PIC16F18444-E/GZ - 8-bit 32MHz 7KB Flash XLP MCU | Microchip
MPN: PIC16F18444-E/GZ ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.78 | $1.78 |
| 10 | $1.6 | $16.00 |
| 100 | $1.34 | $134.00 |
| 500 | $1.12 | $560.00 |
| 1,000 | $0.96 | $960.00 |
PIC16F18444-E/GZ Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, volatile working memory (RAM), and a set of peripherals on one die. The 8-bit class — typified by the PIC16 architecture — is a register-based RISC design optimized for deterministic interrupt response, low power, and small code size. PIC MCUs sit within the broader taxonomy: microcontroller -> embedded processor -> semiconductor IC, and remain one of the most widely deployed architectures for cost-sensitive, ultra-low-power IoT and industrial nodes.
Key features of the PIC16F18444 include a 12-bit Analog-to-Digital Converter with Computation (ADCC), a 5-bit/8-bit DAC, two PWM modules with Complementary Waveform Generator (CWG), a comparator, EUSART, SPI, and I²C peripherals. XLP technology delivers nanoWatt sleep currents below 100 nA in deep sleep with RTCC, and the device operates across 2.5 V / 3.3 V / 5 V rails from a single supply. Functional Safety (FuSa) support and CIPs such as the Configurable Logic Cell (CLC) and Angular Timer enable offloading of timing-critical tasks from the core.
Architecturally, the PIC16F18444 uses an enhanced mid-range 8-bit core with a 14-bit instruction word and a two-stage pipeline. Memory Access Partitioning (MAP) and the Device Information Area (DIA) provide bootloader-friendly code protection and serialized calibration data, which is critical for secure OTA upgrades and Class B safety libraries. The 20-pin UQFN footprint exposes up to 17 general-purpose I/O pins while keeping the board area at roughly 16 mm².
Typical applications include IoT sensor nodes, low-power wireless sensor transmitters, industrial control modules, battery-powered instrumentation, smart-home peripherals, and small appliance user interfaces. The combination of an integrated 12-bit ADCC and low sleep current makes it especially attractive for energy-harvesting edge devices where both analog accuracy and quiescent power determine field lifetime.
When designing with this part, verify that your firmware memory budget fits within 7KB of Flash and that the 20-pin UQFN land pattern matches your PCB footprint. For battery operation, use the Datasheet section on XLP sleep modes (Deep Sleep, Retention Sleep) and the nanoWatt features (ULPWU, RTCC) — these are the most common sources of power-budget overruns. The exposed thermal pad must be soldered to a copper pour for proper thermal and electrical performance.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical low-power design notes that go beyond the manufacturer datasheet, giving engineers a faster path from concept to certified BOM.
Drop-in alternatives for PIC16F18444-E/GZ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F18444-E/GZ (same form factor and footprint) — differing in ADC, Package, Program Memory (Flash), Operating Temperature, DAC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F18344-E/GZ
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$0.95 / Unit
View Datasheet →PIC16F18424-E/GZ
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC16F18426T-I/ST
✅ Drop-In✓ In Stock
$0.85 / Unit
View Datasheet →PIC16F18346-E/GZ
✅ Drop-In✓ In Stock
$1.28 / Unit
View Datasheet →PIC16F18425-E/P
✅ Drop-In✓ In Stock
$1.05 / Unit
View Datasheet →PIC16F18324-E/GZ
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F18444-E/GZ Maximum Ratings & Electrical Characteristics
| Product Family | PIC16(L)F184xx |
| Core Architecture | 8-bit PIC RISC, enhanced mid-range |
| Program Memory (Flash) | 7 KB (4K x 14 words) |
| RAM | 512 bytes |
| Maximum CPU Frequency | 32 MHz |
| Supply Voltage | 2.5 V / 3.3 V / 5 V |
| Operating Temperature | -40C to +125C (Extended, -E suffix) |
| ADC | 12-bit ADCC (with computation) |
| DAC | 5-bit and 8-bit |
| Comparators | 1 (configurable) |
| PWM Modules | 2x with Complementary Waveform Generator (CWG) |
| Communication | EUSART, SPI, I2C |
| Package | 20-UQFN (4x4 mm) with exposed pad |
| Pin Count | 20 |
| Mounting Type | Surface Mount |
| Low-Power Feature | eXtreme Low-Power (XLP) - nanoWatt |
| Functional Safety | FuSa capable |
| RoHS Status | Compliant |
PIC16F18444-E/GZ Pin Configuration
| Pin 1 | RA5 — GPIO / ADC input |
| Pin 2 | RA4 — GPIO / ADC input |
| Pin 3 | RA3 — GPIO / MCLR |
| Pin 4 | RA2 — GPIO / ADC input |
| Pin 5 | RA1 — GPIO / ADC input / DAC1OUT |
| Pin 6 | RA0 — GPIO / ADC input / DAC0OUT |
| Pin 7 | VSS — Ground |
| Pin 8 | VDD — Positive supply (2.5V/3.3V/5V) |
| Pin 9 | RA7 — GPIO / OSC1 |
| Pin 10 | RA6 — GPIO / OSC2 |
| Pin 11 | RC5 — GPIO / PWM |
| Pin 12 | RC4 — GPIO / PWM |
| Pin 13 | RC3 — GPIO / SCL |
| Pin 14 | RC2 — GPIO / SDA |
| Pin 15 | RC1 — GPIO / EUSART TX |
| Pin 16 | RC0 — GPIO / EUSART RX |
| Pin 17 | RB7 — GPIO / ICSPDAT |
| Pin 18 | RB6 — GPIO / ICSPCLK |
| Pin 19 | RB5 — GPIO / ADC input |
| Pin 20 | RB4 — GPIO / ADC input |
| Pin EP | EP — Exposed pad - connect to VSS for thermal/electrical performance |
Typical Applications
PIC16F18444-E/GZ is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Industrial Control Modules, Smart Home Peripherals, Battery-Powered Medical Wearables, Automotive Body Electronics, Portable Instrumentation and Test Equipment.
Battery-Powered IoT Sensor Nodes
The PIC16F18444-E/GZ fits battery-powered IoT sensor nodes because its eXtreme Low-Power (XLP) nanoWatt technology delivers a deep-sleep current of approximately 100 nA with RTCC running, while the integrated 12-bit ADCC handles analog sensor reads without waking the CPU. The 32 MHz core wakes in microseconds, processes the sample, transmits via SPI to a sub-GHz radio, and returns to deep sleep. With 7 KB Flash, the firmware can include OTA bootloaders, Class B safety libraries, and sensor fusion routines while still fitting. The exposed pad on the 4x4 UQFN package supports the thermal dissipation required for continuous-duty industrial environments.
Recommended
Industrial Control Modules
The PIC16F18444-E/GZ is a strong fit for industrial control modules where deterministic 8-bit behavior, integrated 12-bit ADCC, and -40C to +125C operation are mandatory. The CWG peripheral generates complementary PWM signals for half-bridge motor control up to a few hundred Hz, while the comparator and configurable logic cell (CLC) implement hardware-based fault detection that does not depend on CPU timing. Its extended temperature range and FuSa-capable documentation simplify IEC 61508 SIL-2 designs when paired with the Microchip Class B library. The 20-UQFN small footprint lets designers squeeze the MCU onto compact DIN-rail PCBs.
Recommended
Smart Home Peripherals
The PIC16F18444-E/GZ is well matched to smart-home peripherals such as door/window sensors, leak detectors, and HVAC zone controllers thanks to its XLP deep sleep at roughly 100 nA and integrated 12-bit ADCC that reads temperature, humidity, and PIR outputs without external analog front-end ICs. The 17 GPIO available on the 20-UQFN footprint connect directly to pushbuttons, LEDs, piezo buzzers, and I2C sensors, while the EUSART bridges to a host MCU or wireless module. Designers can leverage MAP (Memory Access Partitioning) to ship firmware upgrades securely over BLE gateways.
Recommended
Battery-Powered Medical Wearables
The PIC16F18444-E/GZ supports low-power medical wearables such as continuous glucose monitors, pulse oximeters, and temperature patches because its nanoWatt XLP sleep modes combined with the 12-bit ADCC enable years of operation from a small Li-ion or coin cell. The Configurable Logic Cell (CLC) and Angular Timer can trigger ADC conversions directly from comparator events, offloading timing-critical tasks from the core and reducing firmware complexity. The FuSa documentation package, including IEC 60730 Class B firmware libraries, accelerates regulatory paths. The 4x4 mm UQFN footprint fits inside wearable enclosures where board area is severely constrained.
Recommended
Automotive Body Electronics
The PIC16F18444-E/GZ is suitable for non-safety automotive body electronics such as seat controllers, mirror adjusters, ambient lighting drivers, and HVAC actuators. Its 32 MHz performance with 8 MIPS, 2x PWM channels with CWG, and LIN-friendly EUSART (via software) support typical automotive body module protocols. The -40C to +125C temperature range meets automotive Grade-2 requirements. Designers should pair the part with the automotive-grade sibling (PIC16F18444-E/GZVAO) when AEC-Q100 documentation is mandatory, since the standard part is FuSa-capable but not formally AEC-Q100 qualified.
Recommended
Portable Instrumentation and Test Equipment
The PIC16F18444-E/GZ is well suited to portable instrumentation such as handheld multimeters, clamp meters, and field testers because the integrated 12-bit ADCC provides accurate voltage and current measurements, while the comparator and CLC implement hardware-level range detection without firmware overhead. The 32 MHz CPU handles display refresh over SPI to small OLED or TFT panels, and the XLP deep sleep extends battery life between measurements. The 20-UQFN 4x4 mm footprint lets designers fit a complete DMM on a sub-50x80 mm PCB alongside the analog front end.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F18444-E/GZ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F18344-E/GZ | PIC16F18424-E/GZ | PIC16F18426T-I/ST | PIC16F18346-E/GZ | PIC16F18324-E/GZ |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-UQFN (4x4) | 20-UQFN (4x4) - same | 20-UQFN (4x4) - same | 20-UQFN family (TSSOP-20 variant also in family) | 20-UQFN (4x4) - same | 20-UQFN (4x4) - same |
| Flash Memory | 7 KB | 7 KB | 7 KB | 28 KB | 28 KB | 7 KB |
| RAM | 512 B | 512 B | 512 B | 2 KB | 2 KB | 512 B |
| Maximum Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| 12-bit ADCC | Yes | No (10-bit ADC) | Yes | Yes | No (10-bit ADC) | No (10-bit ADC) |
| XLP nanoWatt | Yes | Yes | Yes | Yes | Yes | Yes |
| Functional Safety (FuSa) | Yes | Limited | Yes | Yes | Limited | Limited |
Key Differentiators
- Integrated 12-bit ADCC with computation engine (vs PIC16F18344-E/GZ)
- Larger Flash and RAM in same package (vs PIC16F18426T-I/ST)
- Functional Safety (FuSa) documentation package (vs PIC16F18324-E/GZ)
Design Notes
Estimated: deep-sleep current for the PIC16F18444-E/GZ is approximately 100 nA with RTCC running. For a CR2032 coin cell (220 mAh nominal), 100 nA continuous draw would deliver 220,000 hours = ~25 years, but the practical lifetime is dominated by self-discharge (~2%/year) and active-mode pulses. Always run a Monte-Carlo budget including worst-case sleep current, average active current, wake interval, and radio TX peak. Use Datasheet DS40002000B sleep current tables at 3.0V and -40C for pessimistic estimates. Do not forget the I/O leakage current when many pins are all selected as analog inputs.
The 20-pin UQFN package includes an exposed thermal pad (EP) that must be soldered to a copper pour on the PCB. Without the EP soldered, thermal resistance increases dramatically and the device may throttle or fail at high ambient. Land pattern: use a 4x4 mm UQFN footprint with a center pad of approximately 2.5x2.5 mm and 0.5 mm pitch perimeter pads. Route power and ground on inner layers to the EP via an array of thermal vias (8-12 vias, 0.3 mm drill, 0.5 mm pitch).
Watch out for these common mistakes: (1) forgetting to enable the LDO regulator in the CONFIG words when running at 5V - leave it in default. (2) Using the DAC without first enabling the DAC output buffer. (3) Programming the WDT with too short a timeout during firmware development - the WDT reset will interrupt debug sessions. (4) Forgetting that RA3 is the MCLR pin by default and needs to be configured as I/O via the CONFIG register. (5) Drawing more than 200 mA total from VDD/VSS when sourcing/sinking multiple LEDs - check the absolute maximum ratings.
For SPI buses above 4 MHz, place 33 ohm series resistors at the SCK/MOSI outputs to dampen ringing. Keep the SPI traces short and matched within 5 mm if multiple slaves share the bus. The 12-bit ADCC achieves its specified accuracy only when the input source impedance is below 1 kohm - add a buffer op-amp if your sensor exceeds this. Place a 100 nF ceramic decoupling capacitor within 3 mm of VDD, plus a 1 uF bulk capacitor at the board supply input.
Compliance Information
RoHS compliant per Microchip product page. Functional Safety (FuSa) documentation is available for IEC 60730 Class B but the part is not AEC-Q100 qualified - use the automotive -VAO variant for AEC-Q100 requirements.
