PIC16F1779T-I/MV - 8-bit 32MHz 28KB Flash MCU | Microchip
MPN: PIC16F1779T-I/MV β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.55 | $2.55 |
| 10 | $2.35 | $23.50 |
| 100 | $2.1 | $210.00 |
| 500 | $1.92 | $960.00 |
| 1,000 | $1.78 | $1,780.00 |
PIC16F1779T-I/MV Overview
A PIC16F microcontroller is a Harvard-architecture 8-bit RISC MCU using a 14-bit instruction set optimized for deterministic real-time control, and PIC16F177x parts specifically target applications such as LED drivers, switched-mode power supplies, battery chargers, and small brushless-DC motor controllers where high analog peripheral density eliminates external op-amp and PWM-driver ICs. The XLP (eXtreme Low Power) variant designation and the wider 16F177X family place this part in the upper-memory tier of the PIC16 mid-range portfolio, while remaining within the same instruction-set family as the smaller 16F170x and 16F176x devices.
Key features include 28KB (16K x 14) self-programmable Flash, 2KB RAM, 10-bit ADC with up to 28 channels depending on package, multiple 10-bit DACs, op-amps, comparators, configurable logic cells (CLC), complementary output generator (COG), and zero-cross detect (ZCD) for AC-line control. The integrated high-resolution PWM and PWM-steered dead-band control supports digital power topologies. The "T" suffix denotes Tape & Reel packaging and "I" indicates the -40C to +85C industrial temperature range.
The PIC16F1779 architecture pairs the standard PIC16 mid-range CPU with peripheral pin select (PPS), giving the matrix access to nearly any digital peripheral on most pins, which dramatically simplifies PCB layout for complex mixed-signal designs. The 5V-tolerant I/O and 1.8V-5.5V VDD range (for LF variants) or 2.3V-5.5V VDD range (for F variants) cover both lithium-battery and 5V regulated-rail systems.
Typical applications include LED lighting drivers, digital switch-mode power supplies, lithium-ion battery chargers, ceiling-fan and small BLDC motor control, electronic ballasts, and general-purpose mixed-signal embedded platforms. The compact UQFN-40 5x5mm footprint also makes it suitable for space-constrained designs such as smart-home sensor hubs and consumer white goods.
When designing with this part, note that the UQFN package has an exposed thermal pad that must be soldered to the board ground plane for both thermal dissipation and electrical grounding; missing the e-pad solder connection can cause erratic ADC readings and reduced thermal performance. Program development is supported by MPLAB X IDE with the XC8 compiler and the MPLAB Code Configurator (MCC) plug-in.
This page synthesizes distributor pricing, drop-in alternatives sharing the same UQFN-40 footprint, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for PIC16F1779T-I/MV β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F1779T-I/MV (same form factor and footprint) β differing in ADC, DAC, Package, Operating Temperature, Comparators.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
PIC16F1779-I/MV
β Drop-Inπ Reference alternative (not in catalog)
PIC16F1779T-I/ML
β Drop-Inπ Reference alternative (not in catalog)
PIC16F1778-I/MV
β Drop-Inπ Reference alternative (not in catalog)
PIC16F1719-I/MV
β Drop-Inβ In Stock
$1.89 / Unit
View Datasheet βPIC16F1717T-I/MV
β Drop-Inβ In Stock
$2.18 / Unit
View Datasheet βPIC16F1713T-I/MV
β Drop-Inβ In Stock
$1.18 / Unit
View Datasheet βPIC16F1779T-I/MV Maximum Ratings & Electrical Characteristics
| Core Processor | PIC |
| Core Size | 8-bit |
| Program Memory Type | FLASH |
| Program Memory Size | 28KB (16K x 14) |
| RAM Size | 2 KB |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 2.3 V to 5.5 V (F variant) |
| Number of I/O Pins | 36 (approx, depends on package) |
| ADC | 10-bit, 1 module (per snippet) |
| DAC | 10-bit (per family) |
| Op-Amps | Integrated (per family feature) |
| Comparators | Integrated (per family feature) |
| ZCD | Yes (Zero-Cross Detect, per family) |
| COG (Complementary Output Generator) | Yes (per family) |
| CLC (Configurable Logic Cell) | Yes (per family) |
| Package | 40-UQFN (MV) 5x5 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (industrial, "I" suffix) |
| Packaging | Tape & Reel (T suffix) |
| Series | PIC XLP 16F |
| RoHS Status | Compliant |
PIC16F1779T-I/MV Pin Configuration
| Pin 1 | RA0 β Analog/Digital I/O, ADC input |
| Pin 2 | RA1 β Analog/Digital I/O, ADC input |
| Pin 3 | RA2 β Analog/Digital I/O, ADC input |
| Pin 4 | RA3 β Analog/Digital I/O, ADC input |
| Pin 5 | RA4 β Analog/Digital I/O, ADC input |
| Pin 6 | RA5 β Analog/Digital I/O, ADC input |
| Pin 7 | RA6 β Digital I/O, OSC2 |
| Pin 8 | RA7 β Digital I/O, OSC1 |
| Pin 9 | VDD β Power supply (2.3V-5.5V) |
| Pin 10 | VSS β Ground |
| Pin 11 | RB0 β Digital I/O, ZCD input |
| Pin 12 | RB1 β Digital I/O |
| Pin 13 | RB2 β Digital I/O |
| Pin 14 | RB3 β Digital I/O |
| Pin 15 | RB4 β Digital I/O |
| Pin 16 | RB5 β Digital I/O, ICSPCLK (programming) |
| Pin 17 | RB6 β Digital I/O, ICSPDAT (programming) |
| Pin 18 | RB7 β Digital I/O |
| Pin 19 | VSS β Ground |
| Pin 20 | VDD β Power supply |
| Pin 21 | RC0 β Analog/Digital I/O |
| Pin 22 | RC1 β Analog/Digital I/O |
| Pin 23 | RC2 β Analog/Digital I/O |
| Pin 24 | RC3 β Analog/Digital I/O |
| Pin 25 | RC4 β Analog/Digital I/O |
| Pin 26 | RC5 β Analog/Digital I/O |
| Pin 27 | RC6 β Analog/Digital I/O |
| Pin 28 | RC7 β Analog/Digital I/O |
| Pin 29 | RE0 β Analog/Digital I/O |
| Pin 30 | RE1 β Analog/Digital I/O |
| Pin 31 | RE2 β Analog/Digital I/O |
| Pin 32 | RE3 β Analog/Digital I/O |
| Pin 33 | RD0 β Digital I/O |
| Pin 34 | RD1 β Digital I/O |
| Pin 35 | RD2 β Digital I/O |
| Pin 36 | RD3 β Digital I/O |
| Pin 37 | RD4 β Digital I/O |
| Pin 38 | RD5 β Digital I/O |
| Pin 39 | RD6 β Digital I/O |
| Pin 40 | RD7 β Digital I/O, MCLR (reset) |
| Pin EP | ePAD β Exposed thermal pad - must be soldered to GND for thermal/electrical grounding |
Typical Applications
PIC16F1779T-I/MV is suitable for 6 applications: LED Lighting Drivers, Switch-Mode Power Supplies (SMPS), Battery Chargers (Li-ion / Lead-acid), Brushless DC (BLDC) Motor Control, Electronic Ballasts and AC Line Control, Smart Sensor Hubs (IoT / Smart Home).
LED Lighting Drivers
The PIC16F1779T-I/MV's 28KB Flash and high-resolution PWM with dead-band control make it ideal for digital LED driver designs. The integrated 10-bit DAC and op-amps form a closed-loop current control loop with the on-chip ADC, while the ZCD (Zero-Cross Detect) peripheral synchronizes dimming to the AC line frequency for TRIAC-replacement dimmer compatibility. COG generates complementary gate-drive signals for synchronous-rectifier MOSFETs in the LED driver power stage, and CLC implements hardware-based fault protection. Per Microchip application notes, the 32MHz core executes PFC + dimming + LED current regulation loops in a single chip, eliminating external analog ICs.
Recommended
Switch-Mode Power Supplies (SMPS)
The PIC16F1779T-I/MV targets digital SMPS control with its 10-bit ADC for output voltage and current sensing, 10-bit DAC for compensation reference, and high-resolution PWM for switching frequency control. The integrated op-amps close Type-II and Type-III compensation loops, while CLC implements hardware cycle-by-cycle current limiting and overcurrent protection without CPU intervention. The COG peripheral generates complementary gate-drive signals with programmable dead-band for synchronous-rectifier topologies. With 28KB Flash, the firmware can implement PFC + LLC or PFC + flyback control algorithms on the same die, replacing traditional analog UC3842-style controllers.
Recommended
Battery Chargers (Li-ion / Lead-acid)
The PIC16F1779T-I/MV's 28KB Flash and integrated op-amps support multi-stage Li-ion or lead-acid charging profiles (precharge, constant-current, constant-voltage, taper) with on-chip 10-bit ADC measuring pack voltage, charge current, and pack temperature via thermistor divider. The op-amps condition current-sense amplifier outputs directly into the ADC, while CLC implements hardware overcurrent and overtemperature latching. The XLP Sleep mode extends standby battery drain to the nanoampere range during storage, critical for emergency-lighting and back-up battery applications. Per Microchip AN, this MCU has reference designs for 1-3 cell Li-ion chargers up to 5A.
Recommended
Brushless DC (BLDC) Motor Control
The PIC16F1779T-I/MV's complementary output generator (COG) generates 6-step or sinusoidal commutation signals for 3-phase BLDC and PMSM motors with hardware dead-band insertion, freeing the CPU from software PWM. The 10-bit ADC measures back-EMF for sensorless commutation, while the comparators implement hardware overcurrent protection with sub-microsecond response. With 28KB Flash, the firmware supports both trapezoidal 6-step and basic space-vector modulation algorithms. The 32MHz instruction rate and XLP low-power mode also suit small fan and pump motor applications that spend most of the time at low RPM.
Recommended
Electronic Ballasts and AC Line Control
The PIC16F1779T-I/MV's Zero-Cross Detect (ZCD) peripheral synchronizes ballast or heater control to the AC mains cycle with hardware-triggered interrupts, enabling zero-voltage switching (ZVS) for TRIAC and IGBT-based ballast and dimmer circuits. The op-amps condition current and voltage feedback signals while CLC implements hardware latch-off protection for lamp-out and short-circuit faults. The 2.3V-5.5V VDD range covers both 3.3V and 5V regulated supplies typical of electronic ballast designs, and 28KB Flash supports multi-mode operation (preheat, ignite, run) for fluorescent and HID lamps.
Recommended
Smart Sensor Hubs (IoT / Smart Home)
The PIC16F1779T-I/MV's 28KB Flash, 32MHz CPU, and multiple serial interfaces (EUSART, I2C, SPI) make it a capable sensor hub that aggregates multiple sensor buses (temperature, humidity, motion, light) and reports them via UART BLE/Wi-Fi daughter modules. The XLP Sleep current in the low nanoampere range enables multi-year battery life in wireless sensor nodes, while the integrated op-amps and ADC directly interface analog sensors (thermistors, photocells, gas sensors) without external signal conditioning. The 40-UQFN 5x5mm footprint fits compact smart-home sensor form factors.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F1779T-I/MV β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F1779-I/MV | PIC16F1778-I/MV | PIC16F1719-I/MV | PIC16F1717T-I/MV |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 40-UQFN (MV) 5x5 | 40-UQFN (MV) 5x5 - same | 40-UQFN (MV) 5x5 - same | 40-UQFN (MV) 5x5 - same | 40-UQFN (MV) 5x5 - same |
| Flash Memory | 28KB (16K x 14) | 28KB | 16KB | 28KB | 14KB |
| RAM Size | 2 KB | 2 KB | 2 KB | 2 KB | 1 KB |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| 10-bit DAC / Op-amp / COG / ZCD | Yes / Yes / Yes / Yes (full Intelligent Analog) | Same | Same (16KB Flash but full peripheral set) | Reduced - no COG/ZCD/DAC/op-amp | Reduced - no COG/ZCD |
| ADC | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Full Intelligent Analog peripheral set including 10-bit DAC, op-amps, COG, and ZCD (vs PIC16F1719-I/MV)
- 28KB Flash - 12KB more than PIC16F1778 with identical Intelligent Analog peripheral set (vs PIC16F1778-I/MV)
- True PIC16 mid-range core drop-in with all 36 I/O available on the UQFN package (vs PIC16F1717T-I/MV)
Design Notes
The 40-UQFN (MV) package has an exposed thermal pad (EP) on the underside that MUST be soldered to the PCB ground plane for both thermal dissipation and electrical grounding. Missing or weak e-pad solder joints are a leading cause of erratic ADC readings, JTAG programming failures, and reduced thermal performance in field returns. Use an array of thermal vias (typically 4-9 vias, 0.3mm drill, 0.5mm pitch) connecting the e-pad to the inner-layer ground pour to maximize thermal conductivity and improve ADC reference stability by reducing ground bounce.
Place 100nF X7R decoupling capacitors on each VDD pin pair (the UQFN-40 has multiple VDD/VSS pins) as close as physically possible to the IC, with traces no longer than 2mm to the capacitor pads. Add a bulk 10uF X5R or tantalum capacitor on the main VDD rail near the MCU. Estimated: total bulk capacitance requirement is approximately 10-22uF for switching applications where the MCU shares a rail with gate-driver loads. Ensure VDD rise time is faster than the ICSP programming algorithm expects (typically <50ms) to avoid brown-out programming failures.
The analog AVSS and AGND pins must be tied to the same ground plane as digital GND but with a single-point Kelvin connection or ferrite bead if the application is noise-sensitive (precision ADC measurements, audio signal chains). The 10-bit ADC reference voltage (VREF+) should be bypassed with 100nF + 10uF capacitors placed close to the VREF+ pin. Estimated: with the on-chip 10-bit DAC sourcing the ADC reference, expect approximately +/-2 LSB of integral non-linearity at 32MHz CPU clock; for better ADC linearity, halt the CPU in Sleep during ADC conversion when possible.
Three common pitfalls when designing with the PIC16F1779T-I/MV: (1) Forgetting that PPS (Peripheral Pin Select) must be unlocked via CCP unlock sequence before remapping digital peripherals, which causes silent peripheral failures; (2) Using the internal HFINTOSC without enabling the PLL when the application requires 32MHz, leading to a 16MHz top speed and half the expected PWM resolution; (3) Driving the MCLR pin with a slow RC rise time, which can cause intermittent reset events during power-up in noisy industrial environments - always use the internal MCLR disable and rely on the internal POR, or add a 10k pull-up and 100nF decoupling on MCLR for clean reset behavior.
Compliance Information
RoHS and lead-free compliant per Microchip product page. Not AEC-Q100 qualified - choose PIC16F1779T-I/MV only for industrial/consumer, not automotive safety-critical applications. Halogen-free status not explicitly stated in provided data.
