MPC860DPZQ50D4557 - PowerQUICC 50MHz 32-Bit MPU | NXP | 357-PBGA
MPN: MPC860DPZQ50D4557 ⚠ Last Time BuyMPC860DPZQ50D4557 Overview
A PowerQUICC microprocessor (sometimes referred to as a communications SoC or embedded MPU) is a 32-bit processor that combines a Power Architecture core with on-chip peripheral controllers, reducing system BOM count and power consumption in routers, bridges, and remote-access equipment. Within the broader taxonomy it sits at: microprocessor (MPU) > embedded processor > communications SoC > Power Architecture SoC > semiconductor. MPC8xx parts dominated late-1990s/early-2000s telecom designs and remain in long-lifecycle equipment today.
Key features include a single 50 MHz Power Architecture core, an independent CPM supporting Ethernet (10/100), ATM, HDLC/SDLC, and PCMCIA, 4 KB unified instruction/data cache, MMU with 32-entry TLB, and a general-purpose 32-bit data bus. Operating temperature is 0C to +95C (commercial grade). The device supports JTAG boundary-scan and on-chip debug. Memory controller interfaces SDRAM, DRAM, SRAM, EPROM, and Flash, while PCMCIA and CPM peripherals handle external I/O expansion.
The CPM offloads low-level protocol processing from the core, freeing the CPU for higher-layer software stacks. Combined with hardware TCP/IP acceleration and multi-channel DMA, this architecture delivers deterministic throughput for WAN/LAN edge devices. The 357-PBGA package provides high pin density and excellent thermal performance for sustained industrial workloads.
Typical applications include SOHO routers, DSL/cable modems, ATM switches, industrial Ethernet bridges, and legacy telecom access equipment. It is widely used in long-lifecycle embedded designs where firmware stability and proven Power Architecture toolchains are required over raw clock speed.
When designing, verify supply voltage (3.3V core, separate I/O rail), clocking, and JTAG pinout against the NXP hardware specification. Note that lead-time pricing reflects NXP's last-time-buy status; stock from authorized distributors and brokers should be confirmed before BOM commitment.
Drop-in alternatives for MPC860DPZQ50D4557 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
MPC860DPZQ66D4557
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860DTZQ50D4557
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860DPZQ50D4
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860SRZQ50D4557
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC860ENZQ50D4557
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC860DPZQ50D4557 Maximum Ratings & Electrical Characteristics
| Family | PowerQUICC MPC8xx |
| Core Architecture | 32-bit Power Architecture |
| Core Count | 1 |
| Maximum Core Frequency | 50 MHz |
| Communications Processor Module (CPM) | Yes |
| Ethernet Support | 10/100 (ENET) |
| ATM Support | Yes |
| HDLC/SDLC Support | Yes |
| PCMCIA Interface | Yes |
| Instruction/Data Cache | 4 KB unified |
| MMU | Yes, 32-entry TLB |
| Package | 357-PBGA (25x25 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +95C |
| Supply Voltage | 3.3V (typical, dual-rail core+I/O) |
MPC860DPZQ50D4557 357-pbga (25x25 mm) Pin Configuration Guide
Pin configuration for MPC860DPZQ50D4557 (357-pbga (25x25 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC860DPZQ50D4557.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC860DPZQ50D4557 is suitable for 6 applications: SOHO Router and Gateway, DSL and Cable Modem Termination, Industrial Ethernet Bridge and Gateway, ATM Switch Edge Card, Legacy Telecom Access System, Print Server and Networked Embedded Device.
SOHO Router and Gateway
The MPC860DPZQ50D4557 is well-suited for small-office/home-office routers and integrated gateway appliances where Power Architecture stability and the on-chip CPM simplify protocol stacks. The integrated Ethernet (10/100) controller, HDLC, and PCMCIA interfaces allow direct WAN/LAN PHY connections without external bridge chips. At 50 MHz core plus hardware-accelerated DMA, the part can handle typical NAT/firewall routing loads for up to 50-100 Mbps throughput while keeping firmware complexity low. Designers should pair the MPC860 with 16-64 MB SDRAM and 4-8 MB Flash for a complete router BOM under $25 in silicon cost.
Recommended
DSL and Cable Modem Termination
The MPC860DPZQ50D4557's integrated ATM support and HDLC/SDLC channels make it a strong fit for legacy DSLAM termination and cable modem headend equipment. The CPM offloads ATM segmentation-and-reassembly (SAR) and HDLC framing from the CPU, freeing the Power Architecture core for higher-layer routing and management tasks. With PCMCIA support, designers can add wireless or storage peripherals without external controllers. Operating temperature 0C to +95C covers indoor central-office and customer-premises deployments, and the 357-PBGA package supports reflow assembly on standard 4-layer PCBs.
Recommended
Industrial Ethernet Bridge and Gateway
For industrial automation bridging Ethernet to fieldbuses, the MPC860DPZQ50D4557's deterministic CPM and Power Architecture toolchain support make it a long-lifecycle solution. The on-chip Ethernet, serial UART, and PCMCIA interfaces allow direct connection to industrial sensors, while the 50 MHz core runs Modbus/TCP, EtherNet/IP, or PROFINET stacks with predictable latency. Operating temperature (0C to +95C) covers most factory-floor enclosures. Designers value the part for its 10+ year production history, ensuring stable firmware support for industrial control systems that must run continuously for decades.
Recommended
ATM Switch Edge Card
In legacy ATM switch edge cards, the MPC860DPZQ50D4557's ATM hardware acceleration and multi-channel HDLC provide per-port protocol processing with minimal CPU intervention. The CPM's RISC-based controller handles cell delineation, SAR, and OAM cells independently of the Power Architecture core. Multiple MPC860s can be paralleled on a single ATM backplane for scalable edge switching. The 357-PBGA package enables high-density edge-card layouts, and NXP's BSDL files support boundary-scan testing in volume manufacturing.
Recommended
Legacy Telecom Access System
The MPC860DPZQ50D4557 remains deployed in legacy telecom access equipment including T1/E1 multiplexers, frame-relay access devices (FRADs), and ISDN terminal adapters. The part's HDLC/SDLC support and PCMCIA interface (originally for modem cards) match the I/O requirements of these systems. With last-time-buy status, telecom OEMs stockpile the part for maintenance of installed bases that cannot be redesigned without service-provider certification. The 357-PBGA package's thermal performance supports continuous operation in climate-controlled central offices, and NXP's long-term silicon support guarantees firmware stability for the next decade.
Recommended
Print Server and Networked Embedded Device
The MPC860DPZQ50D4557 is used in legacy networked print servers, network-attached storage (NAS) controllers, and other embedded appliances where Ethernet connectivity and Power Architecture stability outweigh raw CPU speed. The on-chip memory controller interfaces SDRAM and Flash directly, eliminating external glue logic, while the CPM handles TCP/IP offload for file-transfer workloads. At 50 MHz, the part can sustain 10-50 Mbps file transfers with appropriate firmware. Designers value the mature Green Hills INTEGRITY/VxWorks/Linux toolchain support, which shortens firmware development cycles for long-lifecycle embedded products.
Recommended
Recommended Products Summary
Engineering reference data for MPC860DPZQ50D4557 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC860DPZQ66D4557 | MPC860DTZQ50D4557 | MPC860DPZQ50D4 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Frequency | 50 MHz | 66 MHz | 50 MHz | 50 MHz |
| Ethernet Channels | 1 (10/100) | 1 (10/100) | 2 (10/100) | 1 (10/100) |
| CPM Support | Yes (Ethernet, ATM, HDLC, PCMCIA) | Yes | Yes | Yes |
| Operating Temperature | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Higher core frequency at same price tier (vs MPC860DPZQ66D4557)
- Dual-Ethernet variant for multi-WAN (vs MPC860DTZQ50D4557)
- Integrated CPM reduces BOM cost (vs MPC860SRZQ50D4557)
Design Notes
The MPC860DPZQ50D4557 requires two supply rails: a 3.3V core supply (typically 3.0-3.6V) and a separate I/O supply. Decouple each power pin with 0.1uF ceramic and 10uF bulk capacitors placed as close to the PBGA balls as possible. Total power consumption at 50 MHz with full CPM activity is approximately 1.5-2.5W; the 357-PBGA package requires thermal vias under the die for sustained workloads.
The 357-PBGA package has a 1.27 mm ball pitch; design 4-layer PCB with microvia-in-pad or dog-bone fanout for BGA breakout. Route signal traces on inner layers to escape from the outer BGA rows, and use ground/power planes on layers 2 and 4 for return-path integrity. Maintain 50-ohm impedance for Ethernet MII signals and 75-ohm for ATM Utopia interfaces to prevent signal-integrity issues at 50 MHz.
Do not assume the MPC860DPZQ50D4557 is RoHS compliant without checking the specific lot; older MPC8xx inventory was SnPb-based. Verify JTAG pinout against NXP's BSDL file before bringing up boundary-scan, since some variants rename TRST or HRESET. Also confirm whether your firmware expects big-endian (default) or little-endian mode by setting the BBE bit at reset; mismatched endianness causes silent data corruption.
Compliance Information
RoHS and lead-free status not explicitly stated in provided distributor data; consult NXP's environmental compliance portal for the specific lot. AEC-Q100 not applicable for embedded MPU. Conflict-minerals compliance assumed per NXP corporate policy.
