MPC859DSLCVR50A - PowerQUICC MPC8xx 32-bit MPU 50MHz | NXP
MPN: MPC859DSLCVR50A ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $25.48 | $25.48 |
| 10 | $23.4 | $234.00 |
| 100 | $20.9 | $2,090.00 |
| 500 | $18.75 | $9,375.00 |
| 1,000 | $17.2 | $17,200.00 |
MPC859DSLCVR50A Overview
A PowerQUICC (PowerPC Quad Integrated Communications Controller) microprocessor is a specialized embedded processor that combines a PowerPC CPU core with dedicated peripherals for networking and telecommunications. Within the broader hierarchy, MPC8xx parts are embedded microprocessors (a subcategory of microcontrollers / MPU ICs) that target serial-communication-intensive designs such as routers, WAN interfaces, and industrial control. The 50 MHz core frequency, integrated SCCs (serial communication controllers), and PCI bridge make the MPC859DSLCVR50A a classic building block for legacy telecom and embedded networking equipment.
Key features include 50 MHz core clock speed, 32-bit PowerPC core, integrated communications processor module (CPM) with multiple serial interfaces, integrated memory controller supporting DRAM/EDO, a 32-bit PCI interface, and low-power 1.8V core operation. The 357-ball PBGA package is a plastic ball grid array measuring 25x25 mm, designed for surface-mount assembly on high-density embedded boards.
Technically, the MPC859DSLCVR50A uses the PowerPC 603e-derived core with a unified 4 KB instruction and 4 KB data cache, hardware MMU, and dual-port RAM between the core and the CPM. The CPM offloads communications tasks from the CPU through independent RISC engines, enabling wire-speed serial handling while the core runs application code. The 0.18 µm CMOS process delivers low power dissipation and high integration density.
Typical applications include WAN routers and CSU/DSU equipment, industrial serial networking hubs, ISDN terminal adapters, embedded communications controllers, protocol converters, and legacy telecom infrastructure requiring deterministic serial performance.
When designing with this device, note that it requires external SDRAM/DRAM, boot ROM, and a system PLL reference. Designers should consult the MPC866/859 hardware specifications document for AC/DC electrical characteristics and pin multiplexing. The 357-ball BGA requires X-ray inspection and reflow profiling compatible with large-array packages.
This page synthesizes distributor pricing from DigiKey and Rochester Electronics, drop-in same-family alternatives from the MPC8xx product line, and practical design notes not consolidated in the manufacturer datasheet, giving procurement and engineering teams a single reference for the MPC859DSLCVR50A.
Drop-in alternatives for MPC859DSLCVR50A — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC859DSLCVR50A (same form factor and footprint) — differing in Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC859DSLVR50A
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →MPC859TCVR50A
✅ Drop-In📋 Reference alternative (not in catalog)
MPC866PCVR50A
✅ Drop-In📋 Reference alternative (not in catalog)
MPC859TVR50A
✅ Drop-In📋 Reference alternative (not in catalog)
MPC866TVR50A
✅ Drop-In📋 Reference alternative (not in catalog)
MPC859DSLCVR50A Maximum Ratings & Electrical Characteristics
| Processor Type | MPC8xx PowerQUICC 32-bit MPU |
| Core Architecture | PowerPC 603e-derived, 1 Core |
| Core Frequency | 50 MHz |
| Core Voltage | 1.8 V |
| I/O Voltage | 3.3 V |
| Process Technology | 0.18 µm CMOS |
| Bit Width | 32-bit |
| Package | 357-PBGA (25x25 mm) |
| Mounting Type | Surface Mount |
| Integrated Communications | CPM with multiple SCCs, SMCs, SPI, I2C |
| PCI Interface | 32-bit PCI bridge integrated |
| Memory Controller | DRAM/EDO/SRAM interface integrated |
| RoHS Status | Compliant |
| Lead Free Status | Lead Free |
| Packaging | Tray |
MPC859DSLCVR50A 357-pbga (25x25 mm) Pin Configuration Guide
Pin configuration for MPC859DSLCVR50A (357-pbga (25x25 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC859DSLCVR50A.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC859DSLCVR50A is suitable for 6 applications: WAN Router / CSU-DSU Equipment, ISDN Terminal Adapter / Modem, Industrial Serial Networking Hub, Protocol Converter Bridge, Legacy Telecom Infrastructure Sustaining, Embedded Communications Controller Module.
WAN Router / CSU-DSU Equipment
The MPC859DSLCVR50A's integrated Communications Processor Module (CPM) with multiple Serial Communication Controllers (SCCs) makes it well-suited for WAN routers and CSU/DSU equipment. Its 50 MHz PowerPC core runs routing and management code while the CPM engines handle HDLC, transparent, and UART serial protocols at wire speed, eliminating the need for an external communications controller. The 32-bit PCI bridge simplifies attachment of additional peripheral chips. The 1.8V core and 3.3V I/O keep power dissipation manageable in fanless telecom enclosures. The 357-ball PBGA enables dense board layouts typical of rack-mount networking gear.
Recommended
ISDN Terminal Adapter / Modem
Legacy ISDN terminal adapters and modem banks rely on the MPC859DSLCVR50A for simultaneous handling of multiple B-channels. Each SCC can manage a full-duplex ISDN BRI link, while the PowerPC core runs higher-layer protocols and call control. The integrated DRAM controller and PCI bridge reduce BOM cost, and the 50 MHz clock is adequate for typical ISDN data rates of 64 kbps to 2 Mbps. The commercial temperature grade suits indoor telecom customer-premises equipment. Engineers maintain the MPC859DSLCVR50A in production for installed-base support contracts.
Recommended
Industrial Serial Networking Hub
Industrial serial hubs use the MPC859DSLCVR50A to bridge multiple RS-232/RS-485 ports to Ethernet backbones. The CPM's serial management controllers and SCCs provide hardware-accelerated protocol handling for Modbus, Profibus, and other industrial serial protocols, offloading the PowerPC core. The 32-bit PCI interface allows expansion cards for additional physical interfaces. Wide operating temperature variants within the MPC8xx family extend deployment to factory floors. The 357-ball PBGA's mechanical robustness suits vibration-prone industrial cabinets.
Recommended
Protocol Converter Bridge
Protocol converters translating between legacy serial protocols and modern IP networks commonly use the MPC859DSLCVR50A as the central controller. The integrated CPM handles low-level serial framing while the PowerPC core runs the protocol conversion logic and TCP/IP stack. PCI expansion allows adding protocol-specific PHY cards. The 50 MHz performance is adequate for protocol translation rates up to several Mbps aggregate. The mature toolchain and reference designs from NXP shorten development cycles for bridge products.
Recommended
Legacy Telecom Infrastructure Sustaining
The MPC859DSLCVR50A remains in service for legacy telecom infrastructure including PBX systems, channel banks, and T1/E1 multiplexers. Its deterministic CPM operation and field-proven reliability keep it specified in long-lifecycle telecom equipment where regulatory re-certification is impractical. The 357-ball PBGA supports high-density PCB layouts required for channel-bank shelf equipment. Repair depots stock the MPC859DSLCVR50A for sustaining customer networks. Consider NXP's product longevity program when qualifying for new deployments.
Recommended
Embedded Communications Controller Module
OEM communications modules for medical, transportation, and energy applications integrate the MPC859DSLCVR50A as a sub-processor managing radio links, sensor buses, and telemetry streams. The integrated PCI and memory controllers reduce module BOM, and the PowerPC architecture supports real-time operating systems like VxWorks and embedded Linux. The 50 MHz clock rate is sufficient for sub-Mbps sensor aggregation. The 357-ball BGA's small footprint suits compact embedded modules requiring multiple serial interfaces.
Recommended
Recommended Products Summary
Engineering reference data for MPC859DSLCVR50A — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC859DSLVR50A | MPC859TCVR50A | MPC866PCVR50A | MPC859TVR50A | MPC866TVR50A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Bit Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Ethernet Support | Limited | Limited | Limited | Full (Fast Ethernet) | Limited | Full (Fast Ethernet) |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Same-family variant with reduced CPM (vs MPC859TCVR50A)
- Migration path with Ethernet upgrade (vs MPC866PCVR50A)
- Modern alternative NOT drop-in (vs NXP QorIQ / Layerscape)
Design Notes
The 357-ball PBGA (25x25 mm) requires a controlled-impedance PCB stack-up with continuous ground planes beneath the BGA footprint. Use non-solder-mask-defined (NSMD) land pads of approximately 0.5 mm diameter on a 1.0 mm or 1.27 mm pitch grid, matching JEDEC MO-192. Place 0.1 µF X7R decoupling capacitors within 2 mm of every power/ground ball pair. A minimum 4-layer PCB with dedicated VCC and GND planes is recommended to suppress simultaneous-switching noise from the parallel external memory bus.
At full 50 MHz operation with the CPM running multiple SCCs, junction temperature must remain below 105 °C. Estimated power dissipation at 1.8V core is approximately 0.5-1.0 W depending on CPM utilization. The PBGA's theta_JA is approximately 15-20 C/W with adequate PCB copper area. Provide at least 4 square inches of top-layer copper connected to the thermal balls for heat spreading. Forced-air cooling may be required in enclosed telecom enclosures.
Do not confuse the MPC859DSLCVR50A (357-ball PBGA, 50 MHz) with the MPC852TZT50A (256-ball PBGA, 50 MHz) - these are NOT pin-compatible and cannot be substituted on the same PCB. Verify boot configuration signals and external memory bus width (32-bit vs 16-bit) against your firmware before designing the boot ROM. Incorrect PLL configuration can cause the core to operate at twice or half the expected frequency, leading to silent failures.
Compliance Information
RoHS compliant and lead-free per distributor product pages. REACH, halogen-free, and conflict-minerals status not explicitly published in the verified web data snippets - confirm directly with NXP if required for regulatory submission. AEC-Q100 is not applicable as the MPC8xx family targets commercial/industrial telecom, not automotive.
