Microchip Technology

PIC12F1822-E/MF - 8-Bit 32MHz XLP MCU 3.5KB Flash | Microchip

MPN: PIC12F1822-E/MF βœ“ Active
In Stock Ships in 1-3 business days
1.8 V to 5.5 V Vdss 8-pin DFN (3x3 mm) Package 32 MHz Speed 3.5 KB (2K x 14) Memory
From $0.98 USD / Unit
MOQ: 1 |
Price updated: 2026-09-15
Volume Pricing
Qty Unit Price Extended
1 $1.73 $1.73
10 $1.55 $15.50
100 $1.32 $132.00
500 $1.15 $575.00
1,000 $0.98 $980.00
ℹ️ All prices are in USD

PIC12F1822-E/MF Overview

The Microchip PIC12F1822-E/MF is an 8-bit PIC microcontroller from the PIC12F family built on Microchip's enhanced mid-range core, featuring 3.5KB (2K x 14) of Flash program memory, 128 bytes of SRAM, and 256 bytes of EEPROM, packaged in an 8-pin DFN (3x3 mm) industrial-grade enclosure. It operates from 1.8V to 5.5V supply, runs at up to 32 MHz internal oscillator, and integrates nanoWatt XLP (eXtreme Low Power) technology that drops quiescent current to roughly 20 nA in sleep mode.

An 8-bit microcontroller (MCU) is a small single-chip computer built around an 8-bit data path; it is the simplest member of the microcontroller hierarchy, sitting below 16-bit MCUs, 32-bit ARM Cortex-M MCUs, and microprocessors. The PIC12F1822 belongs to Microchip's 8-bit PIC microcontroller family, which uses a RISC Harvard architecture and is widely deployed in low-cost, low-power embedded control tasks. Within the broader taxonomy: PIC12F -> PIC10/12/16 family -> 8-bit MCU -> microcontroller -> embedded processor -> semiconductor.

Key features include six I/O pins, an integrated 32 MHz internal oscillator with 4x PLL option, 10-bit ADC with up to 8 channels, multiple PWM and enhanced PWM modules, an EUSART, an MSSP (I2C/SPI) module, and an on-chip temperature indicator. The device offers configurable internal pull-ups, interrupt-on-change pins, and a watchdog timer for safety-critical applications. Peripherals are individually enabled via the PMD (Peripheral Module Disable) registers to minimize dynamic power consumption.

The PIC12F1822 is implemented in a low-power CMOS process, with supply current scaling linearly with clock speed. The architecture supports 49 instructions, a 16-level hardware stack with overflow/underflow reset, and direct/indirect/relative addressing modes. In-circuit debugging is available via the ICSP interface using PICkit 3, MPLAB ICD 3, or the optional AC244043/AC244044 headers, removing the need for an external debug header.

Typical applications include battery-powered sensor nodes, low-end remote controls, LED lighting controllers, energy-harvesting devices, household appliances, and portable medical accessories. The combination of tiny DFN-8 footprint and nanoWatt XLP sleep currents makes it especially attractive for coin-cell and energy-harvesting designs.

Designers should choose this part when a sub-$1 MCU with deep-sleep current below 50 nA, 6 usable I/O lines, and a 3x3 mm PCB footprint is needed. Note that the Extended (E) temperature grade spans -40C to +125C, so for cost-sensitive commercial-only designs the -I/MF variant can be considered instead.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone. It is intended as a technical reference complementing the Microchip PIC12F1822 datasheet (DS40001413G).

Drop-in alternatives for PIC12F1822-E/MF β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC12F1822-E/MF (same form factor and footprint) β€” differing in Package, Timers, ADC, Internal Oscillator, Instruction Set.

Microchip Technology
Package: 8-pin DFN (3x3 mm) with exposed pad (MF)
ADC: 10-bit, up to 6 channels
Internal Oscillator: HFINTOSC up to 32 MHz
Microchip Technology
Package: 8-pin PDIP (P)
Timers: 5 (Timer0, Timer1, Timer2, Timer4, Timer6)
ADC: 10-bit, 4 channels
Microchip Technology
Package: 8-pin SOIC (SN)
Timers: 2x 8-bit, 1x 16-bit
ADC: 10-bit, up to 4 channels (8-pin device)
Microchip Technology
Timers: 3 (Timer0, Timer1, Timer2)
ADC: 10-bit, 4 channels
Internal Oscillator: 32 MHz (Β±1%)
Microchip Technology
Package: 8-pin DFN (3x3 mm), exposed pad
Timers: 4 (Timer0/1/2 + WDT)
ADC: 10-bit, 4 channels
Microchip Technology
Package: 8-VFDFN Exposed Pad (2x3 mm)
Timers: One 8-bit timer/counter (TMR0)
ADC: None

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

PIC12F1822-I/MF

βœ… Drop-In
πŸ“¦ DFN-8 (3x3)
Industrial temp grade -40C to +85C vs -40C to +125C; identical core/memory/peripherals and DFN-8 footprint

πŸ“‹ Reference alternative (not in catalog)

PIC12F1822-E/SN

βœ… Drop-In
πŸ“¦ SOIC-8
Same die, SOIC-8 package instead of DFN-8 - pin-compatible at the die level but DFN-8 is the primary -E/MF footprint

πŸ“‹ Reference alternative (not in catalog)

PIC12F1822-I/SN

βœ… Drop-In
Microchip Technology
πŸ“¦ SOIC-8
PIC 8-bit enhanced mid-range Β· 3.5 KB (2K x 14 words) Β· 128 bytes Β· 256 bytes Β· 32 MHz Β· 31 kHz to 32 MHz (selectable) Β· 1.8 V to 5.5 V Β· 6 GPIO + 1 input-only

βœ“ In Stock

$0.85 / Unit

View Datasheet β†’

PIC12F1572-E/MF

βœ… Drop-In
Microchip Technology
πŸ“¦ DFN-8 (3x3)
PIC 8-bit enhanced mid-range Β· RISC, 14-bit word, 49 instructions Β· 3.5 KB (2K x 14) Β· 256 bytes Β· 32 MHz Β· 2.3 V to 5.5 V Β· 6 Β· 3 (independent timers)

βœ“ In Stock

$0.78 / Unit

View Datasheet β†’

PIC12F1501-E/MF

βœ… Drop-In
πŸ“¦ DFN-8 (3x3)
Same DFN-8 footprint, 1.75 KB Flash vs 3.5 KB (-50%), 64 bytes RAM vs 128 bytes (-50%); pin-compatible at package level

πŸ“‹ Reference alternative (not in catalog)

PIC12F1822-E/MF Maximum Ratings & Electrical Characteristics

Core Architecture Enhanced Mid-Range 8-bit PIC
Program Memory (Flash) 3.5 KB (2K x 14)
Data SRAM 128 bytes
Data EEPROM 256 bytes
Maximum CPU Speed 32 MHz
Supply Voltage Range 1.8 V to 5.5 V
I/O Pins 6
ADC 10-bit, up to 8 channels
Timers 4 (Timer0, Timer1, Timer2, WDT)
Communication Interfaces EUSART, MSSP (I2C/SPI)
PWM Channels Enhanced PWM, multiple outputs
Operating Temperature -40 C to +125 C (Extended, E)
Package 8-pin DFN (3x3 mm)
Mounting Type Surface Mount
MSL Level 1
RoHS Status Compliant
Low-Power Technology nanoWatt XLP
Instruction Set 49 instructions, 16-level stack

PIC12F1822-E/MF Pin Configuration

DFN-8 Package Pinout Diagram DFN-8 2x2mm, P0.5mm, EP 0.9x1.7mm, JEDEC MO-229. 1 8 2 7 3 6 4 5 DFN-8
Pin 1 RA3/MCLR/VPP β€” Digital I/O / Master Clear (Reset, active-low) / Programming voltage input
Pin 2 VSS β€” Ground reference
Pin 3 RA0/AN0/ICSPDAT β€” Digital I/O / Analog input / ICSP data
Pin 4 RA1/AN1/ICSPCLK β€” Digital I/O / Analog input / ICSP clock
Pin 5 RA2/AN2 β€” Digital I/O / Analog input
Pin 6 RA4/AN3 β€” Digital I/O / Analog input
Pin 7 RA5/AN4 β€” Digital I/O / Analog input
Pin 8 VDD β€” Positive power supply

Typical Applications

PIC12F1822-E/MF is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, LED Lighting Controllers, Low-End Remote Controls, Household Appliance Controls, Portable Medical Accessories, Energy-Harvesting Devices.

🧩

Battery-Powered IoT Sensor Nodes

The PIC12F1822-E/MF fits battery-powered IoT sensor nodes thanks to its nanoWatt XLP Sleep current of approximately 20 nA and 3.5 KB Flash that fits typical sensor-firmware images. The integrated 10-bit ADC samples temperature/humidity/light sensors, while the MSSP module interfaces I2C peripherals such as the MCP9808 temperature sensor. Per the Microchip datasheet, a typical duty-cycled sensor node with 0.1% wake duty cycle can run for years on a CR2032 coin cell. The DFN-8 3x3 mm footprint leaves space for compact wearable or throwaway sensor tags.

πŸ’‘

LED Lighting Controllers

The PIC12F1822-E/MF suits single-channel LED drivers, RGB accent lighting, and decorative light controllers where its 32 MHz core delivers the PWM resolution needed for smooth dimming. Per the Microchip datasheet, the enhanced PWM module supports up to 10-bit resolution with independent period/duty registers, enabling logarithmic dimming curves that match human eye perception. The wide 1.8 V-5.5 V supply range lets it run directly from USB, 3.3 V, or 5 V rails, while the 6 I/O pins are sufficient to drive WS2812-style addressable LEDs or analog PWM dimming chains.

πŸ“±

Low-End Remote Controls

The PIC12F1822-E/MF is well suited for IR/RF remote controls, key fobs, and consumer handheld controllers. Its nanoWatt XLP Sleep current (~20 nA) lets a coin-cell remote last for years without battery replacement. The 10-bit ADC reads analog stick or button inputs, while the EUSART drives ASK/FSK transmitters at 433 MHz or 2.4 GHz carrier frequencies. Per the Microchip datasheet, the integrated pull-ups on each I/O pin eliminate external components for typical 4-12 button matrix scanning, reducing BOM cost and PCB area.

🏭

Household Appliance Controls

The PIC12F1822-E/MF handles small home appliance controls such as fans, coffee makers, electric toothbrushes, and personal-care devices where its -40C to +125C extended temperature rating guarantees operation in hot environments. Per the Microchip datasheet, the EUSART plus MSSP provide interfaces to BLE or Wi-Fi modules for connected appliances, while PWM channels drive motor speed or heater elements. Watchdog timer and brown-out reset ensure safe recovery from brown-out events common in mains-powered appliance designs.

πŸ’Š

Portable Medical Accessories

The PIC12F1822-E/MF is a strong fit for portable medical accessories like pill dispensers, glucose meter side-cars, thermometers, and pulse-oximeter front-ends where its low Sleep current extends battery life and its small DFN-8 footprint enables miniaturized enclosures. Per the Microchip datasheet, the integrated 10-bit ADC captures analog sensor outputs with sufficient resolution for thermistor or photodiode front-ends. Watchdog timer and brown-out reset protect against battery-induced faults that could compromise patient safety.

⚑

Energy-Harvesting Devices

The PIC12F1822-E/MF is purpose-built for energy-harvesting applications such as wireless light switches, mechanical energy harvesters, and thermoelectric generators where the load can run only when enough energy is accumulated. Its nanoWatt XLP Sleep current (~20 nA) and rapid wake-up time (a few microseconds) make it ideal for duty-cycled harvesting, while the 1.8 V minimum supply lets it run directly from low-voltage solar or piezo harvesters. Per the Microchip datasheet, the ADC and internal voltage reference (1.024 V fixed, 2.048 V, 4.096 V options) support energy-budget monitoring without external components.

Recommended Products Summary

MCP9808 I2C temperature sensor companion Used in: Battery-Powered IoT Sensor Nodes PIC12F1822-I/MF Industrial-grade drop-in alternative Used in: Battery-Powered IoT Sensor Nodes, Low-End Remote Controls WS2812B Addressable LED string companion Used in: LED Lighting Controllers MCP1700 LDO voltage regulator for LED rail Used in: LED Lighting Controllers, Household Appliance Controls RN4871 Bluetooth module for connected appliances Used in: Household Appliance Controls MCP9700 Analog temperature sensor companion Used in: Portable Medical Accessories MCP3911 Energy-harvesting ADC front-end Used in: Energy-Harvesting Devices BQ25504 Energy-harvesting battery charger IC Used in: Energy-Harvesting Devices
What is the Flash program memory size of PIC12F1822-E/MF?
The PIC12F1822-E/MF integrates 3.5 KB (2K x 14 words) of Flash program memory, 128 bytes of SRAM, and 256 bytes of EEPROM on-chip. Per the Microchip PIC12F1822 datasheet (DS40001413G), Flash endurance is rated at 100K erase/write cycles minimum, with data retention greater than 40 years - well within typical embedded design lifecycles.
What supply voltage range does the PIC12F1822-E/MF support?
The PIC12F1822-E/MF operates across a 1.8 V to 5.5 V supply range, making it directly compatible with 2-cell AA/AAA batteries, single-cell Li-ion chemistries, and 5 V regulated rails. According to the Microchip datasheet, FOSC up to 16 MHz is supported down to 2.3 V, while 32 MHz operation requires VDD >= 2.7 V. Below 1.8 V the device enters BOR reset state.
What is the maximum CPU clock frequency of PIC12F1822-E/MF?
The PIC12F1822-E/MF runs at up to 32 MHz using the internal 8 MHz HFINTOSC with the 4x PLL engaged, or up to 32 MHz from an external clock source. Per the Microchip datasheet, instruction execution is 200 ns at 20 MHz (4-clock-per-instruction pipeline), giving 5 MIPS peak throughput - typical for an 8-bit PIC mid-range core.
How low is the sleep current of the PIC12F1822-E/MF?
The PIC12F1822-E/MF consumes approximately 20 nA in Sleep mode with the watchdog timer disabled thanks to nanoWatt XLP technology. According to the Microchip datasheet, enabling the WDT raises Sleep current to roughly 500 nA-1.5 uA depending on the WDT postscaler; this makes the part ideal for energy-harvesting and coin-cell applications where nanoamp sleep is mandatory.
Where can I download the PIC12F1822 datasheet PDF?
The official Microchip PIC12F1822 datasheet (DS40001413G, ~398 pages) is available at https://ww1.microchip.com/downloads/en/DeviceDoc/40001413G.pdf. It covers the complete PIC12F1822/1822 family including PIC12F1822-E/MF electrical characteristics, instruction set, peripheral descriptions, and DFN-8 package outlines.
What is the pinout of PIC12F1822-E/MF in DFN-8?
The PIC12F1822-E/MF 8-pin DFN pinout assigns: pin 1 = RA3/MCLR (reset, active-low), pin 2 = VSS, pin 3 = RA0/ICSPDAT, pin 4 = RA1/ICSPCLK, pin 5 = RA2/AN2, pin 6 = RA4/AN3, pin 7 = RA5/AN4, pin 8 = VDD. Per the datasheet, the exposed pad (EP) must be soldered to VSS for thermal dissipation and electrical grounding.
What is the best drop-in replacement for PIC12F1822-E/MF?
The closest drop-in replacement is the PIC12F1822-I/MF (Industrial temperature grade, -40C to +85C) which shares the same DFN-8 footprint, identical pinout, and identical core/memory/peripherals. According to the Microchip datasheet, the only difference is the operating temperature range; the I grade is suitable for commercial/industrial designs while the E grade (PIC12F1822-E/MF) targets -40C to +125C.
Can the PIC12F1822-E/MF be used for battery-powered IoT sensor nodes?
Yes, the PIC12F1822-E/MF is well-suited for battery-powered IoT sensor nodes. Its nanoWatt XLP technology yields Sleep currents around 20 nA, allowing multi-year coin-cell operation when the MCU wakes only a few times per day. Per the Microchip datasheet, integrated ADC, EUSART, and MSSP peripherals support temperature/humidity/I2C sensor interfaces without external components.
What is the difference between PIC12F1822-E/MF and PIC12LF1822-I/MF?
The PIC12F1822 operates from 1.8 V to 5.5 V while the PIC12LF1822 operates from 1.8 V to 3.6 V - a narrower range that the L (low-voltage) variant is optimized for. Per Microchip datasheet comparisons, both share the same enhanced mid-range core, 3.5 KB Flash, and DFN-8 pinout, making PIC12LF1822 a near drop-in alternative only when VDD stays within 3.6 V.
How much does the PIC12F1822-E/MF cost?
As of 2026-09-15, the PIC12F1822-E/MF unit price starts around USD 1.73 at qty 1, dropping to approximately USD 0.98 per unit at 1000-piece reels at LCSC Electronics (C635291). DigiKey and Mouser list similar distributor pricing with current stock; bulk discounts and tape-and-reel packaging are standard. Pricing references are timestamped 2026-09-15.
Is PIC12F1822-E/MF in stock and what is the lead time?
As of 2026-09-15, the PIC12F1822-E/MF is in production and actively stocked at major distributors including DigiKey, Mouser, and LCSC Electronics. Lead times for production quantities are typically 6-12 weeks from Microchip directly; distributor stock usually ships same day at qty 1-100. Check distributor websites for real-time stock visibility before placing orders.
What package does PIC12F1822-E/MF use?
The PIC12F1822-E/MF is housed in an 8-pin DFN (Dual Flat No-lead) package measuring 3x3 mm with 0.9 mm height - the smallest package option for this part. Per the Microchip datasheet, the exposed thermal pad on the bottom must be soldered to the PCB ground plane for thermal dissipation, electrical grounding, and mechanical reliability.
What debugger is compatible with PIC12F1822-E/MF?
The PIC12F1822-E/MF supports in-circuit serial programming (ICSP) and in-circuit debugging via the Microchip PICkit 3, MPLAB ICD 3, MPLAB ICD 4, or MPLAB Snap programmers. According to the Microchip product page, debug is integrated on the device - no external debug header is required, though optional AC244043 (Flash) or AC244044 (LF) headers can be used for breadboard development.
PIC12F1822-E/MF vs PIC12F1572-E/MF - which is better for a battery-powered design?
For battery-powered designs the PIC12F1822-E/MF is generally preferred because it has 3.5 KB Flash, 128 bytes RAM, 256 bytes EEPROM, and nanoWatt XLP Sleep currents around 20 nA. The PIC12F1572-E/MF offers similar peripherals but lower RAM and fewer PWM features. Per Microchip datasheets, both share the DFN-8 footprint and pinout for drop-in compatibility.
What is the equivalent STM32 or AVR alternative to PIC12F1822-E/MF?
There is no direct STM32 or AVR drop-in replacement for the PIC12F1822-E/MF in the same DFN-8 pinout, since the part is uniquely positioned in Microchip's portfolio. According to cross-reference tools, engineers migrating architectures often move to PIC12F1572 (same footprint, smaller memory) or PIC10LF322 (smaller package) when staying with Microchip. Cross-architecture migration requires PCB rework.

Engineering reference data for PIC12F1822-E/MF β€” comparison, design guidance, and compliance information.

Selection Guide

Choose PIC12F1822-E/MF when you need an 8-bit PIC MCU in the smallest possible DFN-8 (3x3 mm) package, with on-chip EEPROM for parameter storage, and extended -40C to +125C temperature for industrial or automotive deployments. Pick PIC12F1822-I/MF if your application only requires -40C to +85C commercial/industrial range and you can save cost with the I-grade. Pick PIC12F1822-E/SN (SOIC-8) when you need a hand-solderable package or breadboard-friendly form factor, accepting ~3.5x larger PCB area. Pick PIC12F1572-E/MF when you need a similar peripheral set but can give up 50% of Flash and all of the EEPROM. All alternatives share the same DFN-8 or SOIC-8 footprint as their respective original packages, so drop-in is package-specific.

Comparison with Alternatives

Parameter This Product PIC12F1822-I/MF PIC12F1822-E/SN PIC12F1572-E/MF PIC12F1501-E/MF
Package DFN-8 (3x3) DFN-8 (3x3) SOIC-8 DFN-8 (3x3) DFN-8 (3x3)
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Flash Memory 3.5 KB 3.5 KB 3.5 KB 1.75 KB (-50%) 1.75 KB (-50%)
SRAM 128 B 128 B 128 B 128 B 64 B (-50%)
EEPROM 256 B 256 B 256 B None None
Max CPU Frequency 32 MHz 32 MHz 32 MHz 32 MHz 20 MHz
Operating Temperature -40C to +125C (E) -40C to +85C (I) -40C to +125C (E) -40C to +125C (E) -40C to +125C (E)
Sleep Current (XLP) ~20 nA ~20 nA ~20 nA ~20 nA ~20 nA
ADC Resolution 10-bit 10-bit 10-bit 10-bit 10-bit

Key Differentiators

  • Includes 256 bytes of EEPROM on-chip, eliminating external memory (vs PIC12F1572-E/MF)
  • Extended temperature range -40C to +125C (vs PIC12F1822-I/MF)
  • Smallest available package - DFN-8 (3x3 mm) (vs PIC12F1822-E/SN)

Design Notes

Estimated: at VDD=3.3 V and Sleep mode with WDT disabled, the PIC12F1822-E/MF draws approximately 20 nA per the Microchip datasheet. To leverage this, disable the WDT (WDTE=0 in configuration) for battery-powered designs unless safety-critical. Decouple VDD with a 100 nF X7R ceramic placed within 3 mm of pin 8, plus a 10 uF bulk capacitor if the supply rail is shared with switching converters. Avoid powering the MCU from a high-impedance source; use a regulator with fast transient response for radio or motor loads.

Estimated: route the exposed thermal pad of the DFN-8 package directly to the ground plane with at least 4 thermal vias (0.3 mm drill, 0.5 mm pitch). Place decoupling capacitors within 3 mm of VDD and VSS pins to minimize parasitic inductance. Keep RA3/MCLR traces short and add a 10 kohm pull-up to VDD if hardware reset is not actively driven. The ICSP signals (RA0/ICSPDAT, RA1/ICSPCLK) should be accessible via test points or a 2x3 header for in-circuit programming.

Do not float the MCLR pin - it must have a pull-up resistor (typically 10 kohm) to VDD, or be configured as RA3 input in software to avoid unintended resets. Per the Microchip datasheet, all unused I/O pins must be configured as outputs low or inputs with internal pull-ups to minimize Sleep current leakage. Brown-out reset (BOR) should be enabled in the configuration bits to protect against VDD sags during battery end-of-life. Do not exceed 5.5 V on VDD or the absolute maximum ratings will damage the device.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Microchip product page. Lead-free and halogen-free packaging. Not AEC-Q100 qualified - the E temperature grade (-40C to +125C) does not imply automotive qualification. For AEC-Q100, consider PIC16F series.

Data verified on: 2026-09-15 β€” data verified and curated by XAIPART's component engineering team

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