PIC16F1713T-I/ML - 8-Bit 32MHz 7KB Flash MCU | Microchip
MPN: PIC16F1713T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.62 | $1.62 |
| 10 | $1.46 | $14.60 |
| 100 | $1.21 | $121.00 |
| 500 | $1.02 | $510.00 |
| 1,000 | $0.85 | $850.00 |
PIC16F1713T-I/ML Overview
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (typically Flash), data memory (SRAM), non-volatile EEPROM, and a suite of on-chip peripherals such as timers, ADC, communication interfaces, and I/O. PIC microcontrollers from Microchip use a RISC-based 8-bit core with a 14-bit instruction word, classified within the 8-bit MCU segment of the broader microcontroller > embedded controller > semiconductor taxonomy. The PIC16F1713 belongs to the mid-range PIC16 enhanced family, bridging the gap between baseline PIC10/12/16 and the higher-performance PIC18/dsPIC families.
Key features include on-chip operational amplifiers (Op Amps), Core Independent Peripherals (CLC, COG, NCO and Zero Cross Detect), Peripheral Pin Select (PPS), a 10-bit ADC with computation, 8-bit DAC, comparators, and PWM/Signal Measurement Timers. The XLP technology delivers nanoWatt deep-sleep currents suitable for battery-powered sensor nodes and IoT edge devices. Memory-mapped peripherals and PPS enable flexible routing of digital functions to physical pins without rewiring the PCB.
Architecturally, the PIC16F1713 uses Microchip's enhanced mid-range core with a 14-bit instruction set, hardware multiplier, and 16-level stack. The 'T' suffix denotes tape-and-reel packaging for high-volume assembly, while the 'I' grade specifies the industrial temperature range (-40 °C to +85 °C). The 28-QFN package exposes the die ground pad to improve thermal dissipation and electrical grounding for noise-sensitive analog designs.
Typical applications include sensor signal conditioning with on-chip op-amps, LED lighting control using COG and PWM, low-power IoT battery nodes, motor control signal generation, and general-purpose mixed-signal embedded systems. Designers favor this part when the on-chip analog integration eliminates external components and reduces BOM cost.
When designing, place decoupling capacitors within 2 mm of each VDD pin and provide a low-impedance ground pour under the exposed pad. PPS reassignment must respect the peripheral-to-pin mapping table in the datasheet; consult Microchip MPLAB X IDE Configurator Code for the supported mappings.
This page synthesizes distributor pricing, drop-in alternatives across the PIC16F171x family, and practical design notes compiled from the manufacturer datasheet and verified distributor data not aggregated on any single vendor page.
Drop-in alternatives for PIC16F1713T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F1713T-I/ML (same form factor and footprint) — differing in ADC, Comparators, Core Architecture, DAC, Maximum CPU Speed.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F1713-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F1713-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F1716-I/ML
✅ Drop-In✓ In Stock
$0.98 / Unit
View Datasheet →PIC16F1713T-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | 8-bit PIC enhanced mid-range |
| Instruction Set Width | 14-bit |
| Program Memory (Flash) | 7 KB (4K x 14) |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 1.8 V to 5.5 V |
| I/O Pins | 25 (approx.) |
| ADC | 10-bit, with Computation |
| DAC | 8-bit, on-chip |
| On-chip Op Amps | Yes |
| Comparators | Yes |
| Core Independent Peripherals | CLC, COG, NCO, Zero Cross Detect |
| Peripheral Pin Select (PPS) | Yes |
| PWM Modules | Yes (multiple) |
| Timers | Multiple 8/16-bit |
| Package | 28-pin QFN (6x6 mm) with EP |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| RoHS Status | Compliant |
| Low-Power Technology | XLP (eXtreme Low Power) |
PIC16F1713T-I/ML Pin Configuration
| Pin 1 | RA5 — GPIO / analog input / peripheral pin select I/O |
| Pin 2 | RA4 — GPIO / analog input / peripheral pin select I/O |
| Pin 3 | RA3 — GPIO / analog input / peripheral pin select I/O |
| Pin 4 | RA2 — GPIO / analog input / peripheral pin select I/O |
| Pin 5 | RA1 — GPIO / analog input / peripheral pin select I/O |
| Pin 6 | VSS — Ground reference |
| Pin 7 | VDD — Positive supply voltage |
| Pin 8 | RA0 — GPIO / analog input / peripheral pin select I/O |
| Pin 9 | RC5 — GPIO / peripheral pin select I/O |
| Pin 10 | RC4 — GPIO / peripheral pin select I/O |
| Pin 11 | RC3 — GPIO / peripheral pin select I/O |
| Pin 12 | RC2 — GPIO / peripheral pin select I/O |
| Pin 13 | RC1 — GPIO / peripheral pin select I/O |
| Pin 14 | RC0 — GPIO / peripheral pin select I/O |
| Pin 15 | OSC2 — Crystal oscillator output / CLKO |
| Pin 16 | OSC1 — Crystal oscillator input / CLKI |
| Pin 17 | RB7 — GPIO / ICSPDAT / peripheral pin select I/O |
| Pin 18 | RB6 — GPIO / ICSPCLK / peripheral pin select I/O |
| Pin 19 | RB5 — GPIO / peripheral pin select I/O |
| Pin 20 | RB4 — GPIO / peripheral pin select I/O |
| Pin 21 | VSS — Ground reference |
| Pin 22 | VDD — Positive supply voltage |
| Pin 23 | RB3 — GPIO / peripheral pin select I/O |
| Pin 24 | RB2 — GPIO / peripheral pin select I/O |
| Pin 25 | RB1 — GPIO / peripheral pin select I/O |
| Pin 26 | RB0 — GPIO / interrupt-on-change / peripheral pin select I/O |
| Pin 27 | RA7 — GPIO / peripheral pin select I/O |
| Pin 28 | RA6 — GPIO / peripheral pin select I/O |
Typical Applications
PIC16F1713T-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Node, LED Lighting Control with COG/PWM, Industrial Sensor Signal Conditioning, Automotive Body and Lighting Modules, Home Appliance User Interface, Portable Medical Monitoring Device.
Battery-Powered IoT Sensor Node
The PIC16F1713T-I/ML is well-suited for battery-powered IoT sensor nodes because of its XLP nanoWatt deep-sleep currents and 1.8 V to 5.5 V operating range. The 32 MHz core, 10-bit ADC with computation, and 8-bit DAC allow periodic sensor sampling and low-rate actuation while the CPU spends most of its life in sleep. The 7 KB Flash stores small sensor-fusion and protocol stacks such as Modbus or LoRaWAN device drivers. CIP blocks like CLC and NCO offload pulse counting and frequency synthesis, letting the CPU sleep through burst events. The 28-QFN exposed pad provides a thermal path that keeps junction temperature low even in enclosed housings, preserving battery life in 1-2 year deployment scenarios.
Recommended
LED Lighting Control with COG/PWM
The PIC16F1713T-I/ML integrates a Complementary Output Generator (COG) that produces complementary PWM outputs with programmable dead-band delays, ideal for LED drivers and full-bridge lighting topologies. The Core Independent Peripheral offloads PWM generation from the CPU, freeing cycles for color-mixing math and DMX or DALI protocol handling. The on-chip op-amps condition current-sense feedback from the LED string, closing the loop without external analog ICs. With a 32 MHz core, smooth 16-bit PWM resolution is achievable for high-CRI dimming, and the 1.8 V to 5.5 V range supports direct Li-ion or USB-powered fixtures.
Recommended
Industrial Sensor Signal Conditioning
The PIC16F1713T-I/ML's on-chip operational amplifiers combined with the 10-bit ADC with computation deliver a complete analog front-end for industrial sensors such as strain gauges, RTDs, and thermocouples. The op-amps can be configured as instrumentation-style gain stages, while the ADC's hardware accumulation and averaging reduce firmware overhead. CLC blocks implement digital filtering, comparator hysteresis, and threshold detection in hardware, eliminating CPU jitter. The industrial -40 °C to +85 °C temperature grade and robust ESD on I/O make this MCU suitable for factory-floor modules and process-control transmitter designs.
Recommended
Automotive Body and Lighting Modules
The PIC16F1713T-I/ML suits interior automotive body modules such as ambient lighting, mirror control, and small motor drivers where the AEC-Q100 qualification is not mandatory. The 32 MHz core and PWM channels drive LED strings, while the COG generates complementary FET control signals for brushed-DC motor drivers. The 8-bit DAC provides reference voltages for sensor biasing, and the CLC implements safety interlock logic. Though this part is not AEC-Q100 qualified, Microchip's extended temperature variant PIC16F1713-E/ML operates to +125 °C and is commonly used in under-dash automotive subsystems.
Recommended
Home Appliance User Interface
The PIC16F1713T-I/ML fits home appliance user-interface boards that combine capacitive touch buttons, LED indicators, and small displays. The CIP-based PWM and Zero Cross Detect enable TRIAC-based AC line dimming and synchronous timing with the mains cycle for reduced EMI. The on-chip op-amps can amplify and filter the touch-sensing signals. With 7 KB Flash, the firmware can implement touch libraries, simple UI state machines, and serial slave interfaces to a main appliance controller. The industrial temperature grade ensures reliable operation in kitchen and laundry environments.
Recommended
Portable Medical Monitoring Device
The PIC16F1713T-I/ML's low-power XLP features and integrated analog make it suitable for portable medical monitoring peripherals such as pulse oximetry front-ends, body-worn temperature loggers, and single-lead ECG signal conditioning. The on-chip op-amp provides a low-noise transimpedance stage for photodiode front-ends, and the 10-bit ADC with computation oversamples to improve effective resolution for biosignal acquisition. The Core Independent Peripherals offload timing-critical tasks while the CPU remains in sleep, extending battery life in wearable form factors. Designers should verify IEC 60601 compliance at the system level, as the MCU itself is not a medical-grade qualified part.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F1713T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F1713-I/ML | PIC16F1713-E/ML | PIC16F1716-I/ML |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) with EP | 28-QFN (6x6 mm) with EP - same | 28-QFN (6x6 mm) with EP - same | 28-QFN (6x6 mm) with EP - same |
| Program Memory (Flash) | 7 KB (4K x 14) | 7 KB | 7 KB | 14 KB |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Extended (-40C to +125C) | Industrial (-40C to +85C) |
| On-chip Op Amps | Yes | Yes | Yes | Yes |
| Core Independent Peripherals | CLC, COG, NCO, ZCD | CLC, COG, NCO, ZCD | CLC, COG, NCO, ZCD | CLC, COG, NCO, ZCD |
| Packaging Format | Tape & Reel (T suffix) | Tray | Tray | Tray |
Key Differentiators
- On-chip op-amps reduce external analog component count (vs PIC16F1708-I/SS)
- Larger Flash memory in same QFN footprint (vs PIC16F1713-I/ML)
- Industrial-grade temperature spec at standard price (vs PIC16F1713-E/ML)
- Complementary Output Generator (COG) for power-converter topologies (vs PIC16F1509-I/ML)
Design Notes
Place a 100 nF decoupling capacitor within 2 mm of each VDD pin (pins 7 and 22 on the 28-QFN). Add a bulk 10 uF tantalum or ceramic capacitor at the board entry point. The exposed pad (EP) must be soldered to a continuous ground pour with multiple thermal vias to reduce ground bounce and improve thermal dissipation. The XLP sleep modes (Sleep, Doze, Idle) are entered via the built-in SLP instruction and can reduce current below 50 nA in deep sleep with peripherals disabled.
The 28-QFN (6x6 mm) has a 0.65 mm pitch with a central exposed pad. Follow Microchip's land pattern recommendations: a 4.0 x 4.0 mm center pad with 0.3 mm clearance to perimeter pads and 0.5 mm via diameter thermal vias on a 1.0 mm grid. Stencil aperture should be 1:1 to the land pads with a 0.1 mm reduction on the center pad to mitigate solder-bead float during reflow. Hand soldering is not recommended; use hot-air rework or reflow.
When migrating from PIC16F170x to PIC16F1713, remember that Peripheral Pin Select (PPS) default mappings differ. Always verify peripheral-to-pin assignments via the MPLAB X IDE Pin Manager before generating code. Do not exceed 5.5 V on any I/O pin, even when VDD is 3.3 V. For in-circuit serial programming (ICSP), isolate the ICSPCLK/ICSPDAT lines (RB6/RB7) from external pull-ups stronger than 10 kohm to avoid contention during programming.
Route the 32 MHz crystal traces (OSC1/OSC2) symmetrically and keep them short with a guard ground trace. Place the load capacitors within 3 mm of the oscillator pins. If using the internal 32 MHz HFINTOSC instead, the GPIO pins formerly used for the crystal can be reassigned via PPS, but the crystal pins still require configuration to disable the oscillator amplifier. For ADC accuracy, route analog signals away from PWM outputs and add a small RC filter on noise-prone analog inputs.
Compliance Information
RoHS and REACH compliant per Microchip product page. AEC-Q100 is not qualified for the standard PIC16F1713 variants; designers requiring automotive-grade certification should evaluate the PIC16F177x family or add an external AEC-Q100 qualified supervisory IC.
