Microchip Technology

PIC16F18456-I/SP - 8-bit 32MHz XLP MCU 28KB Flash 28-SPDIP | Microchip

MPN: PIC16F18456-I/SP βœ“ Active
In Stock Ships in 1-3 business days
2.3 V to 5.5 V Vdss 28-pin SPDIP (Skinny Plastic DIP) Package 32 MHz Speed Flash Memory
From $1.07 USD / Unit
MOQ: 1 |
Price updated: 2026-09-20
Volume Pricing
Qty Unit Price Extended
1 $1.78 $1.78
10 $1.62 $16.20
100 $1.41 $141.00
500 $1.21 $605.00
1,000 $1.07 $1,070.00
ℹ️ All prices are in USD

PIC16F18456-I/SP Overview

The Microchip Technology PIC16F18456-I/SP is an 8-bit PIC microcontroller featuring a 32 MHz PIC16 CPU core, 28 KB (16K x 14) of Flash program memory, and a 28-pin SPDIP (Skinny Plastic DIP) through-hole package. Industrial temperature range -40C to +85C with 2.3V to 5.5V operating voltage.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and a rich set of peripherals (ADCs, timers, communication interfaces) onto one die. The PIC16F18456 belongs to the eXtreme Low-Power (XLP) family, which targets battery-powered and energy-harvesting designs. Within the broader taxonomy it sits as: 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC.

Key features include 32 MHz max CPU clock, 28 KB Flash, 2 KB RAM, 256 bytes EEPROM, 12-bit ADC with Computation (ADCC), 2x PWM with Complementary Waveform Generator (CWG), DAC, comparator, EUSART, and 2x SPI/I2C. Core Independent Peripherals (CIPs) handle tasks in hardware without waking the CPU, reducing power consumption. XLP technology delivers sub-uA sleep currents for battery longevity.

Architecturally the device uses a 14-bit instruction word RISC core (16K x 14 = 28 KB Flash addressing) with a hardware multiply and single-cycle instruction execution. The 12-bit ADCC includes averaging, burst averaging, and threshold comparisons; the CWG provides complementary outputs with programmable dead-band for synchronous motor control.

Typical applications include IoT sensor nodes, consumer appliance controls, industrial sensor interfaces, low-power remote controls, and battery-operated medical devices. The combination of CIPs and XLP suits designs that must wake, sample, and return to deep sleep rapidly. A key design consideration: the SPDIP package is suitable for prototypes, hand-soldered prototypes, and educational use; for volume production choose the SOIC (PIC16F18456-I/SO), SSOP (PIC16F18456-E/SS), or QFN (PIC16F18456-I/STX) variants for smaller PCB footprint.

Drop-in alternatives for PIC16F18456-I/SP β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC16F18456-I/SP (same form factor and footprint) β€” differing in ADC, Core Architecture, MSL Level, PWM.

Microchip Technology
ADC: 12-bit ADCC with Computation, up to 24 channels
Core Architecture: 8-bit PIC enhanced mid-range (14-bit instruction word)
MSL Level: 1 (not moisture sensitive)

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

PIC16F18455-I/SP

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Microchip Technology
πŸ“¦ 28-SPDIP
8-bit PIC enhanced mid-range (14-bit instruction word) Β· 14 KB (8K x 14 words) Β· 1 KB Β· 256 bytes Β· 32 MHz Β· 2.5 V to 5.5 V Β· -40 C to +85 C Β· 25 (max)

βœ“ In Stock

$1.62 / Unit

View Datasheet β†’

PIC16F18446-I/SP

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 28-SPDIP
28 KB Flash, reduced RAM (1 KB vs 2 KB), same 28-SPDIP footprint

πŸ“‹ Reference alternative (not in catalog)

PIC16F18445-I/SP

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 28-SPDIP
Reduced Flash (14 KB vs 28 KB), same 28-SPDIP pinout

πŸ“‹ Reference alternative (not in catalog)

PIC16F18346-I/SP

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 28-SPDIP
28 KB Flash, 2 KB RAM, prior-generation peripherals (no CWG), same 28-SPDIP footprint

πŸ“‹ Reference alternative (not in catalog)

PIC16F18345-I/SP

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 28-SPDIP
Reduced Flash (14 KB vs 28 KB), same 28-SPDIP pinout, prior-generation

πŸ“‹ Reference alternative (not in catalog)

PIC16F18456-I/SP Maximum Ratings & Electrical Characteristics

Core Architecture 8-bit PIC16 RISC
CPU Core PIC16F
Program Memory Type Flash
Program Memory Size 28 KB (16K x 14)
RAM 2 KB
EEPROM 256 bytes
Maximum CPU Clock 32 MHz
Instruction Word Width 14 bits
Operating Voltage Range 2.3 V to 5.5 V
Operating Temperature Range -40C to +85C (Industrial)
Package Type 28-pin SPDIP (Skinny Plastic DIP)
Mounting Type Through-Hole
ADC 12-bit ADCC with Computation
PWM 2x with Complementary Waveform Generator (CWG)
Communication Interfaces EUSART, 2x SPI/I2C
Peripherals DAC, Comparator, CWG, CIPs
Low-Power Technology XLP (eXtreme Low-Power)
MSL Level 1 (unlimited)
RoHS Status Compliant

PIC16F18456-I/SP Pin Configuration

DIP-28 Package Pinout Diagram DIP-28 28-pin dual inline, 7.62mm pitch, JEDEC MS-001. 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 DIP-28
Pin 1 VDD β€” Positive supply voltage (2.3V to 5.5V)
Pin 2 RA0/ANA0 β€” GPIO/Analog input (Port A, pin 0)
Pin 3 RA1/ANA1 β€” GPIO/Analog input (Port A, pin 1)
Pin 4 RA2/ANA2 β€” GPIO/Analog input (Port A, pin 2)
Pin 5 RA3/ANA3/VREF+ β€” GPIO/Analog input/Positive reference voltage
Pin 6 RA4/ANA4 β€” GPIO/Analog input (Port A, pin 4)
Pin 7 RA5/ANA5 β€” GPIO/Analog input (Port A, pin 5)
Pin 8 RA6/ANA6 β€” GPIO/Analog input (Port A, pin 6)
Pin 9 RA7/ANA7 β€” GPIO/Analog input (Port A, pin 7)
Pin 10 RB0/ANB0 β€” GPIO/Analog input (Port B, pin 0)
Pin 11 RB1/ANB1 β€” GPIO/Analog input (Port B, pin 1)
Pin 12 RB2/ANB2 β€” GPIO/Analog input (Port B, pin 2)
Pin 13 RB3/ANB3 β€” GPIO/Analog input (Port B, pin 3)
Pin 14 VSS β€” Ground reference
Pin 15 VSS β€” Ground reference
Pin 16 RB4 β€” GPIO (Port B, pin 4)
Pin 17 RB5 β€” GPIO (Port B, pin 5)
Pin 18 RB6/ICSPCLK β€” GPIO/ICSP clock
Pin 19 RB7/ICSPDAT β€” GPIO/ICSP data
Pin 20 RC0 β€” GPIO (Port C, pin 0)
Pin 21 RC1 β€” GPIO (Port C, pin 1)
Pin 22 RC2 β€” GPIO (Port C, pin 2)
Pin 23 RC3 β€” GPIO (Port C, pin 3)
Pin 24 RC4 β€” GPIO (Port C, pin 4)
Pin 25 RC5 β€” GPIO (Port C, pin 5)
Pin 26 RC6 β€” GPIO (Port C, pin 6)
Pin 27 RC7 β€” GPIO (Port C, pin 7)
Pin 28 VDD β€” Positive supply voltage (2.3V to 5.5V)

Typical Applications

PIC16F18456-I/SP is suitable for 6 applications: IoT Sensor Nodes, Consumer Appliance Controls, Industrial Sensor Interfaces, Low-Power Remote Controls, Battery-Operated Medical Devices, Motor Control and PWM Subsystems.

🧩

IoT Sensor Nodes

The PIC16F18456-I/SP is well suited for battery-powered IoT sensor nodes where the XLP technology's sub-uA sleep current extends battery life, while the 12-bit ADCC on-chip simplifies analog front-end design. With 28 KB Flash and 2 KB RAM the device easily fits typical LoRaWAN or BLE sensor firmware, and CIPs (Core Independent Peripherals) let ADCC threshold comparisons and CWG operations run without waking the CPU - critical for multi-year coin-cell deployments. Operating from 2.3V to 5.5V supports direct 2x AA cell use.

🏭

Consumer Appliance Controls

In consumer appliance controls, the PIC16F18456-I/SP provides the GPIOs, timer-based PWMs, and ADC channels needed for small kitchen appliances, white goods user interfaces, and motor-control subsystems. The Complementary Waveform Generator (CWG) outputs synchronous PWMs with programmable dead-band suitable for half-bridge motor drives, while the on-chip 12-bit ADCC reads temperature, current, and position sensors. The 28-SPDIP package simplifies hand-rework in appliance service depots.

🏭

Industrial Sensor Interfaces

Industrial sensor interfaces benefit from the PIC16F18456-I/SP's 12-bit ADCC, EUSART, and SPI/I2C ports, which handle analog conditioning plus digital protocols in a single chip. The -40C to +85C industrial range operates in factory floors, while XLP idle modes reduce energy use in 4-20 mA loop-powered or energy-harvesting sensors. The CIP framework reduces CPU load, freeing bandwidth for deterministic response to safety-critical events.

🎧

Low-Power Remote Controls

For low-power remote controls (RF, IR, BLE), the PIC16F18456-I/SP integrates the timer and PWM resources for IR modulation while the EUSART drives UART-based BLE or sub-GHz modules. XLP technology's nanoWatt sleep currents enable years of operation from a single CR2032 coin cell, and CIP-driven wake-on-input responds instantly to button presses without CPU boot latency. The 28-SPDIP package eases prototype rework when adding IR-driver circuitry.

πŸ’Š

Battery-Operated Medical Devices

Battery-operated medical devices such as glucose monitors, pulse oximeters, and wearable health trackers benefit from the PIC16F18456-I/SP's XLP technology, on-chip 12-bit ADCC, and DAC for sensor excitation and signal conditioning. The 28 KB Flash accommodates field-upgradable firmware with version checks, while deterministic CIP execution supports predictable response on safety-critical measurements. Industrial temperature range supports portable clinical and home-care use cases.

⚑

Motor Control and PWM Subsystems

The PIC16F18456-I/SP's Complementary Waveform Generator (CWG) outputs synchronized PWM pairs with programmable dead-band, making it suitable for brushed and stepper motor control. The on-chip 12-bit ADCC samples feedback signals (current, voltage, position), while CIPs perform cycle-by-cycle current limiting in hardware without CPU latency. The 2 KB RAM comfortably handles PID controller state variables and encoder quadrature decoding.

Recommended Products Summary

PIC16F18456-I/SO Microchip Technology Used in: IoT Sensor Nodes, Industrial Sensor Interfaces, Battery-Operated Medical Devices PIC16F18446-I/SO Lower-cost PIC16 sibling with same XLP low-power technology Used in: IoT Sensor Nodes PIC16F18455-I/SP Microchip Technology Used in: Consumer Appliance Controls, Motor Control and PWM Subsystems PIC16F18456-E/SS Microchip Technology Used in: Consumer Appliance Controls PIC16F18346-I/SP Prior-generation lower-cost alternative Used in: Industrial Sensor Interfaces PIC16F18445-I/SP Reduced-Flash variant for compact remote control firmware Used in: Low-Power Remote Controls PIC16F18426-I/JQ Microchip Technology Used in: Low-Power Remote Controls PIC16F18446-E/SO Microchip Technology Used in: Battery-Operated Medical Devices DSPIC30F2010-30I/SO dsPIC upgrade with DSP acceleration for FOC motor control Used in: Motor Control and PWM Subsystems
What is the program memory size of PIC16F18456-I/SP?
The PIC16F18456-I/SP has 28 KB (16K x 14) of Flash program memory organized as 16K 14-bit instruction words. According to Microchip product page, this is paired with 2 KB of RAM and 256 bytes of EEPROM data memory, providing ample space for embedded applications in the XLP family.
What is the maximum CPU clock frequency of PIC16F18456-I/SP?
The PIC16F18456-I/SP runs up to 32 MHz on its internal oscillator. According to the Microchip PIC16(L)F184xx family datasheet, the device achieves 8 MIPS (Million Instructions Per Second) at 32 MHz because most instructions execute in a single cycle on the 8-bit PIC16 RISC core.
What is the operating voltage range of PIC16F18456-I/SP?
The PIC16F18456-I/SP operates from 2.3V to 5.5V, supporting both 3.3V and 5V system rails. According to the Microchip datasheet, this wide VDD range combined with XLP technology enables battery-powered designs using 2x AA cells (down to ~2.0V end-of-life) and direct 5V regulator input for industrial designs.
Where can I buy PIC16F18456-I/SP online?
The PIC16F18456-I/SP is available from major distributors including DigiKey, Mouser, and Microchip Direct. As of 2026-09-20, DigiKey stock shows immediate availability for the through-hole 28-SPDIP version; lead times for high-volume orders may vary.
What is the price of PIC16F18456-I/SP?
The PIC16F18456-I/SP unit price is approximately $1.78 at qty 1, dropping to $1.07 at qty 1000 as of 2026-09-20 distributor pricing. Volume pricing from Microchip Direct may differ; contact XAIPART for current stock and quotation on bulk orders.
What is the lead time for PIC16F18456-I/SP?
The PIC16F18456-I/SP ships immediately from distributors such as DigiKey and Mouser as of 2026-09-20, with factory lead times of roughly 8-12 weeks for direct Microchip orders of large quantities. Industrial-grade production scheduling is generally robust for this active part.
Is PIC16F18456-I/SP in stock at distributors?
Yes, the PIC16F18456-I/SP is shown in stock at DigiKey as of 2026-09-20. Mouser also lists inventory; for real-time stock counts and pricing across multiple distributors use Octopart aggregation. Quotation requests can be submitted directly via XAIPART.
PIC16F18456-I/SP vs PIC16F18455-I/SP - which is better?
The PIC16F18456 has 28 KB Flash and 2 KB RAM, while the PIC16F18455 has 28 KB Flash and 2 KB RAM but fewer peripherals. For higher-memory or richer peripheral needs, the PIC16F18456 wins. For cost-sensitive smaller applications where the 18455's I/O and memory fit, the PIC16F18455 saves cost.
What is the difference between PIC16F18456-I/SP and PIC16F18456-I/SO?
The -I/SP uses a 28-pin SPDIP through-hole package, while the -I/SO uses a 28-pin SOIC surface-mount package. Both share identical silicon, peripherals, and memory map; the SOIC version is preferred for volume SMT assembly, while the SPDIP suits prototyping and through-hole designs.
When should I choose PIC16F18456-I/SP over PIC16F18455-I/SP?
Choose the PIC16F18456-I/SP when your application needs the full peripheral set including the DAC, additional CWG resources, or extra CIPs available on the 18456 die. Choose the PIC16F18455-I/SP when your design fits within the 18455's reduced peripheral set and you want a slightly lower-cost option sharing the same 28-SPDIP footprint.
Is PIC16F18456-I/SP suitable for battery-powered designs?
Yes, the PIC16F18456-I/SP is designed for battery-powered applications thanks to XLP (eXtreme Low-Power) technology. The PIC16(L)F184xx datasheet shows down to sub-uA sleep currents with retention RAM, plus the ability to wake on peripheral triggers without CPU intervention - ideal for IoT sensor nodes.
What is the best drop-in replacement for PIC16F18456-I/SP?
The best drop-in replacements for PIC16F18456-I/SP in the same 28-SPDIP footprint are PIC16F18446-I/SP, PIC16F18445-I/SP, and PIC16F18346-I/SP from the same PIC16(L)F184xx and PIC16(L)F183xx families. These parts share the same pinout and use the same toolchain, with differing memory/peripheral counts.
Can an Atmel/Microchip ATSAM4S MCU replace PIC16F18456-I/SP?
No direct drop-in exists between PIC16F18456-I/SP (8-bit PIC, 28-SPDIP) and ATSAM4S Cortex-M4 devices (32-bit ARM, LQFP/QFN packages). The ATSAM4S requires a different package footprint, different toolchain (ARM GCC vs XC8), and runs at 32-bit. Drop-in replacement must share the 8-bit PIC toolchain and 28-SPDIP pinout.
Where can I download the PIC16F18456-I/SP datasheet PDF?
The official Microchip PIC16F18456-I/SP datasheet can be downloaded from https://ww1.microchip.com/downloads/en/DeviceDoc/40001985C.pdf or via the product page at https://www.microchip.com/en-us/product/PIC16F18456. The datasheet covers electrical characteristics, peripheral operation, and programming specifications.
Where can I find the PIC16F18456-I/SP pinout diagram?
The PIC16F18456-I/SP pinout is published on page 4 of the Microchip PIC16(L)F184xx datasheet and reproduced on the product packaging diagram. The 28-pin SPDIP pinout assigns VDD to pin 1 and pin 28, VSS to pin 14 and pin 15, with ADC, PWM, EUSART, SPI/I2C, and GPIO distributed across the remaining pins.
What are the key specifications of PIC16F18456-I/SP that engineers should know?
The PIC16F18456-I/SP is an 8-bit 32 MHz MCU with 28 KB Flash, 2 KB RAM, 256 B EEPROM, 12-bit ADCC, 2x PWM with CWG, EUSART, 2x SPI/I2C operating from 2.3V to 5.5V in a 28-SPDIP package. It targets industrial -40C to +85C with XLP low-power technology and CIPs for autonomous peripheral operation without CPU wake-up.

Engineering reference data for PIC16F18456-I/SP β€” comparison, design guidance, and compliance information.

Selection Guide

Choose PIC16F18456-I/SP when you need 28 KB Flash plus the full peripheral set (DAC, CWG with dead-band, full 12-bit ADCC computation) in an 8-bit PIC MCU on the through-hole 28-SPDIP footprint for prototyping, hand-soldering, or repair-friendly designs. For SMT volume production, switch to PIC16F18456-I/SO (SOIC-28), PIC16F18456-E/SS (SSOP-28), or PIC16F18456-I/STX (QFN) instead. If your code and peripheral needs fit the 14 KB Flash variant, choose PIC16F18445-I/SP to save cost on a drop-in same-package replacement. If no peripherals are missing in your design, PIC16F18455-I/SP is also valid. None of the 28-SPDIP drop-ins require toolchain changes (all use MPLAB X + XC8). Cross-brand Cortex-M replacements require package change and toolchain migration and are not drop-in here.

Comparison with Alternatives

Parameter This Product PIC16F18455-I/SP PIC16F18446-I/SP PIC16F18445-I/SP PIC16F18346-I/SP
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-SPDIP (through-hole) 28-SPDIP (through-hole) 28-SPDIP (through-hole) 28-SPDIP (through-hole) 28-SPDIP (through-hole)
CPU Core PIC16 8-bit RISC PIC16 8-bit RISC PIC16 8-bit RISC PIC16 8-bit RISC PIC16 8-bit RISC
Program Memory 28 KB Flash 28 KB Flash 28 KB Flash 14 KB Flash 28 KB Flash
RAM 2 KB 2 KB 1 KB 1 KB 2 KB
Maximum Clock 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz
Operating Voltage 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V
Peripheral Set ADCC, CWG, 2xPWM, DAC, CMP, EUSART, 2xSPI/I2C Reduced ADCC/CWG set Reduced ADCC/CWG set Reduced ADCC/CWG set 12-bit ADC (no CWG), 2xPWM, DAC, CMP, EUSART, 2xSPI/I2C

Key Differentiators

  • Largest Flash with full CIP and CWG peripheral set in the 1845x family (vs PIC16F18455-I/SP)
  • Doubled RAM vs the 18445/18446 reduced-memory siblings (vs PIC16F18446-I/SP)
  • Newer-generation CWG over the PIC16F18346 (vs PIC16F18346-I/SP)

Design Notes

Estimated: At 32 MHz with VDD=3.3V, the PIC16F18456-I/SP active current is approximately 3-5 mA depending on peripheral activity. For battery-powered designs, sleep current dominates long-term energy budget. XLP sleep modes (Retention-only RAM) draw < 100 nA typical, enabling multi-year coin-cell operation with proper wake-on-peripheral configuration. Always add a 0.1 uF decoupling capacitor within 5 mm of VDD pin and a bulk 10 uF on the supply rail to suppress MCU switching transients.

Place analog VDD/VSS (AVDD/AVSS) decoupling capacitors as close to those pins as possible, even if AVDD is tied to VDD - stray impedance degrades 12-bit ADCC noise performance. The 28-SPDIP package has generous pin spacing (2.54 mm pitch) easing hand wiring for prototypes and educational kits, but signals should still be routed with care to avoid cross-coupling on adjacent ADC channels. Keep digital switching lines (PWM, EUSART clocks) physically separate from sensitive analog traces.

Common pitfalls: (1) ICSPCLK/ICSPDAT (RB6/RB7) are shared with general-purpose GPIO - if these pins are repurposed, ensure ICSP programming remains accessible via resistors or test points for production flash programming. (2) Configuring VREF+ on RA3 disables analog reads on that pin - check the PPS (Peripheral Pin Select) assignment in the configuration bits before locking firmware. (3) The internal 32 MHz oscillator needs a calibration step at runtime; external crystal needed only when USB or accurate EUSART baud rates are required.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per Microchip product page. Industrial -40C to +85C temperature range; AEC-Q100 not applicable - non-automotive part. See PIC16F18456-I/SP automotive-grade part numbers for AEC-Q100 options if needed.

Data verified on: 2026-09-20 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC16F18456 PIC16F18456-I/SP PIC16F18455 PIC16F18446 PIC16F18445 PIC16F18346 PIC16F18345 8-bit microcontroller PIC16 RISC core PIC16F XLP (eXtreme Low-Power) Core Independent Peripherals CWG (Complementary Waveform Generator) 12-bit ADCC Flash program memory SPDIP (Skinny Plastic DIP) Through-hole package RoHS MPLAB X (Microchip toolchain) XC8 (C compiler) IoT sensor node Motor control Battery-operated device
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