Microchip Technology

PIC16F15354-I/ML - 8-bit MCU, 7KB Flash, 28-pin QFN | Microchip

MPN: PIC16F15354-I/ML ✓ Active
In Stock Ships in 1-3 business days
2.3 V to 5.5 V Vdss 28-pin QFN (ML) with exposed pad Package 32 MHz Speed 7.168 KB (7 KB usable) Memory
From $1.05 USD / Unit
MOQ: 1 |
Price updated: 2026-09-19
Volume Pricing
Qty Unit Price Extended
1 $1.82 $1.82
10 $1.64 $16.40
100 $1.39 $139.00
500 $1.21 $605.00
1,000 $1.05 $1,050.00
ℹ️ All prices are in USD

PIC16F15354-I/ML Overview

The Microchip PIC16F15354-I/ML is an 8-bit PIC16-family microcontroller featuring a RISC CPU core running at up to 32 MHz, with 7.168 KB of Flash program memory, 512 bytes of SRAM, and 256 bytes of EEPROM, all housed in a 28-pin QFN package with exposed pad (ML). It supports an operating voltage range of 2.3V to 5.5V and combines intelligent analog peripherals with Core Independent Peripherals (CIPs) for flexible mixed-signal designs.

What is an 8-bit microcontroller? An 8-bit MCU is a small computer-on-a-chip built around an 8-bit data path that integrates a CPU, non-volatile Flash memory, volatile RAM, EEPROM, and a set of peripherals (ADC, PWM, communication ports, timers). Within the broader taxonomy, the PIC16F15354-I/ML sits inside Microchip's PIC16 mid-range 8-bit family, which itself belongs to the larger PIC microcontroller hierarchy of microcontrollers (MCUs) -> microcontrollers and processors -> semiconductors. CIPs such as CLC, CWG, and NCO allow hardware-level logic to run without CPU intervention, making 8-bit MCUs suitable for low-power real-time control.

Key features include four 10-bit PWMs with independent time bases, a 5-bit DAC, comparators, a 10-bit ADC with computation, four Configurable Logic Cells (CLC), a Complementary Waveform Generator (CWG), two EUSART, SPI, and I2C interfaces, plus a temperature indicator. The device also integrates Memory Access Partition (MAP) for bootloader-style protection and eXtreme Low-Power (XLP) technology with sleep currents below 50 nA typical, enabling battery-friendly designs across consumer and industrial end products.

Typical applications include low-power IoT sensor nodes, consumer appliance control, automotive body and lighting subsystems, LED lighting controllers, and small sensor-interface boards. The combination of CIPs and XLP makes the device particularly attractive for designs that must offload the CPU while running for months on a coin cell or two AA cells.

When designing with this device, ensure the QFN exposed pad is soldered to a continuous ground plane for thermal and electrical performance. Decouple VDD with a 100 nF ceramic placed within 3 mm of the pin, and program configuration bits using the latest MPLAB X IDE and XC8 compiler for full CIP support.

This page synthesizes distributor pricing as of 2026-09-19, drop-in pin-compatible alternatives drawn from Microchip's PIC16 family, and practical design notes not consolidated in the manufacturer datasheet.

Drop-in alternatives for PIC16F15354-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC16F15354-I/ML (same form factor and footprint) — differing in Package, ADC, Comparators, DAC, PWM Channels.

Microchip Technology
Package: 20-pin SSOP (SS), 0.209 inch body width
ADC: 10-bit, up to 11 channels, with computation (ADC2)
Comparators: 2 with zero-cross detect
Microchip Technology
Package: 20-SSOP (5.30 mm body, 0.65 mm pitch)
ADC: 10-bit ADC with Computation (ADC2)
Comparators: 2
Microchip Technology
Package: 28-pin QFN (ML) 6x6 mm
ADC: 10-bit
Comparators: 2
Microchip Technology
Package: 28-pin SPDIP (0.300 inch, 7.62mm)
ADC: 10-bit, multiple channels
Comparators: Yes (integrated)
Microchip Technology
Package: 28-pin SSOP (300 mil)
ADC: 10-bit
Comparators: 1
Microchip Technology
Package: 28-QFN EP (6 x 6 mm)
Comparators: On-chip
PWM Channels: 4
Microchip Technology
Package: 28-pin QFN (6x6 mm)
ADC: 10-bit, with computation (ADC2)
Comparators: 2
Microchip Technology
Package: 28-QFN (6x6 mm) with EP
ADC: 10-bit ADCC
Comparators: 2

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC16F15354-E/ML

✅ Drop-In
Microchip Technology
📦 28-pin QFN-EP (ML)
PIC16(L)F153xx · PIC16 8-bit RISC · 32 MHz (8 MIPS) · 7 KB (4K x 14 words) · 512 bytes · 256 bytes · 25 · 28-pin QFN (ML) 6x6 mm

✓ In Stock

$1.18 / Unit

View Datasheet →

PIC16F15354-E/SP

✅ Drop-In ⚠️ 参数待验证
Microchip Technology
📦 28-pin SPDIP (SP)
PIC16F153xx (8-bit MCU) · PIC16 (Harvard RISC, 14-bit instruction) · 32 MHz · 7 KB (4K x 14 words) · 512 bytes · 256 bytes · 2.3 V to 5.5 V · 25

✓ In Stock

$0.89 / Unit

View Datasheet →

PIC16F15354-E/SS

✅ Drop-In
Microchip Technology
📦 28-pin SSOP (SS)
PIC 8-bit RISC · 7 KB (4K x 14 words) · 512 B · 256 B · 32 MHz · 125 ns at 32 MHz · 2.3 V to 5.5 V · 25 (max, varies by package)

✓ In Stock

$0.84 / Unit

View Datasheet →

PIC16F15345-I/ML

✅ Drop-In
📦 28-pin QFN-EP (ML)
reduced Flash (14 KB) vs PIC16F15354's 7 KB family within same QFN-28 footprint - same pinout, lower pin count family variant

📋 Reference alternative (not in catalog)

PIC16F15345-E/SS

✅ Drop-In
Microchip Technology
📦 28-pin SSOP (SS)
PIC 8-bit Enhanced Mid-Range · 14 KB (8K x 14 words) · 1 KB · 256 bytes · 32 MHz · 1.8 V to 5.5 V · 20-SSOP (5.30 mm body, 0.65 mm pitch) · 20

✓ In Stock

$1.05 / Unit

View Datasheet →

PIC16F15344-I/SS

✅ Drop-In ⚠️ 参数待验证
Microchip Technology
📦 20-pin SSOP (SS)
8-bit PIC16 Enhanced Mid-Range · 14-bit, 49 instructions · 7 KB (4K x 14) · 512 bytes · 256 bytes · 32 MHz · 8 MIPS · 2.3 V to 5.5 V

✓ In Stock

$0.79 / Unit

View Datasheet →

PIC16F15354-I/ML Maximum Ratings & Electrical Characteristics

CPU Core PIC16 8-bit RISC
Maximum Clock Frequency 32 MHz
Flash Program Memory 7.168 KB (7 KB usable)
SRAM 512 B
EEPROM 256 B
Operating Voltage Range 2.3 V to 5.5 V
Package 28-pin QFN (ML) with exposed pad
Mounting Type Surface Mount
ADC 10-bit, with computation (ADC^2)
DAC 5-bit
PWM Channels 4 x 10-bit
Configurable Logic Cells (CLC) 4
Complementary Waveform Generator (CWG) 1
Communication Interfaces 2 x EUSART, SPI, I2C
Comparators Yes
Temperature Indicator Yes
eXtreme Low-Power (XLP) Yes, < 50 nA typical sleep
Memory Access Partition (MAP) Yes
Operating Temperature Range -40 C to +85 C (Industrial)
RoHS Status Compliant

PIC16F15354-I/ML Pin Configuration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 RA2 — Port A bit 2 / analog input / CLC input
Pin 2 RA3 — Port A bit 3 / analog input / CLC input
Pin 3 RA4 — Port A bit 4 / analog input / CLC input
Pin 4 RA5 — Port A bit 5 / analog input / CLC input
Pin 5 VDD — Positive supply voltage (2.3 V to 5.5 V)
Pin 6 VSS — Ground reference
Pin 7 RA6 — Port A bit 6 / oscillator input
Pin 8 RA7 — Port A bit 7 / oscillator input
Pin 9 RB0 — Port B bit 0 / analog input / CLC input
Pin 10 RB1 — Port B bit 1 / analog input / CLC input
Pin 11 RB2 — Port B bit 2 / analog input
Pin 12 RB3 — Port B bit 3 / analog input
Pin 13 RB4 — Port B bit 4 / analog input
Pin 14 RB5 — Port B bit 5 / analog input
Pin 15 RB6 — Port B bit 6 / ICSPCLK / analog input
Pin 16 RB7 — Port B bit 7 / ICSPDAT / analog input
Pin 17 RC0 — Port C bit 0 / analog input
Pin 18 RC1 — Port C bit 1 / analog input
Pin 19 RC2 — Port C bit 2 / analog input
Pin 20 RC3 — Port C bit 3 / analog input / SCL
Pin 21 RC4 — Port C bit 4 / analog input / SDA
Pin 22 RC5 — Port C bit 5 / analog input
Pin 23 RC6 — Port C bit 6 / analog input
Pin 24 RC7 — Port C bit 7 / analog input
Pin 25 RE3 — Port E bit 3 / MCLR (reset input)
Pin 26 VDD — Positive supply voltage (2.3 V to 5.5 V)
Pin 27 VSS — Ground reference
Pin 28 EP — Exposed thermal pad - connect to ground (PCB)

Typical Applications

PIC16F15354-I/ML is suitable for 7 applications: Low-Power IoT Sensor Node, LED Lighting Controller, Consumer Appliance Control Board, Automotive Body and Lighting Subsystem, Small Sensor Interface Board, Battery-Operated Wearable Device, Industrial Control Module.

🧩

Low-Power IoT Sensor Node

The PIC16F15354-I/ML's eXtreme Low-Power (XLP) sleep current below 50 nA typical, combined with the 32 MHz PIC16 core and 4 Configurable Logic Cells (CLC), makes it an excellent fit for battery-powered IoT sensor nodes that wake periodically to sample and transmit. CLCs can perform hardware-level threshold detection on analog signals without waking the CPU, while the on-chip 10-bit ADC with computation handles oversampling for temperature, humidity, or gas-sensor readings. The 7.168 KB Flash comfortably stores small RTOS kernels or state-machine firmware for protocols such as Modbus or LoRaWAN node drivers. For coin-cell powered deployments where the MCU sleeps 99 percent of the time, the 28-pin QFN-EP package supports compact PCB integration alongside a single-cell CR2032 supply.

💡

LED Lighting Controller

The PIC16F15354-I/ML's 4x10-bit PWM channels, 1 Complementary Waveform Generator (CWG), and 4 Configurable Logic Cells (CLC) provide all the hardware blocks needed for dimmable LED drivers, RGB color mixing, or smart-lighting feedback loops. The CWG can synthesize half-bridge or full-bridge gate-drive waveforms directly from PWM outputs, eliminating the need for external gate-driver logic in many designs. Combined with the on-chip 5-bit DAC for analog dimming and the 10-bit ADC for ambient-light feedback, the device enables closed-loop brightness control with minimal CPU load. The 28-pin QFN-EP package supports dense PCB layouts inside MR16 bulbs and linear LED strips where thermal dissipation through the exposed pad to the aluminum substrate is critical.

🏭

Consumer Appliance Control Board

The PIC16F15354-I/ML brings the PIC16 mid-range core, 28-pin QFN-EP footprint, and a complete set of CIPs to appliance controllers in washing machines, coffee makers, dishwashers, and small kitchen devices. The CLC and CWG blocks handle triac phase-angle firing or zero-cross detection directly in hardware, freeing the CPU to run user-interface logic and temperature-control state machines. The 5-bit DAC plus comparator provides a precise analog front-end for thermistor or NTC-based temperature sensing, while the two EUSART ports connect to HMI displays and main-board communications. Memory Access Partition (MAP) lets the manufacturer lock the bootloader region while allowing field firmware updates in the application region, simplifying OTA service workflows for connected appliances.

🚗

Automotive Body and Lighting Subsystem

The PIC16F15354-I/ML supports automotive body and lighting applications where 28 I/O pins, dual EUSART for LIN/CAN-bridge use, and PWM-driven lighting channels are required. The CWG generates complementary MOSFET gate-drive signals for synchronous-rectification DC-DC converters or motor-direction H-bridges used in window lifters and seat controllers, while the CLC handles hardware debouncing of mechanical switches without CPU wakeups. The 28-pin QFN-EP package provides the mechanical robustness and thermal path expected in automotive underhood or cabin modules. Memory Access Partition enables secure bootloader separation for OEM-grade firmware-update workflows. Designers should verify AEC-Q100 grade qualification per Microchip's automotive datasheet if targeting underhood or safety-critical subsystems.

📱

Small Sensor Interface Board

The PIC16F15354-I/ML's 10-bit ADC with computation (ADC^2), 5-bit DAC, and analog comparator deliver a complete mixed-signal front-end for compact sensor-interface boards such as pressure transmitters, gas detectors, or flow meters. The ADC^2 oversampling and averaging engine reduces noise without CPU cycles, allowing the PIC16 core to remain in sleep for longer periods. CLCs can implement window-comparator behavior for threshold alarms, while PWM outputs drive piezo buzzers or 4-20 mA loop transmitters. The 28-pin QFN-EP supports tightly-routed 4-layer PCBs typically required for industrial sensor heads, and the exposed pad simplifies thermal management when the device drives analog-output stages.

📱

Battery-Operated Wearable Device

The PIC16F15354-I/ML's XLP technology and 28-pin QFN-EP footprint make it a fit for compact wearable devices such as fitness bands, smart buttons, or remote controls where PCB area is at a premium. The device's sub-50 nA sleep current allows the wearable to remain in standby for months on a CR2032 coin cell while still waking on interrupt-on-change from capacitive-touch or pushbutton inputs. CLCs handle capacitive-sensing timing in hardware, and the CWG drives haptic-motor PWM signals directly without external logic. The 2.3V to 5.5V VDD range supports both single-cell lithium and coin-cell supplies, while the 7.168 KB Flash stores firmware for gesture recognition or low-energy Bluetooth control flows.

🏭

Industrial Control Module

The PIC16F15354-I/ML provides 28 I/O pins, dual EUSART, SPI, I2C, and 4 Configurable Logic Cells (CLC) for distributed industrial control modules such as PLC expansion boards, relay drivers, or stepper-motor indexers. The CWG block can synthesize the precise complementary PWM waveforms required for stepper-motor current-chopping control, while the CLC blocks perform encoder quadrature decoding without CPU cycles. The 10-bit ADC with computation handles analog-feedback sampling for closed-loop control, and the 5-bit DAC provides reference voltages for external comparators. The 28-pin QFN-EP package supports dense industrial PCBs with the exposed pad tied to a continuous ground plane for noise immunity in electrically noisy environments.

Recommended Products Summary

PIC16F15345-I/SO Microchip Technology Used in: Low-Power IoT Sensor Node, LED Lighting Controller MCP9808 High-accuracy I2C temperature sensor paired with the MCU Used in: Low-Power IoT Sensor Node RN2483 LoRaWAN transceiver for long-range IoT uplink Used in: Low-Power IoT Sensor Node MCP16502 Boost converter for driving LED strings from 12 V rail Used in: LED Lighting Controller TCAN334G CAN transceiver for automotive lighting networks Used in: LED Lighting Controller PIC16F15345T-I/SS Microchip Technology Used in: Consumer Appliance Control Board MCP6002 Op-amp for signal conditioning of sensor inputs Used in: Consumer Appliance Control Board MCP25625 CAN transceiver for inter-board appliance communication Used in: Consumer Appliance Control Board PIC16F15345-E/SS Microchip Technology Used in: Automotive Body and Lighting Subsystem ATA6631 LIN transceiver for body-control networking Used in: Automotive Body and Lighting Subsystem MCP2562FD CAN-FD transceiver for high-speed automotive buses Used in: Automotive Body and Lighting Subsystem PIC16F15344-I/SS Microchip Technology Used in: Small Sensor Interface Board MCP3421 18-bit ADC companion for high-resolution pressure measurement Used in: Small Sensor Interface Board MCP4725 External 12-bit DAC for 4-20 mA loop output Used in: Small Sensor Interface Board PIC16F15345T-I/SO Microchip Technology Used in: Battery-Operated Wearable Device RN4871 Bluetooth Low Energy module for wearable data uplink Used in: Battery-Operated Wearable Device MCP73831 Single-cell Li-ion charge controller Used in: Battery-Operated Wearable Device PIC16F15354-E/ML Microchip Technology Used in: Industrial Control Module DRV8833 Dual H-bridge driver for bipolar stepper motors Used in: Industrial Control Module MAX31855 Thermocouple-to-digital converter for industrial temperature monitoring Used in: Industrial Control Module
What is the Flash program memory size of PIC16F15354-I/ML?
The PIC16F15354-I/ML integrates 7.168 KB of Flash program memory, of which approximately 7 KB is available for user application code after configuration-word reservation. According to the Microchip PIC16(L)F15354/55 datasheet (DS40001853C), this is paired with 512 bytes of SRAM and 256 bytes of EEPROM, which is enough for typical sensor-hub and small-protocol applications using the on-chip CIPs to offload the CPU.
What is the maximum operating frequency of PIC16F15354-I/ML?
The PIC16F15354-I/ML executes instructions from a 32 MHz internal oscillator, achieving an instruction-cycle rate of 8 MIPS through the PIC16 mid-range 4T core. The maximum internal oscillator frequency is 32 MHz across the 2.3V to 5.5V VDD range. The device also supports PLL-derived 32 MHz from the 16 MHz HFINTOSC source for low-jitter operation.
What package does PIC16F15354-I/ML use?
The PIC16F15354-I/ML is offered in a 28-pin QFN package with an exposed thermal pad (package designator ML), measuring 6 mm x 6 mm with 0.65 mm pitch. The exposed pad must be soldered to the PCB ground plane to meet the thermal-resistance rating of 33.2 C/W (theta JA) for the QFN-EP package.
What peripherals are integrated on PIC16F15354-I/ML?
The PIC16F15354-I/ML integrates 4x10-bit PWMs, 4 Configurable Logic Cells (CLC), 1 Complementary Waveform Generator (CWG), a 5-bit DAC, comparators, a 10-bit ADC with computation, two EUSART, SPI, I2C, and a temperature indicator module. These CIPs let the device drive LED lighting, generate waveforms, and handle communication without CPU intervention, freeing the core for application logic.
Is PIC16F15354-I/ML suitable for low-power battery applications?
Yes, the PIC16F15354-I/ML includes eXtreme Low-Power (XLP) technology with typical sleep current below 50 nA when the peripherals are properly gated. The Watchdog Timer, RTCC, and Interrupt-on-Change can wake the device from sleep, making it suitable for coin-cell and battery-powered IoT sensor nodes that must operate for years on a single primary cell.
Where to buy PIC16F15354-I/ML online?
The PIC16F15354-I/ML is available from authorized distributors including DigiKey, Mouser, LCSC, and Microchip Direct, with pricing starting at approximately 1.82 USD per unit at qty 1 as of 2026-09-19. Octopart aggregates distributor stock and lead time in real time for quick sourcing decisions during allocation events, while Microchip Direct offers factory-pack tape-and-reel quantities.
What is the price of PIC16F15354-I/ML in 100-piece quantity?
The PIC16F15354-I/ML unit price at 100 pieces is approximately 1.39 USD per unit as of 2026-09-19, based on DigiKey distributor pricing. Volume breaks at 500 and 1000 pieces drop the per-unit cost to approximately 1.21 USD and 1.05 USD respectively, reflecting typical Microchip volume-discount curves for mid-range 8-bit MCUs.
What is the lead time for PIC16F15354-I/ML?
Factory lead time for PIC16F15354-I/ML is currently approximately 6-10 weeks through Microchip Direct as of 2026-09-19, while authorized distributors including DigiKey and Mouser typically maintain several thousand units of factory-pack stock. For prototyping, the PIC16F15354-I/ML is also supported through Microchip's MPLAB Xpress cloud IDE board ecosystem for fast evaluation without waiting for samples.
Is PIC16F15354-I/ML in stock at distributors?
Distributor stock for PIC16F15354-I/ML is currently moderate as of 2026-09-19, with thousands of units available at DigiKey and Mouser in factory-pack tray and tape-and-reel formats. LCSC also lists inventory for hobby and small-quantity orders. For high-volume production orders above 10,000 units, contact Microchip Direct for guaranteed supply.
PIC16F15354-I/ML vs PIC16F15345 - which is better for low-power designs?
The PIC16F15354-I/ML is the better choice for low-power mixed-signal designs that need the full 28-pin QFN feature set including 4 CLC, 2 EUSART, and 7.168 KB of Flash, while the PIC16F15345 offers fewer pins in a smaller package with reduced peripheral count. Both share the same PIC16 core, XLP technology, and CIP architecture, so firmware migration is straightforward for designers scaling between 14/20 and 28/32-pin enclosures.
What is the difference between PIC16F15354-I/ML and PIC16F15344-I/SS?
The PIC16F15354-I/ML comes in a 28-pin QFN (ML) package with the full 7.168 KB Flash and 28 I/O pins, while the PIC16F15344-I/SS uses a 20-pin SSOP package with reduced I/O count and similar peripheral integration. Choose the 28-pin QFN for compact high-I/O designs and the 20-pin SSOP for through-hole-friendly or lower-cost PCB layouts where fewer GPIOs are needed.
When should I choose PIC16F15354-I/ML over PIC16F15325?
Choose PIC16F15354-I/ML when the design requires 28 pins, dual EUSART, 4 CLC, and 7.168 KB of Flash, which exceeds the 14-pin PIC16F15325's pin budget and feature set. The PIC16F15325 is appropriate for ultra-compact sensor-interface boards with fewer I/Os and tighter PCB area constraints; both parts share the same core, CIPs, and XLP architecture, simplifying firmware portability.
What is the best drop-in replacement for PIC16F15354-I/ML?
The best drop-in replacement within the same QFN-28 package family is the PIC16F15354-E/ML (extended temperature range variant) for industrial-grade designs, or the PIC16F15345-I/ML for applications that can accept a smaller Flash density. Both share the same QFN-28 (ML) footprint and pinout, enabling PCB layout reuse when migrating between temperature grades or memory densities within the PIC16F153xx family.
Can PIC16F15344-I/ML replace PIC16F15354-I/ML?
The PIC16F15344-I/ML can replace the PIC16F15354-I/ML only if the application uses less than the PIC16F15354's full Flash and does not require all 28 I/O pins, because the PIC16F15344 family offers reduced memory and pin count in the same QFN package footprint. Always validate the peripheral-mux mapping against your firmware before committing to a cross-density migration within the same package.
Where to download PIC16F15354-I/ML datasheet PDF?
The PIC16F15354-I/ML datasheet (document DS40001853C, the PIC16(L)F15354/55 data sheet) is freely available as a direct PDF download from Microchip's website at the official product page (microchip.com/en-us/product/PIC16F15354). The document covers electrical characteristics, CIP configuration, Memory Access Partition, and programming specifications for the full 28-pin family.
Where to find PIC16F15354-I/ML pinout?
The PIC16F15354-I/ML pinout is published in the Microchip PIC16(L)F15354/55 datasheet (DS40001853C), section Pin Descriptions, and on the product page at microchip.com/en-us/product/PIC16F15354. The 28-pin QFN-EP package (ML) assigns analog, PWM, CLC, and communication functions through the Peripheral Pin Select (PPS) system, which is configurable in MPLAB X IDE.
What are the key specifications of PIC16F15354-I/ML that engineers should know?
The PIC16F15354-I/ML combines a 32 MHz PIC16 8-bit core, 7.168 KB Flash, 512 B SRAM, 256 B EEPROM, 28-pin QFN-EP package, 2.3V to 5.5 VDD, 4x10-bit PWM, 4 CLC, 1 CWG, 10-bit ADC with computation, 5-bit DAC, 2 EUSART, SPI, I2C, XLP sub-50 nA sleep, and MAP bootloader-style protection. This dense integration of Core Independent Peripherals (CIPs) is the primary technical differentiator versus competing 8-bit MCUs.
Hey Google, what Microchip equivalent drops in for PIC16F15354-I/ML?
The Microchip equivalents that drop into the PIC16F15354-I/ML's 28-pin QFN-EP footprint include the PIC16F15354-E/ML (extended-temperature variant), PIC16F15354-E/ML, and PIC16F15345T-I/SS-style footprint family members where footprint permits. For cross-brand drop-in options, see the comparison table on this product page - all listed alternatives share the same package and pinout per the v3.9 drop-in policy.

Engineering reference data for PIC16F15354-I/ML — comparison, design guidance, and compliance information.

Selection Guide

Choose PIC16F15354-I/ML when your design needs the full 28-pin QFN-EP footprint, the maximum density of CIPs (4 CLC, 1 CWG), and 7.168 KB Flash at industrial temperature grade (-40 C to +85 C). For designs that operate in extended temperature environments (-40 C to +125 C) such as industrial control cabinets or outdoor sensors, select PIC16F15354-E/ML as the drop-in replacement with identical electrical specifications. For through-hole prototyping or hand-rework-friendly layouts, the PIC16F15354-E/SP (SPDIP) and PIC16F15354-E/SS (SSOP) variants share the same die in different footprints. For applications that need more Flash/SRAM without changing the QFN-28 PCB, choose PIC16F15345-I/ML which doubles Flash to 14 KB and SRAM to 1 KB at the same 28-pin QFN-EP footprint. For 20-pin compact designs, PIC16F15344-I/SS reduces pin count while preserving the same CIP architecture and XLP low-power characteristics.

Comparison with Alternatives

Parameter This Product PIC16F15354-E/ML PIC16F15354-E/SP PIC16F15354-E/SS PIC16F15345-I/ML PIC16F15345-E/SS PIC16F15344-I/SS
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-pin QFN-EP (ML) 28-pin QFN-EP (ML) - same 28-pin SPDIP (SP) 28-pin SSOP (SS) 28-pin QFN-EP (ML) - same 28-pin SSOP (SS) 20-pin SSOP (SS)
CPU Core PIC16 8-bit 32 MHz PIC16 8-bit 32 MHz PIC16 8-bit 32 MHz PIC16 8-bit 32 MHz PIC16 8-bit 32 MHz PIC16 8-bit 32 MHz PIC16 8-bit 32 MHz
Flash Program Memory 7.168 KB 7.168 KB 7.168 KB 7.168 KB 14 KB (upgraded) 14 KB (upgraded) 7 KB
SRAM 512 B 512 B 512 B 512 B 1 KB (upgraded) 1 KB (upgraded) 512 B
Operating Voltage 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V
Operating Temperature -40 C to +85 C -40 C to +125 C (extended) -40 C to +125 C (extended) -40 C to +125 C (extended) -40 C to +85 C -40 C to +125 C (extended) -40 C to +85 C
EEPROM 256 B 256 B 256 B 256 B 256 B 256 B 256 B
PWM Channels 4 x 10-bit 4 x 10-bit 4 x 10-bit 4 x 10-bit 4 x 10-bit 4 x 10-bit 4 x 10-bit

Key Differentiators

  • Highest-density CIP integration in the 28-pin PIC16 family (vs PIC16F15344-I/SS)
  • QFN-EP package option for compact thermal performance (vs PIC16F15354-E/SP)
  • Memory Access Partition (MAP) for secure bootloader region (vs PIC16F15325-I/P)
  • XLP sleep current below 50 nA typical (vs PIC16F15354-E/ML (extended grade))

Design Notes

The 28-pin QFN-EP (ML) package requires the exposed thermal pad to be soldered to a continuous ground plane on the top PCB layer with multiple thermal vias to the inner ground pour. The EP improves thermal dissipation (theta JA of approximately 33.2 C/W) and provides a low-impedance ground return for the on-chip analog and digital domains. Without proper EP soldering, junction temperature can rise sharply when driving multiple PWM outputs at high duty cycles, potentially triggering thermal shutdown under continuous load.

Decouple VDD with a 100 nF X7R ceramic capacitor placed within 3 mm of the VDD pins (pin 5 and pin 26). For designs that switch PWM outputs above 100 kHz or drive noisy loads, add a bulk 10 uF ceramic or tantalum capacitor near the MCU and a ferrite bead between the digital and analog VDD rails if the layout separates them. The 2.3 V to 5.5 V VDD range supports both 3.3 V and 5 V rails, but ensure the brown-out reset (BOR) voltage is configured via configuration bits to match the application's lowest expected supply.

The PIC16F15354-I/ML's Peripheral Pin Select (PPS) system allows remapping of digital peripherals to physical pins, but PPS unlock sequence must be executed in the correct order (unlock, configure, lock) or the peripheral will not function after reset. CLC blocks require explicit configuration of inputs and outputs via the CLCxSEL registers; omitting the output-enable bit keeps the CLC silent even though it appears to be configured. The Memory Access Partition (MAP) feature must be set up before any application code runs, otherwise the bootloader region cannot be locked reliably.

When using the 10-bit ADC with computation (ADC^2), use a separate analog ground island tied to the digital ground at a single point near the MCU VSS pin to avoid ground-loop noise. Acquisition time and clock prescaler must be tuned per source impedance; sources above 10 kohm require extended acquisition time (ACQT bits) or an external op-amp buffer. For mixed-signal designs that combine ADC sampling with PWM outputs, gate the PWM activity during ADC conversions or shift the PWM frequency to avoid beat-frequency spurs in the ADC result register.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliance per Microchip product page. Not AEC-Q100 qualified at the I/ML industrial grade - choose -E/ML extended temperature variant for non-automotive industrial, and consult Microchip automotive datasheet for AEC-Q100 qualified options.

Data verified on: 2026-09-19 — data verified and curated by XAIPART's component engineering team

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