N25Q064A13E12A0F - 64Mb SPI NOR Flash 108MHz | Micron
MPN: N25Q064A13E12A0F β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.9 | $39.00 |
| 100 | $3.45 | $345.00 |
| 500 | $3.1 | $1,550.00 |
| 1,000 | $2.85 | $2,850.00 |
Drop-in alternatives for N25Q064A13E12A0F β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
N25Q064A13E1240E
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
N25Q064A13E12A0E
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
N25Q064A13E440E
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
N25Q064A13E12A0F TR
β Drop-Inπ Reference alternative (not in catalog)
N25Q064A13E12A0F Maximum Ratings & Electrical Characteristics
| Memory Type | Nonvolatile NOR Flash |
| Density | 64 Mbit (8 MB) |
| Interface | SPI (Standard, Dual, Quad I/O) |
| Maximum Clock Frequency | 108 MHz |
| Supply Voltage | 3 V |
| Package | 24-T-PBGA (6x8 mm) |
| Mounting Type | Surface Mount |
| XIP Support | Yes (execute-in-place mode) |
| Program/Erase Suspend | Supported (per datasheet) |
| Write Protection | Hardware and software protection |
| Reel Indicator (F suffix) | Pb-free / RoHS per Micron coding |
| Packaging Option | Tape and Reel (TR) |
N25Q064A13E12A0F 24-t-pbga (6x8 mm) Pin Configuration Guide
Complete pinout information for N25Q064A13E12A0F (24-t-pbga (6x8 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for N25Q064A13E12A0F.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
N25Q064A13E12A0F is suitable for 6 applications: MCU Boot Firmware Storage, FPGA Configuration Memory, Networking and Communications Equipment, Industrial Automation Controllers, Embedded Computing and Single-Board Computers, Automotive-Adjacent and Telematics Modules.
MCU Boot Firmware Storage
The N25Q064A13E12A0F fits MCU boot-code roles because its 108 MHz quad-SPI interface provides the read bandwidth needed to move megabytes of firmware in tens of milliseconds, and its 64 Mbit (8 MB) density covers bootloader plus application plus fallback image slots. In an embedded controller, the MCU copies or executes code from flash at reset using the XIP mode confirmed via the datasheet bit settings. Program/erase suspend lets firmware field-updates run in the background while the application continues reading, avoiding watchdog resets. Decouple VCC with 100 nF plus 10 uF and follow the power-loss rescue sequence so an unplanned brown-out cannot corrupt the boot image.
Recommended
FPGA Configuration Memory
The N25Q064A13E12A0F serves as FPGA bitstream storage because major FPGA toolchains support Micron serial NOR in their configuration flows, and the 108 MHz clock with quad I/O shortens configuration time - an 8 MB-class bitstream loads quickly enough to meet deterministic power-up requirements. The 24-ball T-PBGA (6x8 mm) footprint keeps the configuration memory close to the FPGA without consuming board area needed for the fabric. Designers should confirm the read command opcode and dummy-cycle count expected by the FPGA configuration engine, and reserve a sector for user data beside the bitstream. Write protection prevents accidental bitstream corruption during development rework.
Recommended
Networking and Communications Equipment
Routers, switches, and optical line cards use the N25Q064A13E12A0F to store boot ROM, MAC tables, firmware images, and log data. Its 64 Mbit density accommodates dual firmware images for safe A/B rollback, and 108 MHz quad-SPI reads keep control-plane boot times low for carrier equipment with fast-redundancy requirements. The program/erase suspend feature allows the network CPU to log events to flash while erasing the alternate image slot. Operating from a 3 V rail shared with the line-card logic simplifies the power tree; ensure the SPI bus is isolated from backplane traffic with proper chip-select gating so erase operations do not stall critical code reads.
Recommended
Industrial Automation Controllers
PLC and motor-drive controllers rely on the N25Q064A13E12A0F for deterministic boot and parameter retention: 64 Mbit stores the runtime executive, recipe tables, and diagnostic logs, while XIP mode lets the MCU execute control code directly at 108 MHz to meet loop deadlines. Industrial environments impose voltage dips; the datasheet's power-up/power-down requirements and AC reset specifications define safe windows, and the power-loss rescue sequence protects array integrity if supply collapses mid-write. Add bulk capacitance (47-100 uF) on the 3 V rail to ride through short sags, and use the hardware write-protection pin to lock calibration data against accidental writes during commissioning.
Recommended
Embedded Computing and Single-Board Computers
Single-board computers and SoM modules use the N25Q064A13E12A0F as the primary boot device for the SoC's ROM code, holding the boot loader plus device-tree blobs and a rescue image within the 8 MB array. Quad-SPI at 108 MHz provides enough bandwidth that secondary-stage boot from SPI adds only milliseconds of latency, which matters for products advertising sub-second power-on. The 6x8 mm BGA suits dense module stacking where an SOIC footprint would be impractical. Firmware teams should implement the documented XIP entry sequence in the boot ROM driver and reserve a small factory-data sector with OTP-style software protection for MAC addresses and serial numbers.
Recommended
Automotive-Adjacent and Telematics Modules
Telematics, gateway, and aftermarket vehicle modules need robust nonvolatile code storage that tolerates cranking transients; the N25Q064A13E12A0F's defined power-up/power-down requirements and rescue-sequence behavior give designers a documented failure model for the 9-16 V automotive supply rail after regulation to 3 V. The 64 Mbit array holds modem firmware, calibration data, and OTA update slots - the suspend/resume feature allows OTA downloads to continue while vehicle control code executes. Although this commercial-grade part is not AEC-Q100 qualified, it suits non-safety telematics and aftermarket electronics; validate the operating temperature suffix against the installed environment before release.
Recommended
Recommended Products Summary
Engineering reference data for N25Q064A13E12A0F β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | N25Q064A13E1240E | N25Q064A13E12A0E | N25Q064A13E440E | N25Q064A13E12A0F TR |
|---|---|---|---|---|---|
| Package | 24-T-PBGA (6x8 mm) | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 64 Mbit (8 MB) | 64 Mbit | 64 Mbit | 64 Mbit | 64 Mbit |
| Max Clock Frequency | 108 MHz | 108 MHz | 108 MHz | 108 MHz | 108 MHz |
| Interface | SPI (Standard/Dual/Quad) | SPI (Standard/Dual/Quad) | SPI (Standard/Dual/Quad) | SPI (Standard/Dual/Quad) | SPI (Standard/Dual/Quad) |
| Supply Voltage | 3 V | 3 V | 3 V | 3 V | 3 V |
| Operating Temperature Grade | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | Industrial (extended) | [DATA_NEEDED] |
| Delivery Format | Tray/Reel per suffix | Tray (E) | Tape & Reel (A0) | Tray (E) | Tape & Reel (TR) |
Key Differentiators
- Top-speed 108 MHz quad-SPI read bandwidth (vs N25Q032A13EF4A0F)
- 6x8 mm 24-ball BGA saves board area (vs N25Q064A11ESEA0F)
- Documented power-loss rescue sequence and program/erase suspend (vs Generic commodity SPI flash (e.g., Winbond W25Q64))
Design Notes
Follow the Micron datasheet power-up/power-down requirements: VCC must ramp monotonically to the valid 3 V range before the first command, and CS should be pulled high through a 10-100 kOhm resistor so the device stays deselected during brown-out events. The datasheet defines an AC reset specification and a power-loss rescue sequence; a host-side routine that checks and repairs the volatile status register at boot prevents a mid-erase power cut from leaving the device in an unusable protocol state.
At 108 MHz quad-SPI, treat the flash traces as transmission lines: keep clock-to-data skew under the datasheet setup/hold budget, length-match the four I/O lines within a few millimeters, and series-terminate the clock if trace lengths exceed roughly 50 mm. Avoid routing SPI lines under switching regulators; coupling on the clock line shows up as data corruption only at the top speed grade, which is notoriously hard to debug in the field.
Do not assume the entire 8 MB array erases uniformly - respect sector granularity and program only within erased pages. Suspend an in-progress erase before issuing reads from the array, and resume afterward; skipping this stalls code execution if XIP shares the device with data logging. Finally, since the package is a 24-ball BGA, X-ray or via-in-pad inspection is prudent on first-article builds to catch solder voids invisible visually.
Compliance Information
F suffix in Micron part number coding denotes Pb-free/RoHS package option per manufacturer product data. Formal REACH and conflict-minerals declarations must be requested from Micron or the distributor.
