Microchip Technology

PIC12F1822T-E/MF - 8-bit MCU, 3.5KB Flash, 32MHz, DFN-8

MPN: PIC12F1822T-E/MF βœ“ Active
In Stock Ships in 1-3 business days
1.8 V to 5.5 V Vdss 8-pin DFN-EP (3x3 mm) with exposed thermal pad Package 32 MHz Speed 3.5 KB (2K x 14) Memory
From $0.84 USD / Unit
MOQ: 1 |
Price updated: 2026-09-15
Volume Pricing
Qty Unit Price Extended
1 $1.42 $1.42
10 $1.28 $12.80
100 $1.12 $112.00
500 $0.97 $485.00
1,000 $0.84 $840.00
ℹ️ All prices are in USD

PIC12F1822T-E/MF Overview

The Microchip Technology PIC12F1822T-E/MF is an 8-bit enhanced mid-range PIC12 microcontroller built on nanoWatt XLP (eXtreme Low Power) technology, delivering 32 MHz performance from a 3.5 KB Flash program memory and 128 B SRAM in an 8-pin DFN-EP package on tape-and-reel. According to the Microchip product family brief, the PIC12F1822 family integrates a precision 32 MHz internal oscillator, 10-bit ADC with computation (ADC2), up to four PWM modules, and configurable logic cells that replace simple external glue logic.

What is an 8-bit PIC microcontroller? An 8-bit PIC microcontroller is a RISC-based CMOS microcomputer from Microchip Technology that executes one instruction per cycle (typically 200 ns at 20 MHz, 125 ns at 32 MHz) and is part of the broader microcontroller > microcomputer > embedded IC hierarchy. The PIC12 sub-family targets ultra-small pin-count (8-pin and 14-pin) applications where board space, low quiescent current, and integrated peripherals matter more than raw computational throughput.

Key features of the PIC12F1822T-E/MF include 3.5 KB self-programmable Flash with 256 B EEPROM, 128 B RAM, six I/O pins plus one input-only pin, and a 32 MHz internal oscillator accurate to within Β±1% across voltage and temperature. Peripherals include a 10-bit ADC, two 8-bit timers and one 16-bit timer, enhanced USART, MSSP (SPI/I2C), up to four 10-bit PWM outputs with complementary and dead-band control, and configurable logic cells (CLC) that implement combinational/sequential logic in hardware.

The architecture uses a 14-bit instruction word with an 8-level hardware stack, 32-byte access bank for fast SFR access, and a vectored interrupt controller with context save-on-entry. The XLP technology delivers typical sleep currents below 20 nA at 1.8 V, watchdog timer currents around 400 nA, and active currents around 50 Β΅A/MIPS at 1 MHz / 1.8 V, making the part attractive for battery-powered and energy-harvesting designs.

Typical applications include automotive sensor interfaces (the -E suffix denotes -40Β°C to +125Β°C automotive temperature grade), low-power IoT sensor nodes, LED lighting controllers, consumer appliance user interfaces, and small motor-control loops using the integrated PWM and CLC blocks. The wide 1.8 V to 5.5 V operating range allows direct connection to 2-cell battery stacks or 5 V rails without external level shifting.

When designing with the PIC12F1822T-E/MF, leverage the integrated 32 MHz oscillator to avoid external crystals, reserve one I/O for ICSP programming, and place a 0.1 Β΅F decoupling capacitor within 5 mm of the VDD pin. The DFN-EP exposed pad must be soldered to a thermal pad on the PCB for proper thermal dissipation.

This page synthesizes distributor pricing, drop-in alternatives from the PIC12 family, and practical design notes not found in the manufacturer datasheet.

Drop-in alternatives for PIC12F1822T-E/MF β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC12F1822T-E/MF (same form factor and footprint) β€” differing in Core Architecture, Package, Timers, ADC, Data EEPROM.

Microchip Technology
Core Architecture: Enhanced Mid-Range 8-bit PIC
Package: 8-pin DFN (3x3 mm)
Timers: 4 (Timer0, Timer1, Timer2, WDT)
Microchip Technology
Core Architecture: PIC16 (enhanced mid-range 8-bit RISC)
Package: 8-pin DFN (3 x 3 mm) with exposed pad
Timers: 5 (Timer0/Timer1/Timer2 + 2 SMT/SRN)

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

PIC12F1822-E/MF

βœ… Drop-In
Microchip Technology
πŸ“¦ 8-pin DFN-EP (3x3 mm)
Enhanced Mid-Range 8-bit PIC Β· 3.5 KB (2K x 14) Β· 128 bytes Β· 256 bytes Β· 32 MHz Β· 1.8 V to 5.5 V Β· 6 Β· 10-bit, up to 8 channels

βœ“ In Stock

$0.98 / Unit

View Datasheet β†’

PIC12F1822-I/MF

βœ… Drop-In
πŸ“¦ 8-pin DFN-EP (3x3 mm)
industrial -40C to +85C vs automotive -40C to +125C temperature grade

πŸ“‹ Reference alternative (not in catalog)

PIC12LF1822T-I/MF

βœ… Drop-In
Microchip Technology
πŸ“¦ 8-pin DFN-EP (3x3 mm)
PIC16 (enhanced mid-range 8-bit RISC) Β· 3.5 KB (2K x 14 words) Β· 128 bytes Β· 256 bytes Β· 32 MHz (4 MHz internal, PLL x4) Β· 200 ns at 32 MHz (5 MIPS) Β· 1.8 V to 3.6 V ("LF" wide-VDD) Β· 6

βœ“ In Stock

$1.55 / Unit

View Datasheet β†’

PIC12F1822T-I/SN

βœ… Drop-In
πŸ“¦ 8-pin SOIC-8 (SN)
SOIC-8 package for hand-soldering; industrial -40C to +85C; identical die

πŸ“‹ Reference alternative (not in catalog)

PIC16F1823T-I/MF

βœ… Drop-In
πŸ“¦ 8-pin DFN-EP (3x3 mm)
pin-compatible 14-pin PIC16 upgrade with 7 KB Flash / 384 B SRAM; same DFN-EP package

πŸ“‹ Reference alternative (not in catalog)

PIC12F1822T-E/MF Maximum Ratings & Electrical Characteristics

Core Architecture 8-bit PIC enhanced mid-range (RISC)
Instruction Word 14-bit
Maximum CPU Frequency 32 MHz
Program Memory (Flash) 3.5 KB (2K x 14)
Data SRAM 128 B
Data EEPROM 256 B
I/O Pins 6 (plus 1 input-only)
Package 8-pin DFN-EP (3x3 mm) with exposed thermal pad
Operating Voltage Range 1.8 V to 5.5 V
Operating Temperature Range -40C to +125C (automotive, -E suffix)
Internal Oscillator 32 MHz, Β±1% accuracy
ADC 10-bit, up to 8 channels
PWM Modules Up to 4 (10-bit) with complementary outputs and dead-band control
Timers 2x 8-bit, 1x 16-bit
Communication EUSART, MSSP (SPI / I2C)
Configurable Logic Cells (CLC) Yes
ICSP / Debug Integrated in-circuit serial programming and debug (no header required)
Power-Saving Technology nanoWatt XLP (sleep current < 20 nA typical at 1.8 V)
Mounting Type Surface Mount

PIC12F1822T-E/MF Pin Configuration

DFN-8 Package Pinout Diagram DFN-8 2x2mm, P0.5mm, EP 0.9x1.7mm, JEDEC MO-229. 1 8 2 7 3 6 4 5 DFN-8
Pin 1 VDD β€” Positive supply voltage (1.8 V to 5.5 V)
Pin 2 RA5 β€” Bidirectional I/O pin / PWM output
Pin 3 RA4 β€” Bidirectional I/O pin with weak pull-up / PWM output
Pin 4 RA3/MCLR/VPP β€” Input-only pin, Master Clear reset, ICSP programming voltage
Pin 5 RA2 β€” Bidirectional I/O pin / analog input / PWM output
Pin 6 RA1/ICSPCLK β€” Bidirectional I/O pin, ICSP clock, analog input
Pin 7 RA0/ICSPDAT β€” Bidirectional I/O pin, ICSP data, analog input
Pin 8 VSS β€” Ground reference (also exposed pad)

Typical Applications

PIC12F1822T-E/MF is suitable for 6 applications: Automotive Sensor Interface Module, Low-Power IoT Sensor Node, LED Lighting Controller, Consumer Appliance User Interface, Small Motor-Control Loop, Battery Charger Management.

πŸš—

Automotive Sensor Interface Module

The PIC12F1822T-E/MF fits automotive sensor interface modules through its -40Β°C to +125Β°C automotive grade, integrated 10-bit ADC, and EUSART / MSSP peripherals that connect to LIN bus or sensor front-ends. With 3.5 KB Flash it holds a sensor-sampling task with LIN 1.3 slave framing and diagnostics, while the 32 MHz internal oscillator removes the external crystal cost typical of body-electronics BCM sub-modules. Power consumption of around 50 Β΅A/MIPS at 1 MHz / 1.8 V keeps cold-crank quiescent draw low for always-on sensor ECUs. Companion parts include the PIC16F1823 for higher-pin-count BCM slaves and the MCP2515 CAN controller when CAN-FD is required.

🧩

Low-Power IoT Sensor Node

The PIC12F1822T-E/MF suits coin-cell IoT sensor nodes via its nanoWatt XLP technology delivering sub-20 nA sleep current at 1.8 V and 1.8 V to 5.5 V operating range that aligns with single-cell Li-ion and 2-cell alkaline chemistries. Its 32 MHz internal oscillator eliminates external crystals, reducing quiescent leakage paths on the board and shrinking BOM cost for high-volume disposable IoT tags. With 128 B SRAM and 3.5 KB Flash, the part runs a wake-measure-transmit duty cycle handling a temperature or humidity sensor over I2C, then sleeping for seconds between samples. The exposed-pad DFN-EP package supports reflow profiles compatible with standard lead-free SMT lines.

πŸ’‘

LED Lighting Controller

The PIC12F1822T-E/MF drives LED lighting strings through its four 10-bit PWM channels with complementary outputs and dead-band control, supporting smooth dimming curves and color-mixing RGB or RGBA fixtures. Its 32 MHz core and 200 ns instruction cycle enable high-frequency PWM (>20 kHz) above the audible band, eliminating inductor whine in dimmable architectural lighting. The integrated CLC (configurable logic cell) implements hardware PWM blanking and fault-triggered shutdown without external gates, reducing component count in driver PCBs. The DFN-EP exposed pad carries LED driver MOSFET heat away from the silicon junction.

🏭

Consumer Appliance User Interface

The PIC12F1822T-E/MF handles user-interface tasks in consumer appliances such as coffee makers, microwaves, and washing machines, integrating capacitive touch via the ADC and CLC blocks, plus PWM for buzzer tones and indicator LED brightness. The 3.5 KB Flash is sufficient for state-machine UI code with debounced keypad scanning and seven-segment multiplexing without an external display driver. The wide 1.8 V to 5.5 V supply range tolerates unregulated 5 V wall-adapter rails and brown-out conditions common in motor-driven appliances. The -40Β°C to +125Β°C grade supports outdoor appliance cabinets and under-hood automotive accessories.

🏭

Small Motor-Control Loop

The PIC12F1822T-E/MF runs closed-loop control of small DC and stepper motors in fans, pumps, and valves by combining its four 10-bit PWM outputs with the 10-bit ADC for back-EMF or current sensing. The 32 MHz core executes PID loops at 8 kHz control rate with sufficient headroom for commutation, while the CLC blocks generate hardware fault interlocks in nanoseconds without firmware latency. The automotive temperature grade suits under-hood fans and HVAC actuators that must survive -40Β°C cold-soak and +125Β°C engine-bay conditions. The DFN-EP package keeps the footprint small enough to integrate directly on the motor-control PCB.

⚑

Battery Charger Management

The PIC12F1822T-E/MF serves as the supervisor MCU in single-cell Li-ion / Li-poly charger modules through its 10-bit ADC for V/I monitoring, PWM for buck-converter duty-cycle control, and EUSART for SMBus or proprietary charger-status reporting. The 1.8 V to 5.5 V operating range aligns directly with single-cell battery voltages, allowing direct ADC measurement without resistive dividers on the high-impedance sense path. The 32 MHz core runs CC-CV charge profiles with temperature fold-back via the ADC, while the CLC blocks implement hardware over-current and over-voltage latches. The nanoWatt XLP sleep current below 20 nA extends shelf life of unused battery packs by keeping the supervisory MCU alive.

Recommended Products Summary

PIC16F1823T-I/MF 14-pin upgrade with more I/O for multi-sensor BCM Used in: Automotive Sensor Interface Module MCP2515-I/SO Standalone CAN controller for CAN-FD connectivity Used in: Automotive Sensor Interface Module PIC12LF1822T-I/MF Microchip Technology Used in: Low-Power IoT Sensor Node MCP9808T-E/MS High-accuracy I2C temperature sensor companion Used in: Low-Power IoT Sensor Node PIC12F1572-E/MF Microchip Technology Used in: LED Lighting Controller MCP1416T-E/OT Low-side MOSFET gate driver for LED strings Used in: LED Lighting Controller PIC12F1501T-I/MU Microchip Technology Used in: Consumer Appliance User Interface PIC12F1571-I/SN Microchip Technology Used in: Consumer Appliance User Interface PIC12F1822-E/MF Microchip Technology Used in: Small Motor-Control Loop DRV8871DDAR Integrated H-bridge motor driver Used in: Small Motor-Control Loop PIC12F1612-E/SN Microchip Technology Used in: Battery Charger Management MCP73831T-2ACI/OT Companion linear Li-ion charge controller Used in: Battery Charger Management
What is the flash memory size of PIC12F1822T-E/MF?
The PIC12F1822T-E/MF integrates 3.5 KB (2K x 14-bit words) of self-programmable Flash program memory according to the Microchip PIC12(L)F1822 datasheet family. The Flash supports ICSP (in-circuit serial programming) and self-write under firmware control, enabling boot-loader or data-logging use cases without external storage.
What is the operating voltage range of PIC12F1822T-E/MF?
The PIC12F1822T-E/MF operates from 1.8 V to 5.5 V across the -40Β°C to +125Β°C automotive temperature grade. This wide range allows direct connection to single-cell Li-ion, 2-cell alkaline, or 5 V regulated rails without level shifters, simplifying power-tree design in low-power IoT nodes and automotive sensor modules.
Where to buy PIC12F1822T-E/MF online?
The PIC12F1822T-E/MF is in stock at authorized distributors including Mouser, DigiKey (reel-pack / cut-tape variants), Hotenda, and Jotrin Electronics, with pricing starting near $1.42 per unit at qty 1 as of 2026-09-15. For automotive-grade production volumes, contact a Microchip authorized distributor or franchised partner.
What is the price of PIC12F1822T-E/MF?
The PIC12F1822T-E/MF unit price starts at approximately $1.42 at qty 1, dropping to about $0.84 per unit at the 1000-piece tape-and-reel break as of 2026-09-15 per distributor listings. Pricing is volatile for tape-and-reel packaged small-form-factor DFN parts; request a formal quote for volume orders above 5000 pieces.
What is the lead time for PIC12F1822T-E/MF?
Lead time for the PIC12F1822T-E/MF at major distributors is typically 12-16 weeks from Microchip factory order entry as of 2026-09-15, due to broad-based 8-bit MCU demand. Distributor shelf stock at Mouser and Hotenda is occasionally available for prototype and small-production orders with immediate shipment.
PIC12F1822T-E/MF vs PIC12F1822-E/MF - what is the difference?
The PIC12F1822T-E/MF is supplied on tape-and-reel packaging, while the PIC12F1822-E/MF is supplied in tube or tray. Both share identical silicon die, -40Β°C to +125Β°C automotive grade, and DFN-EP package; the only difference is the carrier format for pick-and-place assembly lines. Choose -T- for SMT production, non-T for prototyping or hand-rework.
When should I choose PIC12F1822T-E/MF over PIC12F1822-I/SN?
Choose the PIC12F1822T-E/MF when you need the smallest PCB footprint (3x3 mm DFN-EP) and the -40Β°C to +125Β°C automotive grade for harsh environments. Choose the PIC12F1822-I/SN (SOIC-8) when you need hand-solderable prototyping, breadboard compatibility, or industrial-only -40Β°C to +85Β°C range. Both share identical die, peripherals, and pinout function.
Is PIC12F1822T-E/MF suitable for automotive sensor interface?
Yes, the PIC12F1822T-E/MF carries the -E automotive temperature grade (-40Β°C to +125Β°C) and integrates 10-bit ADC, EUSART, MSSP (I2C/SPI), and four PWM outputs - ideal for sensor signal conditioning, LIN slave nodes, and LED drivers in body-electronics modules. The 32 MHz internal oscillator eliminates external crystals, reducing BOM cost for high-volume automotive ECUs.
What is the best drop-in replacement for PIC12F1822T-E/MF?
The best drop-in replacement is the PIC12F1822-E/MF, which shares the same 8-pin DFN-EP footprint, identical silicon die, and -40Β°C to +125Β°C automotive grade - the only difference is tube vs tape-and-reel packaging. The PIC12F1822-I/MF is a near-identical industrial-grade variant; the PIC12LF1822T-I/MF is a 1.8 V-3.6 V low-voltage variant in the same DFN-EP package.
Where to download PIC12F1822T-E/MF datasheet PDF?
The PIC12F1822T-E/MF datasheet PDF can be downloaded from the Microchip product page at https://www.microchip.com/en-us/product/PIC12F1822 or directly via the family brief link https://ww1.microchip.com/downloads/en/DeviceDoc/41394A.pdf. The full PIC12(L)F1822 datasheet covers electrical characteristics, memory map, peripheral configuration, and DFN-EP land pattern recommendations.
Where to find PIC12F1822T-E/MF pinout?
The PIC12F1822T-E/MF pinout for the 8-pin DFN-EP package is: Pin 1 = VDD, Pin 2 = RA5, Pin 3 = RA4, Pin 4 = RA3/MCLR (input-only), Pin 5 = RA2, Pin 6 = RA1/ICSPCLK, Pin 7 = RA0/ICSPDAT, Pin 8 = VSS (with exposed pad = VSS). The Microchip datasheet includes a full pin description table on page 4.
What is the output noise and PSRR of PIC12F1822T-E/MF?
The PIC12F1822T-E/MF does not have specified output noise or PSRR figures in the manufacturer datasheet because it is a digital microcontroller, not an LDO regulator. These analog power-supply metrics apply to voltage regulators (LDO, DC-DC converters); microcontrollers are characterized by ADC accuracy, clock jitter, and supply rejection of internal references instead.
Hey Google, what can replace PIC12F1822T-E/MF?
The PIC12F1822T-E/MF can be replaced by Microchip same-family variants PIC12F1822-E/MF (tube, identical die), PIC12LF1822T-I/MF (low-voltage 1.8 V-3.6 V), and PIC16F1823T-I/MF (14-pin upgrade path). All four are pin-compatible DFN-EP packages from Microchip with matching RISC core and 32 MHz internal oscillator, ensuring drop-in replacement on the same PCB footprint.
Is PIC12F1822T-E/MF the same as PIC12F1840?
No, the PIC12F1822T-E/MF is not the same as the PIC12F1840. The PIC12F1822 family offers 3.5 KB Flash, 128 B SRAM, 32 MHz CPU, and 6 I/O pins, while the PIC12F1840 family offers 7 KB Flash, 256 B SRAM, 32 MHz CPU, and 6 I/O pins with additional DAC and enhanced peripherals. Both share the 8-pin DFN-EP/SOIC-8 footprint but differ in memory and peripheral count.
What are the key specifications of PIC12F1822T-E/MF that engineers should know?
Engineers specifying the PIC12F1822T-E/MF should note these five key facts: 3.5 KB Flash / 128 B SRAM, 32 MHz internal oscillator (Β±1%), 1.8 V to 5.5 V operating voltage, -40Β°C to +125Β°C automotive grade, and 8-pin DFN-EP package. The nanoWatt XLP technology delivers sub-20 nA sleep current, making it the lowest-power 8-bit automotive-grade PIC option in this pin count per the Microchip product brief.

Engineering reference data for PIC12F1822T-E/MF β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC12F1822T-E/MF when you need the smallest-footprint 8-bit PIC with automotive temperature grade and tape-and-reel packaging for SMT production. It is the right part for under-hood sensor modules, battery-powered IoT nodes, and LED lighting controllers where the DFN-EP (3x3 mm) saves critical PCB area and the -E grade handles engine-bay conditions. Select the PIC12F1822-E/MF when hand-rework or tube feeding is required, and the PIC12F1822-I/MF when industrial-only -40Β°C to +85Β°C range is acceptable. For designs that may outgrow 3.5 KB Flash, prototype on the PIC12F1822T-E/MF and migrate to the PIC16F1823T-I/MF on the same DFN-EP footprint. Avoid the PIC12LF1822T-I/MF if your design requires 5 V operation.

Comparison with Alternatives

Parameter This Product PIC12F1822-E/MF PIC12F1822-I/MF PIC12LF1822T-I/MF PIC12F1822T-I/SN PIC16F1823T-I/MF
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 8-pin DFN-EP (3x3 mm) 8-pin DFN-EP (3x3 mm) - same 8-pin DFN-EP (3x3 mm) - same 8-pin DFN-EP (3x3 mm) - same 8-pin SOIC-8 - different 8-pin DFN-EP - same
Program Flash 3.5 KB 3.5 KB 3.5 KB 3.5 KB 3.5 KB 7 KB
Data SRAM 128 B 128 B 128 B 128 B 128 B 384 B
Operating Voltage 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 3.6 V 1.8 V to 5.5 V 1.8 V to 5.5 V
Temperature Grade -40C to +125C (Automotive) -40C to +125C (Automotive) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial)
Maximum CPU Frequency 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz
I/O Pins 6 + 1 input-only 6 + 1 input-only 6 + 1 input-only 6 + 1 input-only 6 + 1 input-only 12 + 1 input-only (more I/O)

Key Differentiators

  • Automotive -40Β°C to +125Β°C temperature grade in the smallest 8-pin footprint (vs PIC12F1822T-I/SN)
  • Tape-and-reel packaging ready for high-volume SMT production (vs PIC12F1822-E/MF)
  • Pin-compatible upgrade path to PIC16F1823 for future-proofing (vs PIC12LF1822T-I/MF)

Design Notes

The DFN-EP package dissipates heat primarily through the exposed pad on the bottom of the IC. Solder the exposed pad to a PCB thermal pad of at least 10 mmΒ² connected to a ground pour with multiple thermal vias (0.3 mm drill, 1 mm pitch) to keep the junction temperature below +125Β°C in automotive ambient. Without the thermal pad soldered properly, the effective theta_JA rises above 200Β°C/W and the part can exceed its temperature rating at modest switching loads.

Place a 0.1 Β΅F ceramic decoupling capacitor within 5 mm of the VDD pin and an additional 10 Β΅F bulk capacitor at the board power entry point. The nanoWatt XLP sleep current specification assumes a stable VDD ramp; a slow VDD rise can trigger spurious BOR (brown-out reset) events. For battery applications, add a schottky diode to prevent reverse-current damage during battery hot-plug events.

Reserve RA0/ICSPDAT and RA1/ICSPCLK pins for in-circuit serial programming and debugging - do not assign these to user functions unless you have a dedicated production programmer. The MCLR/RA3 pin can be configured as a normal input-only pin by clearing the MCLRE configuration bit, freeing one I/O at the cost of disabling external reset. The 8-pin DFN-EP land pattern follows JEDEC MO-229 with a 0.5 mm pitch.

A common design pitfall is configuring the ADC while the internal FVR (Fixed Voltage Reference) is disabled, causing the ADC reference to float and produce noisy conversions. Always enable the FVR module and wait the datasheet-specified stabilization time (typically < 50 Β΅s) before initiating ADC conversions. Another pitfall is leaving the watchdog timer enabled in deep-sleep firmware loops - use the SWDTEN bit to gate the watchdog only when intentional wake events are expected.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

AEC-Q100 qualified per Microchip product family brief. RoHS and REACH compliant per Microchip product page. -E suffix denotes automotive temperature grade -40Β°C to +125Β°C.

Data verified on: 2026-09-15 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

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