PIC16LF1777-E/ML - 8-Bit MCU 14KB Flash 32MHz 44-QFN | Microchip
MPN: PIC16LF1777-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.15 | $315.00 |
| 500 | $2.62 | $1,310.00 |
| 1,000 | $2.18 | $2,180.00 |
| 2,500 | $1.85 | $4,625.00 |
PIC16LF1777-E/ML Overview
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash/ROM), data memory (RAM), and a rich set of peripherals (ADCs, timers, communication interfaces, GPIO) on a single silicon die. The PIC16 architecture is a RISC (Reduced Instruction Set Computer) design from Microchip, historically favored for deterministic interrupt latency, low power consumption, and ease of development via the MPLAB X IDE and XC8 compiler toolchain. The 8-bit PIC16 family sits below the 16-bit dsPIC33 and PIC24 families and above the 8-bit PIC10/PIC12 baseline families in Microchip's product hierarchy.
Key features of the PIC16LF1777 include 14KB self-programmable Flash, 1KB RAM, up to 36 GPIO pins, multiple communication peripherals (UART, SPI, I2C), 10-bit ADC, and the eXtreme Low Power (XLP™) technology that achieves nanoWatt sleep currents for battery-powered designs. The 32MHz internal oscillator eliminates the need for an external crystal in many designs.
Architecturally, the PIC16LF1777 uses a Harvard memory architecture with separate program and data buses, a 14-bit instruction word, and a hardware multiplier option. The device integrates intelligent analog peripherals such as op-amps, comparators, and DACs that simplify sensor signal conditioning without external components.
Typical applications include LED lighting controllers, battery chargers, small motor control loops, IoT sensor nodes, and general-purpose embedded control where low power and small footprint are essential. The 44-QFN package is well suited for space-constrained PCB designs.
When designing with this part, ensure decoupling capacitors (100nF + 10uF) are placed within 5mm of the VDD pins, and follow Microchip AN2361 PCB layout guidelines for QFN packages to maximize thermal dissipation through the exposed pad.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for sourcing and substitution decisions.
Drop-in alternatives for PIC16LF1777-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16LF1777-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F1777-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1777-E/ML Maximum Ratings & Electrical Characteristics
| Manufacturer | Microchip Technology |
| Series | PIC® XLP™ 16F |
| Core | PIC16 8-bit RISC |
| Core Size | 8-bit |
| Program Memory | 14KB (8K x 14) Flash |
| Maximum Clock Speed | 32 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V |
| Package | 44-QFN (8x8 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40 C to +125 C |
| Temperature Grade | Extended Industrial (E) |
| Connectivity | I2C, SPI, UART |
| Low-Power Technology | XLP™ (eXtreme Low Power) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
PIC16LF1777-E/ML Pin Configuration
| Pin 1 | RA0 — GPIO / analog input |
| Pin 2 | RA1 — GPIO / analog input |
| Pin 3 | RA2 — GPIO / analog input |
| Pin 4 | RA3 — GPIO / analog input |
| Pin 5 | RA4 — GPIO |
| Pin 6 | RA5 — GPIO |
| Pin 7 | RA6 — GPIO |
| Pin 8 | RA7 — GPIO |
| Pin 9 | VSS — Ground |
| Pin 10 | RB0 — GPIO |
| Pin 11 | RB1 — GPIO |
| Pin 12 | RB2 — GPIO |
| Pin 13 | RB3 — GPIO |
| Pin 14 | RB4 — GPIO |
| Pin 15 | RB5 — GPIO |
| Pin 16 | RB6 — GPIO / ICSP clock |
| Pin 17 | RB7 — GPIO / ICSP data |
| Pin 18 | VDD — Positive supply voltage |
| Pin 19 | VSS — Ground |
| Pin 20 | RC0 — GPIO |
| Pin 21 | RC1 — GPIO |
| Pin 22 | RC2 — GPIO |
| Pin 23 | RC3 — GPIO |
| Pin 24 | RC4 — GPIO |
| Pin 25 | RC5 — GPIO |
| Pin 26 | RC6 — GPIO / UART TX |
| Pin 27 | RC7 — GPIO / UART RX |
| Pin 28 | RE3 — GPIO / MCLR |
| Pin 29 | RD0 — GPIO |
| Pin 30 | RD1 — GPIO |
| Pin 31 | RD2 — GPIO |
| Pin 32 | RD3 — GPIO |
| Pin 33 | RD4 — GPIO |
| Pin 34 | RD5 — GPIO |
| Pin 35 | RD6 — GPIO |
| Pin 36 | RD7 — GPIO |
| Pin 37 | VDD — Positive supply voltage |
| Pin 38 | VSS — Ground |
| Pin 39 | RF0 — GPIO |
| Pin 40 | RF1 — GPIO |
| Pin 41 | RF2 — GPIO |
| Pin 42 | RF3 — GPIO |
| Pin 43 | RF4 — GPIO |
| Pin 44 | RF5 — GPIO |
Typical Applications
PIC16LF1777-E/ML is suitable for 6 applications: LED Lighting Controllers, Battery Charging Management, Small Motor Control (BLDC/PMSM), IoT Sensor Nodes, Industrial Sensor Conditioning, General-Purpose Embedded Control.
LED Lighting Controllers
The PIC16LF1777-E/ML is an excellent fit for LED lighting controllers thanks to its integrated high-resolution PWM peripherals and op-amps. With 32MHz clock providing 8 MIPS throughput, the MCU can drive multiple LED channels with smooth dimming curves via 16-bit PWM. The 14KB Flash holds color-mixing algorithms and DMX/RDM protocol stacks. Per Microchip's lighting application brief, the PIC16(L)F177X family includes dedicated LED-driving peripherals that eliminate external driver ICs. The 1.8V-3.6V operation suits battery-powered or 3.3V rail designs.
Recommended
Battery Charging Management
The PIC16LF1777-E/ML fits battery charger designs due to its integrated op-amps for current sensing, comparators for voltage monitoring, and ADC for battery telemetry. The 14KB Flash accommodates Li-Ion, NiMH, and lead-acid charging profiles with state-of-health tracking. Per the Microchip PIC16(L)F177X family brief, the on-chip op-amps and DACs form a complete CC/CV (constant-current/constant-voltage) charger loop without external analog ICs. The 1.8V-3.6V range suits 1S Li-Ion packs directly.
Recommended
Small Motor Control (BLDC/PMSM)
The PIC16LF1777-E/ML supports small BLDC or PMSM motor control via its enhanced PWM modules with complementary outputs and dead-band generation. At 32MHz clock, the MCU achieves 8 MIPS - sufficient for sensorless trapezoidal commutation at moderate RPMs. Per Microchip AN1079 motor control guide, the PIC16F/LF177X peripherals simplify 3-phase inverter control. The 44-QFN package's exposed pad provides thermal dissipation for motor drive PCBs.
Recommended
IoT Sensor Nodes
The PIC16LF1777-E/ML is well-matched to IoT sensor nodes via its XLP nanoWatt sleep technology - per the Microchip datasheet, sleep currents below 100nA enable multi-year battery life on coin cells. The 14KB Flash holds LoRaWAN or BLE protocol stacks plus sensor fusion code. UART/SPI/I2C peripherals interface directly with sensors and wireless modules. Per the Microchip low-power app notes, periodic wake-up from sleep via WDT achieves years of runtime on 2xAA cells.
Recommended
Industrial Sensor Conditioning
The PIC16LF1777-E/ML excels in industrial 4-20mA loop-powered sensor transmitters because of its integrated op-amps for signal conditioning and 10-bit ADC for digitizing process variables. The -40C to +125C extended industrial temperature grade ensures reliability in factory environments. Per Microchip AN2361 sensor conditioning app note, the PIC16(L)F177X on-chip op-amps form Wheatstone bridge drivers and instrumentation amp front-ends without external analog ICs.
Recommended
General-Purpose Embedded Control
The PIC16LF1777-E/ML serves general-purpose embedded control tasks where 8-bit processing and low power matter. With 14KB Flash, 32MHz clock, and a broad peripheral set, it handles user interfaces (LEDs, buttons), serial communication bridges (UART-to-SPI, I2C slaves), and simple state machines. Per the Microchip product page, the PIC16(L)F177X family is positioned for "general purpose applications" requiring both intelligent analog and digital peripherals in a single chip.
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Recommended Products Summary
Engineering reference data for PIC16LF1777-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF1777-I/ML | PIC16F1777-E/ML | PIC16LF1776-I/SS |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 28-SSOP - different |
| Program Memory | 14KB Flash | 14KB Flash | 14KB Flash | 14KB Flash |
| Maximum Clock Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V |
| Temperature Grade | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
| Low-Power XLP Technology | Yes | Yes | No | Yes |
| Approx. Unit Price (qty-1) | $4.20 USD | $3.85 USD | $4.20 USD | $2.50 USD |
Key Differentiators
- Extended industrial temperature grade (vs PIC16LF1777-I/ML)
- Wide-voltage XLP low-power operation (vs PIC16F1777-E/ML)
- Integrated intelligent analog peripherals (vs PIC16LF1776-I/SS)
Design Notes
The PIC16LF1777-E/ML has two VDD pins (18 and 37) and two VSS pins (9 and 19). Place a 100nF ceramic capacitor within 5mm of each VDD pin and a single 10uF bulk capacitor near the MCU. Per Microchip AN2361, low-ESR ceramic capacitors (X7R dielectric) are recommended. For XLP sleep-mode designs, ensure no leakage paths through pull-ups exceed 100nA total.
The 44-QFN package has an exposed thermal pad (EP) on the underside. For thermal dissipation above 100mW continuous, solder the EP to a copper pour of at least 1 square inch on the PCB. Thermal vias (0.3mm diameter, 1mm spacing) under the EP transfer heat to inner planes. Per Microchip QFN PCB layout guidelines, missing EP soldering can increase junction temperature 20-30C above ambient at moderate loads.
Keep traces for the 32MHz oscillator (OSC1/OSC2) as short as possible and surrounded by ground pour to minimize EMI. Per Microchip AN2434 layout guide, the ICSP pins (RB6/ICSPCLK and RB7/ICSPDAT) should be reserved for programming/debug access - do not route sensitive analog traces adjacent to these. The MCLR pin (RE3) requires a 10k pull-up to VDD for normal operation.
Do not exceed the absolute maximum VDD of 4.0V on the LF variant (3.6V operating max). Apply power-on-reset (POR) by allowing VDD to ramp monotonically from 0V. When using the internal 32MHz oscillator, configure OSCCON correctly per the datasheet; incorrect settings can result in the MCU running at the wrong frequency. For ICSP programming, ensure the PGD/PGC lines have no series resistors above 100 ohms.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified (automotive) - choose PIC16F1777-E/ML automotive Q-grade for AEC-Q100 needs. Halogen-free status not explicitly stated in available data.