PIC16LF18855-I/SP - 8-Bit 32MHz 14KB Flash MCU | Microchip
Référence : PIC16LF18855-I/SP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.62 | $26,20 |
| 100 | $2.34 | $234,00 |
| 500 | $2.12 | $1 060,00 |
| 1 000 | $1.95 | $1 950,00 |
PIC16LF18855-I/SP Présentation
What is a PIC16 microcontroller? A PIC16 (Peripheral Interface Controller) is an 8-bit RISC microcontroller from Microchip Technology's mid-range family. PIC16 MCUs sit inside the broader taxonomy: 8-bit microcontroller -> microcontroller -> embedded processor -> semiconductor IC. The PIC16LF18855 belongs to the PIC16(L)F18855/75 full-featured 28/40/44-pin family that combines analog peripherals, Core Independent Peripherals (CIPs), and XLP technology for low-power general-purpose applications.
Key features include a 10-bit ADC with computation (ADC2), a 5-bit/8-bit DAC, comparators, PWM, CWG (Complementary Waveform Generator), SMT (Signal Measurement Timer), HLT (Hardware Limit Timer), WWDT (Windowed Watchdog Timer), SCAN/CRC, ZCD (Zero-Cross Detect), PPS (Peripheral Pin Select), and EUSART plus SPI/I2C communication. The 14KB Flash supports 8K x 14 word addressing.
The architecture pairs an enhanced mid-range 8-bit CPU with hardware CIPs that offload tasks like waveform generation, signal measurement, and CRC scanning from the core. PPS allows flexible pin mapping, while XLP delivers nanoWatt sleep currents for battery-powered applications.
Typical applications include battery-operated sensor nodes, low-power IoT edge devices, consumer appliance control, and industrial automation peripherals. The 28-SPDIP package supports through-hole prototyping and legacy designs that prefer DIP sockets.
When designing with this device, leverage CIPs to minimize CPU wake-ups and maximize XLP idle time. Use PPS to remap peripherals and avoid pin conflicts during PCB layout. Verify that the 1.8V minimum VDD matches sensor and peripheral supply rails.
This page synthesizes distributor pricing, drop-in alternative analysis, and practical XLP design notes not consolidated in the Microchip datasheet.
Alternatives de remplacement direct pour PIC16LF18855-I/SP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16LF18855-I/SP (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Program Memory (Flash), Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F18855-I/SP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16LF18855-I/SO
✅ Remplacement direct✓ En stock
$1.24 / unité
Voir la fiche technique →PIC16LF18855-E/SP
✅ Remplacement direct✓ En stock
$1.52 / unité
Voir la fiche technique →PIC16LF18855-E/SO
✅ Remplacement direct✓ En stock
$1.52 / unité
Voir la fiche technique →PIC16LF18855-E/ML
✅ Remplacement direct✓ En stock
$1.05 / unité
Voir la fiche technique →PIC16LF18854-I/SP
✅ Remplacement direct✓ En stock
$1.22 / unité
Voir la fiche technique →PIC16LF18455-I/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.05 / unité
Voir la fiche technique →PIC16LF18855-I/SP Valeurs maximales et caractéristiques électriques
| Product Family | PIC16 (L)F18855/75 |
| Core | 8-bit PIC mid-range |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| SRAM | 1 KB |
| EEPROM | 256 B |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| Température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Boîtier | 28-pin SPDIP (SP) |
| Type de montage | Through-Hole (DIP) |
| ADC | 10-bit with Computation (ADC2) |
| DAC | 5-bit / 8-bit |
| Comparators | Yes |
| Communication | EUSART, SPI, I2C |
| Core Independent Peripherals | PWM, CWG, SMT, HLT, WWDT, SCAN/CRC, ZCD, PPS |
| Low-Power Technology | eXtreme Low Power (XLP) |
| Statut RoHS | Compliant |
Configuration des broches de PIC16LF18855-I/SP
| Broche 1 | RA0 — Analog/Digital I/O |
| Broche 2 | RA1 — Analog/Digital I/O |
| Broche 3 | RA2 — Analog/Digital I/O |
| Broche 4 | RA3 — Analog/Digital I/O |
| Broche 5 | RA4 — Analog/Digital I/O |
| Broche 6 | RA5 — Analog/Digital I/O |
| Broche 7 | RA6 — Analog/Digital I/O |
| Broche 8 | RA7 — Analog/Digital I/O |
| Broche 9 | VSS — Ground |
| Broche 10 | RB0 — Digital I/O with interrupt-on-change |
| Broche 11 | RB1 — Digital I/O with interrupt-on-change |
| Broche 12 | RB2 — Digital I/O with interrupt-on-change |
| Broche 13 | RB3 — Digital I/O with interrupt-on-change |
| Broche 14 | RB4 — Digital I/O with interrupt-on-change |
| Broche 15 | RB5 — Digital I/O with interrupt-on-change |
| Broche 16 | RB6 — Digital I/O with interrupt-on-change/ICSP clock |
| Broche 17 | RB7 — Digital I/O with interrupt-on-change/ICSP data |
| Broche 18 | VSS — Ground (or second VSS on some variants) |
| Broche 19 | VDD — Positive supply voltage |
| Broche 20 | RC0 — Digital I/O |
| Broche 21 | RC1 — Digital I/O |
| Broche 22 | RC2 — Digital I/O |
| Broche 23 | RC3 — Digital I/O |
| Broche 24 | RC4 — Digital I/O |
| Broche 25 | RC5 — Digital I/O |
| Broche 26 | RC6 — Digital I/O |
| Broche 27 | RC7 — Digital I/O |
| Broche 28 | VDD — Positive supply voltage (or auxiliary) |
Applications typiques
PIC16LF18855-I/SP convient pour 6 applications: Battery-Powered IoT Sensor Nodes, Consumer Appliance Control, Industrial Automation Peripherals, Low-Power Wearable Devices, HVAC and Building Automation, Educational and Prototyping Platforms.
Battery-Powered IoT Sensor Nodes
PIC16LF18855-I/SP fits battery-powered IoT sensor nodes by combining 1.8-3.6 V operation with eXtreme Low Power (XLP) nanoWatt sleep currents and Core Independent Peripherals. The 10-bit ADC2 with computation performs sensor conversions while the CPU stays asleep, extending coin-cell battery life. The 28-SPDIP package enables through-hole prototyping for low-volume sensor products where surface-mount assembly costs are prohibitive.
Recommandé
Consumer Appliance Control
PIC16LF18855-I/SP is well-suited for consumer appliance control panels where its 14 KB Flash accommodates state-machine firmware, PWM drives loads, and CWG (Complementary Waveform Generator) generates motor control waveforms. The 32 MHz core delivers responsive user-interface timing, while ZCD (Zero-Cross Detect) supports AC-line dimming. Industrial -40 °C to +85 °C temperature grade covers appliance operating environments.
Recommandé
Industrial Automation Peripherals
PIC16LF18855-I/SP suits industrial automation peripherals like sensor transmitters and actuator drivers, leveraging EUSART for RS-485/RS-232 communication and SPI/I2C for inter-IC connectivity. SCAN/CRC peripherals ensure data integrity in noisy factory environments. The 28-SPDIP package supports rugged through-hole assembly preferred in industrial modules.
Recommandé
Low-Power Wearable Devices
PIC16LF18855-I/SP supports wearable device designs through its 1.8 V minimum VDD and XLP nanoWatt sleep currents. The SMT (Signal Measurement Timer) captures pulse signals from biometric sensors without CPU intervention, while PPS remaps peripherals to optimize PCB layout in space-constrained wearable form factors. The 32 MHz performance enables on-device signal processing for heart-rate or motion tracking.
Recommandé
HVAC and Building Automation
PIC16LF18855-I/SP powers HVAC zone controllers and building automation sensors by combining 14 KB Flash for control firmware, multiple PWM outputs for damper/valve actuators, and ZCD for AC-line synchronization. WWDT (Windowed Watchdog Timer) ensures system reliability in unattended installations. Industrial temperature grade and XLP support battery-backed wireless sensor nodes.
Recommandé
Educational and Prototyping Platforms
PIC16LF18855-I/SP is ideal for educational microcontroller courses and prototyping platforms because the 28-SPDIP package fits standard DIP sockets and breadboards. Students gain access to advanced features like ADC2, CIPs, and PPS at a low price point near $2.85. The 14 KB Flash accommodates substantial student projects while the 32 MHz core supports real-time control experiments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16LF18855-I/SP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F18855-I/SP | PIC16LF18855-I/SO | PIC16LF18855-E/SP | PIC16LF18855-E/SO | PIC16LF18855-E/ML | PIC16LF18854-I/SP | PIC16LF18455-I/SP |
|---|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SPDIP | 28-SPDIP - same | 28-SOIC | 28-SPDIP - same | 28-SOIC | 28-QFN | 28-SPDIP - same | 28-SPDIP - same |
| Flash Memory | 14 KB | 14 KB | 14 KB | 14 KB | 14 KB | 14 KB | 7 KB | 14 KB |
| SRAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Operating Voltage | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Temperature Grade | Industrial -40 °C to +85 °C | Industrial -40 °C to +85 °C | Industrial -40 °C to +85 °C | Extended -40 °C to +125 °C | Extended -40 °C to +125 °C | Extended -40 °C to +125 °C | Industrial -40 °C to +85 °C | Industrial -40 °C to +85 °C |
Principaux différenciateurs
- Same-family 28-SPDIP drop-in with 5 V support (vs PIC16F18855-I/SP)
- Surface-mount migration path within same family (vs PIC16LF18855-I/SO)
- Extended temperature variant for harsh environments (vs PIC16LF18855-E/SP)
Notes de conception
Estimated: PIC16LF18855-I/SP draws roughly 100 µA/MHz active and under 50 nA in sleep mode per the XLP datasheet. At 32 MHz with 3.3 V VDD, expect ~3.2 mA active current. Use IDLE/DOZE modes and PMD (Peripheral Module Disable) registers to gate unused peripherals during long sleep intervals, extending coin-cell battery life in IoT sensor nodes.
Place a 100 nF decoupling capacitor within 5 mm of each VDD pin and a 10 µF bulk capacitor near the MCU power pins. Route VDD/VSS traces with low impedance and avoid daisy-chained power. For high-frequency ADC accuracy, isolate analog VDD/AVSS from digital supplies via ferrite beads or star routing, and keep analog traces away from PWM/SPI switching signals.
Do not exceed 3.6 V on VDD for the LF variant - damage will occur above absolute maximum. Configure unused pins as outputs (not inputs) to avoid floating-pin current consumption. When migrating firmware between LF and F variants, verify oscillator settings remain valid at the lower VDD; some HFINTOSC frequencies require minimum 2.0 V or 2.3 V operation.
For 28-SPDIP prototyping, reserve a standard 0.6 inch wide DIP footprint on the PCB to maintain breadboard compatibility. When transitioning to surface-mount SOIC-28 (SO) or QFN-28 (ML) variants, update the PCB layout to match the smaller pad pattern. Use PPS (Peripheral Pin Select) early in firmware development to optimize pin assignments for the chosen package layout.
Informations de conformité
RoHS compliant per Microchip product page and Alibaba listing. Not AEC-Q100 qualified; for automotive applications use AEC-Q100 qualified variants if available or add external qualification testing.
