P1014NSN5HFB557 - QorIQ P1 32-Bit Power Arch SoC, 800MHz | NXP
MPN: P1014NSN5HFB557 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.1 | $821.00 |
| 50 | $76 | $3,800.00 |
| 100 | $71.2 | $7,120.00 |
| 250 | $65.4 | $16,350.00 |
P1014NSN5HFB557 Overview
The QorIQ platform is a series of Power Architecture-based SoCs from NXP (formerly Freescale) targeting networking infrastructure and embedded systems. The P1 series sits at the entry-level tier of the QorIQ lineup, balancing modest performance with low power draw and rich peripheral integration. Understanding this taxonomy helps position the P1014 within the broader semiconductor hierarchy: Power Architecture SoC -> embedded microprocessor -> SoC -> semiconductor device.
Key features include an integrated PowerPC e500v2 core with 32 KB L1 instruction and 32 KB L1 data caches, hardware-based encryption acceleration (SEC), DDR3 memory controller with ECC support, and a flexible peripheral set covering USB 2.0, SATA 2.0, dual Gigabit Ethernet with packet acceleration, and PCI Express Gen 2.0. The 425-TEPBGA package exposes all high-speed serial and parallel interfaces for full SoC utilization in fanless networking gear.
Architecturally, the P1014 leverages Freescale/NXP's proven Power Architecture e500v2 with dual-issue superscalar in-order execution. The on-chip SEC engine accelerates DES, 3DES, AES, and SHA-1/256 algorithms offloading IPsec and TLS tasks from the CPU, while packet acceleration engines handle header parsing and checksum computation. The integrated DDR3 controller with ECC supports up to 4 GB of addressable memory for routing tables and bulk data buffers.
Typical applications include wireless LAN access points, SOHO/SMB routers and gateways, networked industrial controllers, networked printing and imaging devices, and entry-level unified threat management appliances. The 0 to 105 °C junction temperature range makes the P1014 suitable for sealed enclosures without forced-air cooling in office and light-industrial environments.
When designing with the P1014, ensure the PCB is laid out as a 12-layer (or more) stack-up to maintain DDR3 signal integrity, and provide a 25 MHz reference clock with low-jitter characteristics. Power sequencing of the core, SerDes, and I/O rails must follow the reference manual sequence to avoid latch-up during startup.
This page synthesizes distributor availability, package and pinout details, drop-in compatible variants in the P1014 family, and practical design guidance distilled from NXP's reference documentation and the active distributor ecosystem.
Drop-in alternatives for P1014NSN5HFB557 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1014NSN5HFB557 (same form factor and footprint) — differing in Memory Controller, Mounting Type, Core Architecture, Ethernet, Manufacturer.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1014NSN5HFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1014NSN5HHB
✅ Drop-In✓ In Stock
$31.95 / Unit
View Datasheet →P1014NSN5FFB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
P1010NSN5HFB
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$47.8 / Unit
View Datasheet →P1014NSN5HFB557 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Part Number | P1014NSN5HFB557 |
| Family | QorIQ P1 |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 1 |
| Data Bus Width | 32-bit |
| Maximum Core Frequency | 800 MHz |
| Package Type | 425-TEPBGA I (19x19 mm) |
| Operating Temperature Range | 0 °C to 105 °C |
| Memory Controller | DDR3 with ECC |
| Peripherals | USB 2.0, SATA 2.0, 2x Gigabit Ethernet, PCIe Gen 2.0 |
| Hardware Encryption | SEC (DES, 3DES, AES, SHA-1/256) |
| L1 Cache (I/D) | 32 KB / 32 KB |
| Mounting Type | Surface Mount |
P1014NSN5HFB557 425-tepbga i (19x19 mm) Pin Configuration Guide
Pin configuration for P1014NSN5HFB557 (425-tepbga i (19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1014NSN5HFB557.
Refer to the datasheet for full pin configuration.
Typical Applications
P1014NSN5HFB557 is suitable for 6 applications: Wireless LAN Access Point, SOHO/SMB Router, Networked Print and Imaging Server, Industrial Gateway / IoT Edge, Entry-level Unified Threat Management Appliance, Network-Attached Storage (NAS) Controller.
Wireless LAN Access Point
The P1014NSN5HFB557 fits wireless LAN access points because of its integrated dual Gigabit Ethernet MACs and PCIe Gen 2.0 root complex that can host common 802.11ac/ax WLAN SoCs as PCIe endpoints. The 800 MHz e500v2 core runs the AP control plane, 802.1X/EAP auth, and management agent, while the on-chip SEC engine handles WPA2/3-Enterprise encryption and SSL provisioning without CPU offload. Power consumption stays within the 0 to 105 °C commercial envelope, enabling sealed-indoor AP enclosures with convection cooling.
Recommended
SOHO/SMB Router
The P1014NSN5HFB557 is positioned by NXP/Freescale's product brief as the SoC target for SOHO/SMB router products, with the integrated GbE MACs, DDR3 controller, and PCI Express supplying every external interface a router needs. The e500v2 core at 800 MHz sustains NAT, firewall, and IPv6 routing for small-office WAN aggregates. Hardware IPsec via the SEC accelerator sustains typical SMB branch-office VPN throughput (tens of Mbps per tunnel) without saturating the CPU.
Recommended
Networked Print and Imaging Server
The P1014NSN5HFB557 supports networked print and imaging servers by combining the 800 MHz Power Architecture core for print-image rendering/PDL interpretation with USB 2.0 for local peripherals and GbE for WAN/LAN attachment. The DDR3 controller scales up to 4 GB of addressable memory for bitmap caching, while the SEC engine protects document queues with SSL/TLS for network pull-print workflows. Operating junction temperature 0 to 105 °C is well-suited to office imaging equipment enclosures.
Recommended
Industrial Gateway / IoT Edge
The P1014NSN5HFB557 serves industrial gateway and IoT edge use cases that need deterministic networking plus protocol conversion. The dual GbE MACs segregate field-bus traffic from upstream WAN traffic, PCIe attaches a wireless or cellular module, and the e500v2 core runs Node-RED-style flow software or lightweight OPC UA aggregation. The SEC block provides at-the-edge credential storage and TLS for cloud onboarding with no extra microcontroller required.
Recommended
Entry-level Unified Threat Management Appliance
The P1014NSN5HFB557 drives entry-level unified threat management appliances by combining the SEC block's IPsec/SSL acceleration with the GbE MACs, enabling routing plus firewall plus VPN plus content filtering in a fanless SOHO form factor. The DDR3 controller holds state tables, signatures, and connection tracking buffers, while SATA attaches a local logging drive. The 0 to 105 °C commercial temperature grade targets office and small-cabinet UTM chassis designs.
Recommended
Network-Attached Storage (NAS) Controller
The P1014NSN5HFB557 works as a low-power NAS controller in two-bay residential and SOHO backup devices. SATA 2.0 ports attach 3.5-inch HDDs, the DDR3 controller holds ZFS metadata caches, and the USB 2.0 supplies front-panel or external backup connectivity. Hardware AES from the SEC block encrypts volumes with negligible throughput loss, while the 800 MHz core sustains gigabit-line-rate SMB/NFS protocols for two simultaneous clients.
Recommended
Recommended Products Summary
Engineering reference data for P1014NSN5HFB557 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1014NSN5HFB | P1014NSN5HHB | P1014NSN5FFB | P1010NSN5HFB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors (Freescale legacy) | NXP Semiconductors | Freescale Semiconductor (legacy stock) | NXP Semiconductors | NXP Semiconductors |
| Package | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19 mm) - same | 425-TEPBGA I (19x19 mm) - same | 425-TEPBGA I (19x19 mm) - same | 425-TEPBGA I (19x19 mm) - same |
| Core | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| Core Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 533 MHz |
| Memory Controller | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC |
| Ethernet MACs | 2x 1 GbE | 2x 1 GbE | 2x 1 GbE | 2x 1 GbE | 2x 1 GbE |
| Hardware Encryption | SEC (DES/3DES/AES/SHA) | SEC (DES/3DES/AES/SHA) | SEC (DES/3DES/AES/SHA) | SEC (DES/3DES/AES/SHA) | SEC (DES/3DES/AES/SHA) |
| Operating Temperature | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C |
Key Differentiators
- Identical silicon with broader catalog availability (vs P1014NSN5HFB)
- Freescale legacy stock for older designs (vs P1014NSN5HHB)
- Lower-cost lower-frequency sibling for cost-sensitive designs (vs P1010NSN5HFB)
Design Notes
The P1014NSN5HFB557 425-TEPBGA 19x19 mm package requires a high-density 12-layer (or greater) PCB stack-up to maintain DDR3 and SerDes signal integrity. Matched-impedance 50 ohm single-ended and 100 ohm differential traces must be routed with reference to a solid ground plane, with BGA escape vias drilled via laser or mechanical 6-mil process to break out the 1.0 mm pitch ball pattern under the package body.
Provide sequenced core, SerDes, and I/O rails per the P1014 reference manual to prevent latch-up during chip startup. The 800 MHz e500v2 core typical power is on the order of 3 W to 5 W depending on workload; pair the core regulator with sufficient bulk decoupling (220 uF) plus 10 uF and 100 nF ceramic local to each rail to suppress transient droop during AES acceleration bursts.
Place the 25 MHz reference oscillator within 25 mm of the P1014's clock input pins, surrounded by a guard ring stitched with ground vias, and route the differential output with controlled 50 ohm impedance. Adjacent high-frequency switching supplies should be isolated by Faraday caging; co-located RF traces (Wi-Fi modems via PCIe) need their own RF keepout regions to avoid coupling into the clock path.
Do not omit the e500v2 boot sequencer configuration resistors - the P1014 samples the cfg pins at POR to select boot ROM boot vs. NAND flash boot vs. SD/QSPI boot, and a wrong sample causes no-console hang at first power-up. Configure ECC on the DDR3 controller in software to get the reliability the e500v2 platform was designed to deliver; running non-ECC DDR3 on a 32-bit data bus risks silent single-bit corruption in routing tables.
Compliance Information
Lead-free solder balls are standard for the 425-TEPBGA package per the NXP product brief. RoHS, REACH, halogen-free status, and exact AEC-Q100 applicability were not explicitly stated in the verified web snippets and should be confirmed against the full NXP datasheet or by contacting NXP under NDA.
