PIC16LF874AT-I/ML - 8-bit PIC MCU, 7KB Flash, 44-QFN | Microchip
MPN: PIC16LF874AT-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $8.95 | $89.50 |
| 100 | $8.1 | $810.00 |
| 500 | $7.4 | $3,700.00 |
| 1,000 | $6.75 | $6,750.00 |
PIC16LF874AT-I/ML Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory, working RAM, data EEPROM, and a rich set of on-chip peripherals such as timers, ADC, communication ports, and I/O. Within the broader semiconductor taxonomy, the PIC16LF874A belongs to the 8-bit microcontroller family, which sits below 16-bit dsPIC and 32-bit Cortex-M devices in performance but above simple discrete logic in integration. The PIC16 architecture is a Harvard RISC design with separate program and data buses, instruction pipelining, and a compact 14-bit instruction word optimized for deterministic real-time control.
Key features include a 10-bit successive-approximation ADC with up to 8 input channels, a USART/SCI module for asynchronous and synchronous serial, an MSSP module supporting both SPI and I2C (master/slave), two 8-bit timers plus one 16-bit timer, a 10 MHz internal oscillator option, an in-circuit serial programming (ICSP) interface for field updates, and an integrated brown-out reset and watchdog timer for safe operation. The wide 2.0 V to 5.5 V supply range (LF low-voltage variant) lets the device run directly from a lithium cell or a regulated 3.3 V/5 V rail.
Architecturally, the device uses a 14-bit wide program-memory word and an 8-bit data path, with hardware stack and interrupt controller supporting up to 14 interrupt sources. In-system programmability via ICSP eliminates the need for a socketed programmer and enables bootloader-style firmware upgrades in deployed equipment. The CMOS process with low-power sleep modes keeps active current low while the integrated peripherals minimize external component count.
Typical applications include industrial sensor interfaces, low-power remote sensing nodes, consumer appliance controls, automotive body electronics sub-modules, battery-powered instruments, USB-to-UART bridges, and general-purpose embedded control for small-to-medium complexity products. The combination of 33 I/O, 7 KB Flash, and on-chip ADC/serial peripherals makes it well suited as a bridge between analog sensors and a host processor.
When designing with this part, plan for ICSP header access (PGD/PGC pins) on the PCB to allow in-circuit firmware updates, place a 100 nF decoupling capacitor within 5 mm of each VDD pin and a bulk 10 uF tantalum or ceramic near the exposed pad, and verify that the chosen development toolchain (MPLAB X IDE with XC8 compiler) supports the exact PIC16LF874A silicon revision installed on the board.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in any single manufacturer datasheet.
Drop-in alternatives for PIC16LF874AT-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF874AT-I/ML (same form factor and footprint) — differing in Package, ADC, MSL Level, Maximum CPU Speed, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F874A-I/ML
✅ Drop-In✓ In Stock
$3.21 / Unit
View Datasheet →PIC16LF874A-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF874AT-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | 8-bit PIC16 enhanced mid-range |
| Program Memory (Flash) | 7 KB (4K x 14) |
| RAM | 192 bytes |
| EEPROM Data Memory | 128 bytes |
| Maximum CPU Speed | 20 MHz (10 MIPS) |
| Supply Voltage (VDD) | 2.0 V to 5.5 V |
| Number of I/O Pins | 33 |
| ADC | 10-bit, up to 8 channels |
| Timers | 2 x 8-bit + 1 x 16-bit |
| Communication Peripherals | USART/SCI, MSSP (SPI / I2C) |
| Package | 44-QFN (8x8 mm) with exposed pad |
| Operating Temperature | -40 C to +85 C (industrial) |
| In-Circuit Programming | ICSP (PGD/PGC) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free / Halogen-Free | Yes |
| MSL Level | 3 |
PIC16LF874AT-I/ML Pin Configuration
| Pin 1 | MCLR/VPP — Master clear reset input or programming voltage input |
| Pin 2 | OSC1/CLKIN — Oscillator input or external clock input |
| Pin 3 | OSC2/CLKOUT — Oscillator output or clock output |
| Pin 4 | RA0/AN0 — PORTA bit 0 / analog input 0 |
| Pin 5 | RA1/AN1 — PORTA bit 1 / analog input 1 |
| Pin 6 | RA2/AN2 — PORTA bit 2 / analog input 2 |
| Pin 7 | RA3/AN3/VREF+ — PORTA bit 3 / analog input 3 / ADC positive reference |
| Pin 8 | RA4/AN4/TOCK1 — PORTA bit 4 / analog input 4 / Timer0 clock |
| Pin 9 | RA5/AN5/SS — PORTA bit 5 / analog input 5 / SPI slave select |
| Pin 10 | VSS — Ground reference |
| Pin 11 | VDD — Positive supply voltage |
| Pin 12 | RB0/INT — PORTB bit 0 / external interrupt |
| Pin 13 | RB1 — PORTB bit 1 |
| Pin 14 | RB2 — PORTB bit 2 |
| Pin 15 | RB3 — PORTB bit 3 |
| Pin 16 | RB4 — PORTB bit 4 |
| Pin 17 | RB5 — PORTB bit 5 |
| Pin 18 | RB6/PGC — PORTB bit 6 / ICSP clock |
| Pin 19 | RB7/PGD — PORTB bit 7 / ICSP data |
| Pin 20 | VSS — Ground reference |
| Pin 21 | VDD — Positive supply voltage |
| Pin 22 | RC0/T1OSO/T1CKI — PORTC bit 0 / Timer1 oscillator output / Timer1 clock |
| Pin 23 | RC1/T1OSI — PORTC bit 1 / Timer1 oscillator input |
| Pin 24 | RC2/CCP1 — PORTC bit 2 / Capture-Compare-PWM 1 |
| Pin 25 | RC3/SCK/SCL — PORTC bit 3 / SPI clock / I2C clock |
| Pin 26 | RC4/SDI/SDA — PORTC bit 4 / SPI data in / I2C data |
| Pin 27 | RC5/SDO — PORTC bit 5 / SPI data out |
| Pin 28 | RC6/TX/CK — PORTC bit 6 / USART transmit / USART clock |
| Pin 29 | RC7/RX/DT — PORTC bit 7 / USART receive / USART data |
| Pin 30 | VSS — Ground reference |
| Pin 31 | VDD — Positive supply voltage |
| Pin 32 | RD0 — PORTD bit 0 |
| Pin 33 | RD1 — PORTD bit 1 |
| Pin 34 | RD2 — PORTD bit 2 |
| Pin 35 | RD3 — PORTD bit 3 |
| Pin 36 | RD4 — PORTD bit 4 |
| Pin 37 | RD5 — PORTD bit 5 |
| Pin 38 | RD6 — PORTD bit 6 |
| Pin 39 | RD7 — PORTD bit 7 |
| Pin 40 | RE0/RD/AN6 — PORTE bit 0 / parallel slave port read / analog input 6 |
| Pin 41 | RE1/WR/AN7 — PORTE bit 1 / parallel slave port write / analog input 7 |
| Pin 42 | RE2/CS — PORTE bit 2 / parallel slave port chip select |
| Pin 43 | VSS — Ground reference |
| Pin 44 | VDD — Positive supply voltage |
Typical Applications
PIC16LF874AT-I/ML is suitable for 6 applications: Industrial Sensor Interface Module, Battery-Powered Remote Sensor Node, Consumer Appliance Control Board, Automotive Body Electronics Sub-Module, USB-to-UART Bridge Dongle, General-Purpose Embedded Control Platform.
Industrial Sensor Interface Module
The PIC16LF874AT-I/ML fits industrial sensor interfaces because its 10-bit ADC with 8 input channels handles analog transducer signals (temperature, pressure, flow) while its 33 I/O drive relays, optocouplers, and indicator LEDs without external bus expanders. The 7 KB Flash accommodates Modbus or proprietary protocols, and the 2.0 V to 5.5 V supply range tolerates long cable drops on 24 V industrial loops after regulation. The exposed-pad QFN provides a low 35 C/W theta-JA thermal path, allowing continuous ADC sampling at 25 C ambient without derating. Place 100 nF ceramic decoupling within 5 mm of each VDD pin and a 10 uF bulk capacitor on the exposed pad for noise-sensitive RTD measurements.
Recommended
Battery-Powered Remote Sensor Node
The PIC16LF874AT-I/ML suits battery-powered remote nodes because it operates down to 2.0 V from a single lithium cell, supports low-power sleep modes that drop quiescent current below 1 uA, and integrates a 10-bit ADC plus USART and I2C peripherals that eliminate external ADC and bus-driver chips. Its 7 KB Flash fits typical BLE beacon or LoRa driver stacks when paired with a host radio module. The 44-QFN exposed-pad package maximizes PCB real estate for the sensor and antenna, and the ICSP interface allows field firmware updates without opening the enclosure. Engineers should benchmark sleep current against the datasheet typical values and add a load switch on the radio rail for deep-sleep modes.
Recommended
Consumer Appliance Control Board
The PIC16LF874AT-I/ML powers consumer appliance controls (washing machines, microwave ovens, dishwasher HMIs) because its 33 I/O drive seven-segment displays, keypads, buzzer, and triac optocouplers while the 7 KB Flash stores menu state machines and fault logs in 128 B EEPROM. The wide 2.0 V to 5.5 V range tolerates rectified mains after regulation, and the -40 C to +85 C industrial temperature grade survives kitchen and laundry environments. The exposed-pad QFN ground plane doubles as a heatsink for triac-driving I/O switching up to 20 mA per pin. Use the MSSP in SPI mode to talk to an external EEPROM for extended logging and the USART for diagnostic debug output.
Recommended
Automotive Body Electronics Sub-Module
The PIC16LF874AT-I/ML serves automotive body electronics (mirror controllers, seat adjusters, climate-panel slaves) when the design does not require AEC-Q100 qualification, because its 33 I/O drive LED backlights, rotary encoders, and LIN-bus transceivers while the 7 KB Flash holds LIN slave stack and PWM profiles. The exposed-pad 44-QFN fits behind dashboard plastic with minimal footprint, and the -40 C to +85 C industrial grade covers cabin temperatures. For designs that DO require AEC-Q100, the PIC16LF874AT-I/ML is not qualified; migrate to the automotive-graded PIC16F874A-E/ML or PIC18 family instead, and verify ESD and load-dump compliance with external TVS protection.
Recommended
USB-to-UART Bridge Dongle
The PIC16LF874AT-I/ML functions as a USB-to-UART bridge when paired with a USB-serial chip like MCP2200 or FT232, because its USART module delivers full-duplex asynchronous serial up to 115200 baud while the 33 I/O drive flow-control RTS/CTS handshakes and status LEDs. Its 7 KB Flash holds CDC-IACM protocol glue code, and the 192 B SRAM buffers incoming packets without overrun at typical 9600 baud target devices. The 44-QFN exposed-pad package allows a compact dongle form factor, and ICSP on RB6/RB7 enables factory firmware updates before shipment. Designers should isolate the USB 5 V rail with a ferrite bead to keep conducted noise out of the analog reference.
Recommended
General-Purpose Embedded Control Platform
The PIC16LF874AT-I/ML acts as a general-purpose embedded control platform for small-to-medium complexity products (HVAC zone controllers, smart-lighting masters, fitness equipment), because its 8-bit PIC16 core with 10 MIPS handles button debouncing, PWM dimming, fan speed loops, and serial command parsing on a single chip. The 33 I/O accommodate multiple SPI/I2C peripherals plus discrete sensors without bus multiplexing, and the 128 B EEPROM stores user preferences that survive power cycles. The exposed-pad QFN gives a 35 C/W thermal path, and the wide 2.0 V to 5.5 V supply range simplifies power-tree design when the product ships in both 3.3 V and 5 V variants. Use MPLAB X IDE with XC8 compiler and an ICD 3 or PICKit 4 programmer for development.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF874AT-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F874A-I/ML | PIC16LF874A-I/ML | PIC16LF874AT-I/L |
|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) exposed pad | 44-QFN (8x8) exposed pad - same | 44-QFN (8x8) exposed pad - same | 44-PLCC - different |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Minimum VDD | 2.0 V (LF variant) | 4.0 V (F variant, +2.0 V difference) | 2.0 V (LF, identical) | 2.0 V (LF, identical) |
| Program Memory (Flash) | 7 KB (4K x 14) | 7 KB (same) | 7 KB (same) | 7 KB (same) |
| RAM | 192 bytes | 192 bytes (same) | 192 bytes (same) | 192 bytes (same) |
| EEPROM | 128 bytes | 128 bytes (same) | 128 bytes (same) | 128 bytes (same) |
| I/O Pins | 33 | 33 (same) | 33 (same) | 33 (same) |
| Maximum Clock | 20 MHz / 10 MIPS | 20 MHz (same) | 20 MHz (same) | 20 MHz (same) |
| Operating Temperature | -40 C to +85 C (industrial) | -40 C to +85 C (same) | -40 C to +85 C (same) | -40 C to +85 C (same) |
| ADC Resolution | 10-bit, 8 channels | 10-bit, 8 channels (same) | 10-bit, 8 channels (same) | 10-bit, 8 channels (same) |
Key Differentiators
- Low-voltage LF variant supports 2.0 V single-cell lithium operation (vs PIC16F874A-I/ML)
- Exposed-pad 44-QFN package reduces PCB footprint versus 44-QFP (vs PIC16F877A-I/PT)
- 33 I/O plus on-chip 10-bit ADC and USART/MSSP eliminate external peripherals (vs PIC16LF872-I/SS)
Design Notes
Place a 100 nF ceramic decoupling capacitor within 5 mm of each VDD pin (4 VDD pins on the 44-QFN) and a single 10 uF bulk tantalum or ceramic capacitor on the exposed thermal pad, which must be soldered to a continuous ground plane for both electrical grounding and thermal dissipation. Keep ADC analog traces (RA0-RA5, RE0-RE1) away from digital switching lines (PORTD, oscillator) to preserve 10-bit ADC accuracy. Maintain a 4-layer stack-up with a dedicated ground plane for best EMI performance on USART and SPI routes.
Do not omit the ICSP header on pins RB6/PGC and RB7/PGD - this prevents in-circuit firmware updates and forces expensive socketed programming in production. Use a 2x3 0.1 inch header with the standard Microchip ICSP pinout (1=MCLR, 2=VDD, 3=VSS, 4=PGD, 5=PGC, 6=NC). Confirm the LF low-voltage variant (2.0 V minimum) vs standard F (4.0 V minimum) when sourcing: substituting the F variant into a 3.3 V design will cause erratic brown-out-reset behavior at low battery states.
Add a 10 kohm pull-up on MCLR to VDD and a 100 nF cap on MCLR to ground for proper reset behavior; missing the cap causes spurious resets in noisy environments. For battery-powered designs, switch the radio and sensor rails through PNP transistors or load switches controlled by a spare PORTB I/O, and verify sleep current against the datasheet typical of 1 uA or less; supply the MCU from an MCP1700 or similar low-Iq LDO rather than a switching converter that injects noise into the analog reference.
Estimated: at ambient 25 C with continuous 20 MHz operation and all 33 I/O driving 5 mA loads, the die dissipates approximately 0.25 W, giving a 9 C junction rise above ambient on the exposed-pad QFN with a properly soldered thermal pad. The exposed pad MUST be soldered to a 0.5 square inch or larger copper pour on the top or bottom layer to achieve the datasheet 35 C/W theta-JA; without this, theta-JA can exceed 100 C/W and the part may throttle in enclosed industrial enclosures at 85 C ambient.
Compliance Information
RoHS and REACH compliant per Microchip product page; LF designation denotes 2.0 V low-voltage operation; part is NOT AEC-Q100 qualified - choose AEC-Q100 grade for automotive applications.