PIC16F1776T-I/MX - 8-Bit MCU 32MHz 14KB Flash 28-UQFN
MPN: PIC16F1776T-I/MX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.56 | $25.60 |
| 100 | $2.28 | $228.00 |
| 500 | $2.05 | $1,025.00 |
| 1,000 | $1.82 | $1,820.00 |
PIC16F1776T-I/MX Overview
A PIC microcontroller is an 8-bit RISC-based MCU built on Microchip's Harvard architecture, commonly used in embedded control for its deterministic instruction timing, low power draw, and broad peripheral integration. PIC MCUs sit at the entry-level of the embedded hierarchy: microcontroller -> embedded processor -> semiconductor. The PIC16F1776 specifically adds CIP (Core Independent Peripherals) that operate without CPU intervention, enabling efficient lighting, SMPS, and motor control loops.
Key differentiating features include four 10-bit PWMs with independent timing, four programmable gain amplifiers (PGAs), four operational amplifiers, four 10-bit DACs, three 5-bit DACs, four 16-bit timers, and high-resolution configurable logic cells. These peripherals enable closed-loop control of LEDs, motors, and power supplies without burdening the CPU. The 28-UQFN exposed-pad package (6x6 mm) provides compact board footprint with improved thermal dissipation for higher-power applications.
The PIC16F1776 uses an enhanced mid-range 8-bit core with 49 instructions and 16-level hardware stack. Internal 32 MHz oscillator, 256 bytes of EEPROM, and an integrated temperature indicator simplify BOM cost. Peripherals communicate via PPS (Peripheral Pin Select), allowing flexible pin assignments. The combination of internal peripherals makes this MCU suitable for complex mixed-signal control in a small package.
Typical applications include LED lighting drivers, switched-mode power supplies, battery chargers, BLDC/PMSM motor control, and general-purpose embedded systems. The high level of analog integration reduces external component count for closed-loop power-conversion designs.
When designing with this device, ensure adequate PCB copper area beneath the exposed pad to meet thermal and electrical grounding requirements. Decoupling capacitors should be placed close to VDD/VSS pairs. Configure PPS registers to assign peripheral functions to specific I/O pins as required by the board layout.
Drop-in alternatives for PIC16F1776T-I/MX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F1776T-I/MX (same form factor and footprint) — differing in Package, ADC, DAC, Program Memory (Flash), Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F1776-I/SP
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1.78 / Unit
View Datasheet →PIC16F1776-E/SP
✅ Drop-In✓ In Stock
$2.2 / Unit
View Datasheet →PIC16F1776-E/SO
✅ Drop-In✓ In Stock
$1.82 / Unit
View Datasheet →PIC16F15356T-I/MX
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
PIC16F15356-E/MX
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1.21 / Unit
View Datasheet →PIC16F1769T-I/ML
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
PIC16F1768T-I/ML
✅ Drop-In✓ In Stock
$1.08 / Unit
View Datasheet →PIC16F1776T-I/MX Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC (Enhanced Mid-Range 8-bit) |
| Program Memory | 14 KB Flash (8K x 14 words) |
| Data Memory (RAM) | 1 KB |
| EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz |
| ADC | 10-bit |
| Operating Voltage Range | 2.3 V to 5.5 V (F-version) |
| Number of I/O Pins | 25 (approx.) |
| PWM Channels | 4 x 10-bit PWM with independent timing |
| Operational Amplifiers | 4 on-chip op-amps |
| Programmable Gain Amplifiers | 4 PGAs |
| DAC | 4 x 10-bit DAC + 3 x 5-bit DAC |
| Timers | 4 x 16-bit timers |
| Package | 28-pin UQFN with exposed pad (6x6 mm) |
| Operating Temperature Range | -40C to +85C (Industrial) |
| Low-Power Feature | XLP (eXtreme Low Power) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC16F1776T-I/MX Pin Configuration
| Pin 1 | RA5 — GPIO RA5 / PWM3 / DAC4OUT |
| Pin 2 | RA4 — GPIO RA4 / PWM2 / DAC3OUT |
| Pin 3 | RA3 — GPIO RA3 / MCLR/VPP |
| Pin 4 | RA2 — GPIO RA2 / AN2 / DAC2OUT |
| Pin 5 | RA1 — GPIO RA1 / AN1 / OPA1IN+ / DAC1OUT |
| Pin 6 | RA0 — GPIO RA0 / AN0 / OPA1IN- |
| Pin 7 | VSS — Ground reference |
| Pin 8 | RA7 — GPIO RA7 / OSC1 / CLKIN |
| Pin 9 | RA6 — GPIO RA6 / OSC2 / CLKOUT |
| Pin 10 | RC0 — GPIO RC0 / AN4 / PWM4 |
| Pin 11 | RC1 — GPIO RC1 / AN5 / PWM3 |
| Pin 12 | RC2 — GPIO RC2 / AN6 / PWM2 |
| Pin 13 | RC3 — GPIO RC3 / AN7 / PWM1 |
| Pin 14 | RC4 — GPIO RC4 / AN8 |
| Pin 15 | RC5 — GPIO RC5 / AN9 |
| Pin 16 | RC6 — GPIO RC6 / AN10 / TX/CK |
| Pin 17 | RC7 — GPIO RC7 / AN11 / RX/DT |
| Pin 18 | VSS — Ground reference |
| Pin 19 | VDD — Positive supply voltage 2.3-5.5 V |
| Pin 20 | RB0 — GPIO RB0 / INT / IOC |
| Pin 21 | RB1 — GPIO RB1 / AN12 |
| Pin 22 | RB2 — GPIO RB2 / AN13 |
| Pin 23 | RB3 — GPIO RB3 / AN14 / OPA2IN- |
| Pin 24 | RB4 — GPIO RB4 / AN15 / OPA2IN+ |
| Pin 25 | RB5 — GPIO RB5 / AN16 / OPA3IN- |
| Pin 26 | RB6 — GPIO RB6 / ICSPCLK |
| Pin 27 | RB7 — GPIO RB7 / ICSPDAT |
| Pin 28 | VDD — Positive supply voltage 2.3-5.5 V |
Typical Applications
PIC16F1776T-I/MX is suitable for 6 applications: LED Lighting Drivers, Switched-Mode Power Supplies, BLDC and PMSM Motor Control, Battery Charging Systems, General-Purpose Embedded Control, Sensor Signal Conditioning.
LED Lighting Drivers
The PIC16F1776T-I/MX drives multi-channel LED lighting systems with high-resolution dimming and color mixing. Its four 10-bit PWM channels with dead-band generators provide independent control of RGBW or warm-dim channels, while four on-chip op-amps and four PGAs enable closed-loop current feedback without external amplifiers. The 32 MHz CPU executes digital control loops fast enough to maintain flicker-free dimming down to 1 percent, and the 14 KB Flash stores lookup tables for logarithmic dimming curves. Combined with the compact 28-UQFN 6x6 mm package, this MCU fits inside E27 retrofit bulbs, downlights, and architectural fixtures where PCB area is constrained. Power dissipation under 100 mW at 5 V means no heatsink is required.
Recommended
Switched-Mode Power Supplies
In SMPS applications, the PIC16F1776T-I/MX serves as the digital control core for peak current-mode or average current-mode converters. Four high-speed PWMs with programmable dead-band drive half-bridge and full-bridge topologies at switching frequencies up to 500 kHz. Four on-chip op-amps amplify current-sense signals from shunt resistors or current transformers, while four 10-bit DACs set reference thresholds for voltage and current loops. The 10-bit ADC samples output voltage at high rate for tight regulation. With 14 KB Flash, control algorithms including soft-start, slope compensation, and OVP/OCP protection fit comfortably. The compact 28-UQFN package suits dense AC-DC adapter and DC-DC converter layouts.
Recommended
BLDC and PMSM Motor Control
The PIC16F1776T-I/MX drives brushless DC and permanent magnet synchronous motors in field-oriented control (FOC) or trapezoidal commutation schemes. Four complementary PWM pairs with dead-band insertion directly drive three-phase inverter legs, while four op-amps and four PGAs condition Hall-effect sensor or back-EMF signals. Three 5-bit DACs and four 10-bit DACs provide analog references for protection thresholds. The 32 MHz CPU completes Park/Clarke transforms and PI loops within microseconds, supporting rotor speeds up to several thousand RPM. The 28-UQFN exposed pad dissipates the moderate power dissipation of small motor control boards for fans, pumps, and small appliances.
Recommended
Battery Charging Systems
In lithium-ion or lead-acid battery chargers, the PIC16F1776T-I/MX executes CC/CV (constant-current / constant-voltage) charging algorithms with multiple protection layers. Four 10-bit DACs set precise charge current and voltage references, while the 10-bit ADC monitors battery voltage, current, and temperature via the on-chip op-amps. The 14 KB Flash stores charging profiles for Li-ion, LiFePO4, NiMH, and SLA chemistries. The XLP low-power feature enables quiescent currents below 1 microamp in standby mode, critical for shelf-life. The 28-UQFN package fits compact charging cradles for handheld tools, e-bikes, and portable medical devices.
Recommended
General-Purpose Embedded Control
For general embedded control tasks, the PIC16F1776T-I/MX delivers flexible I/O and rich peripherals in a small package. The 25 I/O pins drive keypads, LCD segments, sensors, and actuators, while PPS (Peripheral Pin Select) reassigns peripheral functions to different pins during PCB layout. Four 16-bit timers capture input signals or generate precise timing for valves, pumps, and indicators. With 32 MHz performance, 14 KB Flash, 1 KB RAM, and industrial -40C to +85C temperature range, the part fits industrial sensors, building automation nodes, smart thermostats, and appliance controls. The exposed pad package provides reliable thermal performance under moderate CPU loading.
Recommended
Sensor Signal Conditioning
The PIC16F1776T-I/MX performs sensor signal conditioning for industrial measurement and IoT edge devices. Four on-chip op-amps amplify thermocouple, RTD, strain-gauge, or bridge-pressure signals, while four PGAs provide software-selectable gains from 1x to 32x. Four 10-bit DACs generate excitation voltages for bridge sensors. The 10-bit ADC digitizes conditioned signals for compensation algorithms (linearization, temperature compensation) running on the 32 MHz CPU. With XLP sleep modes below 1 microamp, battery-powered wireless sensor nodes can run for years. The compact 28-UQFN footprint fits inside sealed sensor housings for harsh-environment applications.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F1776T-I/MX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F1776-I/SP | PIC16F1776-E/SP | PIC16F1776-E/SO | PIC16F15356T-I/MX | PIC16F1769T-I/ML | PIC16F1768T-I/ML |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | UQFN-28 (6x6 mm) | SPDIP-28 - thru-hole | SPDIP-28 - thru-hole | SOIC-28 - SMD wider | UQFN-28 - same | QFN-28 - same family | QFN-28 - same family |
| Flash Memory | 14 KB | 14 KB | 14 KB | 14 KB | 28 KB | 14 KB | 7 KB |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 2 KB | 1 KB | 512 B |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
| Temperature Range | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C |
| PWM Channels | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 5 x 10-bit | 3 x 10-bit | 3 x 10-bit |
| Op-amps / PGAs | 4 / 4 | 4 / 4 | 4 / 4 | 4 / 4 | 3 / 3 | 2 / 2 | 2 / 2 |
| ADC Resolution | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit |
Key Differentiators
- Highest peripheral integration in PIC16F177x 28-pin family (vs PIC16F1769T-I/ML)
- Largest flash in 28-pin UQFN footprint (vs PIC16F15356T-I/MX)
- CIP (Core Independent Peripherals) for offloading CPU (vs PIC16F1768T-I/ML)
Design Notes
The 28-UQFN exposed pad must be soldered to a PCB ground plane for both thermal dissipation and electrical grounding. Use at least 1 square inch of copper area beneath the exposed pad on the top layer, plus thermal vias to inner ground planes. Estimated: at 32 MHz CPU with active peripherals, power dissipation is approximately 30-50 mW at 5 V supply, which keeps junction temperature rise below 10 C above ambient with proper PCB copper. Without proper thermal design, junction temperature rise increases by 5-8 C above the same die in a larger SOIC package.
Decoupling capacitors must be placed within 2-3 mm of the VDD/VSS pin pairs. Use 100 nF X7R ceramic capacitors on each VDD pin plus a single 10 uF bulk capacitor at the regulator output. For ADC accuracy, isolate the analog VDD/AVSS supply pins from digital switching noise with separate traces and a ferrite bead if needed. Place the ICSP programming header (RB6/ICSPDAT, RB7/ICSPCLK, MCLR/VPP) on the board edge with a 2x3 or 1x6 0.1 inch pin header footprint for production programming.
Three common pitfalls to avoid. First, do not connect the MCLR pin directly to VDD without a 10 kohm pull-up resistor, as this prevents ICSP programming. Second, configure PPS (Peripheral Pin Select) registers to a known default state at startup; otherwise peripheral signals may appear on unexpected pins. Third, the 10-bit ADC requires an acquisition time of at least 1.5 us before conversion - violating this timing degrades ADC accuracy by several LSBs. Reference Microchip application note AN1079 for ADC design guidance.
When using the four on-chip op-amps in sensitive analog circuits (sensor signal conditioning), keep the analog signal traces short and routed away from PWM or digital switching signals. Use a ground pour on the top layer around the analog section, connected to the analog ground reference via a star connection to the IC's analog ground pin (VSS). Keep the input traces of each op-amp under 10 mm to minimize noise pickup. For motor control applications, route the back-EMF sense traces away from the high-current inverter traces.
Compliance Information
RoHS compliant per Microchip product page. Industrial temperature range -40C to +85C. Not AEC-Q100 qualified - choose PIC16F1776-E variant for extended -40C to +125C operation.
