N25Q064A13E12A0F - 64Mb SPI NOR Flash 108MHz | Micron
料号： N25Q064A13E12A0F ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.9 | $39.00 |
| 100 | $3.45 | $345.00 |
| 500 | $3.1 | $1,550.00 |
| 1,000 | $2.85 | $2,850.00 |
N25Q064A13E12A0F 概述
A serial NOR flash memory is a nonvolatile storage device organized so the CPU can execute or read code directly from individual byte-addressable locations over a serial peripheral interface. Within the memory hierarchy, NOR flash sits between EEPROM and parallel NAND flash, offering random access with fast read latency but lower density and higher cost per bit than NAND. Serial NOR devices connect to a host MCU or FPGA through an SPI bus, making them the de facto standard for boot code storage in embedded systems.
Key features of the N25Q064A family include standard, dual, and quad SPI protocol support, effectively multiplying bandwidth when using 2-bit or 4-bit I/O. The 108 MHz clock rate enables read throughput suitable for XIP (execute-in-place) code shadowing without copying to RAM. The device supports sector and bulk erase operations, hardware and software write protection, and XIP mode activation per the manufacturer datasheet.
Technically, the part is organized as 64 Mbit accessed over a 3.0 V supply range, with the A13 speed/temperature suffix indicating the commercial operating envelope. Programmable sector protection and suspend/resume of program-erase operations allow background updates without stalling code reads, which matters in systems where flash is shared between boot code and data logging.
Typical applications include MCU boot firmware storage in industrial automation, FPGA configuration memory in networking and communications equipment, and code storage in embedded computing and consumer platforms where board space and pin count favor serial interfaces.
Design considerations: respect power-up sequencing requirements and the power-loss rescue sequence described in the manufacturer datasheet, and follow recommended decoupling to avoid brown-out corruption during erase operations.
This page adds value beyond the datasheet by synthesizing distributor availability data, same-family drop-in alternatives, pricing context, and practical design notes for engineering and procurement teams.
直接替换替代料： N25Q064A13E12A0F ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： N25Q064A13E12A0F （相同外形与封装尺寸） ——差异在于 Package, Supply Voltage, Memory Type, Interface, Organization.
快速对比工具——选择替代料号进行并排对比：
N25Q064A13E1240E
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
N25Q064A13E12A0E
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
N25Q064A13E440E
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
N25Q064A13E12A0F TR
✅ 直接替换📋 参考替代料（不在目录中）
N25Q064A13E12A0F 最大额定值与电气特性
| 存储器类型 | Nonvolatile NOR Flash |
| Density | 64 Mbit (8 MB) |
| 接口 | SPI (Standard, Dual, Quad I/O) |
| 最大时钟频率 | 108 MHz |
| 电源电压 | 3 V |
| 封装 | 24-T-PBGA (6x8 mm) |
| 安装类型 | Surface Mount |
| XIP Support | Yes (execute-in-place mode) |
| Program/Erase Suspend | Supported (per datasheet) |
| Write Protection | Hardware and software protection |
| Reel Indicator (F suffix) | Pb-free / RoHS per Micron coding |
| Packaging Option | Tape and Reel (TR) |
N25Q064A13E12A0F 24-t-pbga (6x8 mm) 引脚配置指南
N25Q064A13E12A0F（24-t-pbga (6x8 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： N25Q064A13E12A0F.
请参阅 数据手册 以查看完整引脚配置。
典型应用
N25Q064A13E12A0F 适用于 6 应用s: MCU Boot Firmware Storage, FPGA Configuration Memory, Networking and Communications Equipment, Industrial Automation Controllers, Embedded Computing and Single-Board Computers, Automotive-Adjacent and Telematics Modules.
MCU Boot Firmware Storage
The N25Q064A13E12A0F fits MCU boot-code roles because its 108 MHz quad-SPI interface provides the read bandwidth needed to move megabytes of firmware in tens of milliseconds, and its 64 Mbit (8 MB) density covers bootloader plus application plus fallback image slots. In an embedded controller, the MCU copies or executes code from flash at reset using the XIP mode confirmed via the datasheet bit settings. Program/erase suspend lets firmware field-updates run in the background while the application continues reading, avoiding watchdog resets. Decouple VCC with 100 nF plus 10 uF and follow the power-loss rescue sequence so an unplanned brown-out cannot corrupt the boot image.
推荐
FPGA Configuration Memory
The N25Q064A13E12A0F serves as FPGA bitstream storage because major FPGA toolchains support Micron serial NOR in their configuration flows, and the 108 MHz clock with quad I/O shortens configuration time - an 8 MB-class bitstream loads quickly enough to meet deterministic power-up requirements. The 24-ball T-PBGA (6x8 mm) footprint keeps the configuration memory close to the FPGA without consuming board area needed for the fabric. Designers should confirm the read command opcode and dummy-cycle count expected by the FPGA configuration engine, and reserve a sector for user data beside the bitstream. Write protection prevents accidental bitstream corruption during development rework.
推荐
Networking and Communications Equipment
Routers, switches, and optical line cards use the N25Q064A13E12A0F to store boot ROM, MAC tables, firmware images, and log data. Its 64 Mbit density accommodates dual firmware images for safe A/B rollback, and 108 MHz quad-SPI reads keep control-plane boot times low for carrier equipment with fast-redundancy requirements. The program/erase suspend feature allows the network CPU to log events to flash while erasing the alternate image slot. Operating from a 3 V rail shared with the line-card logic simplifies the power tree; ensure the SPI bus is isolated from backplane traffic with proper chip-select gating so erase operations do not stall critical code reads.
推荐
Industrial Automation Controllers
PLC and motor-drive controllers rely on the N25Q064A13E12A0F for deterministic boot and parameter retention: 64 Mbit stores the runtime executive, recipe tables, and diagnostic logs, while XIP mode lets the MCU execute control code directly at 108 MHz to meet loop deadlines. Industrial environments impose voltage dips; the datasheet's power-up/power-down requirements and AC reset specifications define safe windows, and the power-loss rescue sequence protects array integrity if supply collapses mid-write. Add bulk capacitance (47-100 uF) on the 3 V rail to ride through short sags, and use the hardware write-protection pin to lock calibration data against accidental writes during commissioning.
推荐
Embedded Computing and Single-Board Computers
Single-board computers and SoM modules use the N25Q064A13E12A0F as the primary boot device for the SoC's ROM code, holding the boot loader plus device-tree blobs and a rescue image within the 8 MB array. Quad-SPI at 108 MHz provides enough bandwidth that secondary-stage boot from SPI adds only milliseconds of latency, which matters for products advertising sub-second power-on. The 6x8 mm BGA suits dense module stacking where an SOIC footprint would be impractical. Firmware teams should implement the documented XIP entry sequence in the boot ROM driver and reserve a small factory-data sector with OTP-style software protection for MAC addresses and serial numbers.
推荐
Automotive-Adjacent and Telematics Modules
Telematics, gateway, and aftermarket vehicle modules need robust nonvolatile code storage that tolerates cranking transients; the N25Q064A13E12A0F's defined power-up/power-down requirements and rescue-sequence behavior give designers a documented failure model for the 9-16 V automotive supply rail after regulation to 3 V. The 64 Mbit array holds modem firmware, calibration data, and OTA update slots - the suspend/resume feature allows OTA downloads to continue while vehicle control code executes. Although this commercial-grade part is not AEC-Q100 qualified, it suits non-safety telematics and aftermarket electronics; validate the operating temperature suffix against the installed environment before release.
推荐
推荐产品汇总
工程参考数据： N25Q064A13E12A0F ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | N25Q064A13E1240E | N25Q064A13E12A0E | N25Q064A13E440E | N25Q064A13E12A0F TR |
|---|---|---|---|---|---|
| Package | 24-T-PBGA (6x8 mm) | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same | 24-T-PBGA (6x8 mm) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 64 Mbit (8 MB) | 64 Mbit | 64 Mbit | 64 Mbit | 64 Mbit |
| Max Clock Frequency | 108 MHz | 108 MHz | 108 MHz | 108 MHz | 108 MHz |
| Interface | SPI (Standard/Dual/Quad) | SPI (Standard/Dual/Quad) | SPI (Standard/Dual/Quad) | SPI (Standard/Dual/Quad) | SPI (Standard/Dual/Quad) |
| Supply Voltage | 3 V | 3 V | 3 V | 3 V | 3 V |
| Delivery Format | Tray/Reel per suffix | Tray (E) | Tape & Reel (A0) | Tray (E) | Tape & Reel (TR) |
关键差异点
- Top-speed 108 MHz quad-SPI read bandwidth （对比 N25Q032A13EF4A0F)
- 6x8 mm 24-ball BGA saves board area （对比 N25Q064A11ESEA0F)
- Documented power-loss rescue sequence and program/erase suspend （对比 Generic commodity SPI flash (e.g., Winbond W25Q64))
设计说明
Follow the Micron datasheet power-up/power-down requirements: VCC must ramp monotonically to the valid 3 V range before the first command, and CS should be pulled high through a 10-100 kOhm resistor so the device stays deselected during brown-out events. The datasheet defines an AC reset specification and a power-loss rescue sequence; a host-side routine that checks and repairs the volatile status register at boot prevents a mid-erase power cut from leaving the device in an unusable protocol state.
At 108 MHz quad-SPI, treat the flash traces as transmission lines: keep clock-to-data skew under the datasheet setup/hold budget, length-match the four I/O lines within a few millimeters, and series-terminate the clock if trace lengths exceed roughly 50 mm. Avoid routing SPI lines under switching regulators; coupling on the clock line shows up as data corruption only at the top speed grade, which is notoriously hard to debug in the field.
Do not assume the entire 8 MB array erases uniformly - respect sector granularity and program only within erased pages. Suspend an in-progress erase before issuing reads from the array, and resume afterward; skipping this stalls code execution if XIP shares the device with data logging. Finally, since the package is a 24-ball BGA, X-ray or via-in-pad inspection is prudent on first-article builds to catch solder voids invisible visually.
合规信息
F suffix in Micron part number coding denotes Pb-free/RoHS package option per manufacturer product data. Formal REACH and conflict-minerals declarations must be requested from Micron or the distributor.