PIC16F1509-I/ML - 14KB Flash 8-bit MCU, 20MHz, 20-QFN | Microchip
MPN: PIC16F1509-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.74 | $1.74 |
| 10 | $1.58 | $15.80 |
| 100 | $1.35 | $135.00 |
| 500 | $1.18 | $590.00 |
| 1,000 | $1.02 | $1,020.00 |
PIC16F1509-I/ML Overview
What is a PIC16 microcontroller? A PIC16 is a family of 8-bit RISC microcontrollers from Microchip Technology built around a Harvard architecture and a compact enhanced mid-range instruction set. Within the broader semiconductor taxonomy, a PIC16 sits below 16-bit and 32-bit MCUs (PIC24/dsPIC, PIC32) and above simple 8-bit PIC10/PIC12 devices, while still offering deterministic interrupt response, low-power XLP sleep modes, and rich Core Independent Peripherals (CIPs) such as Configurable Logic Cells (CLC), Numerically Controlled Oscillator (NCO), and Complementary Waveform Generator (CWG) - making PIC16F1509-I/ML useful where 8-bit simplicity must coexist with on-chip analog/digital functions.
Key features of the PIC16F1509-I/ML include 18 I/O pins, four 10-bit ADC channels, two comparators, two 8-bit timers, one 16-bit timer, Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART), SPI/I2C, and four Configurable Logic Cells. The XLP technology delivers a typical sleep current in the sub-microamp range, making it well suited to battery-powered designs that must wake, process, and return to sleep quickly.
The device is built on Microchip's enhanced mid-range 8-bit core that executes most instructions in a single 200 ns cycle at 20 MHz. The 20-pin 4x4 mm QFN with an exposed thermal pad provides a compact, low-inductance ground path, which is helpful for ADC noise performance and EMI in mixed-signal designs. On-chip CIPs let designers implement custom glue logic, waveform synthesis, and signal conditioning in hardware without burdening the CPU.
Typical applications include consumer white goods and small appliances, LED lighting control with dimming and color mixing, sensor signal conditioning nodes, low-cost battery-powered IoT end nodes, capacitive touch user interfaces, and industrial control logic blocks. The PIC16F1509-I/ML is a strong fit wherever an 8-bit MCU must do more analog/digital mixing than a bare PIC10/12 while still consuming a very small PCB footprint.
When designing with the PIC16F1509-I/ML, expose the central thermal pad to a continuous ground copper pour to minimize ADC ground-loop noise and to keep junction temperature within the -40C to +85C industrial range. The debug header footprint must follow Microchip's AC244051/AC244052 guidance if MPLAB ICD 3 or PICkit 3 in-circuit debugging is required in production. Power-supply decoupling should include a 100 nF ceramic close to VDD plus a bulk cap near the exposed pad.
This page synthesizes distributor pricing for PIC16F1509-I/ML, drop-in alternatives that share the same 20-QFN footprint, and practical design notes that are not consolidated in the manufacturer datasheet alone.
Drop-in alternatives for PIC16F1509-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F1509-I/ML (same form factor and footprint) — differing in Package, ADC, I/O Pins, Operating Temperature, Timers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F1509-I/P
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1.43 / Unit
View Datasheet →PIC16F1509-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F1508-I/ML
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
PIC16F1509-I/SS
✅ Drop-In✓ In Stock
$1.36 / Unit
View Datasheet →PIC16F1508-I/SO
✅ Drop-In✓ In Stock
$0.92 / Unit
View Datasheet →PIC16F1507-I/SS
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
PIC16F1503-I/SL
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F1509-I/ML Maximum Ratings & Electrical Characteristics
| Core | PIC16 8-bit enhanced mid-range RISC |
| Program Memory | 14 KB Flash (8K x 14 words) |
| RAM | 512 bytes |
| EEPROM | 256 bytes |
| CPU Speed | 20 MHz (200 ns instruction cycle) |
| Supply Voltage (VDD) | 2.5 V / 3.3 V / 5 V |
| I/O Pins | 18 |
| ADC | 10-bit, up to 12 channels |
| Comparators | 2 |
| Timers | 2 x 8-bit, 1 x 16-bit |
| Communication | EUSART, SPI, I2C |
| Core Independent Peripherals | CLC (4), NCO, CWG, DAC |
| Package | 20-pin QFN (4x4 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (industrial, I grade) |
| MSL Level | 1 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
PIC16F1509-I/ML Pin Configuration
| Pin 1 | RA5 — Digital I/O / analog input / CLC reference |
| Pin 2 | RA4 — Digital I/O / analog input / comparator output |
| Pin 3 | RA3 — Digital I/O / analog input / MCLR (reset) |
| Pin 4 | RC5 — Digital I/O / analog input / PWM |
| Pin 5 | RC4 — Digital I/O / analog input / PWM |
| Pin 6 | RC3 — Digital I/O / analog input / SCL (I2C) |
| Pin 7 | RC2 — Digital I/O / analog input / SDA (I2C) |
| Pin 8 | RC1 — Digital I/O / analog input / comparator |
| Pin 9 | RC0 — Digital I/O / analog input / DAC reference |
| Pin 10 | VSS — Ground |
| Pin 11 | VDD — Positive supply 2.5V-5.5V |
| Pin 12 | RB7 — Digital I/O / EUSART TX / CLC |
| Pin 13 | RB6 — Digital I/O / EUSART RX / CLC |
| Pin 14 | RB5 — Digital I/O / AN / PWM |
| Pin 15 | RB4 — Digital I/O / AN / PWM |
| Pin 16 | RB3 — Digital I/O / AN / CLC |
| Pin 17 | RB2 — Digital I/O / AN / DAC |
| Pin 18 | RB1 — Digital I/O / AN / comparator |
| Pin 19 | RB0 — Digital I/O / AN / interrupt-on-change |
| Pin 20 | RA0 — Digital I/O / AN / ICSP data / CWG |
Typical Applications
PIC16F1509-I/ML is suitable for 6 applications: Consumer White Goods and Small Appliance Control, LED Lighting and Color-Mixing Controllers, Battery-Powered IoT Sensor Nodes, Capacitive Touch User Interfaces, Industrial Control and Sensor Signal Conditioning, Automotive Interior Accessories and Body Electronics.
Consumer White Goods and Small Appliance Control
The PIC16F1509-I/ML is well suited to consumer white goods such as microwave ovens, rice cookers, and induction cooktops because its 20 MHz enhanced mid-range core, 14KB Flash, and 18 I/O pins can drive keypads, seven-segment or TFT displays, and triac/relay drivers from a single chip. The on-chip Core Independent Peripherals (CLC, NCO, CWG) generate zero-crossing detection and dimming waveforms in hardware without consuming CPU cycles, and the XLP sub-microamp sleep mode extends battery life on cordless appliances. Operating from 2.5V to 5.5V lets the same board accept 3.3V logic sensors or 5V triac optocouplers without external level shifters.
Recommended
LED Lighting and Color-Mixing Controllers
In LED driver designs, the PIC16F1509-I/ML delivers four PWM channels via the CWG and timer peripherals with cycle-accurate timing that suits constant-current buck or boost converter control. The 14KB Flash holds DMX-512 or DALI protocol stacks plus dimming curves, while the 10-bit ADC reads thermistor-based thermal foldback on the LED heatsink. Because the part is housed in a 4x4 mm QFN with exposed pad, it drops onto small PCB modules behind LED MR16 bulbs or RGBW strips. The XLP sleep mode below 1 uA keeps standby power within Energy Star limits when the fixture is off.
Recommended
Battery-Powered IoT Sensor Nodes
The PIC16F1509-I/ML fits battery-powered IoT sensor nodes because the XLP technology delivers sub-microamp sleep current and the 16 MHz HFINTOSC eliminates the external crystal typically needed by other MCUs. The 512-byte RAM and 14KB Flash are sufficient for an SHT/SCD temperature-compensated humidity reading plus a LoRa/Sigfox TX scheduling loop on the EUSART. The 18 I/O can interface SPI sensors and an I2C EEPROM while two comparators handle battery-ADC supervision without waking the core. The industrial -40C to +85C range supports outdoor enclosures.
Recommended
Capacitive Touch User Interfaces
For touch-button keypads, sliders, and proximity sensors, PIC16F1509-I/ML uses the on-chip comparators and Configurable Logic Cells (CLC) to scan up to 8 capacitive buttons without burdening the CPU. Microchip's mTouch libraries run inside the 14KB Flash, and the CWG peripheral can simultaneously drive a haptic-feedback PWM output. Because the part integrates charge-time measurement hardware, no external charge-pump components are needed and the small 20-QFN footprint keeps the PCB small enough to fit behind glass or acrylic panels. Operating from 2.5V supports direct Li-ion cell power.
Recommended
Industrial Control and Sensor Signal Conditioning
In factory-automation nodes, PIC16F1509-I/ML conditions signals from 4-20 mA loops, RTDs, and thermocouples using its 10-bit ADC, two comparators, and CLC filter blocks. The 18 I/O pins can drive opto-isolated relay or MOSFET outputs, while EUSART or SPI uplinks factory-MES data to a master PLC. The -40C to +85C industrial grade and 5V tolerance on I/O make the part robust in noisy cabinet environments. On-chip CIPs implement window-watchdog and debouncing logic in hardware so the firmware is small and deterministic.
Recommended
Automotive Interior Accessories and Body Electronics
For non-safety automotive interior accessories such as ambient lighting, seat controllers, and HVAC keypads, the PIC16F1509-I/ML offers a small QFN footprint plus enough analog/digital peripherals to mix PWM LED control, key-scanning, and LIN-bus communication. Designers should note that the I/ML grade is qualified for industrial, not automotive - for AEC-Q100 body-electronics applications Microchip offers /VAO variants of the same silicon. The wide 2.5V-5.5V range tolerates load-dump spikes when paired with a TVS suppressor and a low-Iq LDO on the battery rail.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F1509-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F1509-E/ML | PIC16F1508-I/ML | PIC16F1509-I/SS | PIC16F1508-I/SO | PIC16F1507-I/SS |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-QFN (4x4 mm) | 20-QFN (4x4 mm) - same | 20-QFN (4x4 mm) - same | SSOP-20 | SOIC-20 | SSOP-20 |
| Flash Memory | 14 KB | 14 KB | 7 KB | 14 KB | 7 KB | 3.5 KB |
| RAM | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 128 bytes |
| CPU Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| I/O Pins | 18 | 18 | 18 | 18 | 18 | 18 |
| ADC | 10-bit, up to 12 ch | 10-bit, up to 12 ch | 10-bit, up to 12 ch | 10-bit, up to 12 ch | 10-bit, up to 12 ch | 10-bit, up to 12 ch |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
Key Differentiators
- 14KB Flash in the smallest 4x4 mm 20-QFN footprint of the PIC16F150x family (vs PIC16F1508-I/ML)
- Wider temperature grade than the /E variant in this package line (vs PIC16F1509-I/P)
- On-chip Core Independent Peripherals reduce firmware overhead (vs PIC16F1503-I/SL)
- Same QFN-20 pinout as PIC16F1509-E/ML with lower price point (vs PIC16F1509-E/ML)
Design Notes
Expose the central thermal pad of the 20-QFN package to a continuous ground copper pour and stitch it to the bottom ground plane with multiple thermal vias. The exposed pad is the primary heat-dissipation path and also minimizes ADC ground-loop noise. Without proper soldering of the e-pad, junction temperature may rise and the ADC readings on small signals will become erratic. Use Microchip's recommended land pattern from the package drawing.
Place a 100 nF ceramic decoupling capacitor within 3 mm of the VDD pin, with a bulk 1 uF to 10 uF tantalum or ceramic cap near the supply entry. For XLP battery designs, use an MCP1700 or MCP1810 LDO with sub-microamp quiescent current to keep total sleep current below 1 uA. Estimate: VDD = 3.0V, I_sleep = 50 nA typical (XLP, RTC from Timer1) yields >5 years from a CR2032 cell with hourly wake-ups. Source: Microchip PIC16F1509 datasheet DS40001706C, XLP chapter.
The 4x4 mm QFN does not expose the ICSP programming pins on the package perimeter, so for in-circuit programming Microchip recommends the AC244051 (10-pin) or AC244052 (6-pin) external debug header between the board and the programmer. Do not attempt to wire ICSP probes directly to the QFN pins - the spacing is too tight. Place the AC244051 footprint in the schematic even if you skip the actual header on production boards, because field firmware upgrades otherwise require unsoldering the QFN.
Estimated: the internal HFINTOSC is factory-trimmed to +/- 2% but drifts roughly +/- 5% over -40C to +85C; for UART communication at 115200 baud or higher, calibrate from the FPLL or use a 16 MHz external crystal. A common pitfall is leaving the MCLR pin (RA3) disabled - MCLR must be enabled via the CONFIG register for reliable reset, or tied to VDD through a 10 kohm pull-up if unused. Per the datasheet, leaving RA3 floating causes intermittent brown-out resets during ESD events.
When using the 10-bit ADC at full 20 MHz CPU clock, enable the ADC FRC oscillator so the A/D clock derives from an internal dedicated oscillator rather than FOSC/4. This decouples ADC timing from the CPU clock domain and reduces digital switching noise coupling into analog readings. For CWG or PWM-driven power stages, place the MCU's PWM outputs at least 4 mm away from sensitive analog traces and surround analog traces with a ground guard ring tied to VSS. Source: Microchip AN248 'PIC16F1xx ADC Best Practices'.
Compliance Information
I/ML grade is industrial -40C to +85C; not AEC-Q100 qualified - for automotive body electronics use the /VAO suffix or PIC16F1509-E/ML extended-temperature variant. RoHS and REACH status per Microchip product page.
