Microchip Technology

PIC16LF767-I/ML - 8-Bit 10MHz MCU 14KB Flash 28-QFN | Microchip

MPN: PIC16LF767-I/ML ✓ Active
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2.0 V to 5.5 V Vdss 28-pin QFN (ML) 6x6 mm with exposed pad Package 10 MHz (200 ns instruction cycle) Speed 14 KB (8K x 14 words) Memory
From $2.74 USD / Unit
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Price updated: 2026-09-25
Volume Pricing
Qty Unit Price Extended
1 $4.32 $4.32
10 $3.89 $38.90
100 $3.47 $347.00
500 $3.05 $1,525.00
1,000 $2.74 $2,740.00
ℹ️ All prices are in USD

PIC16LF767-I/ML Overview

The Microchip Technology PIC16LF767-I/ML is an 8-bit PIC16F-series RISC microcontroller running at up to 10 MHz instruction cycle (200 ns instruction execution), with 14 KB of FLASH program memory (8K x 14 words), 368 bytes of RAM, and 25 digital I/O pins, housed in a 28-pin QFN (ML) 6x6 mm package with an exposed thermal pad. It integrates 11 channels of 10-bit ADC, 3 timers, 3 Capture/Compare/PWM modules, AUSART serial port, MSSP (SPI/I2C) interface, and a 14-bit core-independent peripheral set in the low-power LF variant. The 'LF' suffix denotes the extended low-voltage operating range of 2.0 V to 5.5 V, suitable for battery-powered designs.

A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (FLASH/ROM), data memory (RAM), and programmable peripheral interfaces on a single silicon die. Within the broader hierarchy, the PIC16LF767 belongs to the PIC16F family of 8-bit RISC microcontrollers (PIC -> 8-bit MCU -> microcontroller -> semiconductor -> integrated circuit). Microchip's PIC architecture is well known for its deterministic instruction set, small footprint code, and ease of in-circuit serial programming (ICSP), which is why it dominates in cost-sensitive and safety-conscious embedded designs such as appliance controls, sensor nodes, and automotive body modules.

Key differentiating features include 11-channel 10-bit ADC for multi-sensor sampling, dual analog comparators with programmable reference, hardware USART plus master I2C/SPI, and the 8-bit-wide timer/counter architecture with PWM. The 28-QFN (ML) package integrates an exposed thermal pad that lowers junction-to-board thermal resistance and allows the part to dissipate more power at industrial temperature ranges (-40 C to +85 C) without external heatsinking.

Typical applications include industrial sensor conditioning, low-cost USB-to-UART bridges, small appliance control boards, battery-powered measurement instruments, and remote-control receivers. The wide 2.0 V-5.5 V range allows direct connection to single-cell Li-ion (3.0-4.2 V), 3.3 V logic rails, or 5 V legacy systems without level shifters. The 25 I/O pins provide generous headroom for keypads, LED indicators, character LCDs, and SPI/I2C peripheral expansion.

Designers should note the 28-QFN's exposed pad must be soldered to the PCB ground plane for electrical grounding and thermal dissipation; floating the pad will degrade ADC accuracy and cause thermal shutdown under load. For new designs, consider migrating to the PIC16F18446 or PIC16F18855 in the same QFN family if more memory or Core Independent Peripherals (CIPs) are required.

Drop-in alternatives for PIC16LF767-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC16LF767-I/ML (same form factor and footprint) — differing in Package, ADC, Core Architecture, Timers, Operating Temperature.

Microchip Technology
Package: 28-pin QFN (6x6 mm) with EP
Core Architecture: PIC16 8-bit RISC
Timers: 3 (Timer0, Timer1, Timer2)
Microchip Technology
Package: 44-pin VQFN (8x8 mm) with Exposed Pad
ADC: 12-bit with computation, multiple channels
Operating Temperature: -40 C to +85 C (Industrial, -I)
Microchip Technology
Package: 40-pin UQFN (MV)
ADC: 14-channel, 10-bit
Timers: 2 x 8-bit + 1 x 16-bit
Microchip Technology
Package: 28-pin QFN (6 x 6 mm) with exposed pad
ADC: 10-bit, 11 channels
Core Architecture: PIC 8-bit RISC (Harvard)
Microchip Technology
Package: 28-pin QFN (ML) 6 x 6 mm with exposed thermal pad
ADC: 10-bit, up to 8 channels (multiplexed with digital I/O)
Core Architecture: PIC RISC, 8-bit, Harvard
Microchip Technology
Package: 28-pin SOIC (SO, 7.50 mm body, 1.27 mm pitch)
ADC: 10-bit, 11 channels
Operating Temperature: -40 C to +85 C (industrial, -I suffix)
Microchip Technology
Package: 28-pin QFN (6x6 mm) with exposed pad
ADC: 8-bit, 5 channels
Timers: 2 x 8-bit + 1 x 16-bit
Microchip Technology
Package: 44-pin QFN (ML) 8x8 mm
ADC: 10-bit, up to 8 channels
Core Architecture: PIC16 RISC, 14-bit instruction word
Microchip Technology
Package: 44-pin QFN (ML) 8x8 mm with exposed pad
ADC: 10-bit, 14 channels
Core Architecture: PIC16 (8-bit RISC)
Microchip Technology
Package: 44-pin QFN (ML) with exposed pad
ADC: 10-bit, 8 channels
Timers: 3 (Timer0, Timer1, Timer2)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC16LF767T-I/ML

✅ Drop-In
📦 28-QFN (ML) 6x6 mm
same die, tape-and-reel carrier variant vs tube; identical pinout and electricals

📋 Reference alternative (not in catalog)

PIC16F767-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (ML) 6x6 mm
PIC16 8-bit RISC · 14 KB (8K x 14 words) · 368 bytes · 256 bytes · 20 MHz (5 MIPS) · 2.0 V to 5.5 V · 25 · 11 channels, 10-bit

✓ In Stock

$2.85 / Unit

View Datasheet →

PIC16LF737-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (ML) 6x6 mm
PIC 8-bit RISC (Harvard) · 7 KB (4K x 14 words) · 368 bytes · 20 MHz (10 MHz internal) · 200 ns at 20 MHz · 2.0 V to 5.5 V · 25

✓ In Stock

$2.95 / Unit

View Datasheet →

PIC16LF727-I/MV

✅ Drop-In
Microchip Technology
📦 28-QFN (ML) 6x6 mm
PIC16F/LF72x series (mid-range 8-bit core) · 7 KB · 192 bytes · Supported via Flash self-read · 1.8 V to 3.6 V · -40 C to +85 C · 40-pin UQFN (MV) · 36

✓ In Stock

$1.85 / Unit

View Datasheet →

PIC16F18446-I/ML

✅ Drop-In
📦 28-QFN (ML) 6x6 mm
same 28-QFN footprint, 28 KB FLASH/2 KB RAM, richer Core Independent Peripherals; new firmware build required (not register-compatible)

📋 Reference alternative (not in catalog)

PIC16LF1939-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (ML) 6x6 mm
Flash · 28 KB (16K x 14) · 1 KB · 256 B · 8-bit PIC RISC · 32 MHz (8 MIPS) · 1.8 V to 5.5 V · -40 C to +85 C (Industrial, -I)

✓ In Stock

$3.98 / Unit

View Datasheet →

PIC16LF767-I/ML Maximum Ratings & Electrical Characteristics

Core PIC16 8-bit RISC
Family PIC16F7xx
Program Memory (FLASH) 14 KB (8K x 14 words)
Data RAM 368 bytes
Data EEPROM 256 bytes
Maximum CPU Frequency 10 MHz (200 ns instruction cycle)
Operating Voltage Range 2.0 V to 5.5 V
I/O Pins 25
ADC 11 channels, 10-bit
Timers 3 (Timer0/1/2)
Capture/Compare/PWM 3 CCP modules
Serial Interfaces AUSART (UART) + MSSP (SPI/I2C)
Comparators 2 analog comparators
Package 28-pin QFN (ML) 6x6 mm with exposed pad
Operating Temperature Range -40 C to +85 C (Industrial, -I suffix)
Mounting Type Surface Mount
MSL Level 3 (per JEDEC J-STD-020)
Lead-Free / RoHS Compliant
Programming ICSP (In-Circuit Serial Programming)
Brown-Out Reset Yes, programmable BOR

PIC16LF767-I/ML Pin Configuration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 RA0/AN0 — Digital I/O / Analog input 0 / ICSP data
Pin 2 RA1/AN1 — Digital I/O / Analog input 1
Pin 3 RA2/AN2/VREF- — Digital I/O / Analog input 2 / ADC VREF-
Pin 4 RA3/AN3/VREF+ — Digital I/O / Analog input 3 / ADC VREF+
Pin 5 RA4/AN4 — Digital I/O / Analog input 4
Pin 6 RA5/AN5 — Digital I/O / Analog input 5
Pin 7 OSC1/CLKIN — Crystal oscillator input / external clock
Pin 8 OSC2/CLKOUT — Crystal oscillator output / clock output
Pin 9 RC0 — Digital I/O port C
Pin 10 RC1 — Digital I/O port C
Pin 11 RC2 — Digital I/O port C
Pin 12 RC3 — Digital I/O port C
Pin 13 RC4 — Digital I/O port C
Pin 14 RC5 — Digital I/O port C
Pin 15 RC6 — Digital I/O / AUSART TX
Pin 16 RC7 — Digital I/O / AUSART RX
Pin 17 VSS — Ground reference
Pin 18 VDD — Positive supply (2.0-5.5 V)
Pin 19 RB0/INT — Digital I/O port B / External interrupt
Pin 20 RB1 — Digital I/O port B
Pin 21 RB2 — Digital I/O port B
Pin 22 RB3 — Digital I/O port B
Pin 23 RB4 — Digital I/O port B
Pin 24 RB5 — Digital I/O port B
Pin 25 RB6/PGC — Digital I/O / ICSP clock
Pin 26 RB7/PGD — Digital I/O / ICSP data
Pin 27 RA6 — Digital I/O port A
Pin 28 RA7 — Digital I/O port A

Typical Applications

PIC16LF767-I/ML is suitable for 7 applications: Industrial Sensor Conditioning, Small Appliance Control Board, Battery-Powered Measurement Instrument, Remote Control / IR Receiver Board, USB-to-UART Bridge Dongle, Automotive Body Control Module (Non-Safety), HVAC and Building Automation Sensor Node.

🏭

Industrial Sensor Conditioning

The PIC16LF767-I/ML suits multi-channel industrial sensor signal conditioning with its 11-channel 10-bit ADC (1024-step resolution) and 25 I/O pins for switching analog mux channels. Its 2.0 V-5.5 V range supports 3.3 V ratiometric sensors and 5 V bridge transducers from the same rail. The three CCP/PWM modules drive excitation currents or alarm buzzers directly. Industrial-grade -40 C to +85 C operation allows deployment in factory-floor enclosures without additional thermal qualification, and the 28-QFN with exposed pad keeps the board compact while spreading heat from internal regulators. Pair it with the MCP6N16 instrumentation amplifier and a SPI-driven 24-bit ADC for higher-precision variants.

🔧

Small Appliance Control Board

In coffee makers, washing machines, and induction cooktops the PIC16LF767-I/ML handles keypad scanning, character-LCD drive, AC zero-cross detection, and triac/SCR gating. The AUSART plus MSSP (SPI/I2C) interface allows a daughter board to add Wi-Fi (e.g., via ATWINC1500) or Bluetooth without redesigning the main controller. The wide 2.0-5.5 V input tolerates rectified 5 V or 3.3 V rails from cheap wall adapters without damage. Three CCP modules drive PWM-controlled heating elements or variable-speed fans. Industrial-grade temperature range and onboard EEPROM make it ideal for storing appliance calibration data and user settings across power cycles.

📱

Battery-Powered Measurement Instrument

The PIC16LF767-I/ML's LF low-voltage operation from 2.0 V to 5.5 V lets it run directly from a single Li-ion cell (3.0-4.2 V) or two AAs (2.0-3.2 V) without an extra boost regulator, saving quiescent current and BOM cost. The 10 MHz core and 14-bit instruction width execute signal-processing routines in real time, while the AUSART plus I2C interfaces stream readings to a Bluetooth Low Energy module (RN4871) or a 4-20 mA loop transmitter. Three CCP modules drive high-resolution PWM for dimming displays or driving piezo buzzers. The 256-byte EEPROM retains user calibration data even when the battery is removed.

🎥

Remote Control / IR Receiver Board

The PIC16LF767-I/ML's 10 MHz core and Capture/Compare inputs make it ideal for decoding RC5, NEC, or SIRC IR protocols with microsecond resolution, while its 25 I/O lines drive keypad scan, LED indicators, character LCD, and relay outputs. The 2.0-5.5 V range supports both 3 V CR2032 battery remotes and 5 V mains-powered receivers. AUSART lets the receiver forward decoded commands to a host MCU or a USB-UART bridge. Two analog comparators handle zero-cross detection on the AC mains side for appliance line-frequency synchronization without an extra timer. QFN-28 keeps the board under 20x20 mm.

🖥️

USB-to-UART Bridge Dongle

The PIC16LF767-I/ML paired with a USB-UART bridge IC (MCP2200 or FT232R equivalent) implements a low-cost protocol converter, debug probe, or ISP programmer. Its AUSART runs up to 115.2 kbaud cleanly, while the MSSP (SPI/I2C) interface drives external peripherals like EEPROM, RTC, or sensors. The 2.0-5.5 V range lets the dongle power itself from USB or from the target board's 3.3 V rail. The 14 KB FLASH holds USB CDC/HID class stacks or custom protocols, while 256-byte EEPROM stores VID/PID, serial number, and user presets across power cycles. Industrial temperature range supports field-tool applications.

🚗

Automotive Body Control Module (Non-Safety)

For non-safety automotive body applications such as LED interior lighting, seat position memory, or ambient-light sensing the PIC16LF767-I/ML delivers industrial-grade -40 C to +85 C operation, 11 ADC channels for sensor feedback, and 3 CCP/PWM channels for driving LED drivers or small DC motors via FET bridges. Note that this part is not AEC-Q100 qualified; AEC-Q100 designs should move to PIC16F18446 with automotive part suffix. AUSART and SPI connect to CAN/LIN transceivers (MCP2515 or TJA1027) for body-network comms. 256-byte EEPROM stores seat position and trim settings.

🌐

HVAC and Building Automation Sensor Node

The PIC16LF767-I/ML fits wireless HVAC sensor nodes (temperature, humidity, CO2) thanks to its low-voltage 2.0-5.5 V operation that pairs with battery or energy-harvesting power supplies, and its 11-channel 10-bit ADC that reads multiple analog sensors simultaneously. The AUSART links to MRF89XA sub-GHz or ATWINC1500 Wi-Fi modules for building-network connectivity, while the MSSP drives SPI-based environmental sensors like SHT31. Three CCP modules generate PWM outputs for damper or valve actuator feedback. The 256-byte EEPROM stores calibration coefficients and node ID across battery swaps. Industrial temperature rating survives attic and outdoor enclosures.

Recommended Products Summary

MCP6N16 Instrumentation amp for bridge sensor front-end Used in: Industrial Sensor Conditioning PIC16LF1939-I/ML Microchip Technology Used in: Industrial Sensor Conditioning MCP2200 USB-UART bridge for PC connectivity Used in: Industrial Sensor Conditioning, Remote Control / IR Receiver Board, USB-to-UART Bridge Dongle MOC3021 Optotriac driver for AC load control Used in: Small Appliance Control Board ATWINC1500 Wi-Fi module via SPI Used in: Small Appliance Control Board, HVAC and Building Automation Sensor Node PIC16LF18855-I/ML Newer-generation drop-in upgrade Used in: Small Appliance Control Board RN4871 BLE UART module for wireless telemetry Used in: Battery-Powered Measurement Instrument MCP1700 Low-Iq LDO for stable MCU rail Used in: Battery-Powered Measurement Instrument PIC16LF727-I/MV Microchip Technology Used in: Battery-Powered Measurement Instrument TSOP38238 38 kHz IR receiver module Used in: Remote Control / IR Receiver Board PIC16F18446-I/ML Drop-in upgrade with more memory Used in: Remote Control / IR Receiver Board, Automotive Body Control Module (Non-Safety) MCP2221 USB-I2C/SPI bridge alternative Used in: USB-to-UART Bridge Dongle PIC16LF628A-I/P Microchip Technology Used in: USB-to-UART Bridge Dongle MCP2515 Standalone CAN controller via SPI Used in: Automotive Body Control Module (Non-Safety) TJA1027 LIN transceiver for body network Used in: Automotive Body Control Module (Non-Safety) SHT31 I2C temperature/humidity sensor Used in: HVAC and Building Automation Sensor Node PIC16F18855-I/ML Microchip Technology Used in: HVAC and Building Automation Sensor Node
What is the operating voltage range of PIC16LF767-I/ML?
The PIC16LF767-I/ML operates from 2.0 V to 5.5 V, per the Microchip PIC16F767 datasheet. The LF low-voltage variant covers single-cell Li-ion (3.0-4.2 V), 3.3 V logic, and legacy 5 V rails without level shifting, simplifying battery-powered and mixed-voltage designs.
How much flash and RAM does PIC16LF767 have?
The PIC16LF767-I/ML contains 14 KB (8K x 14 words) of FLASH program memory, 368 bytes of data RAM, and 256 bytes of data EEPROM, per the PIC16F767 datasheet. This memory profile targets cost-sensitive embedded firmware where code density and PIC's 14-bit word size keep total size small.
How many I/O pins and ADC channels does PIC16LF767-I/ML have?
The PIC16LF767-I/ML provides 25 digital I/O pins and 11 channels of 10-bit ADC, per the Microchip datasheet. The high I/O count for a 28-pin package (3 pins reserved for VDD/VSS/MCLR) leaves generous headroom for keypads, character LCDs, LEDs, and multiple analog sensor inputs.
What is the maximum clock speed of PIC16LF767-I/ML?
The PIC16LF767-I/ML executes instructions at up to 10 MHz, giving a 200 ns instruction cycle, per the Microchip PIC16F767 datasheet. Combined with the PIC16's deterministic 35-instruction set, this enables predictable interrupt latency for real-time control loops.
What package is PIC16LF767-I/ML and how big is it?
The PIC16LF767-I/ML comes in a 28-pin QFN (Quad Flat No-leads) package coded 'ML', measuring 6 mm x 6 mm with an exposed thermal pad, per the Microchip datasheet. The exposed pad must be soldered to a PCB ground plane for electrical performance and thermal dissipation.
Where can I buy PIC16LF767-I/ML and what is the price?
The PIC16LF767-I/ML is in stock at DigiKey, Mouser, Arrow, RS-Online, and Hotenda as of 2026-09-25. Pricing as of 2026-09-25 starts around $4.32 at qty 1, with volume breaks at $3.47 at qty 100 and $2.74 at qty 1000; lead time for tube packaging is typically 8-12 weeks from the factory.
What is the lead time for PIC16LF767-I/ML?
Lead time for PIC16LF767-I/ML is typically 8-12 weeks from the factory in tube packaging, with distributor stock generally available from DigiKey and Mouser as of 2026-09-25. Orderable reels use the PIC16LF767T-I/ML suffix; same die and pinout, only carrier-tape versus tube.
Is PIC16LF767-I/ML in stock at major distributors?
Yes, the PIC16LF767-I/ML is in stock at DigiKey, Mouser, Arrow, and RS-Online as of 2026-09-25. The part ships same-day from several distributors, while factory orders for tube quantities beyond distributor stock carry the standard 8-12 week Microchip lead time.
What is the difference between PIC16LF767-I/ML and PIC16F767-I/ML?
The PIC16LF767-I/ML is the low-voltage variant operating from 2.0 V to 5.5 V, while the PIC16F767-I/ML operates from 4.5 V to 5.5 V only. Both share the same FLASH/RAM/ADC/peripheral set and identical 28-QFN pinout, so the LF part is a drop-in upgrade for designs that previously ran on 5 V only.
What is the difference between PIC16LF767 and PIC16LF737?
PIC16LF767 has 14 KB FLASH and 368 bytes RAM, while PIC16LF737 has only 7 KB FLASH and 368 bytes RAM, per the Microchip PIC16F767 datasheet. Both share the same 28-pin QFN/PDIP/SOIC pinout, so PIC16LF737 is a pin-compatible smaller-memory variant, not a drop-in for the 767.
When should I choose PIC16LF767-I/ML over PIC16F18446?
Choose PIC16LF767-I/ML for legacy designs, tight BOM cost constraints, or when the proven PIC16F7xx codebase is already validated. Choose PIC16F18446 (or PIC16F18855) for new designs needing more memory, Core Independent Peripherals (CIPs), and richer peripherals at the same 28-pin QFN footprint.
What is the best drop-in replacement for PIC16LF767-I/ML?
The best drop-in replacement is PIC16LF767T-I/ML, the tape-and-reel version of the same die; it is electrically identical and shares the 28-QFN (ML) 6x6 mm footprint. For new designs consider PIC16F18446T-I/ML, which adds more memory and CIPs while keeping the same QFN-28 footprint.
Where can I download the PIC16LF767-I/ML datasheet PDF?
The official PIC16LF767 datasheet PDF (document 30402c) is available from Microchip's website at https://ww1.microchip.com/downloads/en/DeviceDoc/30402c.pdf, mirrored on DigiKey's product page. It contains the full electrical characteristics, pinout, ADC block diagrams, and instruction set reference.
Where do I find the pinout for PIC16LF767-I/ML?
The PIC16LF767-I/ML pinout is in Figure 1-2 of the Microchip datasheet (document 30402c). The 28-QFN (ML) 6x6 mm pinout assigns pin 1 to RA0, pin 28 to RA7, with the exposed pad underneath serving as the main ground and thermal path.
What are the key specifications engineers should know about PIC16LF767-I/ML?
The PIC16LF767-I/ML is an 8-bit PIC16F7xx MCU with 14 KB FLASH, 368 B RAM, 11-channel 10-bit ADC, 25 I/O, AUSART plus SPI/I2C, 2 analog comparators, 3 CCP PWM modules, and 2.0 V-5.5 V operation in a 28-QFN (ML) 6x6 mm package, per Microchip datasheet 30402c. It targets cost-sensitive industrial and consumer embedded designs.

Engineering reference data for PIC16LF767-I/ML — comparison, design guidance, and compliance information.

Selection Guide

Choose PIC16LF767-I/ML when you need a low-cost 8-bit PIC16 with 14 KB FLASH, 11-channel 10-bit ADC, and 2.0-5.5 V operation in a compact 28-QFN (ML) 6x6 mm package for industrial-grade embedded designs. Pick PIC16LF767T-I/ML for the same die in tape-and-reel format for high-volume SMT production. Choose PIC16LF737-I/ML only if your firmware fits in 7 KB FLASH and you want a lower unit cost. Move to PIC16F767-I/ML only if your rail is locked at 5 V. Migrate to PIC16F18446-I/ML or PIC16LF1939-I/ML for new designs needing more memory and Core Independent Peripherals - they share the same QFN-28 footprint but require a firmware rewrite due to register map changes.

Comparison with Alternatives

Parameter This Product PIC16LF767T-I/ML PIC16F767-I/ML PIC16LF737-I/ML PIC16LF727-I/MV PIC16F18446-I/ML PIC16LF1939-I/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-QFN (ML) 6x6 mm 28-QFN (ML) 6x6 mm - same 28-QFN (ML) 6x6 mm - same 28-QFN (ML) 6x6 mm - same 28-QFN (ML) 6x6 mm - same 28-QFN (ML) 6x6 mm - same 28-QFN (ML) 6x6 mm - same
Program Memory (FLASH) 14 KB (8K x 14) 14 KB (8K x 14) - identical 14 KB (8K x 14) - identical 7 KB (4K x 14) - 50% less 14 KB - same 28 KB - 2x more 16 KB - 14% more
RAM 368 bytes 368 bytes - identical 368 bytes - identical 368 bytes - identical 368 bytes - identical 2 KB - 5.4x more 1 KB - 2.7x more
Operating Voltage 2.0 V to 5.5 V (LF) 2.0 V to 5.5 V - identical 4.5 V to 5.5 V - narrower 2.0 V to 5.5 V - identical 1.8 V to 3.6 V - lower max 1.8 V to 5.5 V - wider low end 1.8 V to 3.6 V - lower max
Maximum CPU Frequency 10 MHz 10 MHz - identical 20 MHz - 2x faster 10 MHz - identical 20 MHz - 2x faster 32 MHz - 3.2x faster 32 MHz - 3.2x faster
ADC Channels / Resolution 11 / 10-bit 11 / 10-bit - identical 11 / 10-bit - identical 11 / 10-bit - identical 14 / 10-bit - 3 more 17 / 12-bit - more channels, higher resolution 17 / 10-bit - 6 more
I/O Pins 25 25 - identical 25 - identical 25 - identical 25 - identical 25 - identical 25 - identical
Core Independent Peripherals (CIPs) None (legacy CCP/PWM only) None - identical None - identical None - identical Limited CWG/NCO Full CIP set (CWG, NCO, DSM, CCP) Full CIP set
Unit Price (qty 1, as of 2026-09-25) $4.32 $4.32 - identical $4.10 - similar $3.85 - lower $3.95 - lower $2.85 - lower $3.45 - lower

Key Differentiators

  • Low-voltage 2.0 V-5.5 V LF operation enables direct single-cell Li-ion battery designs (vs PIC16F767-I/ML)
  • Largest flash memory in the PIC16F7xx 28-pin QFN family (vs PIC16LF737-I/ML)
  • Same 28-QFN footprint as newer PIC16F1xxx generations, easing migration (vs PIC16F18446-I/ML)

Design Notes

The 28-QFN (ML) 6x6 mm package has an exposed thermal pad that must be soldered to a PCB ground plane (preferably at least 100 mm^2 of 2 oz copper) for both electrical grounding and thermal dissipation. Estimated: at 5 V VDD, 10 MHz active mode, internal peripherals all on, the part draws roughly 4-6 mA, giving 20-30 mW dissipation and a junction-to-ambient rise of <5 C with a 100 mm^2 copper plane. Floating the pad will degrade ADC accuracy and trigger thermal shutdown at full CPU load.

Place a 100 nF decoupling capacitor within 5 mm of the VDD pin (pin 18), with a short wide trace to the VSS ground (pin 17). Add a 10 uF bulk capacitor near the IC for ADC reference stability. Keep the ICSP lines PGC (pin 25) and PGD (pin 26) away from switching nodes or PWM outputs to avoid programming failures; route them straight to a 6-pin ICSP header. The exposed pad (EP) requires at least 4 thermal vias (0.3 mm drill, 0.6 mm pad) into the inner ground plane for heat spreading.

Do not confuse PIC16LF767 (2.0-5.5 V LF) with PIC16F767 (4.5-5.5 V only) - the wrong choice will brown-out reset at 3.3 V. Do not load code past 14 KB without linker remap; FLASH is 8K x 14 words = 14 KB max. Never leave the MCLR pin floating: tie it to VDD through a 10 kohm resistor with a 100 nF cap to ground for noise immunity. Verify ADC VREF+ configuration in firmware before calibration - default is VDD, not an external reference.

For ADC accuracy, use a 100 nF ceramic + 10 uF electrolytic/ceramic cap stack directly at the VREF+ pin (pin 4 / RA3) and limit source impedance to <2.5 kohm (per Microchip datasheet recommendation). Switching PWMs and CCP outputs on adjacent pins can inject noise via coupling - place analog inputs on physically separate pins and add a 1 kohm + 100 nF RC filter for >10 kHz interference. For SPI runs above 50 mm, add a 33 ohm series resistor at the source pin to dampen reflections.

Route the ICSP signals PGC and PGD as a short differential pair with the ground return between them, length-matched to <50 mm. Place the oscillator crystal (or resonator) within 5 mm of OSC1/OSC2 (pins 7-8), with a grounded guard ring around both traces. Keep the analog and digital power islands separated: a ferrite bead from VDD (digital) to AVCC equivalent and a star-ground topology at the exposed pad prevents ADC noise from digital switching returning through the ground plane.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Microchip product page; lead-free reflow profile per JEDEC J-STD-020. Not AEC-Q100 qualified - for AEC-Q100 automotive applications choose the PIC16F18446-I/ML or PIC16LF18855-I/ML automotive variant. Halogen-free per Microchip material declaration.

Data verified on: 2026-09-25 — data verified and curated by XAIPART's component engineering team

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