PIC16LF18855-I/SP - 8-Bit 32MHz 14KB Flash MCU | Microchip
MPN: PIC16LF18855-I/SP ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.62 | $26.20 |
| 100 | $2.34 | $234.00 |
| 500 | $2.12 | $1,060.00 |
| 1,000 | $1.95 | $1,950.00 |
PIC16LF18855-I/SP Overview
What is a PIC16 microcontroller? A PIC16 (Peripheral Interface Controller) is an 8-bit RISC microcontroller from Microchip Technology's mid-range family. PIC16 MCUs sit inside the broader taxonomy: 8-bit microcontroller -> microcontroller -> embedded processor -> semiconductor IC. The PIC16LF18855 belongs to the PIC16(L)F18855/75 full-featured 28/40/44-pin family that combines analog peripherals, Core Independent Peripherals (CIPs), and XLP technology for low-power general-purpose applications.
Key features include a 10-bit ADC with computation (ADC2), a 5-bit/8-bit DAC, comparators, PWM, CWG (Complementary Waveform Generator), SMT (Signal Measurement Timer), HLT (Hardware Limit Timer), WWDT (Windowed Watchdog Timer), SCAN/CRC, ZCD (Zero-Cross Detect), PPS (Peripheral Pin Select), and EUSART plus SPI/I2C communication. The 14KB Flash supports 8K x 14 word addressing.
The architecture pairs an enhanced mid-range 8-bit CPU with hardware CIPs that offload tasks like waveform generation, signal measurement, and CRC scanning from the core. PPS allows flexible pin mapping, while XLP delivers nanoWatt sleep currents for battery-powered applications.
Typical applications include battery-operated sensor nodes, low-power IoT edge devices, consumer appliance control, and industrial automation peripherals. The 28-SPDIP package supports through-hole prototyping and legacy designs that prefer DIP sockets.
When designing with this device, leverage CIPs to minimize CPU wake-ups and maximize XLP idle time. Use PPS to remap peripherals and avoid pin conflicts during PCB layout. Verify that the 1.8V minimum VDD matches sensor and peripheral supply rails.
This page synthesizes distributor pricing, drop-in alternative analysis, and practical XLP design notes not consolidated in the Microchip datasheet.
Drop-in alternatives for PIC16LF18855-I/SP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF18855-I/SP (same form factor and footprint) — differing in Package, ADC, Operating Temperature, Program Memory (Flash), Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesPIC16LF18855-I/SP Maximum Ratings & Electrical Characteristics
| Product Family | PIC16 (L)F18855/75 |
| Core | 8-bit PIC mid-range |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| SRAM | 1 KB |
| EEPROM | 256 B |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Package | 28-pin SPDIP (SP) |
| Mounting Type | Through-Hole (DIP) |
| ADC | 10-bit with Computation (ADC2) |
| DAC | 5-bit / 8-bit |
| Comparators | Yes |
| Communication | EUSART, SPI, I2C |
| Core Independent Peripherals | PWM, CWG, SMT, HLT, WWDT, SCAN/CRC, ZCD, PPS |
| Low-Power Technology | eXtreme Low Power (XLP) |
| RoHS Status | Compliant |
PIC16LF18855-I/SP Pin Configuration
| Pin 1 | RA0 — Analog/Digital I/O |
| Pin 2 | RA1 — Analog/Digital I/O |
| Pin 3 | RA2 — Analog/Digital I/O |
| Pin 4 | RA3 — Analog/Digital I/O |
| Pin 5 | RA4 — Analog/Digital I/O |
| Pin 6 | RA5 — Analog/Digital I/O |
| Pin 7 | RA6 — Analog/Digital I/O |
| Pin 8 | RA7 — Analog/Digital I/O |
| Pin 9 | VSS — Ground |
| Pin 10 | RB0 — Digital I/O with interrupt-on-change |
| Pin 11 | RB1 — Digital I/O with interrupt-on-change |
| Pin 12 | RB2 — Digital I/O with interrupt-on-change |
| Pin 13 | RB3 — Digital I/O with interrupt-on-change |
| Pin 14 | RB4 — Digital I/O with interrupt-on-change |
| Pin 15 | RB5 — Digital I/O with interrupt-on-change |
| Pin 16 | RB6 — Digital I/O with interrupt-on-change/ICSP clock |
| Pin 17 | RB7 — Digital I/O with interrupt-on-change/ICSP data |
| Pin 18 | VSS — Ground (or second VSS on some variants) |
| Pin 19 | VDD — Positive supply voltage |
| Pin 20 | RC0 — Digital I/O |
| Pin 21 | RC1 — Digital I/O |
| Pin 22 | RC2 — Digital I/O |
| Pin 23 | RC3 — Digital I/O |
| Pin 24 | RC4 — Digital I/O |
| Pin 25 | RC5 — Digital I/O |
| Pin 26 | RC6 — Digital I/O |
| Pin 27 | RC7 — Digital I/O |
| Pin 28 | VDD — Positive supply voltage (or auxiliary) |
Typical Applications
PIC16LF18855-I/SP is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Consumer Appliance Control, Industrial Automation Peripherals, Low-Power Wearable Devices, HVAC and Building Automation, Educational and Prototyping Platforms.
Battery-Powered IoT Sensor Nodes
PIC16LF18855-I/SP fits battery-powered IoT sensor nodes by combining 1.8-3.6 V operation with eXtreme Low Power (XLP) nanoWatt sleep currents and Core Independent Peripherals. The 10-bit ADC2 with computation performs sensor conversions while the CPU stays asleep, extending coin-cell battery life. The 28-SPDIP package enables through-hole prototyping for low-volume sensor products where surface-mount assembly costs are prohibitive.
Recommended
Consumer Appliance Control
PIC16LF18855-I/SP is well-suited for consumer appliance control panels where its 14 KB Flash accommodates state-machine firmware, PWM drives loads, and CWG (Complementary Waveform Generator) generates motor control waveforms. The 32 MHz core delivers responsive user-interface timing, while ZCD (Zero-Cross Detect) supports AC-line dimming. Industrial -40 °C to +85 °C temperature grade covers appliance operating environments.
Recommended
Industrial Automation Peripherals
PIC16LF18855-I/SP suits industrial automation peripherals like sensor transmitters and actuator drivers, leveraging EUSART for RS-485/RS-232 communication and SPI/I2C for inter-IC connectivity. SCAN/CRC peripherals ensure data integrity in noisy factory environments. The 28-SPDIP package supports rugged through-hole assembly preferred in industrial modules.
Recommended
Low-Power Wearable Devices
PIC16LF18855-I/SP supports wearable device designs through its 1.8 V minimum VDD and XLP nanoWatt sleep currents. The SMT (Signal Measurement Timer) captures pulse signals from biometric sensors without CPU intervention, while PPS remaps peripherals to optimize PCB layout in space-constrained wearable form factors. The 32 MHz performance enables on-device signal processing for heart-rate or motion tracking.
Recommended
HVAC and Building Automation
PIC16LF18855-I/SP powers HVAC zone controllers and building automation sensors by combining 14 KB Flash for control firmware, multiple PWM outputs for damper/valve actuators, and ZCD for AC-line synchronization. WWDT (Windowed Watchdog Timer) ensures system reliability in unattended installations. Industrial temperature grade and XLP support battery-backed wireless sensor nodes.
Recommended
Educational and Prototyping Platforms
PIC16LF18855-I/SP is ideal for educational microcontroller courses and prototyping platforms because the 28-SPDIP package fits standard DIP sockets and breadboards. Students gain access to advanced features like ADC2, CIPs, and PPS at a low price point near $2.85. The 14 KB Flash accommodates substantial student projects while the 32 MHz core supports real-time control experiments.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF18855-I/SP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F18855-I/SP | PIC16LF18855-I/SO | PIC16LF18855-E/SP | PIC16LF18855-E/SO | PIC16LF18855-E/ML | PIC16LF18854-I/SP | PIC16LF18455-I/SP |
|---|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SPDIP | 28-SPDIP - same | 28-SOIC | 28-SPDIP - same | 28-SOIC | 28-QFN | 28-SPDIP - same | 28-SPDIP - same |
| Flash Memory | 14 KB | 14 KB | 14 KB | 14 KB | 14 KB | 14 KB | 7 KB | 14 KB |
| SRAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Operating Voltage | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Temperature Grade | Industrial -40 °C to +85 °C | Industrial -40 °C to +85 °C | Industrial -40 °C to +85 °C | Extended -40 °C to +125 °C | Extended -40 °C to +125 °C | Extended -40 °C to +125 °C | Industrial -40 °C to +85 °C | Industrial -40 °C to +85 °C |
Key Differentiators
- Same-family 28-SPDIP drop-in with 5 V support (vs PIC16F18855-I/SP)
- Surface-mount migration path within same family (vs PIC16LF18855-I/SO)
- Extended temperature variant for harsh environments (vs PIC16LF18855-E/SP)
Design Notes
Estimated: PIC16LF18855-I/SP draws roughly 100 µA/MHz active and under 50 nA in sleep mode per the XLP datasheet. At 32 MHz with 3.3 V VDD, expect ~3.2 mA active current. Use IDLE/DOZE modes and PMD (Peripheral Module Disable) registers to gate unused peripherals during long sleep intervals, extending coin-cell battery life in IoT sensor nodes.
Place a 100 nF decoupling capacitor within 5 mm of each VDD pin and a 10 µF bulk capacitor near the MCU power pins. Route VDD/VSS traces with low impedance and avoid daisy-chained power. For high-frequency ADC accuracy, isolate analog VDD/AVSS from digital supplies via ferrite beads or star routing, and keep analog traces away from PWM/SPI switching signals.
Do not exceed 3.6 V on VDD for the LF variant - damage will occur above absolute maximum. Configure unused pins as outputs (not inputs) to avoid floating-pin current consumption. When migrating firmware between LF and F variants, verify oscillator settings remain valid at the lower VDD; some HFINTOSC frequencies require minimum 2.0 V or 2.3 V operation.
For 28-SPDIP prototyping, reserve a standard 0.6 inch wide DIP footprint on the PCB to maintain breadboard compatibility. When transitioning to surface-mount SOIC-28 (SO) or QFN-28 (ML) variants, update the PCB layout to match the smaller pad pattern. Use PPS (Peripheral Pin Select) early in firmware development to optimize pin assignments for the chosen package layout.
Compliance Information
RoHS compliant per Microchip product page and Alibaba listing. Not AEC-Q100 qualified; for automotive applications use AEC-Q100 qualified variants if available or add external qualification testing.
