PIC16F15354-I/ML - 8-bit MCU, 7KB Flash, 28-pin QFN | Microchip
N.º da peça: PIC16F15354-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1.82 | $1,82 |
| 10 | $1.64 | $16,40 |
| 100 | $1.39 | $139,00 |
| 500 | $1.21 | $605,00 |
| 1.000 | $1.05 | $1.050,00 |
PIC16F15354-I/ML Visão geral
What is an 8-bit microcontroller? An 8-bit MCU is a small computer-on-a-chip built around an 8-bit data path that integrates a CPU, non-volatile Flash memory, volatile RAM, EEPROM, and a set of peripherals (ADC, PWM, communication ports, timers). Within the broader taxonomy, the PIC16F15354-I/ML sits inside Microchip's PIC16 mid-range 8-bit family, which itself belongs to the larger PIC microcontroller hierarchy of microcontrollers (MCUs) -> microcontrollers and processors -> semiconductors. CIPs such as CLC, CWG, and NCO allow hardware-level logic to run without CPU intervention, making 8-bit MCUs suitable for low-power real-time control.
Key features include four 10-bit PWMs with independent time bases, a 5-bit DAC, comparators, a 10-bit ADC with computation, four Configurable Logic Cells (CLC), a Complementary Waveform Generator (CWG), two EUSART, SPI, and I2C interfaces, plus a temperature indicator. The device also integrates Memory Access Partition (MAP) for bootloader-style protection and eXtreme Low-Power (XLP) technology with sleep currents below 50 nA typical, enabling battery-friendly designs across consumer and industrial end products.
Typical applications include low-power IoT sensor nodes, consumer appliance control, automotive body and lighting subsystems, LED lighting controllers, and small sensor-interface boards. The combination of CIPs and XLP makes the device particularly attractive for designs that must offload the CPU while running for months on a coin cell or two AA cells.
When designing with this device, ensure the QFN exposed pad is soldered to a continuous ground plane for thermal and electrical performance. Decouple VDD with a 100 nF ceramic placed within 3 mm of the pin, and program configuration bits using the latest MPLAB X IDE and XC8 compiler for full CIP support.
This page synthesizes distributor pricing as of 2026-09-19, drop-in pin-compatible alternatives drawn from Microchip's PIC16 family, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para PIC16F15354-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F15354-I/ML (mesmo formato e footprint) — diferindo em Package, ADC, Comparators, DAC, PWM Channels.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F15354-E/ML
✅ Drop-In✓ Em estoque
$1.18 / unidade
Ver ficha técnica →PIC16F15354-E/SP
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$0.89 / unidade
Ver ficha técnica →PIC16F15354-E/SS
✅ Drop-In✓ Em estoque
$0.84 / unidade
Ver ficha técnica →PIC16F15345-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F15345-E/SS
✅ Drop-In✓ Em estoque
$1.05 / unidade
Ver ficha técnica →PIC16F15344-I/SS
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$0.79 / unidade
Ver ficha técnica →PIC16F15354-I/ML Classificações máximas e características elétricas
| CPU Core | PIC16 8-bit RISC |
| Frequência máxima de clock | 32 MHz |
| Flash Program Memory | 7.168 KB (7 KB usable) |
| SRAM | 512 B |
| EEPROM | 256 B |
| Operating Voltage Range | 2.3 V to 5.5 V |
| Encapsulamento | 28-pin QFN (ML) with exposed pad |
| Tipo de montagem | Surface Mount |
| ADC | 10-bit, with computation (ADC^2) |
| DAC | 5-bit |
| PWM Channels | 4 x 10-bit |
| Configurable Logic Cells (CLC) | 4 |
| Complementary Waveform Generator (CWG) | 1 |
| Communication Interfaces | 2 x EUSART, SPI, I2C |
| Comparators | Yes |
| Temperature Indicator | Yes |
| eXtreme Low-Power (XLP) | Yes, < 50 nA typical sleep |
| Memory Access Partition (MAP) | Yes |
| Faixa de temperatura de operação | -40 C to +85 C (Industrial) |
| Status RoHS | Compliant |
Configuração de pinos do PIC16F15354-I/ML
| Pino 1 | RA2 — Port A bit 2 / analog input / CLC input |
| Pino 2 | RA3 — Port A bit 3 / analog input / CLC input |
| Pino 3 | RA4 — Port A bit 4 / analog input / CLC input |
| Pino 4 | RA5 — Port A bit 5 / analog input / CLC input |
| Pino 5 | VDD — Positive supply voltage (2.3 V to 5.5 V) |
| Pino 6 | VSS — Ground reference |
| Pino 7 | RA6 — Port A bit 6 / oscillator input |
| Pino 8 | RA7 — Port A bit 7 / oscillator input |
| Pino 9 | RB0 — Port B bit 0 / analog input / CLC input |
| Pino 10 | RB1 — Port B bit 1 / analog input / CLC input |
| Pino 11 | RB2 — Port B bit 2 / analog input |
| Pino 12 | RB3 — Port B bit 3 / analog input |
| Pino 13 | RB4 — Port B bit 4 / analog input |
| Pino 14 | RB5 — Port B bit 5 / analog input |
| Pino 15 | RB6 — Port B bit 6 / ICSPCLK / analog input |
| Pino 16 | RB7 — Port B bit 7 / ICSPDAT / analog input |
| Pino 17 | RC0 — Port C bit 0 / analog input |
| Pino 18 | RC1 — Port C bit 1 / analog input |
| Pino 19 | RC2 — Port C bit 2 / analog input |
| Pino 20 | RC3 — Port C bit 3 / analog input / SCL |
| Pino 21 | RC4 — Port C bit 4 / analog input / SDA |
| Pino 22 | RC5 — Port C bit 5 / analog input |
| Pino 23 | RC6 — Port C bit 6 / analog input |
| Pino 24 | RC7 — Port C bit 7 / analog input |
| Pino 25 | RE3 — Port E bit 3 / MCLR (reset input) |
| Pino 26 | VDD — Positive supply voltage (2.3 V to 5.5 V) |
| Pino 27 | VSS — Ground reference |
| Pino 28 | EP — Exposed thermal pad - connect to ground (PCB) |
Aplicações típicas
PIC16F15354-I/ML é adequado para 7 aplicaçãos: Low-Power IoT Sensor Node, LED Lighting Controller, Consumer Appliance Control Board, Automotive Body and Lighting Subsystem, Small Sensor Interface Board, Battery-Operated Wearable Device, Industrial Control Module.
Low-Power IoT Sensor Node
The PIC16F15354-I/ML's eXtreme Low-Power (XLP) sleep current below 50 nA typical, combined with the 32 MHz PIC16 core and 4 Configurable Logic Cells (CLC), makes it an excellent fit for battery-powered IoT sensor nodes that wake periodically to sample and transmit. CLCs can perform hardware-level threshold detection on analog signals without waking the CPU, while the on-chip 10-bit ADC with computation handles oversampling for temperature, humidity, or gas-sensor readings. The 7.168 KB Flash comfortably stores small RTOS kernels or state-machine firmware for protocols such as Modbus or LoRaWAN node drivers. For coin-cell powered deployments where the MCU sleeps 99 percent of the time, the 28-pin QFN-EP package supports compact PCB integration alongside a single-cell CR2032 supply.
Recomendado
LED Lighting Controller
The PIC16F15354-I/ML's 4x10-bit PWM channels, 1 Complementary Waveform Generator (CWG), and 4 Configurable Logic Cells (CLC) provide all the hardware blocks needed for dimmable LED drivers, RGB color mixing, or smart-lighting feedback loops. The CWG can synthesize half-bridge or full-bridge gate-drive waveforms directly from PWM outputs, eliminating the need for external gate-driver logic in many designs. Combined with the on-chip 5-bit DAC for analog dimming and the 10-bit ADC for ambient-light feedback, the device enables closed-loop brightness control with minimal CPU load. The 28-pin QFN-EP package supports dense PCB layouts inside MR16 bulbs and linear LED strips where thermal dissipation through the exposed pad to the aluminum substrate is critical.
Recomendado
Consumer Appliance Control Board
The PIC16F15354-I/ML brings the PIC16 mid-range core, 28-pin QFN-EP footprint, and a complete set of CIPs to appliance controllers in washing machines, coffee makers, dishwashers, and small kitchen devices. The CLC and CWG blocks handle triac phase-angle firing or zero-cross detection directly in hardware, freeing the CPU to run user-interface logic and temperature-control state machines. The 5-bit DAC plus comparator provides a precise analog front-end for thermistor or NTC-based temperature sensing, while the two EUSART ports connect to HMI displays and main-board communications. Memory Access Partition (MAP) lets the manufacturer lock the bootloader region while allowing field firmware updates in the application region, simplifying OTA service workflows for connected appliances.
Recomendado
Automotive Body and Lighting Subsystem
The PIC16F15354-I/ML supports automotive body and lighting applications where 28 I/O pins, dual EUSART for LIN/CAN-bridge use, and PWM-driven lighting channels are required. The CWG generates complementary MOSFET gate-drive signals for synchronous-rectification DC-DC converters or motor-direction H-bridges used in window lifters and seat controllers, while the CLC handles hardware debouncing of mechanical switches without CPU wakeups. The 28-pin QFN-EP package provides the mechanical robustness and thermal path expected in automotive underhood or cabin modules. Memory Access Partition enables secure bootloader separation for OEM-grade firmware-update workflows. Designers should verify AEC-Q100 grade qualification per Microchip's automotive datasheet if targeting underhood or safety-critical subsystems.
Recomendado
Small Sensor Interface Board
The PIC16F15354-I/ML's 10-bit ADC with computation (ADC^2), 5-bit DAC, and analog comparator deliver a complete mixed-signal front-end for compact sensor-interface boards such as pressure transmitters, gas detectors, or flow meters. The ADC^2 oversampling and averaging engine reduces noise without CPU cycles, allowing the PIC16 core to remain in sleep for longer periods. CLCs can implement window-comparator behavior for threshold alarms, while PWM outputs drive piezo buzzers or 4-20 mA loop transmitters. The 28-pin QFN-EP supports tightly-routed 4-layer PCBs typically required for industrial sensor heads, and the exposed pad simplifies thermal management when the device drives analog-output stages.
Recomendado
Battery-Operated Wearable Device
The PIC16F15354-I/ML's XLP technology and 28-pin QFN-EP footprint make it a fit for compact wearable devices such as fitness bands, smart buttons, or remote controls where PCB area is at a premium. The device's sub-50 nA sleep current allows the wearable to remain in standby for months on a CR2032 coin cell while still waking on interrupt-on-change from capacitive-touch or pushbutton inputs. CLCs handle capacitive-sensing timing in hardware, and the CWG drives haptic-motor PWM signals directly without external logic. The 2.3V to 5.5V VDD range supports both single-cell lithium and coin-cell supplies, while the 7.168 KB Flash stores firmware for gesture recognition or low-energy Bluetooth control flows.
Recomendado
Industrial Control Module
The PIC16F15354-I/ML provides 28 I/O pins, dual EUSART, SPI, I2C, and 4 Configurable Logic Cells (CLC) for distributed industrial control modules such as PLC expansion boards, relay drivers, or stepper-motor indexers. The CWG block can synthesize the precise complementary PWM waveforms required for stepper-motor current-chopping control, while the CLC blocks perform encoder quadrature decoding without CPU cycles. The 10-bit ADC with computation handles analog-feedback sampling for closed-loop control, and the 5-bit DAC provides reference voltages for external comparators. The 28-pin QFN-EP package supports dense industrial PCBs with the exposed pad tied to a continuous ground plane for noise immunity in electrically noisy environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F15354-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F15354-E/ML | PIC16F15354-E/SP | PIC16F15354-E/SS | PIC16F15345-I/ML | PIC16F15345-E/SS | PIC16F15344-I/SS |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-pin QFN-EP (ML) | 28-pin QFN-EP (ML) - same | 28-pin SPDIP (SP) | 28-pin SSOP (SS) | 28-pin QFN-EP (ML) - same | 28-pin SSOP (SS) | 20-pin SSOP (SS) |
| CPU Core | PIC16 8-bit 32 MHz | PIC16 8-bit 32 MHz | PIC16 8-bit 32 MHz | PIC16 8-bit 32 MHz | PIC16 8-bit 32 MHz | PIC16 8-bit 32 MHz | PIC16 8-bit 32 MHz |
| Flash Program Memory | 7.168 KB | 7.168 KB | 7.168 KB | 7.168 KB | 14 KB (upgraded) | 14 KB (upgraded) | 7 KB |
| SRAM | 512 B | 512 B | 512 B | 512 B | 1 KB (upgraded) | 1 KB (upgraded) | 512 B |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
| Operating Temperature | -40 C to +85 C | -40 C to +125 C (extended) | -40 C to +125 C (extended) | -40 C to +125 C (extended) | -40 C to +85 C | -40 C to +125 C (extended) | -40 C to +85 C |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| PWM Channels | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit |
Principais diferenciais
- Highest-density CIP integration in the 28-pin PIC16 family (vs PIC16F15344-I/SS)
- QFN-EP package option for compact thermal performance (vs PIC16F15354-E/SP)
- Memory Access Partition (MAP) for secure bootloader region (vs PIC16F15325-I/P)
- XLP sleep current below 50 nA typical (vs PIC16F15354-E/ML (extended grade))
Notas de projeto
The 28-pin QFN-EP (ML) package requires the exposed thermal pad to be soldered to a continuous ground plane on the top PCB layer with multiple thermal vias to the inner ground pour. The EP improves thermal dissipation (theta JA of approximately 33.2 C/W) and provides a low-impedance ground return for the on-chip analog and digital domains. Without proper EP soldering, junction temperature can rise sharply when driving multiple PWM outputs at high duty cycles, potentially triggering thermal shutdown under continuous load.
Decouple VDD with a 100 nF X7R ceramic capacitor placed within 3 mm of the VDD pins (pin 5 and pin 26). For designs that switch PWM outputs above 100 kHz or drive noisy loads, add a bulk 10 uF ceramic or tantalum capacitor near the MCU and a ferrite bead between the digital and analog VDD rails if the layout separates them. The 2.3 V to 5.5 V VDD range supports both 3.3 V and 5 V rails, but ensure the brown-out reset (BOR) voltage is configured via configuration bits to match the application's lowest expected supply.
The PIC16F15354-I/ML's Peripheral Pin Select (PPS) system allows remapping of digital peripherals to physical pins, but PPS unlock sequence must be executed in the correct order (unlock, configure, lock) or the peripheral will not function after reset. CLC blocks require explicit configuration of inputs and outputs via the CLCxSEL registers; omitting the output-enable bit keeps the CLC silent even though it appears to be configured. The Memory Access Partition (MAP) feature must be set up before any application code runs, otherwise the bootloader region cannot be locked reliably.
When using the 10-bit ADC with computation (ADC^2), use a separate analog ground island tied to the digital ground at a single point near the MCU VSS pin to avoid ground-loop noise. Acquisition time and clock prescaler must be tuned per source impedance; sources above 10 kohm require extended acquisition time (ACQT bits) or an external op-amp buffer. For mixed-signal designs that combine ADC sampling with PWM outputs, gate the PWM activity during ADC conversions or shift the PWM frequency to avoid beat-frequency spurs in the ADC result register.
Informações de conformidade
RoHS and REACH compliance per Microchip product page. Not AEC-Q100 qualified at the I/ML industrial grade - choose -E/ML extended temperature variant for non-automotive industrial, and consult Microchip automotive datasheet for AEC-Q100 qualified options.
