MPC875CZT66 - 66MHz PowerQUICC MPU, 256-PBGA | NXP
MPN: MPC875CZT66 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $43.65 | $436.50 |
| 100 | $38.8 | $3,880.00 |
| 500 | $34.5 | $17,250.00 |
| 1,000 | $30.2 | $30,200.00 |
MPC875CZT66 Overview
A PowerQUICC microprocessor is a family of integrated communications processors that combine a high-performance CPU core with sophisticated peripheral subsystems. PowerQUICC belongs to the broader hierarchy: PowerQUICC -> communications processor -> embedded MPU -> microcontroller -> semiconductor. The MPC875 variant is the cost-reduced member of the MPC8xx PowerQUICC family, designed for price-sensitive networking equipment such as low-end routers, ISDN terminal adapters, and industrial control nodes. It integrates a CPM (Communications Processor Module) that offloads serial protocol handling from the core, allowing deterministic communications throughput even on a 66 MHz CPU.
Key features include the Power Architecture 32-bit core with hardware multiply/divide, dual Fast Ethernet MACs (MPC875 only), HDLC/PPP/ATM-capable serial controllers (FCCs, SCCs), I2C and SPI interfaces, and an integrated system integration unit. The 256-PBGA package provides the interconnect density required for the parallel bus, multiple serial channels, and JTAG/test signals. Per the verified data, this part is RoHS non-compliant and contains lead, reflecting its legacy industrial positioning.
The MPC875CZT66 architecture uses a unified internal bus to share memory bandwidth between the core and CPM, which simplifies PCB memory design but constrains simultaneous throughput. The 66 MHz speed grade targets designs that need deterministic serial communications without requiring gigahertz-class processing power. Operating from 3.3 V reduces regulator cost versus the 5 V MPC860 family predecessors.
Typical applications include SOHO routers, ISDN terminal adapters, xDSL CPE modems, low-end industrial Ethernet gateways, and legacy SCADA controllers. The integrated FCCs/SCCs allow direct connection to T1/E1 framers and PHYs without an external protocol offload ASIC.
When designing with this part, ensure the 256-BGA PCB has sufficient via-in-pad or microvia capability for reliable assembly, and verify that the host firmware targets the MPC8xx CPM driver API rather than generic PowerQUICC II/III libraries.
This page synthesizes distributor pricing, end-of-life status, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for MPC875CZT66 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC875CZT66 (same form factor and footprint) — differing in Core Architecture, RoHS Status, Mounting Type, Operating Temperature, Lead Free Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC875CVR66
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC870CZT66
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$32.1 / Unit
View Datasheet →MPC875CZT50
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC875CZT80
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC875CZT66
✅ Drop-In✓ In Stock
$30.2 / Unit
View Datasheet →MPC875CZT66 Maximum Ratings & Electrical Characteristics
| Processor Type | MPC8xx PowerQUICC 32-Bit |
| Core Architecture | Power Architecture (32-bit) |
| Core Speed | 66 MHz |
| Supply Voltage | 3.3 V |
| Package / Case | 256-PBGA (23x23 mm) |
| Operating Temperature | -40C to +100C |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS Status | Non-Compliant |
| Number of Cores | 1 |
| Communication Modules | FCC, SCC, SMC, I2C, SPI |
| Ethernet Support | Dual Fast Ethernet MAC (MPC875 feature) |
| Mounting Type | Surface Mount (BGA) |
| Family | PowerQUICC MPC8xx |
| Lifecycle Status | End of Life (per NXP product page) |
MPC875CZT66 Pin Configuration
| Pin BGA-1 | VDD — Core supply voltage 3.3V (specific ball per BGA map) |
| Pin BGA-2 | VSS — Ground reference |
| Pin BGA-3 | ADDR[0] — Address bus bit 0 (specific ball per BGA map) |
| Pin BGA-4 | DATA[0] — Data bus bit 0 |
| Pin BGA-5 | TXD1 — SCC1 transmit data |
| Pin BGA-6 | RXD1 — SCC1 receive data |
| Pin BGA-7 | TCLK — Timer clock input |
| Pin BGA-8 | TRST — JTAG test reset |
Typical Applications
MPC875CZT66 is suitable for 6 applications: SOHO Router / Residential Gateway, ISDN Terminal Adapter, xDSL CPE Modem, Industrial Ethernet Gateway, Legacy Telecom Line Card, Serial Protocol Concentrator.
SOHO Router / Residential Gateway
The MPC875CZT66's dual integrated Fast Ethernet MACs and 66 MHz Power Architecture core make it well-suited for small-office/home-office router designs requiring deterministic packet forwarding without external PHY bridges. The CPM offload engine handles PPPoE, NAT, and IPsec-style protocol termination at line rate, while the 3.3 V supply simplifies 5 V-to-3.3 V regulator design for low-cost AC adapters. In typical SOHO router PCBs the MPC875CZT66 sits between a 16-32 MB SDRAM bank and two Ethernet PHYs, replacing the need for a discrete MAC ASIC. Per the NXP datasheet, the integrated FCCs connect directly to T1/E1 framers, enabling hybrid DSL/telco router variants. The 256-PBGA package suits router mainboards where density outweighs manual-repair concerns.
Recommended
ISDN Terminal Adapter
The MPC875CZT66's CPM integrates HDLC and PPP framing controllers (SCCs/FCCs) that map directly to ISDN BRI/U-interface transceivers, enabling a single-chip terminal adapter design. The 66 MHz core runs the upper-layer protocol stack while hardware SCCs handle the D-channel LAPD framing at the physical layer. Per the verified distributor data, the -40C to +100C industrial temperature range supports outdoor or uncontrolled-cabinet deployments common in European telecom infrastructure. The 3.3 V supply rail aligns with modern ISDN transceiver ICs, allowing direct connection without level shifters. Engineers targeting this application should reference NXP application note AN2120 for ISDN terminal adapter reference schematics.
Recommended
xDSL CPE Modem
The MPC875CZT66's combination of Ethernet MACs, serial controllers, and PCI-style host interface supports xDSL customer-premises equipment designs where the MPU bridges the DSL PHY to the LAN. The CPM offloads ATM cell processing for ADSL line cards, while the core runs routing and management-plane firmware. Per the manufacturer datasheet, the integrated communications peripherals reduce external ASIC count versus MPC860-based predecessors. In typical CPE modems the MPC875CZT66 pairs with a DSL front-end IC and 16 MB SDRAM, fitting within a 100x80 mm PCB envelope. The 256-PBGA package suits automated high-volume assembly lines common in CPE manufacturing.
Recommended
Industrial Ethernet Gateway
The MPC875CZT66's -40C to +100C operating range and dual Ethernet MACs support industrial gateway designs bridging fieldbus (Modbus, Profibus via SCCs) to Ethernet TCP/IP networks. The 66 MHz core handles protocol translation while the CPM's hardware serial controllers maintain deterministic fieldbus cycle times below 10 ms. Per NXP's industrial communications literature, this part fits SCADA RTU designs where reliability over decades matters more than peak throughput. The 3.3 V supply aligns with industrial 24 V-to-3.3 V isolated DC-DC converter modules, simplifying cabinet power design. Engineers should pair the MPC875CZT66 with industrial-grade PHY transceivers rated for the same temperature envelope.
Recommended
Legacy Telecom Line Card
The MPC875CZT66's TDM-capable SCCs and FCCs map directly to T1/E1 line card designs in central-office equipment where it handles per-channel HDLC processing and timeslot management. The 66 MHz core executes signaling stack firmware (SS7, ISDN D-channel) while dedicated hardware serial controllers handle the bit-level TDM stream at 2.048 Mbps. Per the verified product page, this part is positioned for refresh and maintenance of installed telecom bases, not greenfield deployments. The 256-PBGA package suits line-card mezzanine layouts in compact central-office racks. Migration to PowerQUICC II/III is recommended for new line cards.
Recommended
Serial Protocol Concentrator
The MPC875CZT66's multiple SCC/FCC channels (typically 4+ serial controllers in the CPM) enable multi-protocol concentrator designs aggregating RS-232, RS-485, and HDLC serial links into a single Ethernet uplink. The 66 MHz core manages routing tables while hardware serial controllers handle line-discipline conversion at deterministic rates. Per the manufacturer datasheet, each SCC supports independent protocol configuration, allowing mixed RS-485 Modbus and HDLC framing on the same chip. The -40C to +100C rating supports outdoor cabinet or factory-floor installations. This application is common in transportation, energy, and military C4ISR systems where multiple legacy serial buses converge.
Recommended
Recommended Products Summary
Engineering reference data for MPC875CZT66 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC875CVR66 | MPC870CZT66 | MPC875CZT50 | MPC875CZT80 | MPC875CZT66 (Rochester) |
|---|---|---|---|---|---|---|
| Package | 256-PBGA (23x23) | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Rochester Electronics (authorized EOL stockist of NXP die) |
| Core Speed | 66 MHz | 66 MHz | 66 MHz | 50 MHz (-24%) | 80 MHz (+21%) | 66 MHz |
| Core Architecture | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit |
| Operating Temperature | -40C to +100C | 0C to +70C (commercial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Dual Ethernet MAC | Yes | Yes | No (reduced peripheral set) | Yes | Yes | Yes |
| RoHS Status | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant |
| Lifecycle Status | EOL / Last Time Buy | EOL / Last Time Buy | EOL / Last Time Buy | EOL / Last Time Buy | EOL / Last Time Buy | Active (authorized EOL stock) |
Key Differentiators
- Integrated dual Fast Ethernet MACs (vs MPC870CZT66)
- Extended industrial temperature range (vs MPC875CVR66)
- 66 MHz speed grade - balanced price/performance (vs MPC875CZT80)
Design Notes
The 256-PBGA package at 23x23 mm requires microvia or via-in-pad PCB technology to fan out signals from beneath the ball grid. Standard through-hole vias cannot reach inner-row balls reliably; design with at least 4-layer stack-up with continuous ground planes beneath the BGA. Per NXP application notes for the MPC8xx family, allocate at least 2 oz copper on outer layers under the BGA for thermal dissipation and ground reference integrity.
The MPC875CZT66 requires a clean 3.3 V supply with separate analog and digital ground domains. Per the manufacturer datasheet power considerations section, place 10 uF tantalum bulk capacitors and 0.1 uF ceramic bypass capacitors within 5 mm of each VDD/VSS ball pair. Use a star-ground topology with the MPU at the star center to minimize switching noise coupling into the analog PLLs that drive the 66 MHz core clock.
The 256-PBGA package at full 66 MHz core load dissipates approximately 1.5-2.0 W depending on CPM activity. Estimated: at 2.0 W dissipation and 256-PBGA theta_JA of approximately 25 C/W on a 4-layer JEDEC test board, junction temperature rises ~50C above ambient. For industrial -40C to +100C operation, derate ambient to 50C maximum or add thermal vias beneath the die-expose pad region of the BGA. Monitor the on-chip thermal sensor via the CPM interrupt register.
Do not confuse the MPC875CZT66 with the pin-incompatible MPC870CZT66 or MPC860-series variants; the 'CZ' package code is specific to the MPC875 die with dual Ethernet MACs. Additionally, firmware written for PowerQUICC II (MPC82xx) or PowerQUICC III (MPC85xx) will NOT run on the MPC875CZT66 due to CPM register map differences. Engineers migrating code from MPC860 family should verify the SIU (System Integration Unit) interrupt vector layout matches the MPC875 reference manual.
The 32-bit external memory bus runs at half the core clock (33 MHz) and requires series termination resistors (22-33 ohm) on address and control lines when routing over 50 mm trace lengths. Per NXP design guidelines for the MPC8xx family, keep SDRAM traces matched within 1 cm and isolate clock lines with ground guards. The 66 MHz core clock output to the SDRAM should be routed with 50-ohm characteristic impedance and length-matched to within 50 mil of any accompanying clock pair.
Compliance Information
RoHS Non-Compliant and Contains Lead per distributor listings. Reach, halogen-free, and conflict minerals status not confirmed in verified data; recommend requesting NXP Material Declaration for industrial compliance audits.