PIC18F25K83-I/SP - 64MHz 8-bit MCU 32KB Flash CAN 28-SPDIP
MPN: PIC18F25K83-I/SP ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.35 | $335.00 |
| 500 | $2.85 | $1,425.00 |
| 1,000 | $2.45 | $2,450.00 |
PIC18F25K83-I/SP Overview
A microcontroller (MCU) is an integrated circuit containing a CPU, program memory (Flash/ROM), working memory (RAM), and configurable peripherals such as timers, ADC, communication interfaces (UART/SPI/I²C), and I/O pins on a single silicon die. Within the embedded system hierarchy, an MCU sits below an MPU (microprocessor) by integrating memory and I/O on-chip, and is a subset of the broader microcontroller > microprocessor > system-on-chip (SoC) family of semiconductor devices. The 8-bit PIC18 family uses a RISC Harvard architecture and is part of Microchip's eXtreme Low Power (XLP) line.
Key features of the PIC18F25K83 include: 32KB (16K x 16) self-programmable Flash with 10K Erase/Write cycles endurance, 2KB SRAM, 1KB data EEPROM, a 12-bit ADC with Computation (ADC²) supporting up to 100K samples/sec, a 10-bit DAC module, five CCP/ECCP modules, multiple 16-bit timers, two USART, two SPI, two I²C, one CAN FD module, and 25 I/O pins. The device supports an operating voltage range of 2.3V to 5.5V (PIC18LF25K83) or 3.0V to 5.5V (PIC18F25K83), with XLP sleep currents under 50 nA typical.
The PIC18F25K83 architecture combines a RISC CPU with up to 64 MHz operation, hardware-accelerated CIP blocks (CLC, NCO, 16-bit PWM, DMA), and a deterministic interrupt controller. The integrated CAN 2.0B interface enables robust in-vehicle networking, while ADC² with averaging and oversampling delivers 14-bit effective resolution for precision sensor reading. This level of integration eliminates many external components, reducing PCB area and BOM cost for connected sensor nodes.
Typical applications include automotive body and comfort modules (CAN nodes), industrial sensor hubs, capacitive touch human-machine interfaces (HMIs), building automation controllers, low-power IoT edge nodes, and brushless DC motor drive controllers. The 28-SPDIP package supports easy through-hole prototyping and breadboard-compatible development.
When designing with this part, ensure decoupling capacitors (100 nF and 1 µF minimum) are placed within 5 mm of the VDD pins, and that the MCLR pin is pulled high through a 10 kΩ resistor for normal operation. The CAN bus requires an external transceiver (such as MCP2551 or ATA6560) for physical-layer signaling.
This page synthesizes distributor pricing for PIC18F25K83-I/SP, drop-in SPDIP alternatives from the same PIC18 K83/K80 family and cross-brand equivalents from verified web data, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for PIC18F25K83-I/SP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F25K83-I/SP (same form factor and footprint) — differing in ADC, Package, DAC, Timers, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F25K83T-I/SP
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F25K83-E/SP
✅ Drop-In✓ In Stock
$1.85 / Unit
View Datasheet →PIC18F26K83-I/SP
✅ Drop-In✓ In Stock
$2.18 / Unit
View Datasheet →PIC18F25K80-I/SP
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F25K42-I/SP
✅ Drop-In✓ In Stock
$2.51 / Unit
View Datasheet →PIC18F25K40-I/SP
✅ Drop-In✓ In Stock
$1.85 / Unit
View Datasheet →PIC18F25K50-I/SP
✅ Drop-In📋 Reference alternative (not in catalog)
AT90CAN32-PU
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F25K83-I/SP Maximum Ratings & Electrical Characteristics
| Product Type | 8-bit Microcontroller (MCU) |
| Series | PIC® XLP™ 18K, Functional Safety (FuSa) |
| Core | PIC18 RISC |
| Program Memory Size | 32 KB (16K x 16) Flash |
| RAM Size | 2 KB |
| EEPROM Size | 1 KB |
| Maximum CPU Frequency | 64 MHz |
| Supply Voltage Range | 3.0 V to 5.5 V |
| Number of I/O Pins | 25 |
| ADC | 12-bit ADC² with Computation, up to 100 ksps |
| DAC | 1 x 10-bit |
| Communication Interfaces | 2x USART, 2x SPI, 2x I²C, 1x CAN 2.0B |
| Timers | Multiple 8-bit and 16-bit timers |
| CCP/ECCP Modules | 5 |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Package | 28-pin SPDIP (SP) |
| Mounting Type | Through-Hole |
| MSL Level | 1 (unlimited) |
| RoHS Status | Compliant |
PIC18F25K83-I/SP Pin Configuration
| Pin 1 | RA3/AN3/C1IN+/C2IN+/VREF+ — I/O / Analog input / Comparator input / Voltage reference positive |
| Pin 2 | RA4/AN4/C1OUT/T0CKI — I/O / Analog input / Comparator output / Timer0 clock input |
| Pin 3 | RA5/AN5/C2OUT — I/O / Analog input / Comparator output |
| Pin 4 | RA6/OSC2/CLKOUT — I/O / Oscillator output / Clock output |
| Pin 5 | RA7/OSC1/CLKIN — I/O / Oscillator input / External clock input |
| Pin 6 | VDD — Positive power supply |
| Pin 7 | VSS — Ground reference |
| Pin 8 | RB0/INT0/AN12 — I/O / External interrupt 0 / Analog input |
| Pin 9 | RB1/INT1/AN10 — I/O / External interrupt 1 / Analog input |
| Pin 10 | RB2/INT2/AN8 — I/O / External interrupt 2 / Analog input |
| Pin 11 | RB3/INT3/CCP2/AN9 — I/O / External interrupt 3 / CCP2 / Analog input |
| Pin 12 | RB4/CCP3/KBI0/AN11 — I/O / CCP3 / Keyboard interrupt / Analog input |
| Pin 13 | RB5/CCP4/KBI1/AN13 — I/O / CCP4 / Keyboard interrupt / Analog input |
| Pin 14 | RB6/PGC/KBI2 — I/O / ICSP clock / Keyboard interrupt |
| Pin 15 | RB7/PGD/KBI3 — I/O / ICSP data / Keyboard interrupt |
| Pin 16 | RC0/SOSCO/T1CKI — I/O / Secondary oscillator output / Timer1 clock input |
| Pin 17 | RC1/SOSCI — I/O / Secondary oscillator input |
| Pin 18 | RC2/CCP1/AN14 — I/O / CCP1 / Analog input |
| Pin 19 | RC3/CCP2/SCL — I/O / CCP2 / I²C clock |
| Pin 20 | RC4/SDA — I/O / I²C data |
| Pin 21 | RC5/CANTX — I/O / CAN bus transmit |
| Pin 22 | RC6/CANRX/TX/CK — I/O / CAN bus receive / USART TX/CK |
| Pin 23 | RC7/RX/DT — I/O / USART RX/DT |
| Pin 24 | RE3/MCLR — Input only / Master Clear (reset) |
| Pin 25 | RD0/AN16/CCP5 — I/O / Analog input / CCP5 |
| Pin 26 | RD1/AN17/CCP6 — I/O / Analog input / CCP6 |
| Pin 27 | RD2/AN18/CCP7 — I/O / Analog input / CCP7 |
| Pin 28 | RD3/AN19/CCP8 — I/O / Analog input / CCP8 |
Typical Applications
PIC18F25K83-I/SP is suitable for 7 applications: Automotive CAN Body & Comfort Modules, Capacitive Touch HMI Panels, Industrial Sensor Hubs & PLCs, Building Automation Controllers, Low-Power IoT Edge Nodes, Brushless DC Motor Drive Controllers, Functional Safety (FuSa) Subsystems.
Automotive CAN Body & Comfort Modules
The PIC18F25K83-I/SP's integrated CAN 2.0B controller, 32 KB Flash, and -40C to +85C industrial temperature range make it ideal for automotive body and comfort nodes such as door modules, seat controllers, mirror adjusters, and lighting ECUs. Its hardware acceptance filters offload the CPU, allowing deterministic message handling under bus load while running application logic. The 12-bit ADC² with averaging and oversampling reads sensors like thermistors, hall-effect switches, and potentiometers at up to 100 ksps. Pair the MCU with the MCP2562 CAN transceiver for a complete in-vehicle network node that handles 125-500 kbps CAN traffic reliably. Compared to a discrete CAN solution, this part eliminates an external CAN controller, reducing BOM cost and PCB area by ~30% in compact body modules.
Recommended
Capacitive Touch HMI Panels
The PIC18F25K83-I/SP integrates Microchip's ADC² (ADC with Computation) module, which automates Capacitive Voltage Divider (CVD) techniques for robust touch sensing. This allows engineers to implement up to 12-15 touch buttons or a small slider/wheel on a glass or PCB overlay without an external touch controller IC. The 16 MHz instruction cycle at 64 MHz FOSC enables real-time touch response under 20 ms. Combined with CLC (Configurable Logic Cell) for hardware debouncing and NCO (Numerically Controlled Oscillator) for LED/PWM dimming, the MCU can drive an entire touch-and-display HMI on a single chip. The 28-SPDIP package fits standard through-hole prototyping boards used in lab HMI development.
Recommended
Industrial Sensor Hubs & PLCs
The PIC18F25K83-I/SP serves as a low-cost sensor aggregation node in industrial PLC and SCADA networks. Its 12-bit ADC² with 100 ksps throughput reads multiple 4-20 mA, 0-10 V, RTD, and thermocouple inputs through external signal conditioning, while the 32 KB Flash hosts Modbus RTU over RS-485 (via USART) or CANopen over CAN. The XLP technology with sleep currents under 50 nA typical makes it suitable for battery-backed remote sensors that must run for years on a single battery. The 25 I/O pins support keypad, LCD, and relay outputs in a compact PLC brick. Compared to a 32-bit ARM Cortex-M0+ solution, the PIC18F25K83 offers comparable peripheral integration at lower unit cost for 8-bit applications.
Recommended
Building Automation Controllers
The PIC18F25K83-I/SP is well suited for building automation nodes including HVAC damper actuators, lighting ballast controllers, and BACnet MS-TP or Modbus over RS-485 field devices. Its low sleep current (< 50 nA typical) supports battery-backed wireless sensors and PoE-powered wall switches. The 2 KB SRAM can buffer 50-100 BACnet/Modbus frames before forwarding, while the 32 KB Flash hosts full BACnet MS-TP or Modbus stack implementations. The 28-SPDIP footprint suits through-hole wiring harnesses common in commercial building panels. Combined with the AT86RF233 2.4 GHz transceiver, it can act as a wireless sensor node in retrofit smart-building deployments.
Recommended
Low-Power IoT Edge Nodes
The PIC18F25K83-I/SP belongs to Microchip's eXtreme Low Power (XLP) family with sleep currents under 50 nA typical and active currents under 1 mA/MHz, making it ideal for battery-powered IoT edge devices. Combined with the AT86RF233 2.4 GHz IEEE 802.15.4 transceiver or RN2483 LoRa module, it can form complete wireless sensor nodes lasting 5-10 years on two AA batteries. The Core Independent Peripherals (CLC, NCO, DMA) handle sensor sampling and radio packet assembly without waking the CPU, maximizing battery life. The 25 I/O pins support I²C/SPI sensors (temperature, humidity, accelerometer), UART for GPS modules, and GPIOs for relay control.
Recommended
Brushless DC Motor Drive Controllers
The PIC18F25K83-I/SP's five CCP/ECCP modules and 16-bit PWM capability make it suitable for sensorless and sensored BLDC motor drive control in small appliances, fans, and pumps. The 16 MIPS throughput at 64 MHz FOSC runs sensorless back-EMF zero-crossing algorithms at > 30 kHz PWM, sufficient for motors up to ~500 W. The 12-bit ADC² samples motor current via shunt resistor for torque control and overcurrent protection. The integrated CAN peripheral enables networked motor drives in industrial multi-axis systems. Pair with the DRV8313 three-phase gate driver for a complete low-voltage BLDC drive module, eliminating the need for a discrete DSP or 32-bit MCU.
Recommended
Functional Safety (FuSa) Subsystems
The PIC18F25K83 family includes Functional Safety (FuSa) hardware features such as a windowed watchdog timer (WWDT), code protection, and self-test BIST libraries that help designers meet IEC 60730 / IEC 61508 SIL-class safety requirements for home appliances and industrial equipment. The 32 KB Flash can host the Class B safety library alongside application code, with hardware CRC for memory integrity checks. The 28-SPDIP package is preferred for through-hole safety-certified designs where SOIC leads may be more susceptible to vibration-induced cracks. Combined with redundant sensors and external watchdog supervisors, this part forms the brain of washing machines, dishwashers, and oven controllers requiring safety certification.
Recommended
Recommended Products Summary
Engineering reference data for PIC18F25K83-I/SP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F25K83T-I/SP | PIC18F25K83-E/SP | PIC18F26K83-I/SP | PIC18F25K80-I/SP | PIC18F25K42-I/SP |
|---|---|---|---|---|---|---|
| Package | 28-SPDIP (SP) | 28-SPDIP (SP) - same | 28-SPDIP (SP) - same | 28-SPDIP (SP) - same | 28-SPDIP (SP) - same | 28-SPDIP (SP) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Size | 32 KB | 32 KB | 32 KB | 64 KB | 32 KB | 32 KB |
| RAM Size | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Maximum CPU Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| CAN Peripheral | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | No (USB instead) | No |
| ADC Type | 12-bit ADC² with Computation | 12-bit ADC² | 12-bit ADC² | 12-bit ADC² | 10-bit ADC | 12-bit ADC |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Unit Price (qty 1, USD) | 4.20 | 4.10 | 4.50 | 5.00 | 4.30 | 3.40 |
Key Differentiators
- Integrated CAN 2.0B peripheral with hardware acceptance filters (vs PIC18F25K80-I/SP)
- 12-bit ADC² with Computation for hardware-offloaded signal processing (vs PIC18F25K80-I/SP)
- XLP (eXtreme Low Power) sleep current <50 nA typical (vs PIC18F26K83-I/SP)
- Core Independent Peripherals (CIPs): CLC, NCO, DMA, hardware CRC (vs PIC18F25K42-I/SP)
Design Notes
Place a 100 nF low-ESR ceramic decoupling capacitor within 5 mm of each VDD pin (pin 6) and a bulk 1 uF to 10 uF capacitor on the VDD rail. Add a 10 kΩ pull-up resistor on the MCLR pin (pin 24) to VDD for normal operation; failure to do so will cause the MCU to remain in reset. Estimated: total quiescent current draw with no load is approximately 5-8 mA active at 64 MHz, dropping to <50 nA in sleep mode (XLP technology). For battery-backed designs, route the MCP1700-3302 LDO with its own bulk capacitor to minimize voltage drop during radio transmissions.
When using the internal CAN peripheral, route the CANTX (pin 21) and CANRX (pin 22) traces as a differential pair to the MCP2562 transceiver, keeping trace length under 25 mm to minimize EMI susceptibility. Place the transceiver within 10 mm of the MCU. Add a 60-ohm split termination (two 60-ohm resistors and a 10 nF capacitor) at the bus ends. The 28-SPDIP package is forgiving for hand-wired prototypes, but production designs should use the SOIC variant (-SO) for SMT compatibility and vibration tolerance.
Do not exceed 5.5 V on VDD - the F-variant is not 3.3 V low-voltage compatible (use PIC18LF25K83 for 2.3V-5.5V operation). Always configure the MCLR as a digital input with internal pull-up disabled if not used for reset, otherwise high-voltage ICSP programming will fail. When migrating from PIC18F25K80 firmware, note the K83 uses ADC² (12-bit with Computation) instead of the 10-bit ADC - register definitions and trigger sources differ. Estimate: firmware porting time from K80 to K83 is typically 1-2 weeks for a mid-complexity application.
At maximum CPU frequency of 64 MHz with full peripheral activity, the 28-SPDIP package dissipates approximately 200-300 mW of power - well within the 1 W package limit. Estimated junction temperature rise at 25 C ambient is ~25 C, putting Tj at 50 C (well below the 150 C maximum). No heatsink is required. For high-temperature applications approaching the 85 C industrial limit, ensure adequate ventilation around the SPDIP package; the plastic body limits heat conduction compared to exposed-pad QFN variants.
Compliance Information
RoHS compliant per Microchip product page. -I/SP is industrial temperature grade (-40C to +85C), not AEC-Q100 qualified. For AEC-Q100 automotive applications, use the -E/VAO or -VAO suffix variants. Lead-free per Microchip Pb-free symbol on datasheet cover page.
