P1010NXN5DFA557 - QorIQ P1010 1.0GHz Power Arch SoC, 425-TEPBGA | NXP
MPN: P1010NXN5DFA557 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $34.94 | $34.94 |
| 10 | $31.45 | $314.50 |
| 100 | $27.95 | $2,795.00 |
| 500 | $24.5 | $12,250.00 |
| 1,000 | $21.8 | $21,800.00 |
P1010NXN5DFA557 Overview
A QorIQ communications processor is a multi-protocol SoC tailored for power- and cost-sensitive networking equipment such as industrial control, factory automation, smart-grid gateways, and entry-level networking appliances. It occupies a tier in the system hierarchy between general-purpose microcontrollers (which lack GbE/PCIe/SE security acceleration) and high-end multicore communications processors (such as the P2041 or T4240), delivering a balance of peripheral integration, deterministic performance, and security offload for embedded networking.
Key features include a single e500v2 32-bit core with double-precision FPU, dual 10/100/1000 Mb/s Ethernet controllers with L2 switching, dual SATA Gen 2/3 ports, dual PCIe Gen 2 controllers, a 32/64-bit DDR3 SDRAM controller with ECC, integrated SEC 4.x cryptographic acceleration, Trusted Boot hardware root-of-trust, USB 2.0, UART, SPI, I2C, GPIO, and 4-channel DMA. The Trusted Boot variant adds secure silicon fuses, secure boot ROM, and runtime integrity checking.
Architecturally, the P1010 family replaces the earlier PowerQUICC II Pro family with deeper pipeline and lower power per MHz. The 45 nm process enables 1.0 GHz operation while keeping typical SoC power in the 3-5 W envelope, allowing fanless thermal designs. The integrated SEC engine offloads AES, 3DES, SHA, RSA, and ECC from the core, and the Trusted Boot block validates signed firmware before releasing the core from reset.
Typical applications include industrial Ethernet switches, IEC 61850 substation gateways, factory-floor protocol converters, smart-grid concentrators, edge routers, and embedded NAS/SAN appliances. The combination of GbE + SATA + PCIe + DDR3 + SEC makes it a one-chip solution for many line-rate networking designs.
When designing with the P1010NXN5DFA557, ensure the PCB footprint and 19x19 mm BGA land pattern are correct, validate DDR3 IBIS-AMI simulation with the chosen DRAM data sheet, and follow NXP's hardware design guide for SERDES reference clock jitter. Heat dissipation at 1.0 GHz continuous load typically requires a small thermal pad or copper spreader.
This page synthesizes distributor stock, datasheet parameters, drop-in family alternatives, and design guidance not found in a single manufacturer document.
Drop-in alternatives for P1010NXN5DFA557 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1010NXN5DFA557 (same form factor and footprint) — differing in Core Architecture, Package, RoHS Status, Security Engine, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1010NXN5DFA
✅ Drop-In✓ In Stock
$22.5 / Unit
View Datasheet →P1010NXN2DFA
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NXN5DFA
✅ Drop-In📋 Reference alternative (not in catalog)
P1014NXN5DFA
✅ Drop-In✓ In Stock
$22.1 / Unit
View Datasheet →P1010NSN5DFA
✅ Drop-In📋 Reference alternative (not in catalog)
P1010NXN5DFA557 Maximum Ratings & Electrical Characteristics
| Core Architecture | Power Architecture e500v2 |
| Number of Cores | 1 |
| Data Width | 32-bit |
| Maximum Core Frequency | 1.0 GHz |
| Process Technology | 45 nm |
| Instruction Set | Power ISA v2.06 |
| Floating Point Unit | Double-precision hardware FPU |
| DDR Memory Controller | 32/64-bit DDR3 with ECC |
| Ethernet | 2x 10/100/1000 Mb/s MAC with L2 switching |
| SATA | 2x SATA Gen 2/3 |
| PCIe | 2x PCIe Gen 2 controllers |
| USB | 1x USB 2.0 |
| Security Engine | SEC 4.x (AES, 3DES, SHA, RSA, ECC) |
| Trusted Boot | Yes (per '557' suffix) |
| Operating Temperature | -40C to +105C |
| Package | 425-TEPBGA I (19x19 mm) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
P1010NXN5DFA557 425-tepbga i (19x19 mm) Pin Configuration Guide
Pin configuration for P1010NXN5DFA557 (425-tepbga i (19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1010NXN5DFA557.
Refer to the datasheet for full pin configuration.
Typical Applications
P1010NXN5DFA557 is suitable for 7 applications: Industrial Ethernet Switch / Substation Gateway, Edge Router / Industrial IoT Gateway, Embedded NAS / SAN Appliance Controller, Factory-Floor Protocol Converter, Smart-Grid Concentrator / Metering Hub, Automotive Telematics / Industrial Vehicle Gateway, Network-Attached Printer / MFP Controller.
Industrial Ethernet Switch / Substation Gateway
The P1010NXN5DFA557 fits industrial Ethernet switches and IEC 61850 substation gateways because it integrates dual GbE MACs with L2 switching, a 32/64-bit DDR3 controller with ECC, and hardware SEC 4.x crypto in a single BGA - removing the need for an external security coprocessor. At 1.0 GHz the e500v2 core sustains line-rate GOOSE message processing while the SEC engine encrypts SCADA traffic with AES-256 at multi-Gbps. The Trusted Boot option validates signed firmware before releasing the core, which is essential for substation cyber-security compliance (IEC 62443).
Recommended
Edge Router / Industrial IoT Gateway
For edge routers and IIoT gateways, the P1010NXN5DFA557 delivers the peripheral mix needed at the network edge: two GbE MACs for WAN/LAN, two SATA ports for local logging, two PCIe Gen 2 lanes for Wi-Fi/4G modems, and a USB 2.0 port for diagnostics. The 1.0 GHz e500v2 core runs a full Linux networking stack (VyOS, OpenWrt-class) with deterministic latency, while the -40C to +105C rating tolerates outdoor cabinet temperatures. Trusted Boot secures firmware against physical-tamper attacks common in field-deployed IIoT hardware.
Recommended
Embedded NAS / SAN Appliance Controller
The P1010NXN5DFA557 is a strong fit for low-power embedded NAS controllers because the dual SATA Gen 2/3 ports support two 3.5-inch HDDs or SSDs directly, while the GbE MACs aggregate LAN traffic and the DDR3 controller holds the filesystem cache. The SEC engine accelerates AES-NI-class SMB/Kerberos crypto, sustaining gigabit-class encrypted file transfer. At 3-5 W typical SoC power, the part enables fanless NAS chassis designs - a key differentiator versus x86-based alternatives.
Recommended
Factory-Floor Protocol Converter
The P1010NXN5DFA557 integrates exactly the interfaces factory-floor protocol converters need: dual GbE for Ethernet/IP or PROFINET, PCIe for fieldbus cards (EtherCAT, DeviceNet), USB for local HMI touchscreens, and GPIO/UART/SPI/I2C for legacy RS-485 and sensor interfaces. The 1.0 GHz e500v2 core runs deterministic real-time Linux (PREEMPT_RT or Xenomai) with cycle-jitter under 50 microseconds, while Trusted Boot verifies signed protocol-conversion firmware. This combination replaces multiple discrete MCUs with a single SoC.
Recommended
Smart-Grid Concentrator / Metering Hub
For smart-grid concentrators and AMI metering hubs, the P1010NXN5DFA557 provides the AES/RSA/ECC acceleration needed to authenticate and decrypt DLMS/COSEM or IEEE 2030.5 messages at scale, while the DDR3 with ECC protects meter data against bit-flips. The industrial -40C to +105C rating survives outdoor meter-cabinet conditions, and Trusted Boot meets the security baseline required by utility procurement. Dual GbE enables redundant uplink to head-end systems, and the PCIe lane accepts a 4G/5G modem for cellular backhaul.
Recommended
Automotive Telematics / Industrial Vehicle Gateway
The P1010NXN5DFA557 supports automotive telematics and industrial-vehicle gateway designs that need the -40C to +105C automotive-grade temperature range, hardware AES/SHA for secure OTA firmware updates, and the GbE + PCIe + USB mix for camera/LiDAR aggregation. While not AEC-Q100 qualified, the part is widely deployed in commercial-vehicle and heavy-equipment telematics where industrial temp and Trusted Boot satisfy the security and reliability requirements. The 425-TEPBGA supports rugged PCB stack-ups with underfilled BGA for vibration tolerance.
Recommended
Network-Attached Printer / MFP Controller
Network-attached printers and MFP controllers benefit from the P1010NXN5DFA557's combination of USB 2.0 for device ports, GbE for the network uplink, SATA for the print-job spool disk, and the DDR3 controller for image-data buffers. The SEC engine encrypts the print-job queue at rest, and Trusted Boot ensures only signed firmware can boot - addressing the rising regulatory pressure on print-device security (Common Criteria, BSI). The 1.0 GHz core sustains high-resolution rasterization pipelines for office-class print engines.
Recommended
Recommended Products Summary
Engineering reference data for P1010NXN5DFA557 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1010NXN5DFA | P1010NXN2DFA | P1020NXN5DFA | P1014NXN5DFA | P1010NSN5DFA |
|---|---|---|---|---|---|---|
| Package | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19 mm) - same | 425-TEPBGA I (19x19 mm) - same | 425-TEPBGA I (19x19 mm) - same | 425-TEPBGA I (19x19 mm) - same | 425-TEPBGA I (19x19 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 1.0 GHz | 1.0 GHz (same) | 533 MHz (-47%) | 1.0 GHz (same) | 1.0 GHz (same) | 1.0 GHz (same) |
| Number of Cores | 1 | 1 (same) | 1 (same) | 2 (+100%) | 1 (same) | 1 (same) |
| Trusted Boot | Yes | No | No | No | No | Yes (same) |
| Operating Temperature | -40C to +105C | -40C to +105C (same) | -40C to +105C (same) | -40C to +105C (same) | -40C to +105C (same) | 0C to +105C (commercial) |
| Ethernet | 2x GbE | 2x GbE (same) | 2x GbE (same) | 2x GbE (same) | Reduced peripheral set | 2x GbE (same) |
| Unit Price (qty 1, USD) | 34.94 | Lower (no Trusted Boot) | Lower (533 MHz) | Higher (dual-core) | Comparable | Comparable |
Key Differentiators
- Trusted Boot hardware root-of-trust integrated (vs P1010NXN5DFA)
- 1.0 GHz e500v2 single-core throughput (vs P1010NXN2DFA)
- Single-core deterministic execution for real-time Linux (vs P1020NXN5DFA)
- Full industrial -40C to +105C temperature range (vs P1010NSN5DFA)
Design Notes
The 425-TEPBGA I package has 0.8 mm ball pitch and a 19x19 mm body. Use an HDI PCB stack-up with laser-drilled microvias and a 1:1 trace-to-pad fanout on the top layer. Match the impedance-controlled stack-up to the DDR3, SATA, PCIe, and GbE interfaces per the NXP QorIQ P1010 Hardware Design Guide, and validate SERDES reference-clock jitter against the IBIS-AMI model before layout freeze.
Estimated: at 1.0 GHz continuous core load with both SATA ports active and dual GbE at line rate, the P1010NXN5DFA557 dissipates approximately 4-5 W. Using the package theta_JA from the NXP datasheet (typically 18-22 C/W for the 425-TEPBGA with a 4-layer JEDEC test board), this yields a junction-to-ambient temperature rise of about 80-100 C above ambient. A thermal pad, copper spreader, or small heatsink is recommended for closed-chassis designs without airflow. Always verify thermal margin under worst-case industrial +105C ambient.
Do not substitute the P1010NXN5DFA557 with the P1010NXN5DFA (without '557') in designs that depend on Trusted Boot - the secure-boot fuses and ROM will not bind and the system will fail secure-boot validation. Do not assume the P1020NXN5DFA is software-compatible; it requires SMP Linux kernel and dual-core scheduler support. Always validate DDR3 IBIS-AMI simulation with the chosen DRAM data sheet, and follow the NXP hardware design guide for SERDES reference-clock jitter.
The P1010NXN5DFA557 requires a multi-rail power supply (typically 1.0 V core, 1.5 V DDR3, 1.8 V / 2.5 V / 3.3 V I/O) with strict sequencing. Use the NXP-recommended PMIC and follow the power-up sequence specified in the datasheet; reverse sequencing can latch-up the BGA. Decouple each voltage rail with bulk + ceramic capacitors placed as close as physically possible to the package balls. Power-rail noise above 50 mVpp on the core rail can cause DDR3 link-training failures and GbE PHY link drops.
Compliance Information
RoHS compliant per NXP product page and distributor listings. Industrial -40C to +105C temperature grade but not AEC-Q100 qualified - for AEC-Q100 automotive designs, use a different processor family.
