MPC8545PXATGD557 - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP
部品番号: MPC8545PXATGD557 ✗ 生産終了MPC8545PXATGD557 概要
ドロップイン代替品: MPC8545PXATGD557 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
MPC8545PXANGD557
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品(カタログ未掲載)
MPC8555PXATGD557
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品(カタログ未掲載)
MPC8545EVTATGD557
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品(カタログ未掲載)
MPC8545PXATGD557 最大定格&電気的特性
| Core Architecture | PowerPC e500 |
| Core Count | 1 |
| データバス幅 | 32-bit |
| 最大クロック周波数 | 1.2 GHz |
| L1 Cache (Instruction) | 32 KB |
| L1 Cache (Data) | 32 KB |
| L2 Cache | 256 KB unified |
| 動作温度範囲 | -40C to +105C (extended) |
| Package Type | 783-FCPBGA (29x29 mm) |
| 実装タイプ | Surface Mount |
| Memory Controller | 64-bit DDR / DDR2 |
| Ethernet MACs | 4 x Gigabit (10/100/1000) |
| PCI / PCI-X Controllers | 2 |
| Local Bus Controller | Yes (8/16/32-bit) |
| MSLレベル | 3 (168 hours) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
MPC8545PXATGD557 783-fcpbga (29x29 mm) ピン配置ガイド
MPC8545PXATGD557 (783-fcpbga (29x29 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8545PXATGD557.
詳細は データシート をご参照ください。
主な用途
MPC8545PXATGD557 の用途: 6 件s: Enterprise Networking Line Cards, Storage Area Network (SAN) Controllers, Industrial Routers and Gateways, Secure Communications Gateways, Single-Board Computers (SBCs) for Embedded Computing, Wireless Base Station Controllers.
Enterprise Networking Line Cards
The MPC8545PXATGD557's 1.2 GHz e500 core, four integrated tri-speed Gigabit Ethernet MACs, two PCI/PCI-X controllers, and 64-bit DDR controller make it well suited for enterprise routing and switching line cards. The integrated SerDes lanes eliminate external PHYs in many designs, reducing BOM cost. PowerQUICC III is a well-known architecture with mature firmware support in VxWorks and Linux, simplifying carrier-grade deployment.
おすすめ
Storage Area Network (SAN) Controllers
The MPC8545PXATGD557's PCI-X and local bus interfaces enable high-throughput connectivity to Fibre Channel or SAS controllers in iSCSI and FC-SAN storage designs. The 64-bit DDR controller with ECC support delivers the memory bandwidth required for RAID parity calculations and on-chip DMA engines offload copy operations. PowerQUICC III integration reduces component count for compact RAID controller cards.
おすすめ
Industrial Routers and Gateways
The MPC8545PXATGD557's extended -40C to +105C operating temperature range makes it suitable for industrial routers deployed in factory floors, outdoor cabinets, and utility substations. Its hardware cryptography engines (in the MPC8545E variant) accelerate IPsec and TLS tunnels, while the dual PCI/PCI-X buses accommodate multiple WAN interface cards. The PowerPC e500 core runs deterministic real-time firmware for SCADA protocols.
おすすめ
Secure Communications Gateways
For VPN gateways, the MPC8545E variant of the MPC8545PXATGD557 integrates SEC 2.0 and crypto engines that offload AES, 3DES, SHA, and RSA operations. This allows the 1.2 GHz e500 core to focus on packet forwarding while the security block sustains multi-gigabit tunnel throughput. The 783-FCPBGA package fits standard telecom SOM designs.
おすすめ
Single-Board Computers (SBCs) for Embedded Computing
The MPC8545PXATGD557's rich peripheral integration (Gigabit Ethernet, PCI-X, local bus, DDR controller, I2C, DUART) makes it a complete SoC for VME/CompactPCI single-board computers in defense and aerospace applications. VxWorks and LynxOS BSPs are widely available, and the Book-E architecture provides deterministic interrupt response for safety-critical control loops.
おすすめ
Wireless Base Station Controllers
The MPC8545PXATGD557's combination of high-throughput DDR memory, fast Ethernet MACs, and PCI-X enables it to function as a baseband controller or base station controller in 3G/4G small cell designs. Its deterministic e500 core executes real-time protocol stacks, while the integrated peripherals streamline the radio card interface. The wide operating temperature range suits outdoor radio units.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8545PXATGD557 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8545PXANGD557 | MPC8555PXATGD557 | MPC8545EVTATGD557 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Core Frequency | 1.2 GHz | 1.0 GHz | 1.2 GHz | 1.2 GHz |
| L2 Cache | 256 KB | 256 KB | 256 KB | 256 KB |
| Security Engine | No (MPC8545) | No | Yes (SEC 2.0) | Yes (SEC 2.0) |
| Ethernet MACs | 4 x Gigabit | 4 x Gigabit | 4 x Gigabit | 4 x Gigabit |
| Lifecycle Status | NRND | NRND | NRND | NRND |
主な差別化要因
- Integrated 4-port Gigabit Ethernet with on-chip SerDes (vs MPC8545PXANGD557 (1.0 GHz variant))
- Higher performance vs MPC8545E cousin (vs MPC8545EVTATGD557)
- PCI-X bus support vs lower-tier alternatives (vs MPC8555PXATGD557)
設計ノート
The 783-FCPBGA package uses a 1.06 mm ball pitch, which requires a multi-layer PCB with laser-drilled microvias or stacked-via technology for the breakout layer. Recommended stack-up: 8+ layers with dedicated ground/power planes under the BGA. Use HDI design rules (line/space 4 mil/4 mil minimum) and ensure the BGA breakout fan-out is symmetrical on all four sides. Refer to NXP AN-2800 for FCPBGA layout guidelines.
The MPC8545PXATGD557 can dissipate 8-12 W at 1.2 GHz under typical networking workloads. A thermal pad or heat spreader must be attached to the top of the package using a thermal interface material (TIM). For conduction-cooled applications (VME/CompactPCI), a thermal pad on the lid with a minimum 2 C/W interface is required. Air-cooled designs should provide 200 LFM airflow across the heatsink.
Do not assume the security engine is present in all MPC8545 variants - the standard MPC8545 lacks SEC 2.0. If your firmware uses crypto acceleration, verify the silicon revision (MPC8545E = with SEC; MPC8545 = without). Also confirm the DDR memory topology: the MPC8545 supports only DDR/DDR2, not DDR3. Mixing DIMM types will damage the controller.
Design the core voltage rail (Vdd) at 1.1 V typical with +/-5% tolerance and a peak current capability of 4-5 A during core bursts. Use a multi-phase PWM controller with output inductors rated for at least 6 A saturation. Place decoupling capacitors within 2 mm of every Vdd/Vss pair, with a mix of 0.1 uF, 1 uF, and 10 uF bulk caps.
The DDR2 controller supports up to 533 MHz with 64-bit data plus ECC. Match trace lengths to within +/-25 mils for the data/strobe groups and use matched-impedance routing (50 ohm single-ended, 100 ohm differential for strobes). Place the DDR termination resistors as close as possible to the DRAM to prevent signal reflections.
コンプライアンス情報
RoHS and lead-free compliant per NXP product page. Not AEC-Q100 qualified (industrial/commercial part). Halogen-free status not explicitly stated in the verified data; consult NXP for confirmation.