PIC16LF1509T-I/GZ - 8-bit MCU, 14KB Flash, 20MHz XLP | Microchip
MPN: PIC16LF1509T-I/GZ β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.45 | $1.45 |
| 10 | $1.3 | $13.00 |
| 100 | $1.12 | $112.00 |
| 500 | $0.95 | $475.00 |
| 1,000 | $0.8 | $800.00 |
PIC16LF1509T-I/GZ Overview
A PIC16 microcontroller is an 8-bit RISC processor built on Microchip's enhanced mid-range x14 instruction architecture, executing a 14-bit instruction word in a single clock cycle (200 ns at 20 MHz). The PIC16F family is the workhorse of Microchip's 8-bit portfolio, sitting between the baseline PIC10/12/16 families and the more advanced PIC18 and dsPIC33 families. It is widely adopted for cost-sensitive embedded control in consumer, industrial, and IoT applications.
Key features of this part include a 20 MHz internal oscillator, 12 I/O pins, multiple communication peripherals (UART, I2C, SPI), a 10-bit ADC with up to 12 channels, enhanced PWM, and configurable logic cells. The XLP technology delivers typical sleep currents below 50 nA, making it well-suited for battery-powered sensor nodes, energy harvesting designs, and remote controls.
This tape-and-reel ("T") industrial-grade variant (-40C to +85C) combines ultra-low-power consumption with a small 4x4 mm UQFN footprint, enabling dense PCB layouts. Compared to the PIC16F1509 (F-version), the LF variant reduces power consumption and supports extended input voltage margins, making it preferable for portable, energy-conscious designs.
Drop-in alternatives for PIC16LF1509T-I/GZ β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF1509T-I/GZ (same form factor and footprint) β differing in ADC, Instruction Set, Package, Packaging, Series.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
PIC16LF1509-I/GZ
β Drop-Inπ Reference alternative (not in catalog)
PIC16LF1509T-E/GZ
β Drop-Inπ Reference alternative (not in catalog)
PIC16LF1509-E/GZ
β Drop-Inπ Reference alternative (not in catalog)
PIC16LF1509T-I/ML
β Drop-Inπ Reference alternative (not in catalog)
PIC16LF1509-I/ML
β Drop-Inπ Reference alternative (not in catalog)
PIC16LF1508T-I/GZ
β Drop-Inβ In Stock
$1.31 / Unit
View Datasheet βPIC16LF1509T-I/GZ Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC (8-bit) |
| Series | PIC16F XLP |
| Core Size | 8-bit |
| Max CPU Speed | 20 MHz |
| Program Memory | 14 KB (8K x 14) Flash |
| RAM | 512 bytes |
| ADC | 10-bit |
| Number of I/O | 12 |
| Operating Voltage | 1.8 V to 3.6 V |
| Package | 20-UQFN (4x4 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (Industrial, "I") |
| Packaging | Tape & Reel ("T") |
| Instruction Set | PIC16F enhanced mid-range (x14), 200 ns instruction cycle |
| XLP Sleep Current | <50 nA typical (per Microchip XLP technology) |
| RoHS Status | Compliant |
PIC16LF1509T-I/GZ Pin Configuration
| Pin 1 | RA5 β Digital I/O / analog input |
| Pin 2 | RA4 β Digital I/O / analog input |
| Pin 3 | RA3/MCLR β Digital I/O / Master Clear (reset) input |
| Pin 4 | RA2 β Digital I/O / analog input |
| Pin 5 | RA1 β Digital I/O / analog input / ICSPCLK |
| Pin 6 | RA0 β Digital I/O / analog input / ICSPDAT |
| Pin 7 | VSS β Ground reference |
| Pin 8 | RC7 β Digital I/O |
| Pin 9 | RC6 β Digital I/O |
| Pin 10 | RC5 β Digital I/O |
| Pin 11 | RC4 β Digital I/O |
| Pin 12 | RC3 β Digital I/O |
| Pin 13 | RC2 β Digital I/O |
| Pin 14 | RC1 β Digital I/O |
| Pin 15 | RC0 β Digital I/O |
| Pin 16 | VDD β Positive supply voltage |
| Pin 17 | RA7 β Digital I/O / analog input |
| Pin 18 | RA6 β Digital I/O / analog input |
| Pin 19 | VSS β Ground reference (alternate) |
| Pin 20 | VDD β Positive supply voltage (alternate) |
Typical Applications
PIC16LF1509T-I/GZ is suitable for 6 applications: Battery-Powered IoT Sensor Node, Remote Control / Consumer Electronics, Industrial Sensor Monitoring, LED Lighting Control, Wearable Health Monitoring, Automotive Body Electronics (Non-Safety).
Battery-Powered IoT Sensor Node
The PIC16LF1509T-I/GZ is ideally suited for battery-powered IoT sensor nodes due to its XLP technology delivering sub-50 nA sleep current and 1.8V-3.6V operating voltage that supports direct Li-ion or 2x AA battery connection without regulation. The 14 KB Flash accommodates typical sensor processing firmware including periodic ADC reads, threshold checks, and packet transmission. The 10-bit ADC with 12 channels enables direct connection to temperature, humidity, and gas sensors. Compared to higher-performance MCUs, this part's XLP sleep mode extends coin-cell battery life from months to years, critical for remote deployments where battery replacement is impractical.
Recommended
Remote Control / Consumer Electronics
The PIC16LF1509T-I/GZ fits remote control and consumer electronics applications where compact size, low cost, and ultra-low standby power are paramount. The 4x4 mm UQFN-20 package enables slim product enclosures, while XLP sleep currents below 50 nA mean remotes can sit unused for years without battery replacement. The 20 MHz CPU speed handles IR protocol generation, button debouncing, and RF packet formatting. The 10-bit ADC can read battery voltage for low-battery warnings, and the enhanced PWM outputs can drive LEDs, buzzers, or haptic feedback. The UART/SPI/I2C peripherals support modern wireless modules for smart-home integration.
Recommended
Industrial Sensor Monitoring
Industrial sensor monitoring applications benefit from the PIC16LF1509T-I/GZ's industrial temperature range (-40C to +85C), robust 8-bit architecture, and XLP technology. The part monitors analog process variables (temperature, pressure, flow) via its 10-bit ADC with 12 input channels, then communicates readings via UART, I2C, or SPI to a central controller. The 14 KB Flash accommodates Modbus RTU or proprietary protocol stacks, while 512 bytes RAM handles message buffering. The UQFN-20 package's small footprint fits inside sensor housings, and the exposed thermal pad aids heat dissipation in enclosed industrial environments.
Recommended
LED Lighting Control
LED lighting control applications leverage the PIC16LF1509T-I/GZ's enhanced PWM peripherals, 10-bit ADC for ambient light sensing, and XLP low-power operation. The part generates multiple PWM channels to drive RGB or tunable-white LED strings with smooth dimming transitions, while the ADC reads photodiode or ambient light sensor inputs for closed-loop brightness control. The 14 KB Flash supports DMX, DALI, or proprietary lighting protocols, and 512 bytes RAM handles color-mixing buffer math. Low sleep current enables always-on standby modes where the light stays connected but only activates on motion or schedule.
Recommended
Wearable Health Monitoring
Wearable health monitoring devices like fitness bands, heart-rate straps, and smartwatches benefit from the PIC16LF1509T-I/GZ's ultra-low-power operation, small 4x4 mm UQFN package, and integrated 10-bit ADC for biosignal acquisition. XLP sleep currents below 50 nA enable multi-day battery life, while the 20 MHz CPU processes PPG (photoplethysmography) signals, step counting algorithms, and BLE radio control. The 14 KB Flash accommodates firmware for activity classification, while 512 bytes RAM buffers sensor samples between BLE transmissions. The exposed thermal pad aids heat dissipation during continuous heart-rate monitoring.
Recommended
Automotive Body Electronics (Non-Safety)
The PIC16LF1509T-I/GZ suits non-safety automotive body electronics applications such as interior lighting controllers, seat occupancy sensors, and climate control modules where 8-bit processing is sufficient. The industrial temperature range supports under-dash and cabin environments. The 10-bit ADC reads multiple analog sensors (temperature, position, light), while PWM outputs drive LED interior lighting with smooth fade transitions. For under-hood or safety-critical applications (ABS, airbag, engine control), Microchip's AEC-Q100-qualified PIC16F or dsPIC33 families are recommended instead. The UQFN-20 package's small footprint suits space-constrained body controllers.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF1509T-I/GZ β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF1509-I/GZ | PIC16LF1509T-E/GZ | PIC16LF1509T-I/ML | PIC16LF1508T-I/GZ |
|---|---|---|---|---|---|
| Package | 20-UQFN (4x4) - GZ | 20-UQFN (4x4) - GZ - same | 20-UQFN (4x4) - GZ - same | 20-QFN (4x4) - ML - equivalent | 20-UQFN (4x4) - GZ - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 14 KB | 14 KB | 14 KB | 14 KB | 7 KB |
| RAM | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 256 bytes |
| Operating Voltage | 1.8V to 3.6V | 1.8V to 3.6V | 1.8V to 3.6V | 1.8V to 3.6V | 1.8V to 3.6V |
| Max CPU Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C (Extended) | -40C to +85C | -40C to +85C |
| Packaging Format | Tape & Reel (T) | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
Key Differentiators
- Lowest voltage range in PIC16F1509 family (vs PIC16F1509-I/GZ (F variant, 2.3V to 5.5V))
- Larger memory than PIC16LF1508 family (vs PIC16LF1508T-I/GZ)
- Extended temperature variant available (vs PIC16LF1509T-I/GZ vs PIC16LF1509T-E/GZ)
Design Notes
The PIC16LF1509T-I/GZ supports 1.8V to 3.6V operation, enabling direct connection to a single Li-ion cell (2.7V-4.2V requires regulator) or two AA cells (2.0V-3.2V direct). Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of the VDD pin; the exposed thermal pad must be soldered to the ground plane for mechanical and thermal stability. For battery-powered designs, configure the MCU in XLP sleep mode (sleep current below 50 nA typical) and use a watchdog timer or external interrupt to wake periodically. Estimated: at 50 nA average sleep current and a 200 mAh CR2032 coin cell, theoretical battery life exceeds 400 years; practical life is limited by cell self-discharge (~1% per year).
Route the ICSPCLK and ICSPDAT pins (RA1 and RA0 on this package) to accessible test pads or a header for in-circuit programming and debugging. Keep analog input traces (RA0-RA7) short and away from switching signals like PWM outputs to minimize ADC noise coupling. Place the decoupling capacitor as close as possible to the VDD pin with a wide ground return path. The exposed thermal pad on the UQFN-20 package MUST be soldered to a grounded copper pour to meet mechanical reliability standards and provide thermal dissipation.
Do not exceed the 3.6V absolute maximum on VDD; even brief transients above 3.6V can damage the MCU. Ensure the MCLR pin (RA3) has a 10 kohm pull-up to VDD if not driven externally; leaving MCLR floating causes intermittent resets. When migrating from PIC16F1509 to PIC16LF1509 firmware, verify that any voltage-dependent configuration bits (BOR threshold, etc.) remain within the 1.8V-3.6V LF range. The UQFN-20 (GZ suffix) is not pin-compatible with the SSOP-20 (SS suffix) or SOIC-20 (SO suffix) packages; PCB redesign is required for footprint changes.
Compliance Information
RoHS and REACH compliant per Microchip product page; industrial temperature grade -40C to +85C; not AEC-Q100 qualified - use AEC-Q100-qualified PIC16F or dsPIC33 for automotive safety-critical applications
