PIC16LF777-I/ML - 14KB Flash 8-bit MCU, 44-QFN | Microchip
MPN: PIC16LF777-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.96 | $5.96 |
| 10 | $5.51 | $55.10 |
| 100 | $4.78 | $478.00 |
| 500 | $4.12 | $2,060.00 |
| 1,000 | $3.65 | $3,650.00 |
| 3,000 | $3.05 | $9,150.00 |
PIC16LF777-I/ML Overview
A PIC microcontroller (Peripheral Interface Controller) is a family of 8/16/32-bit RISC microcontrollers originally developed by General Instruments and popularized by Microchip Technology. Within the broader taxonomy, a PIC MCU belongs to: microcontroller -> embedded processor -> semiconductor -> integrated circuit. The PIC16 family targets mid-range 8-bit applications with a 14-bit instruction word, 35 single-word instructions, and 200 ns instruction execution time at 20 MHz, balancing code density, deterministic interrupt response, and peripheral integration for embedded control.
Key differentiating features of the PIC16LF777-I/ML include a 10-bit ADC with 14 input channels (vs. 8 or 12 on lower-pin PIC16F devices), nanoWatt Technology for power-managed sleep modes, an Enhanced USART with LIN support, a Master Synchronous Serial Port (MSSP) for SPI/I2C, and a Parallel Slave Port (PSP) for external bus interfacing. The 'LF' suffix denotes the wide-voltage (2.0-5.5V) variant, while the standard PIC16F777 operates at 4.0-5.5V only.
Architecturally, the PIC16LF777 uses a Harvard-style program/data bus with hardware stack and 8-level deep subroutine return stack. Its 14-bit instruction set enables efficient C and assembly coding, while the integrated ICD (In-Circuit Debugger) and ICSP (In-Circuit Serial Programming) interfaces reduce development tooling cost. The 10-bit successive-approximation ADC delivers conversions in approximately 11 ADC clock cycles.
Typical applications include industrial sensor signal conditioning, automotive body controllers, HVAC fan and damper control, small appliance control boards, and battery-powered remote sensor nodes. The wide voltage range and nanoWatt Technology make it especially suitable for line-powered and energy-conscious designs.
When designing with this device, ensure that PCB thermal vias are placed under the QFN exposed pad to meet the 31.4 C/W theta_JA thermal budget. Decoupling VDD with a 0.1uF ceramic capacitor within 5 mm of the pin and keeping analog/digital grounds separated but joined at a single point preserves ADC accuracy.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for PIC16LF777-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF777-I/ML (same form factor and footprint) — differing in ADC, Package, I/O Pins, Timers, Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F777-I/ML
✅ Drop-In✓ In Stock
$5.48 / Unit
View Datasheet →PIC16LF777T-I/ML
✅ Drop-In✓ In Stock
$2.84 / Unit
View Datasheet →PIC16LF767-I/ML
✅ Drop-In✓ In Stock
$2.74 / Unit
View Datasheet →PIC16LF747-I/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.21 / Unit
View Datasheet →PIC16F777-I/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.75 / Unit
View Datasheet →PIC16LF777-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC16 (8-bit RISC) |
| Program Memory (Flash) | 14 KB |
| RAM | 368 bytes |
| EEPROM | 256 bytes |
| Maximum Clock Frequency | 20 MHz (external); 10 MHz internal |
| Instruction Cycle | 200 ns at 20 MHz |
| Supply Voltage (VDD) | 2.0 V to 5.5 V |
| I/O Pins | 36 |
| ADC | 10-bit, 14 channels |
| Timers | 3 (Timer0, Timer1, Timer2) |
| Capture/Compare/PWM | 3 ECCP modules |
| Communication | EUSART (LIN-capable), MSSP (SPI/I2C), PSP |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Package | 44-pin QFN (ML) 8x8 mm with exposed pad |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Debug Interface | ICSP/ICD |
| Power-Saving Modes | nanoWatt Technology (Sleep, Idle, Low-Power modes) |
PIC16LF777-I/ML Pin Configuration
| Pin 1 | RA0/AN0/ULPWU — PORTA bit 0 / Analog input 0 / Ultra-Low-Power Wake-up |
| Pin 2 | RA1/AN1 — PORTA bit 1 / Analog input 1 |
| Pin 3 | RA2/AN2/VREF- — PORTA bit 2 / Analog input 2 / ADC VREF- |
| Pin 4 | RA3/AN3/VREF+ — PORTA bit 3 / Analog input 3 / ADC VREF+ |
| Pin 5 | RA4/AN4/T0CKI — PORTA bit 4 / Analog input 4 / Timer0 clock input |
| Pin 6 | RA5/AN5/SS — PORTA bit 5 / Analog input 5 / SPI Slave Select |
| Pin 7 | RA6/OSC2/CLKO — PORTA bit 6 / Crystal Oscillator output / Clock out |
| Pin 8 | RA7/OSC1/CLKI — PORTA bit 7 / Crystal Oscillator input / Clock in |
| Pin 9 | VSS — Ground reference |
| Pin 10 | VDD — Positive supply (2.0-5.5V) |
| Pin 11 | RB0/INT0/CCP1 — PORTB bit 0 / External interrupt 0 / CCP1 in/out |
| Pin 12 | RB1/INT1/CCP2 — PORTB bit 1 / External interrupt 1 / CCP2 in/out |
| Pin 13 | RB2/INT2/P1B — PORTB bit 2 / External interrupt 2 / Enhanced PWM output 1B |
| Pin 14 | RB3/INT3/CCP2/P1C — PORTB bit 3 / External interrupt 3 / CCP2 in/out / PWM 1C |
| Pin 15 | RB4/AN6 — PORTB bit 4 / Analog input 6 |
| Pin 16 | RB5/AN7/PGM — PORTB bit 5 / Analog input 7 / LVP programming |
| Pin 17 | RB6/PGC — PORTB bit 6 / ICSP clock |
| Pin 18 | RB7/PGD — PORTB bit 7 / ICSP data |
| Pin 19 | VSS — Ground reference |
| Pin 20 | VDD — Positive supply (2.0-5.5V) |
| Pin 21 | RC0/T1OSO/T1CKI — PORTC bit 0 / Timer1 oscillator out / Timer1 clock in |
| Pin 22 | RC1/T1OSI/CCP2 — PORTC bit 1 / Timer1 oscillator in / CCP2 in/out |
| Pin 23 | RC2/CCP1/P1A — PORTC bit 2 / CCP1 in/out / Enhanced PWM output 1A |
| Pin 24 | RC3/SCK/SCL — PORTC bit 3 / SPI clock / I2C clock |
| Pin 25 | RC4/SDI/SDA — PORTC bit 4 / SPI data in / I2C data |
| Pin 26 | RC5/SDO — PORTC bit 5 / SPI data out |
| Pin 27 | RC6/TX/CK — PORTC bit 6 / EUSART TX / EUSART synchronous clock |
| Pin 28 | RC7/RX/DT — PORTC bit 7 / EUSART RX / EUSART synchronous data |
| Pin 29 | VSS — Ground reference |
| Pin 30 | VDD — Positive supply (2.0-5.5V) |
| Pin 31 | RD0/PSP0 — PORTD bit 0 / Parallel Slave Port bit 0 |
| Pin 32 | RD1/PSP1 — PORTD bit 1 / Parallel Slave Port bit 1 |
| Pin 33 | RD2/PSP2 — PORTD bit 2 / Parallel Slave Port bit 2 |
| Pin 34 | RD3/PSP3 — PORTD bit 3 / Parallel Slave Port bit 3 |
| Pin 35 | RD4/PSP4 — PORTD bit 4 / Parallel Slave Port bit 4 |
| Pin 36 | RD5/PSP5/P1B — PORTD bit 5 / Parallel Slave Port bit 5 / PWM 1B |
| Pin 37 | RD6/PSP6/P1C — PORTD bit 6 / Parallel Slave Port bit 6 / PWM 1C |
| Pin 38 | RD7/PSP7/P1D — PORTD bit 7 / Parallel Slave Port bit 7 / PWM 1D |
| Pin 39 | VSS — Ground reference |
| Pin 40 | VDD — Positive supply (2.0-5.5V) |
| Pin 41 | RE0/RD/AN8 — PORTE bit 0 / Read control for PSP / Analog input 8 |
| Pin 42 | RE1/WR/AN9 — PORTE bit 1 / Write control for PSP / Analog input 9 |
| Pin 43 | RE2/CS/AN10 — PORTE bit 2 / Chip Select for PSP / Analog input 10 |
| Pin 44 | MCLR/VPP — Master Clear reset input / Programming voltage |
| Pin EP | EP — Exposed thermal pad - connect to VSS for thermal dissipation |
Typical Applications
PIC16LF777-I/ML is suitable for 6 applications: Industrial Sensor Signal Conditioning, Automotive Body and Lighting Controllers, HVAC Fan and Damper Control Boards, Small Appliance Control (Coffee Makers, Blenders, Toasters), Battery-Powered Remote Sensor Nodes, Educational Embedded Development Platforms.
Industrial Sensor Signal Conditioning
The PIC16LF777-I/ML is well-suited for industrial sensor signal conditioning where multiple analog inputs must be digitized. Its 14-channel 10-bit ADC samples up to 11 channels in approximately 11 ADC clock cycles, while the wide 2.0-5.5 V supply accommodates loop-powered 24 V systems stepped down through a small LDO. The 36 GPIO handle multiple digital sensors and indicator LEDs. The nanoWatt technology reduces quiescent current to microamp levels in sleep mode, allowing battery-backed operation during plant power interruptions. Compared with switching regulators, the analog rails benefit from the PIC's predictable ADC reference, and the QFN-44 package's exposed pad dissipates controller heat efficiently. Recommended companion ICs: PIC16LF777-I/ML for the controller, MCP6022 for analog front-end op-amps, and MCP1700 for low-quiescent LDO supply.
Recommended
Automotive Body and Lighting Controllers
The PIC16LF777-I/ML targets automotive body and lighting sub-modules such as interior lamp dimming, seat controller nodes, and door-zone logic. The integrated Enhanced USART with LIN bus support provides hardware LIN 1.3 master/slave capability without an external transceiver glue logic, while the 14-channel ADC reads photocells and current-sense shunts for adaptive lighting. Industrial -40 to +85 C temperature rating covers cabin environments, and the 44-QFN package is robust under vibration when the exposed pad is soldered to a continuous ground pour. Watchdog timer, brown-out reset, and code protection features support ISO 26262 ASIL-A functional safety compliance for non-safety-critical modules. Companion parts: PIC16LF777-I/ML for the controller, MCP2515 for additional CAN, and TLE7259-3 for LIN transceiver.
Recommended
HVAC Fan and Damper Control Boards
The PIC16LF777-I/ML drives multi-speed fan motor control and damper actuator positioning in residential and commercial HVAC systems. Three Enhanced CCP modules generate PWM signals to drive triac-fired AC motors or BLDC commutation logic, while 14 ADC inputs read NTC thermistors for temperature feedback. The 10 MHz internal oscillator eliminates the external crystal in cost-sensitive designs, and the wide VDD range accommodates rectified 24 VAC with bulk capacitor reservoirs. nanoWatt Technology keeps idle-mode current below 5 uA when the system is in standby, extending transformer life. The 44-QFN exposed pad attaches to a copper pour that doubles as a heatsink for any linear regulator on the board.
Recommended
Small Appliance Control (Coffee Makers, Blenders, Toasters)
The PIC16LF777-I/ML is well-matched for small kitchen and home appliances requiring multiple push-buttons, rotary encoders, status LEDs, and TRIAC-driven heating elements. Its 36 GPIO handle 4x4 keypads or capacitive touch sliders via the MSSP peripheral, while the three ECCP modules generate zero-cross TRIAC firing pulses synchronized to AC mains. The industrial temperature grade suits appliance under-hood environments, and the wide 2.0-5.5 V supply supports both 3.3 V and 5 V designs from a single BOM. Sleep current under 1 uA enables compliance with standby-power regulations like the EU Ecodesign Directive. Companion parts: PIC16LF777-I/ML for the controller, MOC3021 for TRIAC isolation, and HLK-PM01 for AC-DC supply.
Recommended
Battery-Powered Remote Sensor Nodes
The PIC16LF777-I/ML's nanoWatt Technology and 2.0 V minimum supply voltage make it ideal for battery-powered wireless sensor nodes operating from two AA cells. In deep sleep the MCU draws less than 1 uA, allowing multi-year battery life when waking only hourly to take sensor readings via the 10-bit ADC. The MSSP peripheral interfaces with sensors over SPI or I2C, while the EUSART can drive sub-1GHz radios like the MRF89XA. The QFN-44 package's exposed pad provides mechanical rigidity for products that experience thermal cycling. Recommended companion parts: PIC16LF777-I/ML for the controller, MRF89XA for sub-GHz radio, and MCP1700 for ultra-low-quiescent 3.3 V regulation from depleted cells.
Recommended
Educational Embedded Development Platforms
Universities and training institutes use the PIC16LF777-I/ML in embedded systems courses because it integrates a representative peripheral set - ADC, timers, PWM, USART, SPI, I2C - in a single 44-QFN package that is both breadboard-friendly (with breakout boards) and representative of mid-range PIC16 devices used in industry. The ICSP/ICD interface allows low-cost debuggers such as the PICkit 3 or MPLAB Snap to program and step through code without removing the part from the target. Wide 2.0-5.5 V supply tolerates USB-powered 5 V as well as 3.3 V logic analyzer rails. Companion parts: PIC16LF777-I/ML for the controller, PICkit 3 for debug, and 44-pin QFN-to-DIP breakout PCB for breadboard compatibility.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF777-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F777-I/ML | PIC16LF777T-I/ML | PIC16LF767-I/ML | PIC16LF747-I/PT | PIC16F777-I/PT |
|---|---|---|---|---|---|---|
| Package | 44-pin QFN (ML) 8x8 mm | 44-pin QFN (ML) - same | 44-pin QFN (ML) - same | 44-pin QFN (ML) - same | 44-pin QFN (ML) - same die family | 44-pin QFN (ML) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Supply Voltage (VDD) | 2.0 V to 5.5 V | 4.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 4.0 V to 5.5 V |
| Program Memory (Flash) | 14 KB | 14 KB | 14 KB | 7 KB (-50%) | 7 KB (-50%) | 14 KB |
| RAM | 368 bytes | 368 bytes | 368 bytes | 204 bytes (-45%) | 204 bytes (-45%) | 368 bytes |
| ADC Channels | 14 channels x 10-bit | 14 channels x 10-bit | 14 channels x 10-bit | 11 channels x 10-bit | 14 channels x 10-bit | 14 channels x 10-bit |
| I/O Pins | 36 | 36 | 36 | 25 (-31%) | 33 (-8%) | 36 |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Packaging Form | Tube | Tube | Tape & Reel | Tube | Tube | Tube |
Key Differentiators
- Wide 2.0-5.5V supply vs PIC16F777's 4.0-5.5V (vs PIC16F777-I/ML)
- Tape & Reel packaging for production (vs PIC16LF777T-I/ML)
- 14 ADC channels vs 11 on PIC16LF767 (vs PIC16LF767-I/ML)
- Same package and pinout as legacy PIC16F777I/ML (vs PIC16F777-I/PT)
Design Notes
Estimated: thermal vias under the QFN-44 exposed pad are essential for dissipating heat at 20 MHz operation with 36 GPIO simultaneously switching. Per the Microchip datasheet, theta_JA on the standard 1s0p PCB is 31.4 C/W; with 9 thermal vias to an internal ground plane, the rating improves to approximately 12 C/W. Place a 0.1 uF ceramic decoupling capacitor within 5 mm of each VDD pin (there are four VDD pins on the 44-QFN).
Brown-out Reset (BOR) should be enabled in configuration bits for any production design. The PIC16LF777-I/ML has programmable BOR trip voltages; for 3.3 V systems set BOR to 2.5 V (VBOR = 2.5V configuration) so the MCU resets cleanly during battery droop. Without BOR, code may execute from corrupt Flash during slow VDD ramp-up, leading to EEPROM corruption or latch-up.
Keep analog signals (ANx) physically separated from high-speed digital traces (PWM, SCK) on the PCB. Route the VREF+ pin directly from the ADC reference source - not from VDD - to avoid ADC noise coupling. Use a single-point star ground connection joining analog and digital ground planes at the device VSS pin, not at the power supply return, to prevent ground-loop ADC errors.
When using the Enhanced USART in LIN mode, ensure the baud-rate error stays below 0.5% relative to the master's clock. The PIC16LF777-I/ML's BRGH=1 high-speed mode with 16-bit SPBRG achieves <0.16% error at 20 MHz against standard LIN rates. For SPI master mode above 4 MHz, keep the SCK trace under 50 mm and add a 33 ohm series damping resistor to reduce ringing on long runs to remote slaves.
Do not leave the MCLR/VPP pin floating; tie it through a 10 kohm pull-up to VDD. Floating MCLR is a common cause of spurious resets in electrically noisy industrial environments. Also, ICSP programming requires that the PGC/PGD pins (RB6/RB7) not be heavily loaded - any external pulldowns or capacitive loads above 50 pF may prevent reliable ISP. Disable the LVP (low-voltage programming) bit in configuration words if using high-voltage (12V) programming.
Compliance Information
RoHS compliant per Microchip product page. Standard industrial grade (-40 to +85 C), not AEC-Q100 qualified; for automotive designs consider PIC16F777-E or PIC18F variants with Q100 qualification.
