DSPIC33EP256GM604-E/ML - 16-bit 60 MIPS DSC 256KB | Microchip
MPN: DSPIC33EP256GM604-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.86 | $7.86 |
| 10 | $7.32 | $73.20 |
| 100 | $6.98 | $698.00 |
| 500 | $6.55 | $3,275.00 |
| 1,000 | $7.12 | $7,120.00 |
DSPIC33EP256GM604-E/ML Overview
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and control-oriented architecture of a microcontroller. Within the power management hierarchy of embedded systems, the DSC sits above general-purpose MCUs for control loops: it executes fast math (multiply-accumulate, division support, DSP instructions) on a Harvard bus architecture, making it the standard choice for closed-loop motor control and digital power conversion.
Key features include the 16-bit dsPIC33E core operating at up to 60 MIPS, dual-channel 12-bit ADC, multiple PWM modules with complementary outputs and dead-time control, two on-chip operational amplifiers, a 4-channel DMA controller, and a CAN 2.0B module. The Mouser listing confirms 12-channel motor control PWM and quadrature encoder interface (QEI) support, which directly offloads sensor-based commutation from software.
The architecture integrates DSP engine features such as single-cycle MAC and hardware multiply/divide, letting firmware run field-oriented control (FOC) or predictive current loops at kHz-ordered sampling rates while simultaneously handling communication, housekeeping and safety code on the same die.
Typical applications include brushless DC and PMSM motor drives, solar inverters and digital power supplies, CAN-networked automotive body and powertrain auxiliary nodes, and industrial automation controllers requiring precise ADC-triggered PWM timing.
Design consideration: the exposed pad is the primary thermal and ground path; connect it to a solid ground pour with multiple vias, and decouple all VDD pins individually with 100 nF ceramics placed within 2 mm of each supply pin.
This page synthesizes verified distributor data, same-family drop-in alternatives, FAQ-style engineering guidance, and sourcing information not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP256GM604-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256GM604-E/ML (same form factor and footprint) — differing in Operating Temperature, Package, CAN, Core Architecture, Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256GM604-I/ML
✅ Drop-In✓ In Stock
$4.9 / Unit
View Datasheet →DSPIC33EP128GM604-E/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.11 / Unit
View Datasheet →DSPIC33EP256GM304-E/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.35 / Unit
View Datasheet →DSPIC33EP256GM604T-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GM604-E/ML Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC |
| Maximum CPU Speed | 60 MIPS |
| Program Memory Size | 256 KB (85.5K x 24) Flash |
| RAM Size | 16 KB |
| Supply Voltage | 3.3 V |
| Package | 44-QFN (8x8 mm) with exposed pad |
| Operating Temperature | -40C to +125C (E grade, automotive) |
| ADC Resolution | 12-bit / 10-bit |
| On-chip Op Amps | 2 |
| Motor Control PWM Channels | 12 |
| Quadrature Encoder Interfaces | 4 (QEI) |
| Input Capture / Output Compare | 8 IC / 8 OC |
| DMA Channels | 4-channel DMA controller |
| CAN | CAN 2.0B module |
| Mounting Type | Surface Mount |
| Packaging | Tube |
| Automotive Qualification | Automotive temperature grade (per distributor data) |
| RoHS Status | Compliant |
DSPIC33EP256GM604-E/ML 44-qfn (8x8 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP256GM604-E/ML (44-qfn (8x8 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256GM604-E/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256GM604-E/ML is suitable for 6 applications: Brushless DC and PMSM Motor Control, Digital Power Conversion and Inverters, Automotive CAN Network Nodes, Industrial Automation and Robotics, Portable and Battery-Powered Instrumentation, Audio Signal Processing.
Brushless DC and PMSM Motor Control
The DSPIC33EP256GM604-E/ML is purpose-built for precision motor drives: its 12 motor-control PWM channels support complementary outputs with hardware dead-time insertion, its four quadrature encoder interfaces decode position feedback without CPU load, and the 60 MIPS core executes field-oriented control loops at multi-kHz sampling rates. The two on-chip op amps condition shunt-resistor current signals before the 12-bit ADC, and the 4-channel DMA moves conversion results to RAM automatically, keeping loop latency low and deterministic. Place the controller between the current-sense shunts and the gate-driver inputs; the ADC-trigger-to-PWM-update path runs in hardware, eliminating software jitter that would otherwise inject torque ripple. In a -E grade 44-QFN package rated to +125C, the part survives enclosure temperatures near power stages.
Recommended
Digital Power Conversion and Inverters
In solar micro-inverters, PFC stages and LLC converters, the DSPIC33EP256GM604-E/ML supplies the deterministic control timing that digital power demands. The 60 MIPS dsPIC33E core with single-cycle MAC runs average-current-mode and predictive control algorithms, while ADC end-of-conversion events trigger PWM duty updates in hardware for sub-microsecond loop latency. Complementary PWM outputs with programmable dead time and cycle-by-cycle current limiting protect the power stage during transients. The 256KB Flash accommodates anti-islanding, grid-tie compliance and communication stacks alongside the control loop, and the -40C to +125C automotive grade tolerates heatsink-proximate placement. Designers should budget the exposed-pad ground connection carefully, since switching-stage ground bounce directly affects ADC accuracy on shunt-based sensing.
Recommended
Automotive CAN Network Nodes
With its integrated CAN 2.0B controller and -40C to +125C temperature grade, the DSPIC33EP256GM604-E/ML fits automotive body electronics, auxiliary pump and fan controllers, and actuator nodes on in-vehicle networks. The CAN module offloads message buffering and arbitration from the CPU, while the 16KB RAM and DMA support ring-buffered reception of bus traffic during burst conditions. The 12-bit ADC monitors battery voltage, current and temperature sensors, and motor-control PWM drives brushed actuators directly through external gate drivers. Distributor data (Vyrian, Jotrin) classifies this part as automotive temperature grade. For safety-relevant functions, request Microchip's qualification documentation and PPAP support; for non-safety auxiliary nodes the device is a cost-effective single-chip solution combining control, sensing and networking.
Recommended
Industrial Automation and Robotics
Factory automation subsystems - conveyor drives, robotic joint controllers and servo amplifiers - benefit from the DSPIC33EP256GM604-E/ML's combination of four quadrature encoder interfaces, 8 input captures and 8 output compares, which track multiple motion axes simultaneously. The 60 MIPS core closes current and velocity loops while a CAN bus or UART stack coordinates with higher-level PLCs. The dual on-chip op amps reduce external signal-conditioning component count in dense multi-axis boards, and the 4-channel DMA streams encoder-timed ADC samples for condition monitoring. With 256KB of Flash, firmware can retain parameter tables, fieldbus stacks and bootloader space in a single chip. The 44-QFN 8x8 mm footprint keeps the controller compact on crowded drive boards where connector and gate-driver real estate dominate.
Recommended
Portable and Battery-Powered Instrumentation
Handheld test instruments, environmental monitors and battery-operated measurement tools use the DSPIC33EP256GM604-E/ML's 3.3V single-supply operation and DSP capability for real-time signal analysis such as FFT-based spectrum display or digital filtering of sensor streams. The 12-bit ADC with multiple sequencer options multiplexes several analog channels under DMA control, and the 16KB RAM holds buffering windows for DSP math. The dsPIC33E family's power-management features allow clock switching between a high-speed run mode for burst processing and low-power idle between measurements, extending battery life. The 44-QFN (8x8 mm) package suits compact enclosures, while the 256KB Flash leaves generous room for calibration tables, logging firmware and future over-the-air or in-field updates through its ICSP bootloader support.
Recommended
Audio Signal Processing
Embedded audio applications - DSP effects units, active crossover controllers and microphone-array preprocessors - exploit the dsPIC33E core's single-cycle MAC and Harvard dual-data-fetch architecture to implement biquad filters and mixing engines within a 3.3V single-chip solution. The 60 MIPS execution rate allows tens of cascaded biquad sections at a 48 kHz sample rate, while DMA-driven ADC and output-compare timing keep the sample clock jitter-free. On-chip op amps can buffer line-level inputs ahead of the ADC, reducing external component count in cost-sensitive consumer audio. The 256KB Flash stores multiple preset banks and a USB or CAN control interface. Compared with a dedicated audio DSP, the DSC adds general-purpose control (user interface, power management, communication) on the same die, simplifying the bill of materials.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256GM604-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GM604-I/ML | DSPIC33EP128GM604-E/ML | DSPIC33EP256GM604T-E/ML |
|---|---|---|---|---|
| Package | 44-QFN (8x8 mm), exposed pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Memory | 256 KB | 256 KB | 128 KB | 256 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| CAN Module | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B |
| Packaging / Delivery | Tube | Tube | Tube | Tape & Reel |
Key Differentiators
- Extended automotive temperature grade (vs DSPIC33EP256GM604-I/ML)
- Maximum program memory in the 44-pin GM604 tier (vs DSPIC33EP128GM604-E/ML)
- Tube packaging suits prototyping and low-volume hand assembly (vs DSPIC33EP256GM604T-E/ML)
Design Notes
The 44-QFN exposed pad is the main ground return and thermal path. Connect it to a dedicated ground pour through an array of at least 9 (3x3) thermal vias of 0.3 mm diameter. Each VDD pin needs its own 100 nF X7R decoupling capacitor placed within 2 mm of the pin, plus one bulk 4.7 uF to 10 uF ceramic near the package. All VDD and VSS pins must be connected for ICSP programming to work - do not reuse a VDD net as a fuse-protected test point that could be left floating during production programming.
Route PGECx/PGEDx programming pairs away from motor-control PWM and CAN lines. Keep the shunt-amplifier traces to the on-chip op-amp inputs short, differential, and guarded by ground; the 12-bit ADC benefits from a quiet analog supply - consider an RC or ferrite filter from the digital 3.3V rail to AVDD. Because PWM edges couple into neighboring traces, maintain at least 3x trace-width spacing between PWM outputs and encoder inputs to avoid QEI counting glitches at high motor speeds.
Two frequent errors with this part: (1) mismatched ICSP pairs - PGEC and PGED must come from the same numbered pair (e.g. PGEC2 with PGED2); mixing pairs blocks programming. (2) Assuming the -E suffix alone proves AEC-Q100 qualification - distributor listings classify it as an automotive temperature grade, but full qualification documentation should be requested from Microchip for safety-relevant designs. Also verify Flash endurance requirements: for applications with frequent self-write firmware updates, implement the family's flash programming algorithms from the reference manual rather than custom erase loops.
Estimated: for a controller running at 60 MIPS from 3.3 V with typical I/O loading, device power is dominated by core current (order of tens of mA per dsPIC33E family data); dissipation of roughly 0.15 W to 0.3 W in an 8x8 QFN with a solid ground pour keeps junction temperature well inside the -40C to +125C E-grade limit in 85C ambient. Verify with the datasheet's typical IDD curves for your exact clock configuration; avoid mounting the QFN adjacent to power-stage components exceeding 100C surface temperature without thermal modeling.
Compliance Information
Distributor listings (Jotrin, DigiKey) identify the part as automotive temperature grade and RoHS-compliant lead-free. Full AEC-Q100 qualification documentation was not confirmed in the provided data - request from Microchip for automotive safety designs.