P1022NSE2LHB - QorIQ P1 2-Core 1.067GHz Power Arch SoC | NXP
MPN: P1022NSE2LHB ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95.5 | $95.50 |
| 10 | $87.25 | $872.50 |
| 100 | $74.8 | $7,480.00 |
| 500 | $64.4 | $32,200.00 |
| 1,000 | $56.75 | $56,750.00 |
P1022NSE2LHB Overview
A QorIQ communications processor is a multicore Power Architecture SoC built for embedded networking and industrial control, sitting in NXP's product hierarchy between the lower-power QorIQ P1 single/dual-core parts and the higher-end P2/P3/P4 multicore platforms. These devices integrate CPU cores, memory controllers, Ethernet MACs, security engines, and various high-speed serial interfaces into a single package, reducing board area and BOM cost for routers, gateways, and industrial controllers compared with discrete CPU-plus-chipset designs.
Key features include dual 32-bit e500v2 cores with integrated L1/L2 caches, hardware-accelerated SEC (security engine) for encryption and IPSec, three Gigabit Ethernet interfaces with IEEE 1588 support, three PCI Express controllers, two USB 2.0 controllers (host + device), an LCD controller for HMI panels, and a 32-bit DDR2/DDR3 memory controller with ECC. The "NSE" suffix indicates the standard 0C to 105C commercial temperature grade; the "2" in the suffix denotes silicon revision 2.
Architecturally, the P1022 uses a coherent SMP fabric between the two cores, supports hardware virtualization through the embedded hypervisor extensions, and integrates a SerDes block that multiplexes PCIe, SGMII, and SATA lanes. Process technology is 45 nm CMOS, contributing to the 3.5 W to 5 W typical power envelope at full load. The integrated SEC engine accelerates AES, DES, 3DES, SHA, MD5, and Kasumi at line rate, eliminating the need for an external crypto coprocessor on most designs.
Typical applications include industrial routers and gateways, factory-automation controllers, networked HMI panels with the integrated LCD controller, secure VPN concentrators leveraging SEC, networked printers and multifunction devices, and small-form-factor NAS/SAN appliances. Engineers commonly pair the P1022 with NXP power management ICs, a DDR3 memory down configuration, and a Vitesse/Marvell Ethernet PHY for SGMII links.
When designing with this part, allocate careful attention to PCB layout for the 689-ball BGA: trace length matching on DDR3, SerDes, and PCIe lanes is critical, and a minimum 8-layer stackup with continuous ground planes is recommended. The 0C to 105C operating range and 3.5-5 W dissipation generally permit a moderate copper heatsink or thermal pad, but sealed enclosures should be thermally validated. For new designs, engineers should evaluate the recommended replacement per NXP's PCN/end-of-life notice, as the P1022 family has been superseded by Layerscape LS1021A and LS1028A platforms with equivalent software compatibility.
This page synthesizes distributor pricing, BGA pinout, same-family drop-in alternatives, and practical layout guidance not consolidated in the original manufacturer datasheet.
Drop-in alternatives for P1022NSE2LHB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1022NSE2LHB (same form factor and footprint) — differing in Memory Controller, Security Engine, USB, Core Count, Ethernet MACs.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1022NXN2LFB
✅ Drop-In✓ In Stock
$78.4 / Unit
View Datasheet →P1013NSN2LFB
✅ Drop-In✓ In Stock
$53.2 / Unit
View Datasheet →P1022NSE2LHB-R
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
P1010NSN2LFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1024NSE2LHB
✅ Drop-In📋 Reference alternative (not in catalog)
P1022NSE2LHB Maximum Ratings & Electrical Characteristics
| Family | QorIQ P1 |
| CPU Core | Power Architecture e500v2 (32-bit) |
| Number of Cores | 2 |
| Maximum Core Frequency | 1.067 GHz |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| L2 Cache | 256 KB (shared) |
| Memory Controller | 32-bit DDR2/DDR3 with ECC |
| Gigabit Ethernet | 3x 10/100/1000 MAC (eTSEC) |
| PCI Express | 3x PCIe 2.0 controllers |
| USB | 2x USB 2.0 (host + device) |
| Security Engine | SEC (AES, DES, SHA, MD5, Kasumi) |
| Display | Integrated LCD controller |
| Package | 689-TEPBGA II (31x31 mm) |
| Operating Temperature | 0C to 105C |
| Silicon Revision | Rev 2 (suffix "2") |
| Process Technology | 45 nm CMOS |
P1022NSE2LHB 689-tepbga ii (31x31 mm) Pin Configuration Guide
Pin configuration for P1022NSE2LHB (689-tepbga ii (31x31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1022NSE2LHB.
Refer to the datasheet for full pin configuration.
Typical Applications
P1022NSE2LHB is suitable for 7 applications: Industrial Router and Gateway, Networked HMI and Operator Panel, Secure VPN Concentrator, Factory Automation Controller, Networked Multifunction Printer / MFP, Small-Form-Factor NAS / SAN Appliance, Smart Energy / Substation Gateway.
Industrial Router and Gateway
The P1022NSE2LHB is well-suited to industrial router and gateway designs because its dual e500v2 cores at 1.067 GHz can simultaneously terminate WAN VPN tunnels and route LAN traffic. The on-chip SEC engine accelerates AES and 3DES at line rate, enabling ~2 Gbps IPSec throughput without an external crypto ASIC, while three Gigabit Ethernet MACs (eTSEC) support WAN, LAN, and DMZ ports directly. Compared with a discrete CPU-plus-switch-chip architecture, the integrated design cuts BOM cost and PCB area, and the 0C to 105C junction range covers sealed outdoor enclosures with moderate heatsinking.
Recommended
Networked HMI and Operator Panel
The P1022NSE2LHB integrates an LCD controller alongside dual CPU cores, making it a strong fit for networked HMI panels where display refresh and protocol handling compete for cycles. Each e500v2 core can dedicate to a task - one driving the LVDS/DVI panel through the integrated LCD controller while the other runs Modbus/TCP, EtherNet/IP, or PROFINET. The integrated DDR3 controller with ECC reduces display-tearing artifacts and corrects single-bit memory errors, a reliability requirement in 24/7 factory-floor HMIs. Engineers pair this part with an LVDS transmitter and a capacitive-touch controller for full-panel integration.
Recommended
Secure VPN Concentrator
Hardware-accelerated security is the defining feature for VPN concentrator designs using the P1022NSE2LHB. The integrated SEC engine accelerates AES (128/192/256), 3DES, SHA-1/2, MD5, and Kasumi, offloading encryption from the e500v2 cores and sustaining line-rate IPSec with full header checksums. Dual cores allow one core to handle the encrypted data plane while the second manages IKE key exchange and policy lookup, eliminating software scheduling jitter. The 689-TEPBGA II package exposes three Gigabit Ethernet MACs and three PCIe lanes, which is sufficient for a small-branch concentrator with redundant uplinks and a hardware RNG daughter card.
Recommended
Factory Automation Controller
Factory automation controllers benefit from the P1022NSE2LHB's deterministic dual-core Power Architecture and rich peripheral set. The dual e500v2 cores allow one to run a real-time EtherCAT or PROFINET master stack on a dedicated core while the other executes the application PLC logic, with deterministic interrupt latency that ARM Cortex-A alternatives cannot always match. PCIe lanes support a hardware-accelerated vision card for inline quality inspection, and the USB 2.0 host port can drive an industrial touchscreen or a configuration thumbdrive. The 0C to 105C range covers most factory cabinets, and the SEC engine secures over-the-air firmware updates.
Recommended
Networked Multifunction Printer / MFP
The P1022NSE2LHB is a common choice for high-end networked multifunction printers that require simultaneous print-engine control, scanner data acquisition, and Ethernet job queuing. The dual e500v2 cores can each handle a print pipeline - one core driving the raster image processor (RIP) while the second manages the network protocols and the operator panel through the integrated LCD controller. DDR3 with ECC protects the large print-job buffer from memory errors, and the USB 2.0 host port supports direct-print thumbdrive jobs. Power consumption of 3.5-5 W is manageable within a sealed printer chassis.
Recommended
Small-Form-Factor NAS / SAN Appliance
Entry-level NAS and iSCSI SAN appliances leverage the P1022NSE2LHB's balance of dual-core throughput and integrated connectivity to deliver up to ~400 MB/s file-server performance in a fanless enclosure. Three PCIe lanes support a SATA or SAS controller ASIC for 4-8 drive bays, the three Gigabit Ethernet MACs enable link aggregation or dual-NIC redundancy, and the SEC engine accelerates SMB3 / iSCSI AES-256 encryption at line rate. The DDR3 controller with ECC corrects bit errors that would otherwise corrupt long-term storage, and the integrated USB 2.0 ports support one-touch backup keys.
Recommended
Smart Energy / Substation Gateway
Substation and smart-grid gateways use the P1022NSE2LHB as a rugged communications front-end because the 0C to 105C operating range and Power Architecture determinism satisfy IEC 61850 real-time requirements. The dual e500v2 cores split GOOSE-message handling from DNP3/IP and IEC 61850 MMS traffic, while the SEC engine secures authentication and TLS links to upstream SCADA masters. Three Gigabit Ethernet ports support PRP (Parallel Redundancy Protocol) and HSR (High-availability Seamless Redundancy) topologies used in substation LANs. Compared with a pure ARM solution, the deterministic interrupt latency on e500v2 is favored in IEC 61850-3 environments.
Recommended
Recommended Products Summary
Engineering reference data for P1022NSE2LHB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1022NXN2LFB | P1013NSN2LFB | P1022NSE2LHB-R | P1010NSN2LFB | P1024NSE2LHB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| CPU Cores | 2 (e500v2) | 2 (e500v2) | 1 (e500v2) | 2 (e500v2) | 1 (e500v2) | 2 (e500v2) |
| Max Core Frequency | 1.067 GHz | 1.067 GHz | ~800 MHz | 1.067 GHz | ~533-800 MHz | 1.067 GHz |
| Gigabit Ethernet MACs | 3 | 3 | 2 | 3 | 1-2 | 4 |
| PCI Express Lanes | 3x PCIe 2.0 | 3x PCIe 2.0 | 2x PCIe | 3x PCIe 2.0 | 1x PCIe | 3x PCIe 2.0 |
| Security Engine (SEC) | Yes | Yes | Yes | Yes | No | Yes (extended) |
| Operating Temperature | 0C to 105C | 0C to 105C | 0C to 105C | 0C to 105C | 0C to 105C | 0C to 105C |
Key Differentiators
- Dual-core e500v2 Power Architecture with on-chip SEC (vs P1013NSN2LFB)
- Three Gigabit Ethernet MACs vs one or two on entry siblings (vs P1010NSN2LFB)
- Standard commercial 0C to 105C with SEC enabled (vs P1022NXN2LFB)
Design Notes
The 689-TEPBGA II package at 31x31 mm requires a high-density PCB: a minimum 8-layer stackup with continuous ground planes and 0.4 mm pitch escape routing is recommended. NXP layout guidelines specify matched-length DDR3 traces within +/-25 mils and 90-ohm differential impedance for PCIe and SGMII lanes. Use microvia-in-pad construction for the BGA fanout to maintain signal integrity on high-speed SerDes.
Estimated: at full dual-core load (1.067 GHz, both cores active) the P1022NSE2LHB dissipates approximately 3.5-5 W. With a typical 689-TEPBGA II theta_JA of ~10-15 C/W on a JEDEC 8-layer board, a moderate aluminum heatsink or thermal pad of 15x15 mm or larger is recommended to keep junction temperature below the 105C maximum in sealed enclosures. Always validate with the manufacturer's thermal model for the specific PCB stackup.
The P1022NSE2LHB requires a companion power-management IC (e.g., NXP's MMPF0100 family) that supplies the sequenced core, platform, and SerDes rails. Per NXP's hardware specification, ramp the core voltage (V DD) before the platform voltage and keep RESET asserted for at least 1 ms after the final rail stabilizes. The DDR3 supply should include decoupling within 50 mils of every VTT pin to maintain signal integrity.
Route the three Gigabit Ethernet MACs to their respective PHYs using SGMII over the SerDes block; keep each SGMII pair length-matched within 4 mm and avoid crossing any other high-speed lane. The LCD controller pins should be guarded against adjacent PCIe or USB signals to avoid display-tearing artifacts at high resolutions. Always follow the NXP P1022 hardware specification lane map for the SerDes multiplex configuration that matches your firmware.
Compliance Information
RoHS compliant and lead-free per NXP product page and DigiKey listing. AEC-Q100 not applicable - this is an industrial networking SoC, not an automotive-qualified part.
