PIC18LF2320-I/SP - 8KB Flash 8-bit MCU, 25 I/O, 28-SPDIP | Microchip
MPN: PIC18LF2320-I/SP ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.62 | $7.62 |
| 10 | $6.84 | $68.40 |
| 100 | $5.95 | $595.00 |
| 500 | $5.32 | $2,660.00 |
| 1,000 | $4.78 | $4,780.00 |
PIC18LF2320-I/SP Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory, volatile data memory, peripherals and I/O. The PIC18 family sits in Microchip's 8-bit portfolio above the baseline PIC10/12/16 families: it adds a 16-bit instruction word, hardware multiplier, linear memory model, and prioritized interrupts, giving it higher throughput for embedded control than simpler 8-bit parts while retaining byte-level simplicity. Within that family the PIC18F2320 is the 28-pin shrink of the PIC18F4520/4320/4220 group, with nanoWatt Technology for managed power consumption.
Key features include an integrated 10-bit ADC with up to 10 channels, a USART with LIN support, an MSSP module for SPI and I2C (master/slave), one 8-bit and three 16-bit timers, a CCP (Capture/Compare/PWM) module, and nanoWart power management with idle and sleep modes drawing microamp currents. The 25 digital I/O pins drive 25 mA source/sink each, sufficient for LEDs, relays, and small logic loads.
Typical applications include industrial sensor interfaces, low-power remote controls, LIN/J2602 automotive body nodes, appliance control boards, and small automation subsystems. The LF voltage range (2.0V to 5.5V) and nanoWatt sleep (< 1 uA typical) make it attractive for battery-powered or energy-harvesting designs that previously required a separate RTC.
When designing with this part, place 0.1 uF decoupling within 5 mm of each power pin and tie unused I/O to defined logic levels. In-circuit serial programming (ICSP) uses dedicated RB6/RB7 pins; routing these out to a 5-pin header simplifies production programming.
This page synthesizes current distributor pricing, verified drop-in alternatives in the same 28-SPDIP footprint, and practical design notes not collected in the datasheet alone.
Drop-in alternatives for PIC18LF2320-I/SP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18LF2320-I/SP (same form factor and footprint) — differing in Core Architecture, Package, Timers, ADC, Communication.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18LF2220-I/SP
✅ Drop-In✓ In Stock
$2.18 / Unit
View Datasheet →PIC18LF2321-I/SP
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18LF2320-I/SO
✅ Drop-In✓ In Stock
$3.31 / Unit
View Datasheet →PIC18F2320-I/SP
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F2320-I/SO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18LF2320-I/SP Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC18 (8-bit, 16-bit instruction word) |
| Program Memory (Flash) | 8 KB (4K x 16) |
| Data SRAM | 512 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 40 MHz (10 MIPS) |
| Supply Voltage Range | 2.0 V to 5.5 V |
| ADC | 10-bit, up to 10 channels |
| Digital I/O Pins | 25 |
| I/O Source/Sink Current | 25 mA per pin |
| Timers | 1 x 8-bit, 3 x 16-bit |
| Capture/Compare/PWM (CCP) | 1 module |
| Communication | 1 x USART (LIN), 1 x MSSP (SPI/I2C) |
| Operating Temperature Range | -40 C to +85 C (Industrial) |
| Package | 28-pin SPDIP (SP) |
| Mounting Type | Through-Hole |
| MSL Level | 1 (unlimited) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
PIC18LF2320-I/SP Pin Configuration
| Pin 1 | /MCLR — Master clear / reset input, programming voltage input (active-low) |
| Pin 2 | RA0/AN0 — Digital I/O or analog input channel 0 |
| Pin 3 | RA1/AN1 — Digital I/O or analog input channel 1 |
| Pin 4 | RA2/AN2/VREF- — Digital I/O, analog input channel 2, or ADC negative voltage reference |
| Pin 5 | RA3/AN3/VREF+ — Digital I/O, analog input channel 3, or ADC positive voltage reference |
| Pin 6 | RA4/T0CKI — Digital I/O (open-drain) or Timer0 clock input |
| Pin 7 | RA5/AN4 — Digital I/O or analog input channel 4 |
| Pin 8 | VSS — Ground reference |
| Pin 9 | OSC1/CLKIN — Crystal/ceramic resonator input or external clock in |
| Pin 10 | OSC2/CLKOUT — Crystal/ceramic resonator output or clock out |
| Pin 11 | RC0/T1OSO/T1CKI — Digital I/O, Timer1 oscillator output, or Timer1 external clock input |
| Pin 12 | RC1/T1OSI/CCP2 — Digital I/O, Timer1 oscillator input, or CCP2 capture/compare/PWM |
| Pin 13 | RC2/CCP1 — Digital I/O or CCP1 capture/compare/PWM |
| Pin 14 | RC3 — Digital I/O (also SDO/MSSP) |
| Pin 15 | RC4 — Digital I/O (also SDI/MSSP) |
| Pin 16 | RC5 — Digital I/O (also SCK/MSSP) |
| Pin 17 | RC6 — Digital I/O or USART TX |
| Pin 18 | RC7 — Digital I/O or USART RX |
| Pin 19 | VSS — Ground reference |
| Pin 20 | VDD — Positive supply input |
| Pin 21 | RB0/INT0 — Digital I/O or external interrupt 0 |
| Pin 22 | RB1/INT1 — Digital I/O or external interrupt 1 |
| Pin 23 | RB2/INT2 — Digital I/O or external interrupt 2 |
| Pin 24 | RB3/INT3 — Digital I/O or external interrupt 3 / CCP2 source |
| Pin 25 | RB4 — Digital I/O with interrupt-on-change |
| Pin 26 | RB5/PGM — Digital I/O with interrupt-on-change / LVP programming |
| Pin 27 | RB6/PGC — Digital I/O with interrupt-on-change / ICSP clock |
| Pin 28 | RB7/PGD — Digital I/O with interrupt-on-change / ICSP data |
Typical Applications
PIC18LF2320-I/SP is suitable for 6 applications: Battery-Powered Sensor Hubs, LIN Automotive Body Nodes, Industrial Sensor Interfaces, Consumer Appliance Control Boards, Educational and Maker Boards, HVAC and Building Automation.
Battery-Powered Sensor Hubs
The PIC18LF2320-I/SP fits battery-powered sensor hubs because the LF silicon supports 2.0-5.5 V operation, allowing direct connection to a single Li-ion cell (3.0-4.2 V) or 2x AA without a 3.3 V LDO. Combined with nanoWatt sleep currents below 1 uA and a 25 mA capable I/O bus, the part can sleep most of the time and wake on RB0 external interrupts or Timer1 ticks. In this role the part integrates analog acquisition (10-bit ADC up to 10 channels), UART bridge to a host MCU, and the timing budget for periodic sampling that would otherwise need a separate RTC. Trade-off: at 10 MIPS the part cannot crunch heavy DSP, so filter preprocessing should remain light.
Recommended
LIN Automotive Body Nodes
The PIC18LF2320-I/SP is well suited to LIN body and chassis nodes such as mirror controllers, seat adjusters, HVAC flaps, and ambient lighting modules. The integrated USART supports LIN master/slave with auto-baud-detect, while the nanoWatt sleep current (sub-1 uA) and bus-wake-on-activity enable the node to sit idle for days without draining the battery. The 28-SPDIP footprint also suits through-hole manufacturing common in automotive harness electronics. Trade-off: this part is not AEC-Q100 qualified; for ISO 26262 functional-safety or AEC-Q100 requirements, a PIC18 K-series or dsPIC33 part should be specified.
Recommended
Industrial Sensor Interfaces
In industrial sensor interface boards the PIC18LF2320-I/SP acts as a 4-20 mA loop interface, RTD/thermocouple digitiser, or digital-input multiplexer-front-end controller. The 10-bit ADC with up to 10 channels handles multi-sensor fan-out, while the MSSP provides SPI access to digital temperature ICs or I2C EEPROM for parameter storage. The wide -40 to +85 C industrial temperature range ensures reliable operation in cabinets and factory floors. Trade-off: for higher-accuracy (16-bit) measurement tasks a 24-bit ADC companion (such as MCP3911) and a higher-end PIC18 K-series host are recommended.
Recommended
Consumer Appliance Control Boards
The PIC18LF2320-I/SP is widely deployed in consumer appliance main boards (washing machines, microwave ovens, dishwashers) where it pairs the low system cost of an 8-bit MCU with the performance of 10 MIPS, enough to drive triac-based AC phase control, sense multiple pushbuttons via scan-matrix, and run small statemachine firmware. The 25 mA I/O drive handles LED indicators and small relay coils directly without external buffers. Trade-off: safety-critical appliance logic should pair this MCU with hardware interlocks - software-only control is not sufficient for IEC 60730 requirements.
Recommended
Educational and Maker Boards
The PIC18LF2320-I/SP is a popular training MCU because the 28-SPDIP package fits standard 600-mil DIP sockets and breadboards, removing soldering as a hurdle for students. With 8 KB Flash, 77 single-word instructions, and the free MPLAB X + XC8 toolchain, beginners can load complete tutorials (blinking LED, ADC reading, UART echo) within minutes. The ICSP programming pins (RB6/RB7) on a 5-pin header simplify production and lab re-flashing. Trade-off: for advanced courses requiring DMA or hardware design training, a PIC32MX or STM32 part gives more headroom.
Recommended
HVAC and Building Automation
The PIC18LF2320-I/SP fits HVAC and building automation subsystems (thermostats, damper controllers, remote sensor nodes) because it integrates a 10-bit ADC plus multiple serial interfaces on a single 28-SPDIP die, allowing designers to handle analog temperature/humidity sensors and Modbus/Modbus-ASCII communication simultaneously. Idle currents under 1 uA make it suitable for battery or energy-harvesting thermostats. Trade-off: this part lacks native Ethernet MAC, so any node needing IP connectivity should pair it with a serial-to-Ethernet bridge like the ENC28J60.
Recommended
Recommended Products Summary
Engineering reference data for PIC18LF2320-I/SP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18LF2220-I/SP | PIC18LF2321-I/SP | PIC18LF2320-I/SO | PIC18F2320-I/SP | PIC18F2320-I/SO |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SPDIP (through-hole) | 28-SPDIP (through-hole) - same | 28-SPDIP (through-hole) - same | SOIC-28 (SMT) - same die | 28-SPDIP (through-hole) - same | SOIC-28 (SMT) - same die |
| Flash Memory | 8 KB | 4 KB (-50%) | 16 KB (+100%) | 8 KB (same) | 8 KB (same) | 8 KB (same) |
| SRAM | 512 B | 512 B | 512 B | 512 B | 512 B | 512 B |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Supply Voltage Range | 2.0 V to 5.5 V (LF) | 2.0 V to 5.5 V (LF) - same | 2.0 V to 5.5 V (LF) - same | 2.0 V to 5.5 V (LF) - same | 4.2 V to 5.5 V (F) - narrow range | 4.2 V to 5.5 V (F) - narrow range |
| Maximum CPU Speed | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS |
| Temperature Range | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| Mounting Type | Through-Hole (SPDIP) | Through-Hole (SPDIP) | Through-Hole (SPDIP) | Surface Mount (SOIC-28) | Through-Hole (SPDIP) | Surface Mount (SOIC-28) |
| USART / LIN | Yes (LIN 1.3 with auto-baud) | Yes (LIN 1.3 with auto-baud) | Yes (LIN 1.3 with auto-baud) | Yes (LIN 1.3 with auto-baud) | Yes (LIN 1.3 with auto-baud) | Yes (LIN 1.3 with auto-baud) |
Key Differentiators
- Wide 2.0-5.5 V supply range allowing direct Li-ion operation (vs PIC18F2320-I/SP)
- Larger 8 KB Flash for richer firmware stacks (vs PIC18LF2220-I/SP)
- Drop-in upscaling to 16 KB Flash when code grows (vs PIC18LF2321-I/SP)
- Through-hole SPDIP footprint for breadboarding and lab prototyping (vs PIC18LF2320-I/SO)
Design Notes
Place a 0.1 uF decoupling capacitor within 5 mm of each VDD/VSS pin pair of the PIC18LF2320-I/SP. For noisy environments (motor or relay drives on the same PCB) add a 10 uF tantalum or ceramic bulk capacitor near the device. The LF silicon allows direct operation down to 2.0 V, but at very low VDD the oscillator's maximum frequency drops - consult the datasheet's oscillator vs VDD chart before choosing 40 MHz at 2.5 V.
Do not leave any unused I/O on the PIC18LF2320-I/SP floating; configure as outputs or tie via 10 kohm to a known level to avoid unwanted interrupt-on-change wake-ups and excess quiescent current. The /MCLR pin must be tied to VDD via 10 kohm (or lower for noisy rails) for normal reset operation, and never left floating on power-up. For in-circuit serial programming always provide a 5-pin ICSP header connected to /MCLR, VDD, VSS, PGC (RB6), and PGD (RB7).
Route the 28-SPDIP board footprint with 100-mil pads on 600-mil row spacing to match standard DIP sockets; long signal traces should be kept above the analog section with separate analog (AVDD/AVSS) bypass caps if the 28-SPDIP variant is being used without AVDD pins (note: 28-SPDIP has only one VDD/VSS pair, so analog and digital supplies share the rail). Keep high-current switching nodes (LED/relay drivers) at least 5 mm away from the analog pins (RA0-RA5) to avoid ADC noise injection.
For designs where the PIC18LF2320-I/SP drives an MSSP-based SPI bus at high speed, add 33 ohm series resistors on the SCK and SDO lines to limit ringing on the bus. The MSSP I2C pins (RB1/RB4) are open-drain in I2C mode and require external pull-ups selected per the bus capacitance (typically 4.7 kohm at 100 kHz up to 1 m; 1 kohm at 400 kHz for short buses). Failure to size pull-ups correctly is the most common cause of I2C bus hangs on production units.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; for safety-critical automotive designs a PIC18 K-series AEC-Q100 part is recommended. LF silicon also supports industrial -40 to +85 C operation.
