PIC16LF1709T-I/ML - 8-Bit XLP MCU, 14KB Flash, 32MHz | Microchip
MPN: PIC16LF1709T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.18 | $2.18 |
| 10 | $1.96 | $19.60 |
| 100 | $1.62 | $162.00 |
| 500 | $1.34 | $670.00 |
| 1,000 | $1.14 | $1,140.00 |
PIC16LF1709T-I/ML Overview
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path, typically a Harvard-architecture CPU with separate program and data memories. PIC MCUs sit in the broader hierarchy: 8-bit microcontroller -> microcontroller -> embedded processor -> semiconductor -> integrated circuit. The "LF" prefix denotes the low-voltage core optimized for battery operation; "F" denotes Flash program memory; "XLP" denotes Microchip's eXtreme Low Power technology platform with sub-uA sleep currents. Designers choose 8-bit MCUs over 32-bit alternatives when cost, deterministic interrupt latency, and code simplicity dominate over raw MIPS, and the PIC16F170X/171X family specifically targets applications needing integrated intelligent analog (op-amps, DAC, ADC) alongside core-independent peripherals.
Key features include 14KB (8K x 14) Flash, 1KB SRAM, 128 bytes data EEPROM, 32MHz internal oscillator, two op-amps, two comparators, two CCP/PWM channels, 10-bit ADC with computation, 8-bit DAC, two CLCs, one COG, one ZCD, PPS, EUSART, I2C/SPI, and 18 I/O pins. The device supports sleep currents as low as when using XLP nanoWatt features, enabling multi-year battery life on coin cells. The 20-QFN package exposes the die pad (EP) for thermal dissipation and ground connection, requiring PCB thermal via stitching to the internal ground plane.
Typical applications include IoT sensor nodes, low-power wireless peripherals (BLE/Zigbee host boards), consumer battery devices such as remote controls and wearables, LED lighting controllers using the COG for flicker-free dimming, and small motor-control loops using the op-amps as current-sense amplifiers. The integrated op-amps and DAC remove external analog front-end components, reducing BOM cost and PCB area. When laying out the PCB, stitch a via array under the exposed pad to the ground plane; missing vias degrade thermal performance and may cause the internal core to enter thermal shutdown during sustained PWM at high switching frequency. For firmware, the PPS feature allows remapping of digital peripherals to any I/O, simplifying PCB routing when the initial pin assignment is suboptimal.
Drop-in alternatives for PIC16LF1709T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF1709T-I/ML (same form factor and footprint) — differing in ADC, Package, Core Architecture, I/O Pins, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16LF1709-I/ML
✅ Drop-In✓ In Stock
$1.21 / Unit
View Datasheet →PIC16LF1709-I/P
✅ Drop-In✓ In Stock
$1.42 / Unit
View Datasheet →PIC16LF1705-I/ML
✅ Drop-In✓ In Stock
$0.54 / Unit
View Datasheet →PIC16LF1704-I/ML
✅ Drop-In✓ In Stock
$0.71 / Unit
View Datasheet →PIC16LF1579-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1619-I/ML
✅ Drop-In✓ In Stock
$1.32 / Unit
View Datasheet →PIC16LF1709T-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC16 8-bit RISC |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data SRAM | 1 KB |
| Data EEPROM | 128 bytes |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage Range | 1.8 V to 3.6 V |
| I/O Pins | 18 |
| Op-Amps | 2 on-chip |
| Comparators | 2 |
| CCP / PWM Channels | 2 |
| CLC (Configurable Logic Cells) | 2 |
| COG (Complementary Output Generator) | 1 |
| ZCD (Zero-Cross Detect) | 1 |
| PPS (Peripheral Pin Select) | Yes |
| Communication | EUSART, I2C, SPI |
| Package | 20-QFN (4x4 mm) with exposed pad |
| Operating Temperature | -40 C to +85 C (Industrial, "I") |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC16LF1709T-I/ML Pin Configuration
| Pin 1 | RA5 — Bidirectional I/O, analog input |
| Pin 2 | RA4 — Bidirectional I/O, analog input |
| Pin 3 | RA3/MCLR — I/O / Master Clear (reset, active low) |
| Pin 4 | RC5 — Bidirectional I/O, analog input |
| Pin 5 | RC4 — Bidirectional I/O, analog input |
| Pin 6 | RC3 — Bidirectional I/O, analog input |
| Pin 7 | RC6 — Bidirectional I/O, analog input |
| Pin 8 | RC7 — Bidirectional I/O, analog input |
| Pin 9 | RB7 — Bidirectional I/O, analog input |
| Pin 10 | RB6 — Bidirectional I/O, analog input |
| Pin 11 | RB5 — Bidirectional I/O, analog input |
| Pin 12 | RB4 — Bidirectional I/O, analog input |
| Pin 13 | VDD — Positive supply voltage |
| Pin 14 | VSS — Ground reference |
| Pin 15 | RC2 — Bidirectional I/O, analog input |
| Pin 16 | RC1 — Bidirectional I/O, analog input |
| Pin 17 | RC0 — Bidirectional I/O, analog input |
| Pin 18 | RA2 — Bidirectional I/O, analog input |
| Pin 19 | RA1 — Bidirectional I/O, analog input |
| Pin 20 | RA0 — Bidirectional I/O, analog input |
Typical Applications
PIC16LF1709T-I/ML is suitable for 6 applications: IoT Sensor Nodes, Battery-Powered Consumer Wearables, LED Lighting Controllers with Flicker-Free Dimming, Small Motor Control Loops, Smart Home Sensor Hubs, Industrial 4-20 mA Loop Sensors.
IoT Sensor Nodes
The PIC16LF1709T-I/ML fits IoT sensor nodes because its XLP architecture delivers sub-uA sleep currents and the 32 MHz PIC16 core wakes fast enough to service periodic sensor reads. The on-chip 10-bit ADC with computation, two op-amps for direct sensor conditioning (thermocouple, bridge, photodiode), and I2C/SPI for connecting to radio or sensor hubs remove external components. Operating from 1.8 V to 3.6 V matches coin-cell and Li-ion battery rails directly. Engineers typically pair it with sub-GHz or BLE modules for duty-cycled transmissions; the COG peripheral generates timing for the radio enable without waking the CPU, enabling multi-year battery life on a single CR2032 in typical 1% duty-cycle applications.
Recommended
Battery-Powered Consumer Wearables
The PIC16LF1709T-I/ML suits battery-powered consumer wearables thanks to its 1.8 V minimum supply and XLP nanoWatt sleep modes that drop current consumption to the nano-Ampere range during inactive periods. The integrated op-amps interface directly with bio-potential or motion sensors, while the CLC peripherals handle timing-critical sequencing without waking the CPU. The small 20-QFN (4x4 mm) footprint fits inside wristbands and patches where PCB area is constrained. Designers use the PPS feature to remap digital peripherals to optimize layout routing around battery cells and antenna keepout zones. Combined with the 8-bit DAC, the MCU can drive LED indicators or haptic feedback directly, reducing BOM cost.
Recommended
LED Lighting Controllers with Flicker-Free Dimming
The PIC16LF1709T-I/ML's COG (Complementary Output Generator) peripheral generates hardware-timed PWM with programmable dead-band delays and blanking, making it ideal for flicker-free LED dimming applications. The 32 MHz core supports high-resolution PWM at frequencies well above 200 Hz where flicker becomes imperceptible. The ZCD (Zero-Cross Detect) peripheral detects AC mains zero crossings for TRIAC-dimmable LED retrofit designs without external optocouplers. The 8-bit DAC can drive analog LED current references. Designers can implement warm-dim color-temperature curves in firmware while the COG maintains precise LED current regulation in hardware, offloading the CPU entirely.
Recommended
Small Motor Control Loops
The PIC16LF1709T-I/ML is well matched to small motor control loops, such as BLDC fans, micro-pumps, and haptic actuators, because its on-chip op-amps serve as current-sense amplifiers directly at the shunt resistor, while the COG generates complementary PWM with hardware dead-band insertion. The PIC16 core's deterministic interrupt latency ensures predictable commutation timing at up to 32 MHz. The 32 KB CCP/PWM pair provides two independent PWM channels, sufficient for single-phase or simple three-phase modulation. Engineers add external gate drivers (such as the MCP8024 or MIC4606) to drive power MOSFETs; the MCU itself controls timing and current regulation.
Recommended
Smart Home Sensor Hubs
The PIC16LF1709T-I/ML serves as a cost-effective smart home sensor hub controller thanks to its integrated op-amps (direct sensor interface), ADC, DAC, and communication peripherals (EUSART, I2C, SPI) for connecting to radios, displays, or additional sensors. The 14 KB Flash accommodates Zigbee or BLE stack light profiles or proprietary sensor fusion code. Operating from 1.8 V to 3.6 V suits direct battery or USB-powered hub designs. The PPS feature simplifies PCB routing when multiple peripherals must share I/O pins. Engineers typically pair it with a host MCU over UART/SPI for cloud connectivity while the PIC16 handles local sensor processing and actuation.
Recommended
Industrial 4-20 mA Loop Sensors
The PIC16LF1709T-I/ML's 1.8 V minimum supply, on-chip op-amps, and 10-bit ADC with computation make it an excellent fit for low-power 4-20 mA industrial loop sensor transmitters. The op-amps can be configured as current-sense amplifiers and instrumentation front-ends for bridge sensors (pressure, strain). Operating at industrial -40 C to +85 C, the device meets harsh factory floor requirements. Engineers use the EUSART to drive HART modems or RS-485 transceivers for legacy fieldbus connectivity. The XLP sleep modes keep loop current consumption below 3.5 mA, preserving the 4 mA loop budget for the sensor itself.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF1709T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF1709-I/ML | PIC16LF1709-I/P | PIC16LF1705-I/ML | PIC16LF1704-I/ML | PIC16LF1579-I/ML | PIC16LF1619-I/ML |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-QFN (4x4) | 20-QFN (4x4) - same | 20-QFN (4x4) - same | 20-QFN (4x4) - same | 20-QFN (4x4) - same | 20-QFN (4x4) - same | 20-QFN (4x4) - same |
| Program Memory (Flash) | 14 KB | 14 KB | 14 KB | 8 KB (-43%) | 4 KB (-71%) | 14 KB | 28 KB (+100%) |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| COG Peripheral | Yes | Yes | Yes | No | No | No | Yes |
| Op-Amps | 2 | 2 | 2 | 2 | 0 | 0 | 2 |
| Approx. Price (qty 100) | $1.62 | $1.62 | $1.62 | $1.30 (-20%) | $1.10 (-32%) | $1.45 (-10%) | $1.95 (+20%) |
Key Differentiators
- Integrated COG and ZCD peripherals for hardware-timed control (vs PIC16LF1705-I/ML)
- Highest Flash memory in 20-QFN XLP family (vs PIC16LF1619-I/ML)
- Most peripheral-rich 14 KB Flash 8-bit MCU in 20-QFN package (vs PIC16LF1704-I/ML)
Design Notes
The 20-QFN (4x4 mm) package exposes a center thermal pad (EP) that must be soldered to a PCB land pattern with a via array stitched to the internal ground plane. Omitting the via array degrades thermal performance by 30-50% and may cause the internal core to enter thermal shutdown during sustained high-frequency PWM operation. Recommended: 4-9 vias in a 1.0 mm pitch grid, 0.3 mm drill diameter, plugged and capped on top to prevent solder wicking into the via barrel.
Place a 100 nF decoupling capacitor as close as possible to the VDD pin (pin 13) with the trace width matching the package pad to minimize inductance. Add a bulk 1-10 uF capacitor near the supply rail. The LF silicon operates down to 1.8 V but CPU speed is derated to 16 MHz below 2.5 V; ensure firmware clock-switching code respects this limit. For battery designs, use Sleep mode with peripheral wake (IOC or ADC) to achieve sub-uA quiescent current per the XLP datasheet figures.
The PPS (Peripheral Pin Select) feature allows remapping of digital peripherals (EUSART, I2C, SPI, PWM) to any I/O pin after reset. Use PPS to optimize PCB routing when initial pin assignments create cross-overs or require long traces. However, analog peripherals (ADC, op-amps, comparators, DAC) have fixed pin assignments - always consult the datasheet pinout table before finalizing schematic capture. Leave pin 3 (RA3/MCLR) accessible for in-circuit serial programming (ICSP) with a pull-up to VDD and a 4.7 k resistor in series for ICSP isolation.
Estimated: At maximum 32 MHz CPU speed and 3.6 V supply, core current consumption reaches approximately 6-8 mA active; verify this against actual load transients if powering from a low-current LDO. Do not assume the LF silicon is 5 V tolerant - absolute maximum VDD is 4.0 V (per datasheet), and applying 5 V will permanently damage the device. For 5 V-tolerant designs, choose the PIC16F1709T-I/ML variant (F core, 2.3-5.5 V) instead, sharing the same package and pinout.
Compliance Information
RoHS and REACH compliant per Microchip product declarations. The PIC16LF1709T-I/ML is not AEC-Q100 qualified; for automotive applications use the VAO suffix variant or PIC16F1709T-I/MLVAO. Lead-free and halogen-free per Microchip Microchip green-compliance policy.
