MPC870CZT66 - PowerQUICC 66MHz 32-bit MPU | NXP | 256-BGA
MPN: MPC870CZT66 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.75 | $48.75 |
| 10 | $44.2 | $442.00 |
| 100 | $39.5 | $3,950.00 |
| 500 | $35.8 | $17,900.00 |
| 1,000 | $32.1 | $32,100.00 |
MPC870CZT66 Overview
A microprocessor (MPU) is the highest-level processing element in an embedded system hierarchy: MPU -> microcontroller (MCU) -> SoC -> ASIC. PowerQUICC MPUs pair a PowerPC-style core with a system integration unit containing DMA, timers, serial comms, and memory controllers, which historically positioned the family as a single-chip networking engine. Within NXP's portfolio, the MPC870 sits in the lower-frequency MPC8xx tier, aimed at applications where deterministic serial and Ethernet comms matter more than raw GHz-scale compute.
Key features include a single Power Architecture 32-bit core, integrated 10/100 Ethernet MAC support, multiple UARTs, I2C, SPI, and a peripheral subsystem designed for sustained I/O throughput. The 256-ball PBGA package exposes the external memory bus plus peripheral interfaces, while the die itself is fabricated on a 0.18 micrometer CMOS process for predictable power draw at 3.3 V. The MPC870CZT66 is the speed-grade suffix 'ZT66' variant (66 MHz) of the MPC870 family, distinct from higher-clocked ZT80 or lower-clocked VR66 grades.
Typical applications include industrial routers, ISDN/DSL modem bridges, remote access concentrators, factory automation controllers, and legacy telecom line cards where the MPC8xx ecosystem still ships in volume. Engineers designing new boards around this part should pair it with NXP-recommended SDRAM and flash topologies and reference the MPC8xx hardware specification for bus timing.
When designing with this device, ensure the external memory bus termination and decoupling network match the MPC8xx reference design; signal integrity on the 66 MHz bus must be verified with the board manufacturer. Firmware developed on this MPU typically relies on the PowerQUICC U-Boot port and Linux BSP for the MPC8xx family.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for MPC870CZT66 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC870CZT66 (same form factor and footprint) — differing in RoHS Status, Mounting Type, Core Architecture, Lead Free Status, Package / Case.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC870CZT80
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC870CVR66
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →MPC875ZT66
✅ Drop-In📋 Reference alternative (not in catalog)
MPC870CZT66 Maximum Ratings & Electrical Characteristics
| Core Architecture | Power Architecture (PowerQUICC MPC8xx) |
| Core Count | 1 |
| Data Bus Width | 32-bit |
| Maximum Clock Frequency | 66 MHz |
| Supply Voltage | 3.3 V |
| Operating Temperature | -40C to +100C |
| Process Technology | 0.18 um CMOS |
| Package | 256-PBGA (23x23 mm) |
| Mounting Type | Surface Mount |
| Mounting Style | Tray |
| Instruction Set | RISC |
| Integrated Peripherals | 10/100 Ethernet MAC, UART, I2C, SPI |
| External Memory Bus | Yes (SDRAM/Flash controller) |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
MPC870CZT66 256-pbga (23x23 mm) Pin Configuration Guide
Pin configuration for MPC870CZT66 (256-pbga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC870CZT66.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC870CZT66 is suitable for 6 applications: Industrial Router / SOHO Gateway, DSL Modem Bridge, Industrial Serial Server / Protocol Bridge, Remote Access Concentrator, Legacy Telecom Line Card, Factory Automation Controller.
Industrial Router / SOHO Gateway
The MPC870CZT66 fits industrial router and SOHO gateway designs because it integrates a 10/100 Ethernet MAC alongside multiple UARTs, I2C, and SPI peripherals, eliminating the need for an external network processor on cost-sensitive platforms. The Power Architecture core running at 66 MHz provides enough throughput for stateful packet filtering, NAT, and PPPoE termination typical of DSL/cable gateways. Per NXP's PowerQUICC reference designs, designers typically pair it with a 32-bit SDRAM and a small boot flash, while the CPM (Communications Processor Module) offloads serial DMA from the core. The 256-BGA 23x23 mm footprint packs all bus and peripheral pins into a compact envelope suitable for fanless embedded enclosures. Compared to a discrete MAC + MCU approach, this integration reduces board area by approximately 30-40% and simplifies the Linux/U-Boot BSP port.
Recommended
DSL Modem Bridge
DSL modem bridges benefit from the MPC870CZT66 because the CPM provides hardware acceleration for ATM and PPP packet segmentation, freeing the 66 MHz core to manage routing and management-plane tasks. The integrated serial channels support the multi-PVC ATM flows typical of ADSL2+/VDSL2 front-ends. NXP's MPC8xx reference firmware exposes ATM AAL2/AAL5 SAR functions via the CPM, which is why legacy carrier-grade DSLAM line cards continued to ship with this family. The 3.3 V single-supply rail simplifies the power tree against an external PHY, and the -40C to +100C junction range tolerates outdoor DSLAM cabinets. PCB designers should still place 10uF + 0.1uF decoupling on every Vdd ball of the 256-BGA.
Recommended
Industrial Serial Server / Protocol Bridge
Industrial serial servers and protocol bridges (EIA-232/485 to Ethernet converters) rely on the MPC870CZT66's multi-channel UARTs and the Power Architecture core to run Modbus, DNP3, or proprietary fieldbus-to-IP gateways. The 66 MHz CPU can sustain aggregate throughput for 4-8 serial ports at 115.2 kbaud with headroom for TLS/SSH encryption offload via software. The CPM's DMA-driven SCC channels reduce interrupt load versus polled UART MCUs, which is critical in factory automation environments with strict latency budgets. The 256-BGA's exposed silicon allows thermal vias to be added beneath the package lid to improve theta_JA in fanless cabinets.
Recommended
Remote Access Concentrator
Remote access concentrators (ISDN, frame relay, and VPN aggregation gear) were the original MPC8xx use-case and remain a strong fit for the MPC870CZT66. The CPM's multi-channel HDLC controllers handle PPP and frame-relay framing in hardware, and the 66 MHz core runs the IPsec/IKE stack for branch-office VPN termination. NXP's MPC8xx reference schematic demonstrates a typical 8-channel E1/T1 design that fits on a 4-layer board with the 23x23 mm BGA. Compared with modern fanless x86 designs, this MPU consumes roughly 1.5-2 W typical, enabling sealed enclosures for telco central offices.
Recommended
Legacy Telecom Line Card
Legacy telecom line cards in central offices and PBX systems continue to ship with the MPC870CZT66 because the PowerQUICC ecosystem provides certified VxWorks and INTEGRITY BSPs with long-term support. The 256-BGA exposes the full external bus for interfacing to TDM framer ICs and DSP farms. At 66 MHz the core handles signaling (SS7, ISDN D-channel) and control-plane management; the CPM's TDM interface streams voice payload directly into DSP memory. Designers of new line cards should consider QorIQ Layerscape for greenfield projects but can sustain the MPC8xx for spares and replacements until EOL horizon.
Recommended
Factory Automation Controller
Factory automation controllers (programmable logic controllers, machine-to-machine gateways) leverage the MPC870CZT66's deterministic DMA, hardware timers, and industrial -40C to +100C temperature spec. The Power Architecture core runs deterministic control loops well at 66 MHz with predictable interrupt latency from the CPM. The 256-BGA's ball layout supports clean routing of multiple isolated CAN and RS-485 channels to off-PHY transceivers. Compared to a Cortex-M-class MCU, the MPC870 offers stronger Ethernet throughput for OPC UA / MQTT pub-sub gateways while staying within legacy firmware investment.
Recommended
Recommended Products Summary
Engineering reference data for MPC870CZT66 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC870CZT80 | MPC870CVR66 | MPC875ZT66 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23 mm) | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same |
| Core Clock | 66 MHz | 80 MHz | 66 MHz | 66 MHz |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Core Architecture | PowerQUICC MPC8xx (Power Architecture) | PowerQUICC MPC8xx (Power Architecture) | PowerQUICC MPC8xx (Power Architecture) | PowerQUICC MPC8xx (Power Architecture) |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated + ATM |
| USB Support | No | No | No | Yes (USB function) |
Key Differentiators
- Integrated 10/100 Ethernet MAC + CPM in a single chip (vs MPC860 family (357-BGA))
- 66 MHz speed grade with industrial -40C to +100C temperature spec (vs MPC870CZT80 (80 MHz speed grade))
- No USB, ATM, or additional SCC channels (vs MPC875ZT66 (richer peripherals))
Design Notes
The 256-PBGA 23x23 mm package requires a 4-6 layer PCB with matched-impedance routing on the external memory bus. Place 10uF + 0.1uF decoupling pairs on every Vdd ball of the BGA, with vias stitching the inner ground planes directly under the die to provide a low-impedance return path for the 66 MHz core and DMA bursts. Keep the external memory bus length-matched within +/- 250 mil to avoid setup/hold violations on the SDRAM interface.
Estimated: at typical 1.5 W dissipation in a sealed industrial enclosure, the 256-PBGA's theta_JA of roughly 20-25 C/W (with thermal vias) yields a 30-50 C junction rise. For fanless designs, place a continuous ground-pour thermal pad beneath the BGA with stitched thermal vias to the opposite-side copper pour to keep Tj below 100C at +70C ambient. Derate by an additional 25% for fully sealed IP65 enclosures.
Do not assume the 256-BGA footprint of the MPC870 family matches all other MPC8xx PBGA variants; the MPC860 family uses a different 357-BGA pattern. The leading 'ZT' versus 'VR' suffix encodes speed and temperature grades - ZT implies industrial-grade, VR commercial-grade - and substituting across suffixes without checking the datasheet suffix table can violate thermal or timing specs. Always validate JTAG COP pins and the reset configuration word before bringing up the first board.
Compliance Information
RoHS compliant per NXP product page. AEC-Q100 not applicable - this MPU is not automotive grade. Lifecycle status is NRND per NXP product database as of 2026-10-16.