PIC16LF1826-I/MV - 8-bit MCU, 32MHz, 3.5KB Flash | Microchip
MPN: PIC16LF1826-I/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.78 | $1.78 |
| 10 | $1.61 | $16.10 |
| 100 | $1.42 | $142.00 |
| 500 | $1.25 | $625.00 |
| 1,000 | $1.1 | $1,100.00 |
PIC16LF1826-I/MV Overview
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, Flash program memory, RAM, EEPROM, and peripherals onto one die. The PIC16LF1826-I/MV sits within the power-management IC family hierarchy as: 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. Its XLP (eXtreme Low Power) technology positions it for battery-operated and energy-harvesting applications where sleep current in the nanoampere range is critical.
Key differentiating features include 14-channel 10-bit ADC, two 8-bit timers plus one 16-bit timer, EUSART, MSSP (SPI/I2C), up to 11 PWM channels with complementary outputs, and configurable logic cells. The 'LF' voltage range (1.8V to 3.6V) supports direct operation from a single Li-ion or two AA cells without an external LDO, while the 'F' variant (PIC16F1826) operates from 1.8V to 5.5V. The 28-UQFN package achieves a compact 4x4 mm footprint suitable for space-constrained designs.
Typical applications include consumer electronics, IoT sensor nodes, wearable devices, low-power wireless sensor hubs, capacitive touch user interfaces, LED lighting control, and battery management for primary cells. The integrated peripherals reduce BOM cost by eliminating external ADC, op-amps, and timer ICs in many designs.
When designing with this part, route the ICSP programming signals (ICSPCLK/ICSPDAT) on dedicated PCB traces and place a 100 nF decoupling capacitor within 5 mm of VDD. The UQFN exposed pad must be soldered to the ground plane for thermal dissipation and electrical performance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for PIC16LF1826-I/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF1826-I/MV (same form factor and footprint) — differing in ADC, Communication, Operating Temperature, Package, Timers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16LF1826T-I/MV
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1826-E/MV
✅ Drop-In✓ In Stock
$0.95 / Unit
View Datasheet →PIC16F1826-I/MV
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1826-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1826-I/P
✅ Drop-In✓ In Stock
$1.38 / Unit
View Datasheet →PIC16LF1826-I/MV Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC16 enhanced mid-range 8-bit |
| Program Memory (Flash) | 3.5 KB (2K x 14 words) |
| Data SRAM | 256 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz |
| Instruction Execution | 200 ns (at 20 MHz, 1 instruction cycle) |
| Operating Voltage Range | 1.8 V to 3.6 V |
| I/O Pins | 25 (on 28-pin package) |
| ADC | 10-bit, 14 channels |
| Timers | 2 x 8-bit, 1 x 16-bit |
| PWM Channels | Up to 11 (with complementary outputs) |
| Communication | EUSART, MSSP (SPI / I2C) |
| Package | 28-pin UQFN (4x4 mm) |
| Operating Temperature | -40C to +85C (Industrial) |
| XLP Sleep Current | 20 nA typical (per datasheet) |
| Mounting Type | Surface Mount |
| MSL Level | 1 |
| RoHS Status | Compliant |
PIC16LF1826-I/MV Pin Configuration
| Pin 1 | VDD — Positive supply voltage (1.8V-3.6V) |
| Pin 2 | RA5 — I/O port A bit 5 / ICSP data |
| Pin 3 | RA4 — I/O port A bit 4 |
| Pin 4 | RA3 — I/O port A bit 3 / MCLR |
| Pin 5 | RA2 — I/O port A bit 2 / analog input |
| Pin 6 | RA1 — I/O port A bit 1 / analog input |
| Pin 7 | RA0 — I/O port A bit 0 / analog input |
| Pin 8 | VSS — Ground reference |
| Pin 9 | RA7 — I/O port A bit 7 |
| Pin 10 | RA6 — I/O port A bit 6 |
| Pin 11 | RC0 — I/O port C bit 0 |
| Pin 12 | RC1 — I/O port C bit 1 |
| Pin 13 | RC2 — I/O port C bit 2 |
| Pin 14 | RC3 — I/O port C bit 3 / SCL |
| Pin 15 | RC4 — I/O port C bit 4 / SDA |
| Pin 16 | RC5 — I/O port C bit 5 |
| Pin 17 | RC6 — I/O port C bit 6 / TX |
| Pin 18 | RC7 — I/O port C bit 7 / RX |
| Pin 19 | RB7 — I/O port B bit 7 |
| Pin 20 | RB6 — I/O port B bit 6 / ICSP clock |
| Pin 21 | RB5 — I/O port B bit 5 / analog input |
| Pin 22 | RB4 — I/O port B bit 4 / analog input |
| Pin 23 | RB3 — I/O port B bit 3 / analog input |
| Pin 24 | RB2 — I/O port B bit 2 / analog input |
| Pin 25 | RB1 — I/O port B bit 1 / analog input |
| Pin 26 | RB0 — I/O port B bit 0 / analog input / interrupt |
| Pin 27 | RA3 — I/O port A bit 3 / MCLR (reset) |
| Pin 28 | VSS — Ground (second ground pin) |
| Pin 29 | EP — Exposed thermal pad - must be soldered to PCB ground plane |
Typical Applications
PIC16LF1826-I/MV is suitable for 6 applications: Battery-Powered IoT Sensor Node, Wearable Fitness Tracker, Capacitive Touch User Interface, LED Lighting Control, Industrial Sensor Conditioning, Consumer Remote Control.
Battery-Powered IoT Sensor Node
The PIC16LF1826-I/MV fits battery-powered IoT sensor nodes because of its 1.8 V to 3.6 V operating range, 20 nA typical XLP sleep current, and integrated 14-channel 10-bit ADC. Operating directly from a single Li-ion or two AA cells eliminates the need for a boost or buck regulator, reducing BOM by one IC. The 3.5 KB Flash accommodates BLE/Zigbee stack glue logic while the 256-byte SRAM handles sensor data buffering. Placed on a 4x4 mm UQFN footprint, the MCU contributes under 16 mm2 of PCB area, leaving room for a coin-cell holder and a low-power radio module. The mTouch peripheral allows capacitive wake-up buttons without external components.
Recommended
Wearable Fitness Tracker
Wearable fitness trackers benefit from the PIC16LF1826-I/MV's XLP technology, achieving 20 nA sleep current that extends coin-cell battery life beyond 6 months. The mTouch peripheral supports capacitive touch buttons for user input without mechanical switches, while the 10-bit ADC reads heart-rate sensor analog signals with 14-channel multiplexing. The 32 MHz CPU clock runs sensor fusion algorithms at sample rates up to 1 kHz. Its 28-UQFN 4x4 mm footprint fits inside wristband enclosures under 6 mm thick. The 1.8 V minimum operation eliminates the need for an LDO when powered by a 3 V coin cell.
Recommended
Capacitive Touch User Interface
Capacitive touch user interfaces benefit from the PIC16LF1826-I/MV's integrated mTouch module and 10-bit ADC, supporting up to 14 touch electrodes without external components. Each touch channel uses the on-chip CTMU to measure capacitance change with sub-pF resolution, allowing reliable detection through 3 mm acrylic overlays. The 32 MHz CPU runs the Microchip mTouch library with response times under 20 ms. The 4x4 mm UQFN package fits behind glass panels in appliances, kiosks, and industrial control panels. The PIC's nanoWatt XLP mode allows capacitive wake-up from sleep when a finger approaches.
Recommended
LED Lighting Control
LED lighting control uses the PIC16LF1826-I/MV's 11 PWM channels with complementary outputs to drive RGB and white LEDs with 16-bit resolution when chained. The 32 MHz clock supports PWM frequencies above 25 kHz, eliminating audible switching noise in dimmable fixtures. EUSART and MSSP (I2C) connect to DMX-512, DALI, or wireless modules for networked lighting control. The 1.8 V operation suits direct 3.3 V LED driver ICs like the HV9910. The 28-UQFN footprint enables compact MR16 and GU10 form-factor smart bulbs where PCB area is under 100 mm2.
Recommended
Industrial Sensor Conditioning
Industrial sensor conditioning modules benefit from the PIC16LF1826-I/MV's 14-channel 10-bit ADC for multi-sensor signal acquisition and its 1.8 V to 3.6 V operation that supports 3.3 V industrial bus interfaces. The MSSP (I2C/SPI) connects directly to MEMS accelerometers, pressure sensors, and temperature ICs. The EUSART enables RS-485 communication through an external transceiver. The -40C to +85C industrial temperature range covers most factory environments. The 28-UQFN package withstands 260C reflow soldering typical of automated SMT lines. The XLP sleep mode allows battery-backed operation during grid power outages.
Recommended
Consumer Remote Control
Consumer remote controls benefit from the PIC16LF1826-I/MV's XLP nanoWatt sleep current, which extends AAA battery life beyond 2 years in standby. The mTouch peripheral supports capacitive touch keypads without mechanical buttons, reducing manufacturing cost. The integrated 32 MHz oscillator eliminates external crystals, further shrinking BOM. The 1.8 V to 3.6 V range suits two AAA cells in series (3.0 V). The 28-UQFN 4x4 mm footprint fits inside slim remote enclosures. PWM outputs can drive IR LEDs directly for TV/STB control.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF1826-I/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF1826T-I/MV | PIC16LF1826-E/MV | PIC16F1826-I/MV | PIC16LF1826-I/ML | PIC16LF1826-I/P |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | UQFN-28 (MV, 4x4 mm) | UQFN-28 (MV, 4x4 mm) - same | UQFN-28 (MV, 4x4 mm) - same | UQFN-28 (MV, 4x4 mm) - same | QFN-28 (ML, 6x6 mm) - different footprint | PDIP-28 (P) - through-hole |
| Program Memory (Flash) | 3.5 KB | 3.5 KB | 3.5 KB | 3.5 KB | 3.5 KB | 3.5 KB |
| SRAM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Operating Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Operating Temperature Range | -40C to +85C | -40C to +85C | -40C to +125C (extended) | -40C to +85C | -40C to +85C | -40C to +85C |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
Key Differentiators
- Smallest 28-pin PIC16 XLP variant footprint (vs PIC16LF1826-I/ML)
- Lower voltage ceiling suits battery operation (vs PIC16F1826-I/MV)
- Industrial temperature range at lower cost (vs PIC16LF1826-E/MV)
Design Notes
Place a 100 nF decoupling capacitor within 5 mm of the VDD pin (pin 1) and a bulk 10 uF capacitor near the IC. Route VDD traces at least 0.2 mm wide. The UQFN-28 exposed thermal pad (pin 29) MUST be soldered to a PCB ground plane with at least 4 thermal vias (0.3 mm diameter) to dissipate heat and provide low-impedance ground. Without proper ground plane connection, RF emissions and ADC noise increase. The 28-UQFN footprint is 4x4 mm with 0.4 mm pitch - use NSMD (Non-Solder Mask Defined) pads for reliable solder joints.
To achieve the 20 nA XLP sleep current per Microchip datasheet, disable all unused peripherals via PMDx registers before entering SLEEP mode. Configure unused pins as outputs driven low (not floating) to prevent parasitic current through input protection diodes. The LF (1.8 V to 3.6 V) range allows direct operation from a Li-ion battery; for higher-voltage supplies, use the PIC16F1826 F-variant instead. Estimated: at 32 MHz active and 3.3 V supply, the typical IDD is approximately 4 mA per datasheet - 1000:1 active/sleep ratio supports battery sleep intervals in many IoT designs.
Do not skip the 100 nF VDD decoupling cap or place it more than 5 mm from pin 1 - the PIC16LF1826 datasheet specifies this for stable operation. The MCLR/RA3 pin (pin 4 or pin 27) requires a 10 kohm pull-up to VDD if reset is needed; if unused, tie directly to VDD. The ICSP programming pins (ICSPCLK/ICSPDAT) must be accessible on dedicated PCB test points for in-circuit programming. The exposed pad must NOT be left floating - it requires a soldered ground connection. Programming voltage must be 3.0 V minimum; below 2.5 V the Flash cannot be erased reliably.
Compliance Information
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - for automotive applications, Microchip recommends PIC16F1826-E/MV or AEC-Q100-qualified PIC16 variants. Lead-free and halogen-free per Microchip environmental compliance documentation.