PIC18LF2320-I/SP - 8KB Flash 8-bit MCU, 25 I/O, 28-SPDIP | Microchip
MPN: PIC18LF2320-I/SP ✓ Hoạt độngPIC18LF2320-I/SP Tóm tắt
A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory, volatile data memory, peripherals and I/O. The PIC18 family sits in Microchip's 8-bit portfolio above the baseline PIC10/12/16 families: it adds a 16-bit instruction word, hardware multiplier, linear memory model, and prioritized interrupts, giving it higher throughput for embedded control than simpler 8-bit parts while retaining byte-level simplicity. Within that family the PIC18F2320 is the 28-pin shrink of the PIC18F4520/4320/4220 group, with nanoWatt Technology for managed power consumption.
Key features include an integrated 10-bit ADC with up to 10 channels, a USART with LIN support, an MSSP module for SPI and I2C (master/slave), one 8-bit and three 16-bit timers, a CCP (Capture/Compare/PWM) module, and nanoWart power management with idle and sleep modes drawing microamp currents. The 25 digital I/O pins drive 25 mA source/sink each, sufficient for LEDs, relays, and small logic loads.
Typical applications include industrial sensor interfaces, low-power remote controls, LIN/J2602 automotive body nodes, appliance control boards, and small automation subsystems. The LF voltage range (2.0V to 5.5V) and nanoWatt sleep (< 1 uA typical) make it attractive for battery-powered or energy-harvesting designs that previously required a separate RTC.
When designing with this part, place 0.1 uF decoupling within 5 mm of each power pin and tie unused I/O to defined logic levels. In-circuit serial programming (ICSP) uses dedicated RB6/RB7 pins; routing these out to a 5-pin header simplifies production programming.
This page synthesizes current distributor pricing, verified drop-in alternatives in the same 28-SPDIP footprint, and practical design notes not collected in the datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho PIC18LF2320-I/SP — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với PIC18LF2320-I/SP (cùng hình factor và footprint) — khác nhau ở Core Architecture, Package, Timers, ADC, Communication.
PIC18LF2220-I/SP
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →PIC18LF2321-I/SP
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
PIC18LF2320-I/SO
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →PIC18F2320-I/SP
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
PIC18F2320-I/SO
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
PIC18LF2320-I/SP Tỷ lệ tối đa & tính chất điện
| Core Architecture | PIC18 (8-bit, 16-bit instruction word) |
| Program Memory (Flash) | 8 KB (4K x 16) |
| Data SRAM | 512 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 40 MHz (10 MIPS) |
| Supply Voltage Range | 2.0 V to 5.5 V |
| ADC | 10-bit, up to 10 channels |
| Digital I/O Pins | 25 |
| I/O Source/Sink Current | 25 mA per pin |
| Timers | 1 x 8-bit, 3 x 16-bit |
| Capture/Compare/PWM (CCP) | 1 module |
| Communication | 1 x USART (LIN), 1 x MSSP (SPI/I2C) |
| Khoảng nhiệt độ hoạt động | -40 C to +85 C (Industrial) |
| Hộp | 28-pin SPDIP (SP) |
| Kiểu lắp đặt | Through-Hole |
| Cấp MSL | 1 (unlimited) |
| Trạng thái RoHS | Compliant |
| Lead-Free | Yes |
Cấu hình chân PIC18LF2320-I/SP
| Chân 1 | /MCLR — Master clear / reset input, programming voltage input (active-low) |
| Chân 2 | RA0/AN0 — Digital I/O or analog input channel 0 |
| Chân 3 | RA1/AN1 — Digital I/O or analog input channel 1 |
| Chân 4 | RA2/AN2/VREF- — Digital I/O, analog input channel 2, or ADC negative voltage reference |
| Chân 5 | RA3/AN3/VREF+ — Digital I/O, analog input channel 3, or ADC positive voltage reference |
| Chân 6 | RA4/T0CKI — Digital I/O (open-drain) or Timer0 clock input |
| Chân 7 | RA5/AN4 — Digital I/O or analog input channel 4 |
| Chân 8 | VSS — Ground reference |
| Chân 9 | OSC1/CLKIN — Crystal/ceramic resonator input or external clock in |
| Chân 10 | OSC2/CLKOUT — Crystal/ceramic resonator output or clock out |
| Chân 11 | RC0/T1OSO/T1CKI — Digital I/O, Timer1 oscillator output, or Timer1 external clock input |
| Chân 12 | RC1/T1OSI/CCP2 — Digital I/O, Timer1 oscillator input, or CCP2 capture/compare/PWM |
| Chân 13 | RC2/CCP1 — Digital I/O or CCP1 capture/compare/PWM |
| Chân 14 | RC3 — Digital I/O (also SDO/MSSP) |
| Chân 15 | RC4 — Digital I/O (also SDI/MSSP) |
| Chân 16 | RC5 — Digital I/O (also SCK/MSSP) |
| Chân 17 | RC6 — Digital I/O or USART TX |
| Chân 18 | RC7 — Digital I/O or USART RX |
| Chân 19 | VSS — Ground reference |
| Chân 20 | VDD — Positive supply input |
| Chân 21 | RB0/INT0 — Digital I/O or external interrupt 0 |
| Chân 22 | RB1/INT1 — Digital I/O or external interrupt 1 |
| Chân 23 | RB2/INT2 — Digital I/O or external interrupt 2 |
| Chân 24 | RB3/INT3 — Digital I/O or external interrupt 3 / CCP2 source |
| Chân 25 | RB4 — Digital I/O with interrupt-on-change |
| Chân 26 | RB5/PGM — Digital I/O with interrupt-on-change / LVP programming |
| Chân 27 | RB6/PGC — Digital I/O with interrupt-on-change / ICSP clock |
| Chân 28 | RB7/PGD — Digital I/O with interrupt-on-change / ICSP data |
Ứng dụng tiêu biểu
PIC18LF2320-I/SP phù hợp cho 6 Áp dụngs: Battery-Powered Sensor Hubs, LIN Automotive Body Nodes, Industrial Sensor Interfaces, Consumer Appliance Control Boards, Educational and Maker Boards, HVAC and Building Automation.
Battery-Powered Sensor Hubs
The PIC18LF2320-I/SP fits battery-powered sensor hubs because the LF silicon supports 2.0-5.5 V operation, allowing direct connection to a single Li-ion cell (3.0-4.2 V) or 2x AA without a 3.3 V LDO. Combined with nanoWatt sleep currents below 1 uA and a 25 mA capable I/O bus, the part can sleep most of the time and wake on RB0 external interrupts or Timer1 ticks. In this role the part integrates analog acquisition (10-bit ADC up to 10 channels), UART bridge to a host MCU, and the timing budget for periodic sampling that would otherwise need a separate RTC. Trade-off: at 10 MIPS the part cannot crunch heavy DSP, so filter preprocessing should remain light.
Được đề xuất
LIN Automotive Body Nodes
The PIC18LF2320-I/SP is well suited to LIN body and chassis nodes such as mirror controllers, seat adjusters, HVAC flaps, and ambient lighting modules. The integrated USART supports LIN master/slave with auto-baud-detect, while the nanoWatt sleep current (sub-1 uA) and bus-wake-on-activity enable the node to sit idle for days without draining the battery. The 28-SPDIP footprint also suits through-hole manufacturing common in automotive harness electronics. Trade-off: this part is not AEC-Q100 qualified; for ISO 26262 functional-safety or AEC-Q100 requirements, a PIC18 K-series or dsPIC33 part should be specified.
Được đề xuất
Industrial Sensor Interfaces
In industrial sensor interface boards the PIC18LF2320-I/SP acts as a 4-20 mA loop interface, RTD/thermocouple digitiser, or digital-input multiplexer-front-end controller. The 10-bit ADC with up to 10 channels handles multi-sensor fan-out, while the MSSP provides SPI access to digital temperature ICs or I2C EEPROM for parameter storage. The wide -40 to +85 C industrial temperature range ensures reliable operation in cabinets and factory floors. Trade-off: for higher-accuracy (16-bit) measurement tasks a 24-bit ADC companion (such as MCP3911) and a higher-end PIC18 K-series host are recommended.
Được đề xuất
Consumer Appliance Control Boards
The PIC18LF2320-I/SP is widely deployed in consumer appliance main boards (washing machines, microwave ovens, dishwashers) where it pairs the low system cost of an 8-bit MCU with the performance of 10 MIPS, enough to drive triac-based AC phase control, sense multiple pushbuttons via scan-matrix, and run small statemachine firmware. The 25 mA I/O drive handles LED indicators and small relay coils directly without external buffers. Trade-off: safety-critical appliance logic should pair this MCU with hardware interlocks - software-only control is not sufficient for IEC 60730 requirements.
Được đề xuất
Educational and Maker Boards
The PIC18LF2320-I/SP is a popular training MCU because the 28-SPDIP package fits standard 600-mil DIP sockets and breadboards, removing soldering as a hurdle for students. With 8 KB Flash, 77 single-word instructions, and the free MPLAB X + XC8 toolchain, beginners can load complete tutorials (blinking LED, ADC reading, UART echo) within minutes. The ICSP programming pins (RB6/RB7) on a 5-pin header simplify production and lab re-flashing. Trade-off: for advanced courses requiring DMA or hardware design training, a PIC32MX or STM32 part gives more headroom.
Được đề xuất
HVAC and Building Automation
The PIC18LF2320-I/SP fits HVAC and building automation subsystems (thermostats, damper controllers, remote sensor nodes) because it integrates a 10-bit ADC plus multiple serial interfaces on a single 28-SPDIP die, allowing designers to handle analog temperature/humidity sensors and Modbus/Modbus-ASCII communication simultaneously. Idle currents under 1 uA make it suitable for battery or energy-harvesting thermostats. Trade-off: this part lacks native Ethernet MAC, so any node needing IP connectivity should pair it with a serial-to-Ethernet bridge like the ENC28J60.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho PIC18LF2320-I/SP — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | PIC18LF2220-I/SP | PIC18LF2321-I/SP | PIC18LF2320-I/SO | PIC18F2320-I/SP | PIC18F2320-I/SO |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SPDIP (through-hole) | 28-SPDIP (through-hole) - same | 28-SPDIP (through-hole) - same | SOIC-28 (SMT) - same die | 28-SPDIP (through-hole) - same | SOIC-28 (SMT) - same die |
| Flash Memory | 8 KB | 4 KB (-50%) | 16 KB (+100%) | 8 KB (same) | 8 KB (same) | 8 KB (same) |
| SRAM | 512 B | 512 B | 512 B | 512 B | 512 B | 512 B |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Supply Voltage Range | 2.0 V to 5.5 V (LF) | 2.0 V to 5.5 V (LF) - same | 2.0 V to 5.5 V (LF) - same | 2.0 V to 5.5 V (LF) - same | 4.2 V to 5.5 V (F) - narrow range | 4.2 V to 5.5 V (F) - narrow range |
| Maximum CPU Speed | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS | 40 MHz / 10 MIPS |
| Temperature Range | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| Mounting Type | Through-Hole (SPDIP) | Through-Hole (SPDIP) | Through-Hole (SPDIP) | Surface Mount (SOIC-28) | Through-Hole (SPDIP) | Surface Mount (SOIC-28) |
| USART / LIN | Yes (LIN 1.3 with auto-baud) | Yes (LIN 1.3 with auto-baud) | Yes (LIN 1.3 with auto-baud) | Yes (LIN 1.3 with auto-baud) | Yes (LIN 1.3 with auto-baud) | Yes (LIN 1.3 with auto-baud) |
Bảo phân biệt quan trọng
- Wide 2.0-5.5 V supply range allowing direct Li-ion operation (vsPIC18F2320-I/SP)
- Larger 8 KB Flash for richer firmware stacks (vsPIC18LF2220-I/SP)
- Drop-in upscaling to 16 KB Flash when code grows (vsPIC18LF2321-I/SP)
- Through-hole SPDIP footprint for breadboarding and lab prototyping (vsPIC18LF2320-I/SO)
Ghi chú thiết kế
Place a 0.1 uF decoupling capacitor within 5 mm of each VDD/VSS pin pair of the PIC18LF2320-I/SP. For noisy environments (motor or relay drives on the same PCB) add a 10 uF tantalum or ceramic bulk capacitor near the device. The LF silicon allows direct operation down to 2.0 V, but at very low VDD the oscillator's maximum frequency drops - consult the datasheet's oscillator vs VDD chart before choosing 40 MHz at 2.5 V.
Do not leave any unused I/O on the PIC18LF2320-I/SP floating; configure as outputs or tie via 10 kohm to a known level to avoid unwanted interrupt-on-change wake-ups and excess quiescent current. The /MCLR pin must be tied to VDD via 10 kohm (or lower for noisy rails) for normal reset operation, and never left floating on power-up. For in-circuit serial programming always provide a 5-pin ICSP header connected to /MCLR, VDD, VSS, PGC (RB6), and PGD (RB7).
Route the 28-SPDIP board footprint with 100-mil pads on 600-mil row spacing to match standard DIP sockets; long signal traces should be kept above the analog section with separate analog (AVDD/AVSS) bypass caps if the 28-SPDIP variant is being used without AVDD pins (note: 28-SPDIP has only one VDD/VSS pair, so analog and digital supplies share the rail). Keep high-current switching nodes (LED/relay drivers) at least 5 mm away from the analog pins (RA0-RA5) to avoid ADC noise injection.
For designs where the PIC18LF2320-I/SP drives an MSSP-based SPI bus at high speed, add 33 ohm series resistors on the SCK and SDO lines to limit ringing on the bus. The MSSP I2C pins (RB1/RB4) are open-drain in I2C mode and require external pull-ups selected per the bus capacitance (typically 4.7 kohm at 100 kHz up to 1 m; 1 kohm at 400 kHz for short buses). Failure to size pull-ups correctly is the most common cause of I2C bus hangs on production units.
Thông tin tuân thủ
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; for safety-critical automotive designs a PIC18 K-series AEC-Q100 part is recommended. LF silicon also supports industrial -40 to +85 C operation.
