallel data output bit 1
Pin 11 DB0 — Parallel data output bit 0 (LSB)
Pin 12 DGND — Digital ground
Pin 13 /CS — Chip select (active low)
Pin 14 /RD — Read strobe (active low)
Pin 15 /WR — Write/conversion start (active low)
Pin 16 CLK — External clock input
Pin 17 BUSY — Conversion busy / status flag
Pin 18 VDD — +5 V power supply

Typical Applications

MX7575SQ/883B is suitable for 6 applications: Military/Aerospace Data Acquisition Systems, Industrial Process Control Analog Input Modules, Multiplexed 4-to-16 Channel Scanning Digitizers, Vibration and Acoustic Monitoring Front-Ends, Legacy µP-Based Instrumentation, Avionics Multiplexed Sensor Digitizing.

✈️

Military/Aerospace Data Acquisition Systems

The MX7575SQ/883B fits military and aerospace data acquisition because its MIL-STD-883B qualification, -55°C to +125°C screening, and hermetic 18-pin ceramic DIP package are accepted by MIL-PRF-38535 procurement lines. With a 5 µs typical conversion time and 8-bit parallel output, it digitizes flight-control sensor multiplexers and stores raw FCS. Unlike commercial ADCs, the /883B suffix guarantees burn-in and lot traceability required for avionics.

🏭

Industrial Process Control Analog Input Modules

The MX7575SQ/883B is well-suited to ruggedized industrial process-control analog input modules because its 5 µs conversion is fast enough for thermocouple and pressure transducer multiplexing on 4-20 mA loops. The single +5 V supply simplifies isolated power design, and the ratiometric reference lets designers scale FS to any span. Per the Maxim datasheet, the parallel bus interfaces directly to 8085/8051-class microcontrollers without external latches.

🌐

Multiplexed 4-to-16 Channel Scanning Digitizers

The MX7575SQ/883B serves as the converter core in multiplexed 4-to-16 channel scanning digitizers because its 5 µs conversion time allows 50-100 kSPS aggregate throughput across an external analog multiplexer. The parallel output bus simplifies backplane wiring, and the single +5 V supply is compatible with CMOS mux families like the 4051/4052. Compared to integrating ADCs, the SAR topology avoids 50/60 Hz line-cycle synchronization requirements.

🎧

Vibration and Acoustic Monitoring Front-Ends

The MX7575SQ/883B fits vibration and acoustic monitoring front-ends because its 5 µs conversion supports sampling rates up to ~200 kSPS, sufficient for vibration spectrum analysis on rotating machinery and acoustic emission monitoring. The 8-bit resolution is acceptable for envelope detection and broadband RMS measurement. The MIL-STD-883B screening allows deployment in engine bay and naval monitoring systems where commercial ADCs would fail.

🖥️

Legacy µP-Based Instrumentation

The MX7575SQ/883B is a natural fit for legacy µP-based instrumentation (8051, 8085, Z80 buses) because its parallel 8-bit data output interfaces directly without external latches, and the /CS, /RD, /WR control logic maps cleanly to standard µP read/write strobes. New designs can re-use legacy PCB footprints while gaining MIL-grade reliability. Compared to serial-output ADCs, the parallel output eliminates bit-banging software and reduces µP overhead.

✈️

Avionics Multiplexed Sensor Digitizing

The MX7575SQ/883B is used in avionics multiplexed sensor digitizing subsystems because its MIL-STD-883B screening and ceramic DIP hermeticity allow direct installation in pressurized and unpressurized aircraft zones. The ratiometric reference input lets designers scale the FS range to any sensor span (RTD, strain gauge, LVDT) without external precision components. Compared to flash ADCs, the SAR topology provides a clean trade-off between 8-bit resolution and 5 µs speed at low power.

What is the MX7575SQ/883B?
The MX7575SQ/883B is a military-grade (MIL-STD-883B) 8-bit successive-approximation ADC from Maxim Integrated (now part of Analog Devices), with a 5 µs typical conversion time and parallel µP-compatible output, in an 18-pin ceramic DIP package. According to Maxim datasheet 6-page PDF on datasheetq.com, the part operates from a single +5 V supply and uses a ratiometric reference input.
Where can I buy the MX7575SQ/883B online?
The MX7575SQ/883B is listed at DigiKey (part number MX7575SQ/883B-ND), Mouser (Analog Devices / Maxim Integrated SKU), Vyrian, Partstack, and YIC Electronics. According to icDirectory, 5100 units were in stock as of 2026-10-15. Authorized Maxim/ADI franchised distributors remain the recommended source for MIL-STD-883B screened parts.
What is the price of the MX7575SQ/883B as of 2026-10-15?
Per Octopart aggregator pricing as of 2026-10-15, the MX7575SQ/883B typically breaks at approximately $18.50 at qty 1, $16.20 at qty 10, $13.85 at qty 100, $12.10 at qty 500, and $10.75 at qty 1000. Obsolete MIL-STD-883B parts typically carry a premium versus the commercial MX7575KN variant.
What is the lead time for the MX7575SQ/883B?
Lead time for the MX7575SQ/883B varies by distributor and is typically 8 to 14 weeks when ordering from authorized Maxim/ADI channels because the part is obsolete and MIL-STD-883B screened. Per icDirectory on 2026-10-15, distributors listed 5100 units in stock, which may compress lead time to immediate shipment from those channels.
Is the MX7575SQ/883B still in production?
The MX7575SQ/883B is listed as obsolete on icDirectory, but the part remains in distributor inventory (5100 units as of 2026-10-15) and is still being shipped from authorized channels. Maxim/ADI has not announced a last-time-buy for this part, but new design-ins should plan for a cross-reference to a current-generation ADC.
What is the difference between MX7575SQ/883B and MX7575KN?
Per the FindIC comparison page, the MX7575SQ/883B is the MIL-STD-883B ceramic DIP military-temperature variant, while the MX7575KN is the commercial-grade plastic PDIP (PDIP18) variant. Both share the same 8-bit SAR architecture and pinout, but the /883B suffix adds burn-in, hermetic ceramic packaging, and -55 °C to +125 °C screening.
What is the best drop-in replacement for the MX7575SQ/883B?
The Maxim MX7575SQ (commercial, same CDIP18 footprint), the MX7575SQ-883, and the MAX158AEPI+ family of pin-compatible 8-bit ADCs from Maxim/ADI are the closest drop-in candidates. For an exact MIL-STD-883B ceramic DIP replacement, the MX7575SQ/883B itself is typically the only fully qualified pin-compatible option, so stocking from authorized channels is the practical path.
Where can I download the MX7575SQ/883B datasheet PDF?
The MX7575SQ/883B datasheet PDF is available at https://www.icdirectory.com/d/integrated-circuits/mx7575sq-883b.pdf, with additional copies linked from Maxim/ADI's official product page and the datasheetq.com datasheet archive. The 6-page PDF on datasheetq.com contains the electrical characteristics, timing diagrams, and CDIP18 pinout.
What is the pinout of the MX7575SQ/883B?
The MX7575SQ/883B uses an 18-pin CDIP (ceramic DIP) package with standard successive-approximation ADC pinout: pins include VDD (+5 V), GND, analog IN, REF, /CS, /RD, /WR, /CONVST, CLK, and 8 parallel data outputs DB0-DB7. The full pin-by-pin assignment is in the Maxim datasheet mechanical drawing section.
What is the conversion time of the MX7575SQ/883B?
The MX7575SQ/883B has a typical conversion time of 5 µs and a maximum of 10 µs across the military temperature range. According to the MX7575 datasheet family, this corresponds to approximately 100-200 kSPS depending on clock configuration, making it suitable for process-control and instrumentation sampling rather than high-speed waveform capture.
Can the MX7575SQ/883B be replaced by a modern SAR ADC?
Yes, modern pin-compatible alternatives include the MAX1156/MAX1157 family from Maxim/ADI and the AD7574/AD7575 family from Analog Devices, but designers must verify the parallel bus timing and reference pin scaling differ. For new designs, the AD7980 (16-bit) or AD7606 (16-bit, 8-channel) are typical modern replacements if pinout migration is acceptable.
Is the MX7575SQ/883B RoHS compliant?
The MX7575SQ/883B is a MIL-STD-883B screened part in a ceramic DIP package with tin-lead (SnPb) lead finish for military hermetic applications. Per Maxim/ADI product documentation, the /883B variants are typically not RoHS compliant because they require Pb-bearing solder for hermeticity and reliability under MIL-PRF-38535.
What applications is the MX7575SQ/883B designed for?
The MX7575SQ/883B is designed for military and aerospace data acquisition, ruggedized industrial process control, vibration and acoustic monitoring, and legacy µP-based instrumentation. The 5 µs conversion time, parallel rati output, and MIL-STD-883B screening make it a fit for new designs that must trace to MIL-PRF-38535 qualified manufacturing lines.
Does the MX7575SQ/883B require an external reference?
Yes, the MX7575SQ/883B requires an external reference voltage applied to the REF pin; the conversion is ratiometric, meaning the output code scales linearly with the analog input divided by the reference voltage. Per the Maxim datasheet, the reference pin must be bypassed with at least 1 µF to ground and should be driven from a low-impedance source for 8-bit accuracy.
What is the package_svg_key and pin count of the MX7575SQ/883B?
The MX7575SQ/883B is in an 18-pin ceramic DIP (CDIP18) package, so the corresponding package_svg_key is dip-18 and the pinout has 18 entries. The ceramic DIP variant uses a glass-sealed hermetic body with through-hole leads on a 2.54 mm (0.1 inch) pitch.

Engineering reference data for MX7575SQ/883B — comparison, design guidance, and compliance information.

Selection Guide

Choose the MX7575SQ/883B when your design must trace to MIL-PRF-38535 qualified manufacturing lines and is intended for military or aerospace environments - its MIL-STD-883B burn-in, -55°C to +125°C screening, and hermetic ceramic CDIP-18 package are the qualifying factors. Choose the MX7575SQ (commercial CDIP-18) when you need the same die in a military temperature range but do not require formal /883B screening - cost savings. Choose the MX7575KN (plastic PDIP-18) for commercial 0-70°C industrial designs. Choose the MX7575BQ (CDIP-18 Class B /883B) for the tightest linearity bin in military applications. Choose the MX7575CWI (SOIC-18 wide-temp) when you need a surface-mount reflow-solderable footprint in industrial wide-temp systems.

Comparison with Alternatives

Parameter This Product MX7575SQ MX7575KN MX7575JN MX7575BQ MX7575CWI
Package CDIP-18 (ceramic DIP, MIL-STD-883B) CDIP-18 - same PDIP-18 - same pin count, plastic PDIP-18 - same CDIP-18 - same SOIC-18 - same pin count, SMD
Brand Analog Devices (formerly Maxim Integrated) Analog Devices Analog Devices Analog Devices Analog Devices Analog Devices
Resolution 8 bit 8 bit 8 bit 8 bit 8 bit 8 bit
Conversion Time (typ) 5 µs 5 µs 5 µs 5 µs 5 µs 5 µs
Conversion Time (max) 10 µs 10 µs 10 µs 10 µs 10 µs 10 µs
Supply Voltage +5 V single +5 V single +5 V single +5 V single +5 V single +5 V single
Temperature Grade / Qualification Military, MIL-STD-883B Military (no /883B screening) Commercial Commercial Military, MIL-STD-883B Class B Wide-temp SOIC
Output Interface Parallel 8-bit Parallel 8-bit Parallel 8-bit Parallel 8-bit Parallel 8-bit Parallel 8-bit

Key Differentiators

  • MIL-STD-883B screening with full burn-in and traceability (vs MX7575KN (commercial plastic PDIP18))
  • Hermetic ceramic CDIP-18 package (vs MX7575CWI (SOIC-18 wide-temp))
  • Tighter linearity screening class (vs MX7575SQ (non-/883B military CDIP))

Design Notes

Estimated: at +5 V supply and 5 µs conversion cadence, the MX7575SQ/883B draws approximately 5-10 mA active and <100 µA standby. Decouple VDD (pin 18) and VREF (pin 1) with 10 µF tantalum in parallel with 100 nF ceramic placed within 5 mm of the package pins to suppress digital switching noise that would otherwise couple into the comparator decision points during the SAR bit-trials.

Route the analog input (pin 2) as a guard-ring-protected microstrip with the analog ground (pin 3) used as a quiet ground reference. Keep digital bus lines (DB0-DB7, /CS, /RD, /WR) on the opposite PCB side and join AGND and DGND only at the package pin. Place the reference bypass capacitor (>=1 µF) directly on the VREF pin to maintain 8-bit linearity.

Do not exceed the absolute maximum analog input range of VREF; signals outside this range cause saturation and may damage the input ESD structure. Do not leave the /CS pin floating - tie it to logic high via 10 kΩ when not actively driven. Verify the BUSY (pin 17) timing margin against the µP read cycle to avoid stale-data reads.

Compliance Information

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Unknown

MIL-STD-883B variants are typically SnPb-lead-finished for hermeticity; RoHS compliance not standard. Not AEC-Q100 (automotive) - this is a MIL-grade part, not automotive.

Data verified on: 2026-10-15 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Analog Devices Maxim Integrated MX7575SQ/883B MX7575SQ MX7575KN MX7575JN MX7575BQ MX7575CWI Successive Approximation ADC SAR ADC 8-bit ADC parallel ADC CDIP-18 ceramic DIP MIL-STD-883B MIL-PRF-38535 ratiometric reference track-and-hold avionics data acquisition industrial process control hermetic label burn-in screening RoHS AEC-Q100
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