PIC24EP256GP204T-I/ML - 70 MIPS 16-bit MCU, 256KB Flash | Microchip
MPN: PIC24EP256GP204T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $8.92 | $89.20 |
| 100 | $7.65 | $765.00 |
| 500 | $6.84 | $3,420.00 |
| 1,000 | $6.1 | $6,100.00 |
PIC24EP256GP204T-I/ML Overview
A 16-bit microcontroller (MCU) is a class of embedded processor whose data path, registers and ALU are 16 bits wide, giving it a sweet spot between 8-bit MCUs (low cost, low power) and 32-bit Cortex-M parts (highest performance). Within the Microchip taxonomy, this part sits in the PIC24E "Enhanced" family, which adds a hardware multiplier/DSP engine to the classic PIC16-bit architecture and supports up to 32 MIPS at 32 MHz in earlier PIC24F/H variants. The PIC24EP sub-family pushes this to 70 MIPS, placing it in the power-management and signal-conditioning tier of Microchip's 16-bit line.
Key features of the PIC24EP256GP204T-I/ML include 35 general-purpose I/O, five UART modules supporting LIN, IrDA and RS-485 protocols, four SPI ports and three I2C interfaces, plus a 12-bit ADC capable of 500 ksps conversion across multiple channels. Two on-chip op-amps and a Charge Time Measurement Unit (CTMU) simplify touch-sensing and analog front-end designs, while the Peripheral Trigger Generator (PTG) off-loads sequenced peripheral actions from the core, freeing CPU cycles for application logic.
The PIC24EP architecture combines a modified Harvard bus with a 16-bit instruction word and 24-bit fixed-width instruction fetch, giving dense code storage and deterministic interrupt latency. The wide operating voltage of 3.0 V to 3.6 V, industrial -40 °C to +85 °C temperature range, and the 8x8 mm QFN with exposed pad support compact, thermally efficient PCB layouts in motor-control, lighting, and sensor-interface modules.
Typical applications include industrial control boards, sensor hubs with on-chip op-amp conditioning, motor control (BLDC/PMSM low-power drivers), LED lighting controllers, and consumer devices that benefit from 16-bit math precision without the overhead of a full 32-bit MCU. The op-amps and 12-bit ADC simplify analog signal chains, while CTMU and PTG accelerate capacitive touch and timed peripheral sequences.
For designers, the main trade-off is Flash endurance (rated for 1,000 erase/write cycles typical for the program Flash array) versus code density. The wide 3.0-3.6 V supply range allows direct connection to 3.3 V rails, but a regulated LDO is still recommended for ADC accuracy.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, including pin-compatible PIC24E family variants and the cross-brand substitution landscape from the Microchip cross-reference database.
Drop-in alternatives for PIC24EP256GP204T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24EP256GP204T-I/ML (same form factor and footprint) — differing in ADC, Core Architecture, On-chip Op-Amps, Operating Temperature, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24EP256GP204-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24EP256GP204T-I/ML Maximum Ratings & Electrical Characteristics
| Product Family | PIC24EP |
| Core Architecture | PIC 16-bit MCU (modified Harvard) |
| Core Speed | 70 MIPS at 70 MHz |
| Program Flash Memory | 256 KB (85.5K x 24) |
| RAM | 32 KB |
| Operating Voltage (Vdd) | 3.0 V to 3.6 V |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| I/O Pins | 35 |
| ADC | 12-bit, up to 500 ksps |
| On-chip Op-Amps | 2 |
| UART Modules | 5 (LIN / IrDA / RS-485 capable) |
| SPI Modules | 4 |
| I2C Modules | 3 |
| Package | 44-pin QFN (8x8 mm) with exposed thermal pad |
| Mounting Type | Surface Mount |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
PIC24EP256GP204T-I/ML Pin Configuration
| Pin 1 | RA0 — Digital I/O / analog input |
| Pin 2 | RA1 — Digital I/O / analog input |
| Pin 3 | RA2 — Digital I/O / analog input |
| Pin 4 | RA3 — Digital I/O / analog input |
| Pin 5 | RA4 — Digital I/O / analog input |
| Pin 6 | RA5 — Digital I/O / analog input |
| Pin 7 | RA6 — Digital I/O / OSC2 |
| Pin 8 | RA7 — Digital I/O / OSC1 |
| Pin 9 | VSS — Ground reference |
| Pin 10 | RB0 — Digital I/O / programming clock |
| Pin 11 | RB1 — Digital I/O |
| Pin 12 | RB2 — Digital I/O |
| Pin 13 | RB3 — Digital I/O |
| Pin 14 | RB4 — Digital I/O |
| Pin 15 | RB5 — Digital I/O |
| Pin 16 | RB6 — Digital I/O / ICS PGC |
| Pin 17 | RB7 — Digital I/O / ICS PGD |
| Pin 18 | RB8 — Digital I/O |
| Pin 19 | RB9 — Digital I/O |
| Pin 20 | RB10 — Digital I/O |
| Pin 21 | RB11 — Digital I/O |
| Pin 22 | RB12 — Digital I/O |
| Pin 23 | RB13 — Digital I/O |
| Pin 24 | RB14 — Digital I/O |
| Pin 25 | RB15 — Digital I/O |
| Pin 26 | RC0 — Digital I/O |
| Pin 27 | RC1 — Digital I/O |
| Pin 28 | RC2 — Digital I/O |
| Pin 29 | RC3 — Digital I/O |
| Pin 30 | RC4 — Digital I/O |
| Pin 31 | RC5 — Digital I/O |
| Pin 32 | RC6 — Digital I/O |
| Pin 33 | RC7 — Digital I/O |
| Pin 34 | RC8 — Digital I/O |
| Pin 35 | RC9 — Digital I/O |
| Pin 36 | RC10 — Digital I/O |
| Pin 37 | RC11 — Digital I/O |
| Pin 38 | RC12 — Digital I/O |
| Pin 39 | VDD — Positive supply (3.0 V to 3.6 V) |
| Pin 40 | AVSS — Analog ground |
| Pin 41 | AVDD — Analog positive supply |
| Pin 42 | MCLR — Master clear / reset input (active-low) |
| Pin 43 | VSS — Ground reference |
| Pin 44 | EP — Exposed thermal pad (connect to VSS) |
Typical Applications
PIC24EP256GP204T-I/ML is suitable for 6 applications: Industrial Sensor Conditioning, BLDC / PMSM Motor Control (Low Power), LED Lighting Controllers, Capacitive Touch HMI, Portable Medical Monitoring, Building Automation Gateways.
Industrial Sensor Conditioning
The PIC24EP256GP204T-I/ML is a strong fit for industrial sensor-conditioning modules where the 70 MIPS core performs linearization, calibration, and protocol conversion while the on-chip op-amps condition analog signals ahead of the 12-bit ADC. The two integrated op-amps can implement active low-pass filtering of bridge-sensor outputs at 100-200 Hz, replacing a TL072-class external amplifier and reducing BOM cost. The CTMU measures capacitance for humidity and proximity sensing, while five UART channels handle RS-485 sensor networks at 1 Mbps. The 44-QFN (8x8) with exposed thermal pad supports 4-layer FR4 boards inside sealed IP65 housings.
Recommended
BLDC / PMSM Motor Control (Low Power)
The 70 MIPS core of the PIC24EP256GP204T-I/ML executes sensorless field-oriented control (FOC) loops for small BLDC and PMSM motors (under 200 W) within a typical 20-50 µs PWM period, leaving CPU headroom for housekeeping tasks. The 12-bit 500 ksps ADC samples phase currents synchronously to the PWM center, while the two on-chip op-amps directly amplify low-side shunt signals without an external current-sense amplifier. The PTG (Peripheral Trigger Generator) coordinates ADC, PWM and DMA timing without CPU intervention, and the QFN-44 exposed pad handles the dissipation budget. Per Microchip motor-control application notes, the PIC24EP family supports sensorless FOC up to about 30 krpm on small fans and pumps.
Recommended
LED Lighting Controllers
The PIC24EP256GP204T-I/ML drives multi-channel LED lighting controllers with a 32 KB RAM buffer that stores lookup tables for dimming curves and color-mixing while the 70 MIPS core performs high-frequency PWM at 16-bit resolution. The Peripheral Trigger Generator sequences LED refresh cycles without CPU overhead, allowing smooth 16-bit-per-channel dimming for architectural and stage-lighting fixtures. The wide 3.0-3.6 V supply rail accepts regulated 3.3 V LDO outputs, and the integrated op-amps drive external MOSFET gate-driver stages. The 44-QFN (8x8 mm) package enables slim form-factor light fixtures with thermal pad heat spreading under continuous high-current PWM.
Recommended
Capacitive Touch HMI
The PIC24EP256GP204T-I/ML is well-suited for capacitive touch HMI panels where the CTMU (Charge Time Measurement Unit) implements reliable touch and proximity detection across 16+ electrodes. The 12-bit ADC at 500 ksps supports fast electrode scanning with sub-1 ms response time, and the 256 KB Flash stores complex touch-pattern recognition algorithms while 32 KB RAM buffers multi-touch events. Five UART channels expose the touch state to a host controller over LIN, RS-232, or RS-485, while I2C connects to an external LCD driver. The 44-QFN (8x8) footprint allows slim industrial-control bezels with adequate thermal margin.
Recommended
Portable Medical Monitoring
The PIC24EP256GP204T-I/ML fits portable medical-monitoring devices such as pulse oximeters, digital thermometers, and blood-pressure monitors where the two on-chip op-amps condition analog sensor signals and the 12-bit ADC samples at 500 ksps for accurate waveform capture. The 256 KB Flash stores sensor-fusion algorithms and BLE-style protocol stacks, while the 32 KB RAM buffers data between the ADC and the communication link. The industrial -40 °C to +85 °C operating range covers clinical and home environments. Per Microchip medical application notes, the PIC24EP family's deterministic interrupt latency supports real-time biometric processing within IEC 62304 software-safety frameworks.
Recommended
Building Automation Gateways
The PIC24EP256GP204T-I/ML supports building-automation gateway nodes that aggregate sensors and actuators over RS-485, CAN, and LIN buses. Five UART channels plus three I2C and four SPI ports handle multi-protocol bridging between BACnet, Modbus, and proprietary field buses, while the 70 MIPS core runs encryption for secure remote-management links. The 256 KB Flash stores protocol-stack libraries, and 32 KB RAM supports TLS-style handshake buffers. The wide 3.0-3.6 V supply rail and industrial -40 °C to +85 °C temperature range suit DIN-rail mounted controllers with shared 24 V-3.3 V LDO rails.
Recommended
Recommended Products Summary
Engineering reference data for PIC24EP256GP204T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24EP256GP204-I/ML | PIC24EP256GP204-I/PT |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8) | 44-QFN (8x8) - same | 44-TQFP (different footprint) |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS |
| Program Flash | 256 KB | 256 KB | 256 KB |
| RAM | 32 KB | 32 KB | 32 KB |
| I/O Pins | 35 | 35 | 35 |
| ADC | 12-bit, 500 ksps | 12-bit, 500 ksps | 12-bit, 500 ksps |
| On-chip Op-Amps | 2 | 2 | 2 |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
| Packaging Form | Tape and Reel | Tube | Tube |
Key Differentiators
- 70 MIPS core with hardware DSP extensions (vs PIC24EP128GP204-I/PT)
- On-chip dual op-amps eliminate external analog front-end (vs PIC24EP256GP204-I/PT (TQFP-44))
- Peripheral Trigger Generator (PTG) off-loads timing (vs PIC24HJ16GP304-E/ML)
Design Notes
Place a 10 µF bulk capacitor plus 0.1 µF ceramic decoupling within 5 mm of each VDD/AVDD pin pair. The PIC24EP256GP204T-I/ML operates from 3.0 V to 3.6 V; ensure the LDO (such as MCP1700) maintains regulation during ADC conversions to preserve 12-bit accuracy. Estimated quiescent current is in the 30-50 mA range at full 70 MHz operation; budget LDO headroom accordingly for industrial temperature operation.
The 44-QFN exposed thermal pad must be soldered to a copper pour connected to VSS to keep junction temperature below 125 °C. Estimated: at full 70 MIPS with all peripherals enabled, internal dissipation is typically 200-300 mW; with a 25 °C/W theta-JA on a JEDEC EIA/JESD51 4-layer test board, this yields a 5-8 °C junction rise. Use at least 200 mm² of 2-oz copper on the thermal pad for typical industrial environments.
Route crystal traces (OSC1/OSC2 on RA6/RA7) with short, symmetric traces and a guard ring to VSS; keep them away from switching traces such as PWM outputs to minimize crosstalk. The QFN-44 footprint requires the exposed pad to be flooded with thermal vias (0.3 mm drill, 0.6 mm pitch) to spread heat into inner copper planes. Maintain analog and digital ground separation until they meet at the device AVSS pin.
Do not exceed 3.6 V on any VDD or AVDD pin or the device can latch-up. Programming voltages must enter through the proper ICS PGC/PGD pins (RB6/RB7), not through generic GPIO, to avoid accidental bulk-erase or write-protect lockout. Per Microchip datasheet, Flash endurance is rated for 1,000 erase/write cycles minimum; use EEPROM emulation in RAM or external EEPROM for non-volatile data logging above this cycle count.
Compliance Information
RoHS and REACH compliance per Microchip product page. Industrial -40 °C to +85 °C grade; AEC-Q100 automotive-grade variants are available in the same PIC24EP family but with -I temperature range and different MPN suffixes. Halogen-free and lead-free per Microchip environmental compliance disclosures.