MPC8545PXATGD557 - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP
MPN: MPC8545PXATGD557 ✗ End of LifeMPC8545PXATGD557 Overview
Drop-in alternatives for MPC8545PXATGD557 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
MPC8545PXANGD557
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8555PXATGD557
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8545EVTATGD557
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8545PXATGD557 Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC e500 |
| Core Count | 1 |
| Data Bus Width | 32-bit |
| Maximum Clock Frequency | 1.2 GHz |
| L1 Cache (Instruction) | 32 KB |
| L1 Cache (Data) | 32 KB |
| L2 Cache | 256 KB unified |
| Operating Temperature Range | -40C to +105C (extended) |
| Package Type | 783-FCPBGA (29x29 mm) |
| Mounting Type | Surface Mount |
| Memory Controller | 64-bit DDR / DDR2 |
| Ethernet MACs | 4 x Gigabit (10/100/1000) |
| PCI / PCI-X Controllers | 2 |
| Local Bus Controller | Yes (8/16/32-bit) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
MPC8545PXATGD557 783-fcpbga (29x29 mm) Pin Configuration Guide
Pin configuration for MPC8545PXATGD557 (783-fcpbga (29x29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8545PXATGD557.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8545PXATGD557 is suitable for 6 applications: Enterprise Networking Line Cards, Storage Area Network (SAN) Controllers, Industrial Routers and Gateways, Secure Communications Gateways, Single-Board Computers (SBCs) for Embedded Computing, Wireless Base Station Controllers.
Enterprise Networking Line Cards
The MPC8545PXATGD557's 1.2 GHz e500 core, four integrated tri-speed Gigabit Ethernet MACs, two PCI/PCI-X controllers, and 64-bit DDR controller make it well suited for enterprise routing and switching line cards. The integrated SerDes lanes eliminate external PHYs in many designs, reducing BOM cost. PowerQUICC III is a well-known architecture with mature firmware support in VxWorks and Linux, simplifying carrier-grade deployment.
Recommended
Storage Area Network (SAN) Controllers
The MPC8545PXATGD557's PCI-X and local bus interfaces enable high-throughput connectivity to Fibre Channel or SAS controllers in iSCSI and FC-SAN storage designs. The 64-bit DDR controller with ECC support delivers the memory bandwidth required for RAID parity calculations and on-chip DMA engines offload copy operations. PowerQUICC III integration reduces component count for compact RAID controller cards.
Recommended
Industrial Routers and Gateways
The MPC8545PXATGD557's extended -40C to +105C operating temperature range makes it suitable for industrial routers deployed in factory floors, outdoor cabinets, and utility substations. Its hardware cryptography engines (in the MPC8545E variant) accelerate IPsec and TLS tunnels, while the dual PCI/PCI-X buses accommodate multiple WAN interface cards. The PowerPC e500 core runs deterministic real-time firmware for SCADA protocols.
Recommended
Secure Communications Gateways
For VPN gateways, the MPC8545E variant of the MPC8545PXATGD557 integrates SEC 2.0 and crypto engines that offload AES, 3DES, SHA, and RSA operations. This allows the 1.2 GHz e500 core to focus on packet forwarding while the security block sustains multi-gigabit tunnel throughput. The 783-FCPBGA package fits standard telecom SOM designs.
Recommended
Single-Board Computers (SBCs) for Embedded Computing
The MPC8545PXATGD557's rich peripheral integration (Gigabit Ethernet, PCI-X, local bus, DDR controller, I2C, DUART) makes it a complete SoC for VME/CompactPCI single-board computers in defense and aerospace applications. VxWorks and LynxOS BSPs are widely available, and the Book-E architecture provides deterministic interrupt response for safety-critical control loops.
Recommended
Wireless Base Station Controllers
The MPC8545PXATGD557's combination of high-throughput DDR memory, fast Ethernet MACs, and PCI-X enables it to function as a baseband controller or base station controller in 3G/4G small cell designs. Its deterministic e500 core executes real-time protocol stacks, while the integrated peripherals streamline the radio card interface. The wide operating temperature range suits outdoor radio units.
Recommended
Recommended Products Summary
Engineering reference data for MPC8545PXATGD557 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8545PXANGD557 | MPC8555PXATGD557 | MPC8545EVTATGD557 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Core Frequency | 1.2 GHz | 1.0 GHz | 1.2 GHz | 1.2 GHz |
| L2 Cache | 256 KB | 256 KB | 256 KB | 256 KB |
| Security Engine | No (MPC8545) | No | Yes (SEC 2.0) | Yes (SEC 2.0) |
| Ethernet MACs | 4 x Gigabit | 4 x Gigabit | 4 x Gigabit | 4 x Gigabit |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Key Differentiators
- Integrated 4-port Gigabit Ethernet with on-chip SerDes (vs MPC8545PXANGD557 (1.0 GHz variant))
- Higher performance vs MPC8545E cousin (vs MPC8545EVTATGD557)
- PCI-X bus support vs lower-tier alternatives (vs MPC8555PXATGD557)
Design Notes
The 783-FCPBGA package uses a 1.06 mm ball pitch, which requires a multi-layer PCB with laser-drilled microvias or stacked-via technology for the breakout layer. Recommended stack-up: 8+ layers with dedicated ground/power planes under the BGA. Use HDI design rules (line/space 4 mil/4 mil minimum) and ensure the BGA breakout fan-out is symmetrical on all four sides. Refer to NXP AN-2800 for FCPBGA layout guidelines.
The MPC8545PXATGD557 can dissipate 8-12 W at 1.2 GHz under typical networking workloads. A thermal pad or heat spreader must be attached to the top of the package using a thermal interface material (TIM). For conduction-cooled applications (VME/CompactPCI), a thermal pad on the lid with a minimum 2 C/W interface is required. Air-cooled designs should provide 200 LFM airflow across the heatsink.
Do not assume the security engine is present in all MPC8545 variants - the standard MPC8545 lacks SEC 2.0. If your firmware uses crypto acceleration, verify the silicon revision (MPC8545E = with SEC; MPC8545 = without). Also confirm the DDR memory topology: the MPC8545 supports only DDR/DDR2, not DDR3. Mixing DIMM types will damage the controller.
Design the core voltage rail (Vdd) at 1.1 V typical with +/-5% tolerance and a peak current capability of 4-5 A during core bursts. Use a multi-phase PWM controller with output inductors rated for at least 6 A saturation. Place decoupling capacitors within 2 mm of every Vdd/Vss pair, with a mix of 0.1 uF, 1 uF, and 10 uF bulk caps.
The DDR2 controller supports up to 533 MHz with 64-bit data plus ECC. Match trace lengths to within +/-25 mils for the data/strobe groups and use matched-impedance routing (50 ohm single-ended, 100 ohm differential for strobes). Place the DDR termination resistors as close as possible to the DRAM to prevent signal reflections.
Compliance Information
RoHS and lead-free compliant per NXP product page. Not AEC-Q100 qualified (industrial/commercial part). Halogen-free status not explicitly stated in the verified data; consult NXP for confirmation.